Abstract: A linear chemical mechanical polishing apparatus equipped with a brush means and a solvent spray means for cleaning the polishing pad during a chemical mechanical polishing process is described. The brush means may be provided in a cylindrical, tubular shape equipped with bristle for cleaning the surface grooves on the polishing pad and thus, removing large contaminating particles to prevent the particles from scratching the wafer surface. The solvent spray means is used to spray a jet of solvent such as deionized water onto the brush means and the polishing pad for removing debris generated by the polishing process and the cleaning process.

Abstract: An apparatus and a method for retaining moisture on a polishing pad in chemical mechanical polishing during machine idling, i.e. during machine maintenance or repair are described. The apparatus is constructed of a circular disc in a clam-shell configuration having two halves for easy mounting or dismounting from a polishing pad. The circular disc may further include a protruded top portion to accommodate a polishing head when the chemical mechanical polishing apparatus is in a stand-by mode. The circular disc should have a diameter sufficiently large to cover an entire surface area of a polishing pad, while a peripheral edge of the circular disc overlaps a periphery of the polishing pad. The apparatus further includes a moisture retention means mounted on an inner surface of the circular disc for providing a moisturizing environment to the surface of the polishing pad. The moisture retention means can be suitably provided in brushes formed of moisture retaining bristles or in a cellulosic material layer.

Abstract: Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizing pad and moving the substrate assembly across the planarizing surface through a planarizing zone. The method also includes replacing at least a portion of a used volume of planarizing solution on the planarizing surface with fresh planarizing solution during the planarization cycle of a single substrate assembly. The used planarizing solution can be replaced with fresh planarizing solution by actively removing the used planarizing solution from the pad with a removing unit and depositing fresh planarizing solution onto the pad in the planarizing zone.

Abstract: A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface. The method includes positioning a sonic energy generator adjacent to the back surface of the polishing pad, and generating sonic energy through the back surface of the polishing pad. The apparatus includes a sonic energy generator adapted to be positioned adjacent the back surface, the sonic energy generator including a transducer connected to a contact member, wherein the sonic energy generator is adapted to transmit sonic energy in a direction through the back surface and to the polishing surface of the polishing belt.

Abstract: A chemical-mechanical polishing pad conditioning system and method. The system includes a conditioning device that may be used to condition a polishing pad. The system may also include a first conduit for introducing a chemical reagent onto the polishing pad, a second and third conduit for introducing the chemical reagent and a rinsing fluid respectively onto a conditioning surface of the.conditioning device or a storage apparatus of the conditioning device. The method includes introducing the chemical reagent onto the polishing pad during the pad conditioning process. The chemical reagent may further be introduced onto the storage apparatus or be introduced onto the conditioning surface of the conditioning device. The rinsing fluid may be introduced onto the polishing pad, the storage apparatus, or the conditioning surface.

Abstract: An arrangement for planarizing a surface of a semiconductor wafer. The arrangement includes a planarizing member having a planarizing surface configured to be (i) positioned in contact with and (ii) moved relative to the surface of the semiconductor wafer so as to remove material from the surface of the semiconductor wafer such that the surface of the semiconductor wafer is planarized. The arrangement also includes an adherence promoting ligand chemically bonded to the planarizing surface of the planarizing member. The arrangement further includes an abrasion particle chemically bonded to the adherence promoting ligand such that the abrasion particle is attached to the planarizing surface of the planarizing member. The arrangement also includes a conditioning bar having a conditioning portion positioned in contact with a wafer track defined on the planarizing member. The conditioning portion is configured so that the conditioning portion extends completely across the wafer track.

Abstract: A pedestal of a load-cup for supporting wafers loaded onto and being unloaded from a chemical mechanical polishing (CMP) apparatus includes a pedestal plate, and a pedestal film which extends over only a limited area at the upper surface of the pedestal plate. This area includes the regions directly around the fluid ports provided in the pedestal plate for vacuum-chucking the wafers and spraying deionized water. The pedestal plate may have a cross-shaped part, the entirety of which bears the fluid ports. The pedestal film may include annular members each extending around only a respective one of the fluid ports, or one or more members each extending radially around several of the fluid ports. By offering a rather limited contact area to the wafer supported on the pedestal, the pedestal film reduces the amount of contaminants which could be transferred to the wafer surface in contact therewith.

Abstract: The present invention provides a polishing head, for use with a polishing apparatus. In one embodiment, the polishing head includes a carrier head assembly, and a retaining ring having a surface positionable adjacent a polishing pad and couplable to the carrier head assembly and configured to retain a semiconductor wafer therein, the retaining ring having a slurry conduit located therethrough to provide a flow of slurry to the polishing pad.

Abstract: A method of manufacturing a semiconductor device employing a polishing pad conditioner that directs a fluid stream at a polishing pad to remove accumulated material from the pad. The fluid stream may contact a large area of the polishing pad or a smaller area where the fluid stream is moved to condition different areas of the polishing pad. The fluid stream may include abrasive particles to promote the removal of the accumulated materials. The velocity of the fluid stream may be increased or decreased to promote removal of the accumulated materials. In yet another embodiment, the present invention is directed to a process for manufacturing an integrated circuit using a CMP process where the pad has been conditioned using the fluid stream. The present invention is also directed to a chemical mechanical planarization system including a pad conditioner.

Abstract: A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (58) comprises shoulder screws (50), polymer bearings (51), a static plate (52), a wave spring (54), and a floating plate (55). Wave spring (54) is placed between static plate (52) and floating plate (55). The shoulder screws (50) connect through the static plate (52) and fasten to the floating plate (55) to hold the wave spring (54) in a preloaded condition. The polymer bearings (51) prevent the shoulder screws (50) from contacting the static plate (52). Wave spring (54) allows the floating plate (55) to move in a non-parallel position to the static plate (52) for angular compensation in the pad conditioning process.

Abstract: An object of the present invention is to provide a lapping machine in which abrasive grains can be efficiently and completely removed from a lapping plate. In the lapping machine of the present invention, a lapping plate has a lapping face and rotates about a rotary shaft. A moving member has a wiping face extended in a longitudinal and moves, in a plane parallel to the lapping face of the lapping plate, in the direction perpendicular to the wiping face. A driving mechanism moves the moving member. With this structure, the moving member securely catches and removes foreign substances from the lapping plate. The foreign substances left can be completely removed in a short time and the working efficiency of the lapping steps can be highly improved.

Abstract: A system for conditioning rotatable polishing pads used to planarize and polish surfaces of thin film integrated circuits deposited on semiconductor wafer substrates, microelectronic, and optical system. The system has a pad conditioning apparatus, process fluids, a vacuum capability to pull waste material out of the conditioning pad, self-contained flushing means, and a piezo-electric device for vibrating the pad conditioning apparatus.

Abstract: A polishing surface cleaning method and apparatus are capable of effectively removing the polishing residue from the polishing surface of a polishing table in a polisher by using a minimal amount of cleaning liquid. In the polisher, a workpiece to be polished is pressed against the polishing surface of the polishing table to polish the workpiece by relative motion between the polishing surface and the workpiece. The polishing surface cleaning apparatus uses mixing spray nozzles for mixing together a cleaning liquid and a gas and spraying the resulting fluid mixture on the polishing surface to clean it.

Abstract: A polishing apparatus has a plurality of polishing stations for polishing materials to be polished and a plurality of cleaning stations for cleaning the materials being polished, the polishing stations and the cleaning stations being alternately arranged; and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations and the cleaning stations successively. The arm includes a polishing head for holding the material being polished. Each of the cleaning stations comprises a retainer stand on which the material being polished is placed, and a cleaning device for cleaning the material being polished in a state held by the polishing head, cleaning the material being polished in a state placed on the retainer stand, and cleaning the polishing head in a state where the material being polished is separated from the polishing head.

Abstract: A chemical mechanical polishing apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, a washer having a cleaning device; and a dresser. The dresser comprises a bottom disk contacting the polishing pad. The dresser can move between the polishing pad and the washer. When the dresser moves into the washer, a diamond zone on the bottom disk cleans the polishing pad, and the cleaning device cleans the diamond zone.

Abstract: The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride(PcBN). The abrasive particles are brazed to a substrate which may be then coated with an additional anti-corrosive layer. The anti-corrosive layer is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate, the abrasive particles extend for a uniform distance away from the substrate, allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions.

Abstract: A tool for conditioning a wafer polishing pad includes a body having a recess in the upper surface thereof. A holder has a portion extending into the recess in the body. An elastomeric member between the holder and the body acts as a gimble permitting planar contact of the tool with the pad.

Abstract: A method and a configuration for conditioning a polishing pad surface are described. The method includes measuring a rotation table current or voltage as an input for a motor driving the rotation of the polishing pad versus a rotating conditioning head. The electrical power input is used as a measure of an actual abrasion effective in regenerating the polishing pad. Since the polishing pad commonly deteriorates by repeated usage, i.e. debris settles down onto its surface, the abrasion efficiency decreases. The method issues a warning signal, in response to the electrical power input exceeding a limit, to take actions for maintaining the uniformity of the conditioning process. The polishing pad rotation can be accelerated or the conditioning head pressure force or rotation can be increased in response to the warning signal. Therefore, the polishing pad can be conditioned.

Abstract: A semiconductor wafer processing system, more specifically, a chemical mechanical planarization system including a polishing media reconditioning system. In one embodiment, the polishing media reconditioning system comprises at least a first and second conditioning roller that contact a working surface of a polishing media while rotating in opposite directions. Other embodiments include conditioning plates disposed on a carrier that includes the polishing head, a conditioning roller or disk that traverses the surface of the polishing media and a conditioning disk that conditions the polishing media while retained in the polishing head. Alternatively, the polishing media may be conditioned utilizing the devices embodied above remotely from the processing system.

Abstract: A polishing surface cleaning method and apparatus are capable of effectively removing the polishing residue from the polishing surface of a polishing table in a polisher by using a minimal amount of cleaning liquid. In the polisher, a workpiece to be polished is pressed against the polishing surface of the polishing table to polish the workpiece by relative motion between the polishing surface and the workpiece. The polishing surface cleaning apparatus uses mixing spray nozzles for mixing together a cleaning liquid and a gas and spraying the resulting fluid mixture on the polishing surface to clean it.

Abstract: A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.

Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a feed roller located in a cavity in the platen, a take-up roller, and a generally linear polishing sheet releasably secured to the platen to rotate with the platen. The polishing sheet has an exposed portion extending over a top surface of the platen for polishing the substrate, an unused portion wound around the feed roller, and a used portion wound around the take-up roller. A gas source direct a purge gas into the cavity containing the feed roller.

Abstract: The object of the present invention is to provide a polishing apparatus having a grinding member in a compact design that can provide high efficiency for both polishing and dressing operations, and prevents tilting of the grinding member even if the rotation axis thereof is moved away from the outer periphery of the object. A polishing apparatus for an object, comprises: an object holder for holding an object to be polished, such that a surface of the object to be polished faces upward; a dresser disk holder for holding a dresser disk for dressing, such that a dressing surface thereof faces upward; and a grinding member for polishing the object, and for being dressed by the dresser disk, by pressing and sliding the grinding member relative to the object and the dresser disk.

Abstract: A conditioning disk including a unitary thermoplastic polymer sheet material cut a unitary circular plate formed with gear teeth along its circular edge, and formed with block form protrusions that are impelled in a sweeping motion by rotation of the unitary plate as a planetary gear in meshed engagement with a sun gear and a ring gear of a polishing apparatus.

Abstract: An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

Abstract: A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.

Abstract: A method and apparatus for conditioning a fixed abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member formed from glass, at least one collimated hole structure located within the conditioning member, wherein the collimated hole structure forms a channel, and wherein each channel is arranged in a generally parallel orientation with respect to any other channel. The method includes providing at least one conditioning member formed with at least one capillary tube array, wherein the capillary tube array forms multiple channels within the conditioning member, pressing the conditioning member against the fixed abrasive polishing pad, and moving the fixed abrasive polishing pad. In one embodiment, the method further comprises rotating the conditioning member to simulate the polishing of at least one semiconductor wafer.

Abstract: Conditioning systems and methods for conditioning polishing pads used in mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies. In one aspect of the invention, a conditioning system includes a conditioning element or conditioning member having a conditioning face configured to engage a polishing pad. The conditioning face preferably includes a bonding medium covering at least a portion of the conditioning face and a plurality of conditioning particles attached to the bonding medium. The conditioning system also includes a corrosion-inhibiting unit that can be coupled to the conditioning element or a liquid on the polishing pad. The corrosion-inhibiting unit retards corrosion of the bonding medium in the presence of chemicals on the polishing pad that would otherwise corrode the bonding medium.

Abstract: A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.

Abstract: A method and apparatus for chemical mechanical polishing a semiconductor wafer by providing a novel high pressure mixture of gas and liquid in a pulsation mode for eliminating residual slurry, by-products, and slurry abrasive particles on or in the polishing pad.

Abstract: The present invention provides a substrate cleaning apparatus which allows an end face and/or a bevel face of a substrate to be scrub-cleaned in a simple and effective manner. The apparatus comprises a plurality of rotatable substrate rotating rollers 12 and 14 for gripping the periphery of a substrate and rotating the substrate, a cleaning roller 48 capable of rotating and having a cleaning member 52 which is to be brought into contact with an end face and/or a bevel face of the substrate so as to apply scrub-cleaning to the end face and/or the bevel face, and a power transmission mechanism 64 for transmitting a rotating force of the substrate rotating roller 14 to the cleaning roller 48 so as to rotate the cleaning roller 48.

Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.

Abstract: An apparatus and method for conditioning a polishing pad in a polishing system. One embodiment of the apparatus generally includes a movable support member, a conditioner device coupled to the support member, and a first actuator coupled to the support member and adapted to move the conditioner device along a first path. Another embodiment of the apparatus generally includes a platen, a polishing pad supported on the platen, and a conditioner device coupled to a support member and positioned adjacent a region of the polishing pad outside of a substrate polishing area. One embodiment of the method includes raising a conditioner device adjacent to the polishing pad, providing relational movement between the conditioner device and the polishing pad, and lowering the conditioner device away from the polishing pad.

Abstract: An apparatus and method for conditioning the polishing pad of CMP system by employing a multi-zone conditioner, or dresser. The conditioner comprises a plurality of rollers or disks, which can be well tuned to make down-pressure and rolling speed of the rollers or disks to the extent as desirable. The conditioner further comprises driving means for rotating the polishing rollers or disks. It can make a better uniformity of the pad conditioning and improve the profile of the polished wafers. The apparatus and method for conditioning the polishing pad can be especially used to compensate the uniformity of the incoming films, or the pre-CMP films.

Abstract: A method for cleaning or recycling a polishing pad conditioning disk used in a chemical mechanical polishing apparatus is disclosed. In the method, a conditioning disk that has a top surface formed of diamond particles and covered by a layer of polishing debris such as silicon oxide is first provided. A water jet that has a pressure of at least 1,500 psi, or preferably, 3,000 psi is directed toward the top surface of the conditioning disk for at least 5 min., and preferably, for at least 10 min. to substantially remove the polishing debris. The conditioning disk is then positioned on a heated surface and heated to a temperature of at least 40° C. while simultaneously being blown by a flow of inert gas or CO2 maintained at 0° C. or below on the top surface to remove any residual polishing debris by causing a thermal shock in the silicon oxide films and a separation from the conditioning disk.

Abstract: A liquid coater which includes a mist feed tube (5) for feeding oil mist into an airtight container (2), an air hose (10) for feeding air into the airtight container (2) and a mist conveyor pipe (11) for conveying the oil mist pressurized by air inside the airtight container (2) to the outside of the container. Therefore, droplets and large mist particles can be trapped inside the container from the mist feed tube (5), and the mist can be conveyed at a high speed. The liquid coater has excellent applicability. The mist feed tube (5) has a double tube structure comprising an air tube (7) in which air flows, and an oil tube (6) which extends in the air tube (7) and in which the oil flows. The distal end of the oil tube (6) is positioned more inward than the distal end of the air tube (7), so that the oil mist can be fed by a simple construction.

Abstract: An apparatus and method for polishing a workpiece including a polishing pad; at least one polishing arm for holding a workpiece to be polished on the polishing pad; at least one conditioning arm for conditioning the polishing pad; and, a slurry dispenser. The slurry dispenser is disposed between the at least one polishing arm and the at least one conditioning arm so that slurry dispensed by the slurry dispenser contacts the at least one conditioning pad before it contacts the at least one polishing pad.

Abstract: An apparatus for providing a flat to stepped convex facing for grinding wheels used for the finished machining of parts, the apparatus including dressing wheels located only at the outer diameter of the Cubic-Boron-Nitride wheels to be dressed.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: A polishing pad conditioner used in the removal of slurry and semiconductor thin film build-up in the polishing pad in a chemical and mechanical polishing (CMP) process used to planarize a semiconductor wafer surface. The conditioner is pressed against the polishing pad, often while de-ionized water is applied, to remove the material build-up. The conditioner of the present invention has a convex lower surface covered by diamond crystals that are bonded to the underside of the nickel alloy conditioner. Typically, the difference between the center and the edge of the conditioning surface will range from a minimum of about 0.2 mm (very slightly convex) to a maximum of the entire thickness of the conditioning surface (more convex). The convex shape reduces the friction between the pad and conditioner and allows the slurry to reach the center of the conditioner. This more uniformly conditions the pad surface which yields more uniformly polished wafers and also increases pad life.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A polishing apparatus includes a cleaning device for critical cleaning of a top ring or a dressing tool to obtain high quality polishing by minimizing surface damage caused by contaminants originating from the top ring and/or dressing tool. The polishing apparatus includes a polishing table; a workpiece holding member for pressing a workpiece onto the polishing table; a dressing tool for conditioning a work surface provided on the polishing table. A cleaning device is provided for cleaning the dressing tool and/or the workpiece holding member. The cleaning device is provided with a spray nozzle for directing a cleaning solution toward at least an upper surface of the workpiece holding member or the dressing tool.

Abstract: A conditioning disk including a unitary thermoplastic polymer sheet material cut a unitary circular plate formed with gear teeth along its circular edge, and formed with block form protrusions that are impelled in a sweeping motion by rotation of the unitary plate as a planetary gear in meshed engagement with a sun gear and a ring gear of a polishing apparatus.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be actively rotated or reciprocated at variable rates, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet is configured and arranged for receiving treatment elements. A distribution surface is coupled to the inlet and is configured and arranged to disperse the treatment elements. A multitude of outlets are coupled to the distribution surface and are configured and arranged to dispense the treatment elements onto a CMP pad. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.

Abstract: An end face polishing apparatus comprises a polishing board and a jig board for supporting workpieces. A polishing member is detachably arranged on the polishing board and has a polishing film for polishing end faces of the workpieces while the workpieces are supported by the jig board. A first holding device holdings unused polishing members each having a new polishing film preliminarily attached thereto. At least one second holding device holds used polishing members which have been removed from the polishing board. A polishing member exchanging device is mounted for linear movement in horizontal and vertical directions for exchanging a used polishing member arranged on the polishing board with an unused polishing member by seizing the used polishing member from the polishing board and conveying the used polishing member to the second holding device, and by taking an unused polishing member from the first holding device and placing the unused polishing member on the polishing board.

Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.

Abstract: A system (10) for manufacturing a photocathode includes a support (12) and a polishing pad (14) disposed adjacent the support (12). The polishing pad (14) is operable to polish the photocathode in response to movable contact of the photocathode relative to the polishing pad (14). The system (10) also includes a rinsing system (16) coupled to the support (12). The rinsing system (16) is operable to deliver a rinsing agent to the polishing pad (14). The system (10) further includes a control system (62) operable to automatically regulate delivery of the rinsing agent to the rinsing system (16) at a predetermined time period.