Tool Cleaner Patents (Class 451/444)
  • Patent number: 10388534
    Abstract: A method of processing a plate-shaped workpiece that includes on a reverse side thereof a layered body containing metal which is formed in superposed relation to projected dicing lines includes the steps of holding the reverse side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a face side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered body, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered body along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 20, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kenji Takenouchi
  • Patent number: 9527116
    Abstract: A system includes a plurality of nozzles, a pump configured to pump a fluid through the nozzles, and a manifold configured to arrange the plurality of nozzles to substantially match a shape of a workpiece. Each nozzle of the plurality of nozzles is configured to impinge upon a section of the workpiece with the fluid.
    Type: Grant
    Filed: September 28, 2013
    Date of Patent: December 27, 2016
    Assignee: General Electric Company
    Inventors: Jonathan Matthew Lomas, Michelle Fullerton Simpson
  • Patent number: 9486893
    Abstract: Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: November 8, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chen, Rajeev Bajaj, Brian J. Brown, Robert T. Lum, Fred C. Redeker
  • Patent number: 9022840
    Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 5, 2015
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Charles Dinh-Ngoc, Srinivasan Ramanath, Eric M. Schulz, Jianhui Wu, Thomas Puthanangady, Ramanujam Vedantham, Taewook Hwang
  • Patent number: 9017146
    Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: April 28, 2015
    Assignees: Fujikoshi Machinery Corp., National Institute of Advanced Industrial Science and Technology
    Inventors: Yoshio Nakamura, Yoshio Otsuka, Takashi Okubo, Kazutaka Shibuya, Takayuki Fuse, Shiro Hara, Sommawan Khumpuang, Shinichi Ikeda
  • Publication number: 20150079885
    Abstract: A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.
    Type: Application
    Filed: November 20, 2014
    Publication date: March 19, 2015
    Inventor: FENG CHEN
  • Patent number: 8974270
    Abstract: CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: March 10, 2015
    Inventor: Chien-Min Sung
  • Patent number: 8951099
    Abstract: A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: February 10, 2015
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Jianhui Wu, Richard W. J. Hall, Eric M. Schulz, Srinivasan Ramanath
  • Publication number: 20140323017
    Abstract: Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 30, 2014
    Inventors: Jianshe Tang, Thomas H. Osterheld, Fred C. Redeker, Gregory E. Menk
  • Patent number: 8869787
    Abstract: A hand-operated implement has a guide bar on which is fitted a cutting chain for cutting mineral and metal materials. The cutting chain is driven around the guide bar by a chain sprocket. The chain sprocket is arranged in a chain sprocket chamber which is delimited by a chain sprocket cover. A cutting element has an outer side facing a sidewall of the chain sprocket cover which lies in a first notional plane. The distance between the sidewall and the first notional plane measured perpendicular to the first notional plane and centrally between the top of the cutting element and the peripheral wall is less than approximately 0.8 cm over at least 30% of the section between a second notional plane containing the central axis of a fixing bolt on the guide bar and the exit opening at which the cutting chain leaves the chain sprocket chamber.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: October 28, 2014
    Assignee: Andreas Stihl AG & Co. KG
    Inventors: Hannah Thölking, Horst Otterbach, Helmut Zimmermann, Jens Kreutzer, Jonas Lank
  • Patent number: 8845395
    Abstract: Disclosed is an apparatus for injecting slurry onto the polishing pad surface of a chemical mechanical polishing (CMP) tool. The disclosed apparatus includes a rectilinear shaped injector bottom, where multiple slots are created in the top surface of the injector bottom, allowing the injector bottom to flex and to conform to the polishing pad profile. CMP slurry or components thereof are introduced through one or more top surface openings, travel through the injector body, and exit through a slit or bottom surface opening. The slurry is spread into a thin film by the injector, and is introduced at the gap between the surface of the polishing pad and the wafer, along the leading edge of the wafer, in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: September 30, 2014
    Assignee: Araca Inc.
    Inventors: Leonard John Borucki, Yasa Adi Sampurno, Ara Philipossian
  • Patent number: 8845398
    Abstract: This disclosure is directed to a chemical mechanical polisher and a polishing pad component thereof. The chemical mechanical polisher comprises a polishing platen having a flat surface, and the polishing platen comprises: an electromagnet disposed under the flat surface and configured to fix a polishing pad base on the flat surface; and a switch configured to control the power-on and power-off of the electromagnet. The polishing pad component comprises a polishing pad base, and the polishing pad base is formed of a ferromagnetic material. The chemical mechanical polisher of this disclosure and the polishing pad component thereof can make polishing pad replacement easy, and can also save polishing pads and thus reduce the consumable cost of the chemical mechanical polishing.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: September 30, 2014
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Feng Chen
  • Patent number: 8808063
    Abstract: A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an edge of the polishing platen, applying a voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increases the removal rate of the polishing byproducts.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: August 19, 2014
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Feng Chen, Mingqi Li
  • Patent number: 8808061
    Abstract: The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate with supplying slurry thereto, by using a grind stone, comprises the steps of: cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad; and dressing the polishing pad by moving a dressing grind stone, in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: August 19, 2014
    Assignee: Fujikoshi Machinery Corp.
    Inventor: Harumichi Koyama
  • Patent number: 8777699
    Abstract: Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: July 15, 2014
    Assignee: RiteDia Corporation
    Inventor: Chien-Min Sung
  • Patent number: 8771043
    Abstract: A rotary dresser is provided with a roll having an outer circumferential surface which includes an arc portion or inclined portion differing in diameter in dependence on the axial position thereof, and a plurality of diamond abrasive grains embedded on the outer circumferential surface of the roll. The number of the diamond abrasive grains in the circumferential direction is fixed even at any axial position on the outer circumferential surface of the roll.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: July 8, 2014
    Assignees: Toyoda Van Moppes Ltd., JTEKT Corporation
    Inventors: Sadao Sakakibara, Shinji Soma
  • Publication number: 20140154958
    Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 5, 2014
    Applicants: National Institute of Advanced Industrial Science and Technology, Fujikoshi Machinery Corp.
    Inventors: Yoshio NAKAMURA, Yoshio OTSUKA, Takashi OKUBO, Kazutaka SHIBUYA, Takayuki FUSE, Shiro HARA, Sommawan KHUMPUANG, Shinichi IKEDA
  • Patent number: 8721401
    Abstract: A method for cleaning a polishing pad includes dispensing a first amount of deionized water on the polishing pad; cleaning the polishing pad with an acidity/alkalinity solution after dispensing the first amount of deionized water on the polishing pad; rinsing the polishing pad with a second amount of deionized water after cleaning the polishing pad with the acidity/alkalinity solution; removing the acidity/alkalinity solution from the polishing pad. In a subsequent CMP process, the method includes polishing a GST material device for obtaining an improved performance of the GST material device.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: May 13, 2014
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Li Jiang, Mingqi Li
  • Publication number: 20140099870
    Abstract: A substrate grinding apparatus according to an exemplary embodiment of the present invention includes a grinding wheel grinding an object substrate, a nozzle unit spraying cooling water to the object substrate and the grinding wheel in a plurality of directions, and a cooling water controller connected to the nozzle unit and controlling spray speed and pressure of the cooling water, in which the nozzle unit includes a cleansing nozzle cleansing the grinding wheel, a cooling nozzle cooling the grinding wheel, and a surface protecting nozzle cooling the object substrate.
    Type: Application
    Filed: February 28, 2013
    Publication date: April 10, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventors: In Ho LEE, Ee Hyun An, Jun-Hee Lee, Sang-Hoon Back, Jung Kun Shin
  • Patent number: 8647174
    Abstract: Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces (25) of a polishing pad shaping jig (21) are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads (16, 17) before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (16A and 17A) of the respective polishing pads (16, 17). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: February 11, 2014
    Assignee: Sumco Corporation
    Inventor: Hiroshi Takai
  • Patent number: 8641480
    Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: February 4, 2014
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Masayuki Nakanishi, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota, Takeshi Nishioka
  • Patent number: 8622787
    Abstract: The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: January 7, 2014
    Inventor: Chien-Min Sung
  • Patent number: 8562392
    Abstract: A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing pad, and a spraying mechanism (constructed, for example, from a washing water nozzle) that sprays liquid to the conditioning disc positioned at the standby position so as to wash or wet the conditioning disc.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: October 22, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Masafumi Shiratani, Shigeyuki Yoshida, Osamu Ito
  • Patent number: 8557132
    Abstract: A system of cleaning a CMP pad used for removing copper from a substrate, the system comprising an abrasive cleaning pad, a cleaning solution delivery system that delivers a cleaning solution, an analyzing system that monitors the characteristics of the cleaning solution optically and chemically, and a carriage that allows the analyzing system to monitor the cleaning solution at a plurality of locations on the CMP pad. The use of the abrasive cleaning pad and the cleaning solution removes contaminants from the CMP pad, and the contaminants are dissolved in the cleaning solution. By measuring the concentration of contaminants in the cleaning solution, the condition of the CMP pad can be monitored. To measure the concentration of the contaminants, changes in the refractive index and absorption of light in the cleaning solution are measured, wherein the refractive index and absorption depend on the concentration of the contaminants.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: October 15, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Dinesh Chopra, Scott Meikle
  • Patent number: 8545634
    Abstract: A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to dispense a fluid on the conditioning device; and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal at the conditioning device while the fluid dispenser is dispensing the fluid on the conditioning device.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: October 1, 2013
    Assignees: Freescale Semiconductor, Inc., STMicroelectronics SRL, STMicroelectronics (Crolles 2) SAS
    Inventors: Jean-Marc Lafon, Silvio Delmonaco, Sebastien Petitdidier
  • Patent number: 8528913
    Abstract: A dressing roll mounting device for mounting a dressing roll to a dresser shaft of a grinding wheel dressing unit is provided. The dressing roll mounting device includes a mounting sleeve to be positioned at a free end of the dresser shaft, the outer face of the mounting sleeve being provided with a conical mounting region serving as a centering and pushing-on aid during mounting of the dressing roll to the dresser shaft. The maximum outside diameter of the conical mounting region is smaller than or corresponding to a dressing roll reception diameter of the dresser shaft.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: September 10, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Dirk Eggert, Jan-Marc Lischka
  • Patent number: 8480458
    Abstract: A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: July 9, 2013
    Assignee: White Drive Products, Inc.
    Inventor: Hollis N. White, Jr.
  • Patent number: 8465347
    Abstract: A retractable water dispenser arm system for a grinder/polisher includes a flexible hose formed, in part in a loop and affixed at at least one location to a base of the grinder polisher. A spout is mounted to an end of the flexible hose. A biased tension arm engages the hose at the loop, and is moveable, along with movement of the hose, to maintain the hose in tension. The biased tension arm includes a roller over which the hose traverses. A mount on the base is configured to receive the spout and is further configured for traverse of the hose therethrough. The mount includes a mount roller operably mounted thereto for guiding the hose through the mount.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: June 18, 2013
    Assignee: Illinois Tool Works Inc.
    Inventor: Michael F. Hart
  • Publication number: 20130130597
    Abstract: A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Inventors: James William Brown, Keith Mitchell Hill, Siva Venkatachalam, Edward Zhmayev, Naiyue Zhou
  • Publication number: 20130023186
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 24, 2013
    Inventors: Yasuyuki MOTOSHIMA, Toru Maruyama, Hisanori Matsuo
  • Publication number: 20120309278
    Abstract: A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an edge of the polishing platen, applying a voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increases the removal rate of the polishing byproducts.
    Type: Application
    Filed: November 30, 2011
    Publication date: December 6, 2012
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: FENG CHEN, Mingqi Li
  • Patent number: 8317575
    Abstract: An implement for cleaning mineral ring build up in a toilet bowl. The inventive device is an attachment driven by a cordless drill. It consists of a ball covered with a non abrasive material attached to a shaft which rotates the ball to remove mineral ring build up on toilet bowls.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: November 27, 2012
    Inventor: Charles Neil Carr
  • Patent number: 8313359
    Abstract: A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall. The platen is positioned lower than the inwardly-extending upper portion. The first brush brushes the side wall. The first brush is fixed to a side surface of the platen. The second brush brushes a side surface of the platen. The second brush is fixed to the bottom wall. The polishing pad is attached to the platen. The carrier presses a workpiece to be polished against the polishing pad. The slurry supplier supplies a slurry onto the polishing pad.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: November 20, 2012
    Assignee: Elpida Memory, Inc.
    Inventor: Toshiya Saito
  • Publication number: 20120167924
    Abstract: A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.
    Type: Application
    Filed: August 17, 2011
    Publication date: July 5, 2012
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: FENG CHEN
  • Patent number: 8096858
    Abstract: The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%?Ni+Fe?90% (provided that 0?Fe/(Ni+Fe)?0.4), 1%?Cr?25%, 2%?Si+B?15% (provided that 0?B/(Si+B)?0.8), and 0.1%?P?8%.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: January 17, 2012
    Assignee: Nippon Steel Materials Co., Ltd.
    Inventors: Hiroaki Sakamoto, Toshiya Kinoshita
  • Publication number: 20110312254
    Abstract: The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate with supplying slurry thereto, by using a grind stone, comprises the steps of: cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad; and dressing the polishing pad by moving a dressing grind stone, in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 22, 2011
    Inventor: Harumichi KOYAMA
  • Patent number: 8002610
    Abstract: To provide a technique for rotating a plurality of carriers 500 between an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works 400. The work 400 is merged with the carrier 500 outside a polishing apparatus main body 110. The work 400 is supplied onto a lower rotary surface plate 111 of the polishing apparatus main body 110 while remaining merged with the carrier 500. The present invention enables the work 400 on the lower rotary surface plate 111 to be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of works 400 to have both surfaces thereof polished, on the lower rotary surface plate 111. The present invention enables the works 400 to be automatically ejected from the lower rotary surface plate 111.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: August 23, 2011
    Assignee: Sumitomo Mitsubishi Silicon Corporation
    Inventors: Akira Horiguchi, Ken Isobe, Heigo Tanaka, Tomio Fukushima, Kiyohide Murata, Tsuneo Takeda, Yoshiaki Uzu, Hiroshi Matsumoto
  • Publication number: 20110143640
    Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 16, 2011
    Inventor: Rajeev Bajaj
  • Publication number: 20110081848
    Abstract: A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond Implant Array Mapping & Arrangement Process). The last step is providing a second fixing layer onto the first fixing base and the exposed surface of the substrate. The first fixing base and the second fixing layer are used for fixing the abrasive grits on the substrate. Moreover, a grinding tool is provided in the present invention.
    Type: Application
    Filed: October 5, 2009
    Publication date: April 7, 2011
    Inventor: Chia-Pei CHEN
  • Publication number: 20100285723
    Abstract: A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 11, 2010
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Liang Lin, Chien Ling Hwang, Jean Wang, Chen-Hua Yu
  • Patent number: 7815495
    Abstract: A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: October 19, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Jimin Zhang, James C. Wang, Thomas H. Osterheld, Yutao Ma, Steven M. Zuniga, Jin Yi
  • Publication number: 20100248597
    Abstract: The equipment for cleaning polishing cloth is capable of increasing pressure of washing water received by the polishing cloth, securely removing deposits from the polishing cloth and improving polishing efficiency. The equipment is used in a polishing apparatus, in which a work piece is pressed onto the polishing cloth adhered on a polishing plate and the work piece is relatively moved with respect to the polishing plate with supplying slurry to the polishing cloth so as to polish the work piece. The equipment comprises a nozzle unit having a nozzle capable of spraying high-pressure washing water toward the polishing cloth so as to clean the polishing cloth. The nozzle is a straight nozzle capable of linearly spraying the washing water and perpendicularly spraying the washing water with respect to the polishing cloth.
    Type: Application
    Filed: March 26, 2010
    Publication date: September 30, 2010
    Inventor: Kentaro SAKATA
  • Publication number: 20100062696
    Abstract: A retractable water dispenser arm system for a grinder/polisher includes a flexible hose formed, in part in a loop and affixed at at least one location to a base of the grinder polisher. A spout is mounted to an end of the flexible hose. A biased tension arm engages the hose at the loop, and is moveable, along with movement of the hose, to maintain the hose in tension. The biased tension arm includes a roller over which the hose traverses. A mount on the base is configured to receive the spout and is further configured for traverse of the hose therethrough. The mount includes a mount roller operably mounted thereto for guiding the hose through the mount.
    Type: Application
    Filed: July 13, 2009
    Publication date: March 11, 2010
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventor: Michael F. Hart
  • Patent number: 7674156
    Abstract: A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and a nozzle block coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad, the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid, and pressure-injecting the mixed twin-fluid on the polishing pad. Accordingly, cleaning liquid is pressurized so as to be rapidly injected on a polishing pad so that slurry particles and alien substances on the polishing pad are completely removed. Furthermore, wafer scratch can be prevented and the life of the polishing pad can also be increased.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: March 9, 2010
    Assignee: K.C. Tech Co., Ltd
    Inventors: Jun Ho Son, Sung Bum Seo
  • Publication number: 20100035525
    Abstract: Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 11, 2010
    Inventors: SAMEER Deshpande, Shou-Sung Chang, Hung Chih Chen, Roy C. Nangoy, Stan D. Tsai
  • Patent number: 7641538
    Abstract: An abrasive article includes a plurality of abrasive particles securely affixed to a substrate with a corrosion resistant matrix material. The matrix material includes a sintered corrosion resistant powder and a brazing alloy. The brazing alloy includes an element which reacts with and forms a chemical bond with the abrasive particles, thereby securely holding the abrasive particles in place. A method of forming the abrasive article includes arranging the abrasive particles in the matrix material, and applying sufficient heat and pressure to the mixture of abrasive particles and matrix material to cause the corrosion resistant powder to sinter, the brazing alloy to flow around, react with, and form chemical bonds with the abrasive particles, and allow the brazing alloy to flow through the interstices of the sintered corrosion resistant powder and form an inter-metallic compound therewith.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: January 5, 2010
    Assignee: 3M Innovative Properties Company
    Inventor: Brian D. Goers
  • Publication number: 20090275274
    Abstract: The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%?Ni+Fe?90% (provided that 0?Fe/(Ni+Fe)?0.4), 1%?Cr?25%, 2%?Si+B?15% (provided that 0?B/(Si+B)?0.8), and 0.1%?P?8%.
    Type: Application
    Filed: August 17, 2006
    Publication date: November 5, 2009
    Inventors: Hiroaki Sakamoto, Toshiya Kinoshita
  • Publication number: 20090264054
    Abstract: A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid.
    Type: Application
    Filed: July 1, 2009
    Publication date: October 22, 2009
    Applicant: FUJITSU MICROELECTRONICS LIMITED
    Inventors: Tetsuya SHIRASU, Katsuhiko AOYAMA, Fumihiko AKABOSHI, Kunichirou GOTOH
  • Publication number: 20090247054
    Abstract: A method of planarizing a semiconductor structure comprises moving a conditioning element on a surface of a polishing member, rotating the semiconductor structure relative to the polishing member against the surface of the polishing member, and rinsing the surface of the polishing member and the semiconductor structure. While the conditioning element is moved over the surface of the polishing member and the semiconductor structure is rotated against the surface of the polishing member, slurry is directed onto the polishing member. The step of rinsing comprises contacting the conditioning element to the surface of the polishing member.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicants: TEXAS INSTRUMENTS DEUTSCHLAND GMBH, TEXAS INSTRUMENTS INCORPORATED
    Inventors: Eugene C. Davis, Joerg Walter Haussmann, Marcus Paul Haecki
  • Publication number: 20090239454
    Abstract: A CMP conditioner having excellent corrosion resistance around abrasive grains includes a grindstone base having, formed on one side, an abrasive grain layer including abrasive grains fixed in a metallic bonding phase treated to form a first protective layer comprising an oxide on the surface of the metallic bonding phase of the abrasive grain layer by the sol-gel method. Subsequently, an aerosol obtained by dispersing fine particles of a brittle material in a gas is jetted and caused to strike on the surface of the first protective layer to form a second protective layer comprising a thick oxide film.
    Type: Application
    Filed: September 21, 2007
    Publication date: September 24, 2009
    Applicants: Mitsubishi Materials Corp., Toto Ltd.
    Inventors: Tetsuji Yamashita, Naoki Rikita, Takashi Kimura, Masaharu Ogyu, Hiroaki Ashizawa, Hironori Hatono, Masahiro Tokita