Work Face Variegated Or On Projecting Backing Patents (Class 451/530)
  • Patent number: 9656366
    Abstract: An abrasive article having a plurality of apertures arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, and in particular those patterns described by the Vogel equation. Also, provided is a back-up pad having a spiral or phyllotactic patterns of air flow paths, such as in the form of open channels. The back-up pad can be specifically adapted to correspond with an abrasive article having a non-uniform distribution pattern. Alternatively, the back-up pad can be used in conjunction with conventional perforated coated abrasives. The abrasive articles having a non-uniform distribution pattern of apertures and the back-up pads can be used together as an abrasive system.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: May 23, 2017
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Anuj Seth, Julie M. Dinh-Ngoc, Vivek Cheruvari Kottieth Raman, Paul A. Krupa, James M. Garrah
  • Patent number: 9522432
    Abstract: The claimed subject matter provides a cutting head for oscillating tools including a concave or recessed cutting edge. The cutting edge can be a recessed curve, an angular recess, or a combination of the two. The cutting edge can include one or more of serrations or cutting grit. The cutting head can conform to a variety of work piece geometries and cradle the work piece during cutting to prevent slipping and provide faster cuts by applying a greater proportion of the blade to the work piece at once and retaining the work piece between sides of the recess.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: December 20, 2016
    Inventor: Herbert W. Staub
  • Patent number: 9213274
    Abstract: There is provided a grinding roller for use in a fixing device including a pair of rotary fixing members that rotate while being pressed against each other to form an area of contact, and heat and press a recording medium carrying an unfixed toner image and fed to the area of contact, to thereby fix the unfixed toner image on the recording medium. The grinding roller is configured to grind a surface of a toner image-side rotary member of the pair of rotary fixing members that comes into contact with the unfixed toner image. The grinding roller includes an abrasive grain layer including abrasive grains, forming a surface layer of the grinding roller, and having a surface with irregularities including projections each formed by an aggregate of some of the abrasive grains and larger in size than each of the abrasive grains and recesses formed between the projections.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: December 15, 2015
    Assignee: Ricoh Company, Ltd.
    Inventors: Kazuhiro Kotaka, Eiri Sagae, Satoshi Kai, Yoshihisa Hara, Yuusuke Arai
  • Publication number: 20150093978
    Abstract: A polishing film for a polishing head for plastic spectacle lenses, for polishing zones on a front side or rear side of the spectacle lens, having a polishing surface which can be positioned against the spectacle lens and is bounded by a peripheral surface, wherein an edge is provided between the polishing surface and the peripheral surface, wherein the edge either has a radius r of at least 0.5 mm to 10 mm or has a chamfer f with an extent f1×f2, where the extent f1 or f2 is at least 0.5 mm to 10 mm, or the polishing film, when not in use, has a basic curvature G with a radius RG?75 mm and, in addition to this, a peripheral curvature G with a radius Rg?0.5 G, wherein the peripheral curvature g is limited to the peripheral zone, or the polishing film is formed without any basic curvature G and has a peripheral curvature g with a radius Rg?35 mm, wherein the peripheral curvature g is limited to the peripheral zone.
    Type: Application
    Filed: April 23, 2013
    Publication date: April 2, 2015
    Applicant: Schneider GMBH & Co. KG
    Inventors: Gunter Schneider, Stephan Huttenhuis, Ferdinand Achenbach
  • Publication number: 20140364044
    Abstract: Polishing pad and method of manufacturing the same, the method including: (a) mixing materials for forming a polishing layer; (b) mixing at least two from among inert gas, a capsule type foaming agent, a chemical foaming agent, and liquid microelements that are capable of controlling sizes of pores, with the mixture in (a) so as to form two or more types of pores; (c) performing gelling and hardening of the mixture generated in (b) so as to form a polishing layer including the two or more types of pores; and (d) processing the polishing layer so as to distribute micropores defined by opening the two or more types of pores on a surface of the polishing layer.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Inventors: Bong-Su AHN, Young-Jun JANG, Sang-Mok LEE, Hwi-Kuk CHUNG, Kee-Cheon SONG, Seung-Geun KIM, Jang-Won SEO, Jeong-Seon CHOO
  • Patent number: 8628383
    Abstract: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder. Free abrasive products, bonded abrasive products, and the particulate material also contain aggregates.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: January 14, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Shelly C. Starling, James Manning, Colleen Rafferty, Mark Sternberg, Anthony Gaeta
  • Publication number: 20130295827
    Abstract: A grinding body (1), which consists of a support material (5) and an abrasive (2) adhesively applied thereto, is formed such that the grinding body (1) has an abrasive-free rim that laterally adjoins the active region of the abrasive (2).
    Type: Application
    Filed: January 17, 2012
    Publication date: November 7, 2013
    Inventor: Johannes Tack
  • Patent number: 8550878
    Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: October 8, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Naga Chandrasekaran, Arun Vishwanathan
  • Patent number: 8475238
    Abstract: A polishing pad may include a base and a plurality of polishing protrusions on a surface of the base. Each polishing protrusion may include a sidewall defining an opening in a surface of the polishing protrusion opposite the base. In addition, portions of the sidewall opposite the base may define a contact surface.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: July 2, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Kwang Choi, Bo-Un Yoon, Myung-Ki Hong
  • Publication number: 20130048017
    Abstract: An abrasive or cleaning pad includes a composite resin as a wear layer. A cleaning pad system for motorized floor cleaning or polishing applications includes a pad having a combination of two grades of melamine resin-based foam. A method of cleaning a floor surface is also provided.
    Type: Application
    Filed: May 31, 2012
    Publication date: February 28, 2013
    Applicant: CHARLOTT PRODUKTE DR. RAUWALD GMBH
    Inventor: WOLFGANG RAUWALD
  • Publication number: 20120190276
    Abstract: This invention provides a polishing pad, which includes a substrate and a plurality of discrete abrasive blocks fixed on the substrate, wherein the abrasive blocks are of at least two kinds of heights. This invention would not reduce the polishing rate dramatically during the process for polishing a wafer by using the polishing pad in the long run. Therefore a thickness of the wafer to be polished is able to be controlled accurately, thereby improving the effect and yield of polishing the wafer. The present invention further provides a method for manufacturing the polishing pad. The polishing pad according to this invention is manufactured conveniently by using this method. Correspondingly, a method for using the polishing pad is also provided in this invention.
    Type: Application
    Filed: October 17, 2011
    Publication date: July 26, 2012
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Qun SHAO
  • Patent number: 8216030
    Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: July 10, 2012
    Assignee: Oy KWH Mirka AB
    Inventor: Goran Hoglund
  • Patent number: 8206202
    Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: June 26, 2012
    Assignee: Oy KWH Mirka AB
    Inventor: Goran Hoglund
  • Patent number: 8167690
    Abstract: A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 ?m.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: May 1, 2012
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Satoshi Maruyama, Junji Hirose, Kenji Nakamura, Masato Doura
  • Patent number: 8128464
    Abstract: A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface, and a plurality of grooves formed in the polishing surface. The side surface has a slope surface that is connected to the polishing surface, and a depth of the grooves is equal to or smaller than a height of the slope surface.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: March 6, 2012
    Assignee: JSR Corporation
    Inventors: Masayuki Motonari, Tomikazu Ueno, Masahiro Yamamoto, Yuugo Tai, Hiroyuki Miyauchi
  • Patent number: 8083570
    Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: December 27, 2011
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Darrell String, Jon William Turley
  • Patent number: 8062103
    Abstract: The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows: r TR = 0.7 ? r * ? ? to ? ? 1.3 ? r * where r * = R C ? ( R R C ) 2 - cos ? ( 2 ? ? c ? ? 0 ) - sin ? ( 2 ? ? c ? ? 0 ) ? ( R / R C cos ? ? ? c ? ? 0 ) 2 - 1 ; with the inner region originating continuous grooves that extend uninterrupted to the outer region.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: November 22, 2011
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Gregory P. Muldowney
  • Patent number: 7988533
    Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: August 2, 2011
    Assignee: TCG International Inc.
    Inventors: Jonathan P. Thomas, Keith A. Beveridge, Chad James Olson, David Osland
  • Patent number: 7904989
    Abstract: A rotary eraser assembly includes a rotary eraser, two discs, a threaded bolt and a nut. The rotary eraser includes, in each of two opposite sides, a cavity in communication with the aperture and at least one recess in the wall of the cavity. Each of the discs includes an annular lip disposed in the cavity in a related one of the sides of the rotary eraser and at least one block disposed in the recess in the related side of the rotary eraser. The threaded bolt is inserted through the rotary eraser and the discs. The nut is engaged with threaded bolt.
    Type: Grant
    Filed: February 2, 2008
    Date of Patent: March 15, 2011
    Assignee: Tsan Chung Industrial Co., Ltd.
    Inventor: Tao-Chuan Chen
  • Patent number: 7790788
    Abstract: There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy. A chemical mechanical polishing pad produced by the above method has advantages that it is excellent in removal rate and scratches and in-plane uniformity on a polished surface and that it shows a stable removal rate even when polishing a number of objects to be polished successively.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: September 7, 2010
    Assignee: JSR Corporation
    Inventors: Yukio Hosaka, Rikimaru Kuwabara
  • Patent number: 7704122
    Abstract: A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include chip size, pattern density, chip architecture, film material, film topography, and the like. Based on the one or more characteristics of the structure, a value for the one or more chemical or physical properties of the pad is selected. For example, the one or more chemical or physical properties of the pad can include pad material hardness, thickness, surface grooving, pore size, porosity, Youngs modulus, compressibility, asperity, and the like.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: April 27, 2010
    Assignee: NexPlanar Corporation
    Inventors: Sudhanshu Misra, Pradip K. Roy
  • Patent number: 7662022
    Abstract: A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: February 16, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Sam Lim, Dong-Jun Lee, Nam-Soo Kim, Sung-Taek Moon, Kyoung-Moon Kang, Jae-Hyun So
  • Patent number: 7604529
    Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208) form the three-dimensional network of interconnected unit cells (225). The polishing elements (208) have a mean height (214) to a mean width (222) ratio of at least 3. The polishing surface (200) formed from the plurality of polishing elements (208) remains consistent for multiple polishing operations.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: October 20, 2009
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Gregory P. Muldowney
  • Patent number: 7594845
    Abstract: Provided is an abrasive article for lapping or polishing a workpiece comprising a three-dimensional, textured, flexible, fixed abrasive construction having a first surface and a working surface, the working surface comprising a plurality of precisely shaped abrasive composites, wherein the precisely shaped abrasive composite comprises a resin phase and a metal phase, wherein the metal phase further comprises superabrasive material. Also provided are a method of polishing or lapping a workpiece and a kit comprising a three-dimensional, textured, flexible, fixed abrasive construction and instructions for carrying out the method of polishing or lapping a workpiece.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: September 29, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Paul S. Lugg, Timothy D. Fletcher
  • Patent number: 7553346
    Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a temporary layer comprising said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; embossing the layer comprising softened particulate curable binder material and abrasive particles to provide a pattern of raised areas and depressed areas and curing the softened particulate curable binder material to convert the embossed layer into a permanent embossed layer comprised of cured particulate binder material and abrasive particles and cure the at least partially cured primer coati
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: June 30, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Dennis G. Welygan, Jason A. Chesley, Louis S. Moren
  • Patent number: 7527546
    Abstract: A viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius formed in a center portion thereof, and the base disk has a plurality of grooves equiangularly provided in the major surface thereof as extending radially outward from a center portion thereof. This arrangement ensures stable supply of an abrasive liquid, and obviates a need for formation of grooves in the viscoelastic layer.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: May 5, 2009
    Assignee: Panasonic Corporation
    Inventors: Kazunari Nishihara, Tsunemoto Kuriyagawa
  • Patent number: 7520800
    Abstract: Flexible abrasive sheet materials having annular bands of precise height flat-topped raised island structures that are coated with a mono layer of abrasive particles or abrasive agglomerates, processes for manufacture of the abrasive sheet materials, processes for using the abrasive sheeting in high speed lapping/abrading processes, and apparatus for using the abrasive sheeting are described. The process for manufacturing the abrasive sheeting provides an economical method for providing an improved configuration of abrasive sheeting that can provide precisely flat workpiece surfaces that are also highly polished.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: April 21, 2009
    Inventor: Wayne O. Duescher
  • Publication number: 20090023370
    Abstract: A drywall sander includes a replaceable sanding pad having a layer of resilient material, and an abrasive surface. The sanding pad includes one or more edge portions that project beyond the edges of a sander head. The edges of the sanding pad can be deformed during use when the sander is used in a corner or the like to thereby prevent scuffing or other damage to adjacent orthogonal surfaces.
    Type: Application
    Filed: September 26, 2008
    Publication date: January 22, 2009
    Inventors: Craig M. Field, Jeffrey L. Trudeau
  • Publication number: 20080305729
    Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 11, 2008
    Inventors: Dominic J. Benvegnu, Jimin Zhang, Thomas H. Osterheld, Boguslaw A. Swedek
  • Patent number: 7452265
    Abstract: An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, a third filter media with channels, a fourth filter media, and an optional attachment layer. The openings of the porous abrasive layer cooperate with the channels to allow the flow of particles from the abrasive surface to the filter media.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: November 18, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Thomas W. Rambosek, Edward J. Woo, Curtis J. Schmidt
  • Patent number: 7429210
    Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: September 30, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung
  • Publication number: 20080146121
    Abstract: A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 19, 2008
    Inventors: Omer Ozgun, Alpay Yilmaz, Antoine P. Manens, Lakshmanan Karuppiah
  • Patent number: 7377840
    Abstract: Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: May 27, 2008
    Assignee: Neopad Technologies Corporation
    Inventors: Manish Deopura, Hem M. Vaidya, Pradip K. Roy
  • Patent number: 7329175
    Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a porous attachment interface. The screen abrasive has an abrasive layer comprising a plurality of erectly oriented abrasive particles and at least one binder. The porous attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: February 12, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Edward J. Woo, Thomas W. Rambosek, Curtis J. Schmidt
  • Patent number: 7316605
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: January 8, 2008
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Patent number: 7300340
    Abstract: A circular chemical mechanical polishing pad that includes a polishing surface having a concentrically located origin. The polishing surface includes groove sets each containing grooves arranged in a pattern in which ones of the grooves in one groove set cross ones of the grooves in another set. The grooves in each groove set are configured and arranged so that the fraction of the polishing surface that is grooved, as measured along any circle that is concentric with the origin and crosses the grooves, is substantially constant, i.e., within about 25% of its average.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: November 27, 2007
    Assignee: Rohm and Haas Electronics Materials CMP Holdings, Inc.
    Inventors: Carolina L. Elmufdi, Gregory P. Muldowney
  • Patent number: 7300342
    Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: November 27, 2007
    Assignee: TCG International Inc.
    Inventors: Jonathan P. Thomas, Keith A. Beveridge, Chad James Olson, David Osland
  • Patent number: 7294048
    Abstract: An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the make coat to provide an abrasive surface and a size coat arranged over at least a portion of the abrasive surface, wherein the size coat has a Young's modulus of less than 100,000 psi.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: November 13, 2007
    Assignee: 3M Innovative Properties Company
    Inventors: Eric W. Nelson, Chris A. Minick
  • Patent number: 7275311
    Abstract: An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with electrical components embedded therein to provide a desired surface dimension thereof. The described system embodiment comprises a non-abrasive lapping plate having a lapping surface with a plurality of grooves therein, a support structure for supporting a workpiece such that an air bearing surface thereof is exposed, and a non-abrasive liquid. When the non-abrasive liquid is dispensed between the air bearing surface and the lapping plate, the lapping plate contacts the air bearing surface such that the air bearing surface is lapped solely by the grooves in the lapping plate. The electrical components of the air bearing surface are lapped such that they are substantially uniform in dimension relative to the air bearing surface.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: October 2, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yuri Markevitch, Mark C. McMaster, Yu-En Percy Chang
  • Publication number: 20070224925
    Abstract: A polishing pad has polishing elements of at least two different types of materials, each having a different coefficient of friction, and arranged over a surface of the pad so as to provide a non-planar material removal profile for the pad. The polishing elements may be arranged to provide different material removal profiles, such as an edge-fast, edge-slow, center-fast or center-slow material removal profile.
    Type: Application
    Filed: November 21, 2006
    Publication date: September 27, 2007
    Inventor: Rajeev Bajaj
  • Patent number: 7267610
    Abstract: A chemical mechanical polishing pad (100) having a circular polishing track (124) and a concentric center (116). The polishing pad (100) includes a polishing layer (104) having a groove pattern containing a plurality of grooves (128) each extending through the polishing track (124). The plurality of grooves have an angular pitch that varies in a circumferential direction about the concentric center (116) of the pad (100) and the radial pitch between all adjacent grooves (128) within the wafer track (124) is unequal.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: September 11, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Carolina L. Elmufdi, Gregory P. Muldowney
  • Patent number: 7238097
    Abstract: A transparent pad having a polishing surface with an average surface roughness of 5 ?m or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: July 3, 2007
    Assignee: NIHON Microcoating Co., Ltd.
    Inventors: Hisatomo Ohno, Toshihiro Izumi, Mitsuru Saito, Takuya Nagamine, Claughton Miller, Ichiro Kodaka
  • Patent number: 7214126
    Abstract: A flexible layer is formed on a surface of a core, and a polishing layer mixed with abrasive particles is formed on a top of the flexible layer. The flexible layer is produced by applying an emulsion adhesive as a flexible layer onto a core and attaching abrasive particles onto the flexible layer, or by applying an emulsion adhesive mixed with abrasive particles onto a core. The flexible layer is then subjected to a heating and drying process. Thus obtained is an abrasive material which is easy to produce, needs no rigorous criteria in the selection of a core, and imparts, to a binder of abrasive particles, flexibility, conventionally required of the core, at no expense of surface finishing performance.
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: May 8, 2007
    Assignee: Kamei Tekkosho Ltd.
    Inventor: Haruo Kamei
  • Patent number: 7204742
    Abstract: The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrophobic region comprises a polymeric material having a surface energy of 34 mN/m or less and a polymeric material having a surface energy of more than 34 mN/m. The invention further provides a method of polishing a substrate comprising the use of the polishing pad.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: April 17, 2007
    Assignee: Cabot Microelectronics Corporation
    Inventor: Abaneshwar Prasad
  • Patent number: 7201647
    Abstract: Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: April 10, 2007
    Assignee: Praxair Technology, Inc.
    Inventors: Brian Lombardo, Joseph Cianciolo
  • Patent number: 7182677
    Abstract: A polishing pad for a chemical mechanical polishing apparatus has a body with a polishing surface having a radius, a central region, and a peripheral region. The polishing surface has a plurality of main radial-line channels extending radially outwardly from the central region to the peripheral region, each main radial-line channel having an angled outer segment at the peripheral region that is directed at an angle relative to a radius of the polishing surface. The polishing surface also has a plurality of primary tributary radial-line channels that are each connected by an angled transition segment to a main radial-line channel, the tributary radial-line channels being spaced apart from the main radial-line channels. The polishing pad provides an improved distribution and flow of polishing slurry during a polishing process.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: February 27, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Timothy James Donohue, Venkata R. Balagani, Romain Beau de Lomenie
  • Patent number: 7179159
    Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: February 20, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung
  • Patent number: 7160181
    Abstract: A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed between the support layer and the polishing layer and adhesively fixing the polishing layer to the support layer. In one embodiment, the polishing support layer is a plate-shaped molded article formed of a mixture including magnetic powder and a bonding agent containing synthetic resin. In another embodiment, a protective film extends along outer peripheral side walls of the adhesive layer and the support layer.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: January 9, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Gun-Ig Jeung
  • Patent number: 7137872
    Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: November 21, 2006
    Assignee: TCG International Inc.
    Inventors: Jonathan P. Thomas, Keith A. Beveridge, Chad James Olson, David Osland
  • Patent number: 7134953
    Abstract: Endless abrasive belt useful for polishing or otherwise abrading surfaces.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: November 14, 2006
    Assignee: 3M Innovative Properties Company
    Inventor: Paul R. Reinke