Abstract: An automated bore finishing process particularly adapted for lapping automatically corrects one or more bore parameters, such as diameter, geometry, surface finish, in an iterative manner to reach a final value, controlled by algorithms that process feedback from a measurement process. The process determines bore parameter information and determines an optimum set of values for the process parameters, such as stroke position, stroke length and duration of the next lapping iteration. This optimization is targeted to achieve the desired final bore parameter or parameters within the specified bore size limits, and may be used to alter the stroke profile either for the entire next iteration or in a continuously changing manner, to minimize or eliminate bore defects over one or a succession of iterations.
Type:
Grant
Filed:
May 24, 2010
Date of Patent:
June 5, 2018
Assignee:
Sunnen Products Company
Inventors:
Daniel R. Cloutier, Scott W. Alcock, Terry R. Heller, Russell L. Jacobsmeyer
Abstract: A cutting method of a honeycomb formed body is provided. This is a cutting method of a honeycomb formed body in which, while a kneaded material containing a ceramic raw material is extruded to form a honeycomb formed body with a honeycomb shape having partition walls defining and forming a plurality of cells, the extruded honeycomb formed body is cut before drying by a cutting blade vibrated at a frequency of 0.3 kHz or more in a direction perpendicular to a direction in which this honeycomb formed body moves. It is preferably a cutting method of a honeycomb formed body in which the cutting blade is vibrated at a high frequency of 10 kHz or more.
Abstract: A device for sharpening one or more cutting edges of a dental curette has a base support with a frame articulated thereon, and at least one sharpening guide. The frame supports a grinding wheel rotationally driven by a motor and a sharpening guide support intended to receive the sharpening guide(s). The guide includes at least one indicator in the form of a line marked on the guide, whose angle with the horizontal being between 10° and 50° but preferably equal to 10°, 20° or 30° and corresponding to the type of dental curette to be sharpened. The sharpening guide(s) can move with respect to the support, and the support and/or the guide include(s) indexing and positioning elements determining indexing positions of the guide on the support, each indexing position corresponding to a different indicator. A method of sharpening one or more cutting edges, and a sharpening guide are described.
Abstract: A radially inwardly open raceway formed in a nut centered on a nut axis is machined by of oscillating the nut about the nut axis while pressing a tool secured in a holder radially outwardly into the raceway of the nut. The holder is moved parallel to the nut axis and oscillated about a tool axis perpendicular to the nut axis synchronously with the oscillation of the nut about the nut axis. Springs brace the tool against the holder parallel to the nut axis such that the tool can move limitedly in the holder against spring bias parallel to the tool axis.
Type:
Application
Filed:
May 17, 2011
Publication date:
November 24, 2011
Inventors:
Thomas Schmitz, Siegfried Hesse, Hans-Joachim Koerner
Abstract: An innovative cutter-grinder comprised of a base, a cutter holder, and a mobile base plate; the base plate being mounted with emery cloth before being placed on a deck of the frame to secure the emery cloth and allow easy replacement of the emery cloth; the cutter holder adapted with a roller at bottom retaining a blade for the user to hold the cutter holder to roll back and forth on the base plate to grind the cutter against the emery cloth; and an angle set plate being inserted onto slots respectively provided on both sides of the deck allowing the adjustment of the grinding angle.
Abstract: A method and apparatus are disclosed wherein, while holding an optical fiber 1 by an optical fiber holder section 4 so as to serve a distal end 1a of the optical fiber 1 as a free end and holding the distal end 1a of the optical fiber 1 in contact with a grinding flat portion 5b to cause the distal end 1a of the optical fiber 1 to be flexed on the grinding flat portion 5b, reciprocating movement for causing the distal end 1a of the optical fiber 1 to slide on the grinding flat portion 5b in a first sliding direction and an oppositely orientated second sliding direction is relatively implemented a plural number of times between the grinding flat portion 5b and the distal end 1a of the optical fiber 1.
Type:
Grant
Filed:
April 22, 2003
Date of Patent:
May 10, 2005
Assignee:
Nippon Telegraph and Telephone Corporation
Abstract: A machining device for processing metal hanging rod of blinds, comprising a machine platform, two fixing bases, and a retaining unit wherein the top surface of said machine platform is defined by a holding groove for said two fixing bases to be located thereon, the middle section thereof has an internally threaded hole for a reversible bolt of a motor to be led and engaged therewith, and the underside thereof is provided with a registration groove for said retaining unit to be guided thereto via bearings. Said fixing bases, each having a spring and a tapered pivot support disposed at one side, can be adjusted in distance to fit the length of a metal hanging rod.
Abstract: A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.
Type:
Grant
Filed:
November 6, 1997
Date of Patent:
November 21, 2000
Assignee:
Aplex, Inc.
Inventors:
Ethan C. Wilson, H. Alexander Anderson, Gregory Appel
Abstract: A sharpening apparatus for sharpening blades of tools and other implements such as spatulas and grill scrapers. The sharpening apparatus includes a base member on which a sharpening stone is positioned. A slidable blade guide member is slidably connected to the base member. The slidable blade guide member includes a guide surface that is disposed at an angle relative to the upper surface of the sharpening stone, and a mounting mechanism for removably mounting a spatula against the guide surface such that the scraping edge of the spatula is in engagement with the sharpening stone. The slidable blade guide member is manually slidable back and forth to sharpen the scraping edge of the spatula. A fixed blade guide member is also attached to the base member.
Abstract: Blade-sharpening apparatus includes a blade holder that is axially and pivotably movable on an upright post, to enable controlled manual movement of a clamped blade in contact with a sharpening stone supported on an underlying base. The means by which the clamping head is mounted permits adjustment of declination, for producing the desired blade-edge angle, and it permits pivoting of the head for maintaining optimal contact between the blade and the surface of the stone.
Abstract: The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.