Abstract: A finishing belt device includes a pressure apparatus having a pressure roller that applies a pressing force to the rear side of a finishing belt that, when viewed in the running direction of the finishing belt, an active side of the finishing belt is pressed against a peripheral surface to be finished of a workpiece in a linear contact region at the level of the pressing force. A pressure roller support is provided with the pressure roller arranged as a first pressure roller and another pressure roller is arranged as a second pressure roller. When viewed in the running direction of the finishing belt, the active side of the finishing belt is pressed against the peripheral surface to be finished of the workpiece in two spaced-apart linear contact regions via the two pressure rollers. The invention also relates to a method for finishing a peripheral surface of a cam surface.

Abstract: The invention relates to a method for modifying the geometry of gear wheel tooth flanks with a tool with a toothing that engages with the gear wheel during a precision machining. A varied profile is produced on the tool over the width of the tool, in that during a dressing procedure a dressing wheel is moved along the tooth flank of the tooth to be dressed. The width of the teeth of the dressing wheel is much smaller than the width of the tool. In order to cover the width of the tool a length must be covered corresponding to a multiple of the width of the teeth of the dressing wheel. After the dressing, the precision machining of the gear wheel is carried out with the tool. Since the dressing wheel is moved with a changing pitch and a changing crossed axes angle relative to the tool, the modification of the tooth flank geometry can be reproduced in the tool.

Abstract: The invention relates to a device for dressing a grinding wheel, comprising a sleeve to hold a corundum rod laterally and to guide it along its longitudinal axis, a ram to apply constant thrust force onto the corundum rod held in place and guided in the sleeve, to bring it into contact with the grinding wheel, means of rigidly connecting the ram shaft to the end of the corundum rod, and linear guide means for the sleeve for translating the corundum rod parallel to the axis of the grinding wheel while keeping the rod pressed against the grinding wheel with a constant force. Application to a centerless grinder in which the grinding wheel is used to grind nuclear fuel pellets.

Abstract: A dart restoration tool includes a stator having a conical milling surface and a rotor mounted for rotation about a longitudinal axis of the stator. The rotor includes a guide adapted to accept a tip end portion of a game dart such that the tip end portion engages the conical milling surface. Rotation of the rotor about the longitudinal axis produces an orbital motion of the game dart against the conical milling surface to sharpen the tip end portion of the game dart.

Abstract: A polishing apparatus for polishing an optical fiber connector is disclosed. The polishing apparatus has a base portion to support a polishing media; and a polishing puck. The polishing puck includes a connector mount, to receive and hold the optical fiber connector secured to a terminal end of an optical fiber, and a polishing gear configured to engage with a ring gear disposed in the base portion such that a fiber tip of optical fiber mounted in the optical connector traces a roulette pattern on the polishing media upon rotational engagement of the polishing gear within the ring gear.

Abstract: A dart restoration tool includes a stator having a conical milling surface and a rotor mounted for rotation about a longitudinal axis of the stator. The rotor includes a guide adapted to accept a tip end portion of a game dart such that the tip end portion engages the conical milling surface. Rotation of the rotor about the longitudinal axis produces an orbital motion of the game dart against the conical milling surface to sharpen the tip end portion of the game dart.

Abstract: Apparatus, systems and methods related to sharpening blades for rotary cutters. In one illustrative embodiment, a power sharpener system secures a rotary cutting blade between upper and lower columns that form a rotating axle in contact with upper and lower sharpening stones, each positioned at an appropriate angle to contact a cutting edges of the rotary blade for sharpening. The upper column may be rotatably attached to an upper cover or lid and the lower column rotatably disposed in a base. After the rotary blade is secured, an electric motor is used to rotate the column, contacting the edges of the blade against the stones to simultaneously sharpen both edges of the blade. In some embodiments, a retractable plate may be disposed around the lower column for placement of the rotary blade thereon and a lifting lever may be used to facilitate blade removal.

Abstract: Apparatus, systems and methods related to sharpening blades for rotary cutters. In one illustrative embodiment, a power sharpener system secures a rotary cutting blade between upper and lower columns that form a rotating axle in contact with upper and lower sharpening stones, each positioned at an appropriate angle to contact a cutting edges of the rotary blade for sharpening. The upper column may be rotatably attached to an upper cover or lid and the lower column rotatably disposed in a base. After the rotary blade is secured, an electric motor is used to rotate the column, contacting the edges of the blade against the stones to simultaneously sharpen both edges of the blade. In some embodiments, a retractable plate may be disposed around the lower column for placement of the rotary blade thereon and a lifting lever may be used to facilitate blade removal.

Abstract: A finishing device for finish-machining of a workpiece includes a force-generating device for generating a driving force, a force-transmitting arm and a pressing device for applying a working force to a finishing tool, and further a measuring device for measuring a deformation of a segment of the force-transmitting arm arranged in the force flux between the driving force and working force and/or for measuring a deformation force applied in the segment.

Abstract: A prescription label identity peeler includes a box-shaped housing. A lid extends over the box-shaped housing. A sanding member is adjustably carried within the box-shaped housing. A pair of linkage arms is pivotally extend between the lid and the sanding member. The motorized linkage arms will move the sanding member simultaneously and horizontally against the empty pill bottle in an inverted position, while the wheel on the swing arm assembly will contact a bottom end of the empty pill bottle via compression of the springs, thereby removing the label from the empty pill bottle when the inverted empty pill bottle rotates.

Abstract: Methods, apparatus and computer programs for correcting a crown layer variance of a buffed tire carcass, the steps of the method including measuring a distance through a buffed crown layer at a plurality of locations around a tire carcass; identifying a maximum distance location from the distances determined at the plurality of locations around the tire carcass; inflating the tire carcass with the maximum distance location orientated at the 270 degree polar angle position; and, buffing the tire carcass.

Abstract: A disc burnishing head includes an array of burnishing pads and a first and second side rail projecting from a bottom surface of a slider body. The side rails each have an inside surface facing the burnishing pads and an outside surface facing outward. The outside surface of at least the first side rail is serrated. The serrations define a plurality of teeth and notches on the outside surface of the first side rail for cutting, cleaning, and conditioning defects from the surface of a disc.

Abstract: An optical disc polishing device includes a housing in which a disc turntable assembly is arranged for carrying an optical disc on a rotation surface thereof. The housing includes a cover that carries a polishing assembly. The cover forms a slot serving as a track extending in a radial direction of the optical disc. The polishing assembly includes a positioning member, a polishing wheel, and a locking knob. A threaded section is provided on the positioning member and the polishing wheel is coupled to the positioning member to be opposite to the threaded section. The threaded section is set through the track slot to threadingly engage the locking knob in a releasable and re-tightenable manner so as to allow for position adjustment of the polishing assembly with respect to the track slot. The polishing assembly can thus be positionable to oppose a scratch formed on the disc.

Abstract: The invention relates to a method and a device for grinding cams of a camshaft (7) in a clamp with two grinding spindles (10, 11), wherein the cams or cam pairs are each arranged in a mirror image relative to the workpiece rotation axis (16), wherein the camshaft (7) is tensioned and rotated about the longitudinal axis thereof. In the device for carrying out the method, the camshaft (7) can be inserted into the workpiece receiver (6) from the side lying opposite the at least one back stay (15) by means of the loading device.

Abstract: A disc burnishing head includes an array of burnishing pads and a first and second side rail projecting from a bottom surface of a slider body. The side rails each have an inside surface facing the burnishing pads and an outside surface facing outward. The outside surface of at least the first side rail is serrated. The serrations define a plurality of teeth and notches on the outside surface of the first side rail for cutting, cleaning, and conditioning defects from the surface of a disc.

Abstract: Disclosed are devices and methods for chemical and mechanical polishing of the edge of a semiconductor substrate that includes a protruding residual topography in a peripheral region of the substrate resulting from a layer transfer process based on an ion implantation step, a bonding step and a detachment step, such as Smart-Cut™. To be able to remove this step-like region, exemplary devices include a polishing pad, wherein the polishing pad is arranged and configured such that its cross section in a plane perpendicular to the surface of a substrate holder is curved. The disclosure furthermore relates to a pad holder used certain exemplary devices and methods for polishing a semiconductor substrate that has a protruding residual topography.

Abstract: Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

Abstract: A tribological system including: a tribological workpiece having a working surface adapted for moving relative to a counter-surface in a presence of a lubricant, in a load-bearing environment, the working surface for disposing generally opposite the counter-surface, the working surface having: (i) a metal surface layer; (ii) a plurality of organic particles incorporated in the metal surface layer, and (iii) a plurality of inorganic particles incorporated in the working surface, the inorganic particles having a Mohs hardness of at least 8.

Abstract: A burnishing head comprises at least two rails, each rail having an inner wall and an outer wall. The outer walls are at an angle relative to one another and relative to a central axis of the burnishing head. This angle permits the burnishing head to exhibit improved recovery time if it contacts a disk being burnished. The rail walls are vertical, and the corner between the rail walls and the top surface of the rails is sharp.

Abstract: A hybrid burnishing head for processing of surfaces of hard disk media comprises a solid body including a first major surface and a second, opposed major surface comprising a burnishing surface including first and second surface portions, wherein the first surface portion is configured for providing air bearing stability and flyability of the head over the media surface, the second surface portion is configured for providing burnishing of a media surface, and the first and second surface portions are operatively decoupled for simultaneously providing optimized air bearing stability/flyability and burnishing aggressiveness for a particular application.

Abstract: A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face.

Abstract: Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.

Abstract: The present invention relates to a quill to be used to superabrasively machine complex shapes, such as airfoil shapes, into a substrate. The quill has a shaft portion, an enlarged head portion adjacent the shaft portion, and a tapered grinding portion adjacent the enlarged head portion. The tapered grinding portion has a layer of grit material selected from the group consisting of diamonds and cubic boron nitride thereon. In a preferred embodiment, the quill is a vitrified or plated cubic boron nitride quill on the grinding portion. A method of using the tool is also disclosed.

Abstract: An optical disc repairing device is mounted on a repairing machine base to perform cleaning, maintenance and repair of the optical disc. The repairing device includes a movement transmitting element, a connecting element mounted on the movement transmitting element, a resilient piece mounted between the movement transmitting element and the connecting element, a carrier element mounted on the connecting element, and a repair element mounted on the carrier element. When the optical disc rotates, in association with a rotation of the repairing device, the scratched surface of the optical disc is polished until a surface without defects is obtained to proper reflection of the laser beam for data access from the optical disc.

Abstract: A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face.

Abstract: When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.

Abstract: A hard machining process uses a cylindrical tool (21) of ceramic or other hard machining material of comparatively low cost that provides a circular cutting edge to be engaged in cutting relation with hardened workpiece (20) to be machined. As tool cutting edge wear occurs, the tool (21) is rotated through a small angle to bring into contact with the workpiece (20) a fresh portion of the cutting edge. It is not necessary to rotate that tool (21) sufficiently to effect replacement of the entire cutting edge portion in engagement with the tool. Sufficient angular movement of the tool is made to replace that of the cutting edge that has the greatest effect on the finish of the machined workpiece (20), which is the cutting location where the removed chip is thinnest.

Abstract: A superfinishing method of a tapered roller bearing, including the steps of: rotating an outer ring of the tapered roller bearing about a center axis thereof; inserting a straight-shaped superfinishing stone from a front face of outer ring; and slidingly contacting a leading end face of the superfinishing stone with a taper-shaped raceway surface formed in an inner peripheral surface of the outer ring to thereby superfinish the raceway surface. The superfinishing stone is inclined outwardly of the front face of outer ring with respect to a vertical line of the raceway surface.

Abstract: The invention relates to a device for the finishing treatment of shaft workpieces, in particular crankshafts and camshafts. The device comprises a carrier, at least one jaw for exerting contact pressure on the workpiece, and a linear guide for guiding the jaw. The linear guide is supported by a transverse guide to form a cross guiding system which follows the rotational motion of the workpiece by revolving around its axis of rotation. The transverse guide contains a main carriage guided on the carrier. The main carriage is radially aligned with respect to the axis of rotation of the workpiece. The main carriage has a fork-shaped head facing towards the side of the workpiece. A guide rail for the linear guide is chucked between the between the legs of the fork-like head.

Abstract: A disc burnishing system configured to contact and level irregularities located on a surface of a disc is provided. The system includes a motor to rotate the disc and an armature. A slider is carried on the armature over the surface of the disc. The slider includes at least one raised air bearing rail disposed on and extending from a bottom surface that faces the disc. At least one burnish pad is disposed on the bottom surface and extends towards the disc. Each burnish pad is spaced apart from each raised air bearing rail. In accordance with one embodiment of the system, a defect detection apparatus is operably disposed relative the slider and is utilized to first detect an irregularity before it is burnished.

Abstract: A pair of edge polishing members (13a, 13b) each having a recess arcked working surface (22) are located on both sides of a diameter direction of a circular plate-shaped work (1) which is held by a chuck means (12) and is rotatable therewith, with the axes of the respective polishing members being inclined with respect to the axis (L) of the work (1), in a manner such that the working surface (22) of one edge polishing member (13a) gets in contact with the edge portion (2a) on the front side of the work (1), while the working surface (22) of the other edge polishing member (13b) gets in contact with the edge portion (2b) on the back side of the work (1), thereby polishing the two edge portions (2a, 2b).

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A method for mirror processing of an external surface of a long-sized metal piece, by which the external surface is mirror-polished with precision and high efficiency without a surface defect or so that stable dimensional accuracy, such as a roundness and improvement of yield in production, can be obtained. The method comprises the steps of clamping both ends of a long-sized metal piece, applying a positive electrical charge and rotating the metal piece, and moving the long-sized metal in the axial direction through an electrolytic integrated polishing apparatus for processing the external surface of a long-sized metal piece into a mirror surface.

Abstract: A method of truing a grinding wheel includes the steps of providing a material containing a metallic material selected from the group consisting of metals in groups IVA, VA and VIA of the periodic table and alloys thereof, rotating a grinding wheel having a treatment surface to be trued, and contacting the material with the treatment surface of the grinding wheel.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A brake pad operates to both resurface the braking surface of a rotor, and then automatically continue functioning as a normal brake pad. The rotor resurfacing is accomplished on the vehicle, employing all the components of a vehicle brake assembly, creating a perfect fit of the rotor and brake pad surfaces. In one embodiment, the brake pad includes a backing plate, a first plane of frictional material on the backing plate, and a second plane of frictional material mounted over the first plane of frictional material. The second plane of frictional material includes abrasive strips, each of the strips being separated from an adjacent one of the strips by a region of the first plane of frictional material. Preferably, the second plane of frictional material removes material from a rotor, when the brake pad is in frictional engagement with the rotor.

Abstract: A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.

Abstract: Apparatus and method for polishing one or both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel that is operable to rotate the mandrel. A first polisher assembly is provide that has a first polish pad for polishing the first side of the wafer and a second polish pad for polishing the second side of the wafer, and first means for moving the first and second polish pads into and out of engagement with the first and second sides of the wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel and a polishing mixture is dispensed on one or both of the sides of the semiconductor wafer. A first polish pad is brought into contact with the first side of the semiconductor wafer and a second polish pad is brought into contact with the second side of the semiconductor wafer such that the first and second polish pads are positioned in opposition.

Abstract: A spherical body grinding and polishing apparatus comprises: a rotary shaft having a spiral path groove in the outer cylindrical surface along which spherical bodies to be processed are moved, the rotary shaft being vertically movable and rotatable; and a housing having grinding and polishing surfaces on which the spherical surfaces of the spherical bodies moving along the path groove are slid. When spherical bodies such as silicon spherical bodies are supplied to the apparatus, the spherical bodies are rolled and moved along the spiral path groove formed in the outer cylindrical surface of the rotary shaft while sliding on the inner surface of the housing, so that the outer surfaces of the spherical bodies are ground and polished until the spherical bodies become high in sphericity.

Abstract: A holder for an abrasive element used to abrade the surface of a workpiece. The holder is made of an abrasive pad resiliently mounted upon a holder in a manner providing to the pad multiple degrees of freedom of motion.

Abstract: Method for producing drive belts with small rotation-angle error includes measuring the rotation-angle error of a given drive belt, and then physically altering part of the length of the given drive belt so that the rotation-angle error therein is substantially nullified.

Abstract: A flexible conditioning apparatus and method for uniformly conditioning a polishing surface of a pad used to remove undesirable irregularities from a silicon wafer and to achieve a planar condition of the polishing pad. In a preferred embodiment of the present invention, a roughening member comprising a plurality of point contacts, such as diamond particles, is adapted for movement into and out of engagement with the surface of the pad. A flexible member supporting the roughening member allows the roughening member to conform to the surface of the pad to achieve uniform polishing of the pad.

Abstract: A method of and apparatus for burnishing a surface of a magnetic disc of a disc drive are disclosed. The disc drive has a data head and an actuator supporting the head as the head flies above the surface of the disc. A controller causes the disc to be rotated at rates of rotation which will result in burnishing head fly heights which are less than a normal operational fly height of the head. An actuator controller controls the actuator to repeatedly move the head across a region of the disc during a burnishing time period. The head flies above the surface of the disc at the burnishing fly heights during the burnishing time period to thereby reduce asperities on the disc.

Abstract: A resurfacer for resurfacing a working surface of a foam pad used for polishing auto finishes, in particular, includes a base having a support surface for supporting a polishing pad while it is being driven by a polisher power unit with which the polishing pad is used for the actual polishing operation. The base surface has an abrading section made of, preferably, partially perforated thin steel so that sharp corners protrude a selected height above the base surface and a guide fence for guiding the polishing pad as it is moved across the abrading pad so that it is held true and square, until the polishing pad is provided with a new flat and square working surface. The support surface is of size so that it will support the entire polishing pad while the abrading pad has a width slightly more than one-half the diameter of the polishing pad so that the polishing pad is stably held and can be made true and flat.

Abstract: Polishing apparatus cuts and shapes a polishing pad to produce a polishing surface which minimizes pad runout and which can be contoured to better achieve desired polishing rates, pressures, and performance with respect to selected areas on a semiconductor wafer being processed with the polishing pad.

Abstract: A method of dressing a threaded grinding wheel comprising rotating the grinding wheel and dressing tool about their respective axes and bringing the tool into contact with a point on a flank of the grinding thread. The dressing tool is traversed along the width of the grinding wheel with the dressing tool maintaining contact with the point during the traversing to remove stock material at the point on the flank along the width of the grinding wheel. The method includes controlling the amount of stock material removed by the dressing tool during the traversing at the point whereby different amounts of stock may be removed in different axial sections along the grinding wheel width at the point thus varying the grinding profile at each section at the point of contact. The tool is traversed at successive points along the grinding thread profile to produce a different grinding profile at each section of the grinding wheel. A method of grinding spur and helical gears is also disclosed.

Abstract: A burnish head comprising a slider body having a single crystal diamond attached to a rear portion flies above the disk surface at a relatively low flying height when the disk is rotated at a high angular velocity. The diamond produces acoustic waves that cut or crack disk asperities, resulting in a highly-smooth disk surface suitable for near-contact or in-contact magnetic recording.

Abstract: The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.