Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: An integrally molded brush. A preferred embodiment of the integrally molded brush includes a) a generally planar hub having an outer periphery, where the hub has a thickness of at least 0.05 inches; and b) a plurality of bristles extending from the outer periphery of the hub, where each of the bristles includes a bristle tip opposite the hub, where the bristle tip has a thickness up to 0.03 inches, and where the molded brush comprises a thermoplastic polymeric material. The present invention also provides a method of molding an integrally molded brush. A preferred embodiment of the method includes the steps of: a) heating a thermoplastic polymer to allow the thermoplastic polymer to be injected into a mold; b) injecting the thermoplastic polymer into a mold, wherein the mold includes a hub section and a plurality of bristle sections in fluid communication with the hub section, where the bristle tip section has a thickness up to 0.

Abstract: An article or polishing pad for altering a surface of a workpiece includes a polymeric matrix having a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, the work surface is made relatively softer than the subsurface as a result of exposure to the working environment. As the work surface wears during use, the subsurface immediately adjacent to the work surface becomes exposed to the working environment and becomes the relatively softer work surface. As a result, the relatively softer work surface is continuously regenerated. In an alternative embodiment, an article for altering a surface of a workpiece includes a work surface having a texture, and the texture includes artifacts arranged in a fractal pattern.

Abstract: An abrasive element for grinding samples during supply of liquid lubricant includes a layer of binding agent containing grains of a grinding agent and particles of an organic acid, the organic acid being soluble in the lubricant and the particles thereof having sizes of 5 to 250 &mgr;m.

Abstract: An apparatus (46) for reconditioning a protective surface (30) of an optically-read digital recording disc (20) includes a turntable (48) configured to receive the disc (20) and a first motor (52) for rotating the turntable (48) and the disc (20). The apparatus further includes a buffing element (122) and a second motor (54) for rotating the buffing element (122). A timing element (56) synchronizes the first and second motors (52, 54) to substantially simultaneously cease rotation of the turntable (48) and the buffing element (122) following removal of an amount of material from the disc (20). The buffing element (122) includes a foam pad (124) having a discoid portion (126) and an annular portion (128) encircling a perimeter (132) of the discoid portion (126). The annular portion (128) is more resistant to compression than the discoid portion (126). A buffing pad (82) is in fixed relation with the foam pad (124).

Abstract: An abrasive article includes a fixed abrasive element, a resilient element, a rigid element disposed between the resilient element and the fixed abrasive element, and a plurality of microstructures disposed between the rigid element and the fixed abrasive element.

Abstract: A multi-grit manual finishing tool and method for making the tool. In a preferred embodiment, the tool comprises an ordered, linear sequence of pieces of coated abrasive connected by fully pliable hinges. The hinges allow virtually 360° rotation of the planes of adjacent pieces about each other, and permit the tool to accordion-fold together tightly, so that the tool becomes very compact for storage, transit and special uses. The grit sizes progressively increase from one abrasive piece to the next, thereby facilitating a choice of grit sizes within a single tool. On the non-grit surface of each piece is a distinctive labeling addition that includes indicia characterizing the grit size and abrasive nature of its corresponding grit surface. The distinctive labeling addition includes mechanical reinforcement, such as plastic, thin metal or cardboard. Each piece may abrade a work piece individually and without necessarily using any tool other than hand or fingers.

Abstract: A flexible, open-pored cleaning body having at least one scouring surface (2) provided in at least one subregion with continuously formed, raised projecting ridges (3), wherein the ridges (3) have regions C,D of different heights in the direction of their extension.

Abstract: A polishing pad for use in a linear polisher, and more specifically, for a linear chemical mechanical polishing apparatus that has improved polishing uniformity is described. The polishing pad is provided with a top surface for engaging a wafer surface to be polished. The top surface has a center portion and two oppositely situated edge portions. The polishing pad is further provided with a multiplicity of voids situated in the top surface of the pad body such that the top surface has a void-to-surface ratio that is greater in the two edge portions than in the center portion of the top surface. The present invention novel polishing pad provides a more uniform polishing across a wafer surface, together with an improved planarity after polishing.

Abstract: A polisher for polishing a repair surface to a predetermined shape and a ground paper for polishers are provided. The polisher of the present invention includes a substrate portion (30) for holding an abrasive on a surface opposite to a repair surface, a holding plate (2) provided in parallel to the substrate portion with a predetermined space therebetween, and elastic members (3) interposed between the substrate portion (30) and the holding plate (2). The substrate portion (30) has a first face plate portion (4) fixed to the holding plate (2) with a predetermined space therebetween and second face plate portions (5) which are connected to respective end portions of the first place portion (4) and are rotatable about connection lines as axes, connecting them and the first face plate portion (4). The second face plate portions (5) are rotatably provided in a predetermined range from a position where they become flush with the first face plate portion (4) in a direction that they approach the holding plate (2).

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating.

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.

Abstract: Abrasive sheet materials, abrasive sheet materials with island distributions of abrasive particles, processes for manufacture of abrasive sheet materials with minimized abrasive content, processes for attaching abrasive particles exclusively on the top surface of raised islands in monolayers, and processes for attaching raised island foundation structures to inexpensive flexible backing sheets are described. The process for manufacturing the abrasive sheeting provides an economical method for providing improved quality abrasive sheeting, while also allowing for greater control over the shape and distribution of abrasive islands on the sheet than is available from present processes of manufacture.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: A single-layer polishing pad is grooved in a pattern having relatively large turn radius bends (i.e., greater than the 90° bends of conventional rectangular grid grooving) to improve stability. The large radius bends allow slurry to be more easily and uniformly distributed across the surface of the polishing pad than conventional rectangular grooving. This improvement in slurry distribution tends to improve RR uniformity and WIWNU. In one embodiment, the polishing pad is grooved in a hexagonal pattern, which produces a grooving pattern with 120° bends. The grooves do not penetrate all of the way through the upper layer, thereby maintaining the “stiffness” of the polishing pad, which tends to improve planarization. When used in conjunction with standard pad conditioning techniques, polishing pads with groove patterns having large radius bends has yielded startling and unexpected improvement in stability.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: A polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.

Abstract: The present invention is a fixed abrasive article for grinding or polishing the surface of a glass workpiece. The abrasive article for grinding glass has abrasive composites containing a binder, an alkaline metal salt, and diamond abrasive particles or agglomerate particles comprising diamond particles, the composites integrally molded to a backing. The abrasive article for grinding glass is capable of removing between about 200 and 400 micrometers of glass using an RPP procedure having a polish time interval of between 10 and 15 seconds, generally about 12 seconds. The abrasive article for polishing glass comprises a backing containing fibers, and a plurality of abrasive composites integrally molded to the backing comprising an organic resin, ceria abrasive particles, and alkaline metal salt. The abrasive articles for polishing glass also provide an optimum rate of breakdown of the abrasive composites and improved adhesion between the abrasive composites and the backing.

Abstract: A composite polishing pad. A lower polishing pad is concentrically disposed on a turning table. The lower polishing pad has a same radius of the turning pad. A handler is installed at a periphery of the lower polishing pad to advantage a renewal process. An upper polishing pad is disposed on the lower polishing pad, again, concentrically to the turning table. The upper polishing pad has a radius between a covering range of polishing dresser (conditioner) and a covering range of a top ring. Therefore, while initiating, the projecting portions are not formed on the composite polishing pad, so that the manually notching step is skipped.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: A polishing pad having a cross-sectional open area which varies with depth from the pad surface is provided. The cross-sectional open area of the pad may increase and/or decrease moving away from the outer pad surface. In some cases, the cross-sectional open area of the pad varies uniformly with depth over the entire pad. In other cases, certain regions of the pad may define local cross-sectional open areas which vary differently. This can, for example, allow the open area of the pad to vary with pad life and improve or tailor the polishing uniformity of the pad and/or extend the useful life of the pad.

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.

Abstract: A polishing media magazine for improved polishing. The polishing media magazine may include a conditioning element for rapid, uniform conditioning and cleaning of the polishing media. The polishing media magazine may include polishing media having sections of raised elevation to contain the fluid and may include a polishing support platen having features adapted to urge the edges of the polishing media upwards. The polishing media may be roll fed from a supply roll across a support platen and onto a take-up roll.

Abstract: A pad backer for a polishing head of a chemical mechanical polishing machine is described wherein scribe lines in the x-direction and in the y-direction are formed on the surface of the pad backer. Additional scribe lines are formed at angles of about 45 degrees and about 135 degrees from the x-direction scribe lines to increase the usage rate of the polishing pad.

Abstract: A polishing pad surface having a surface designed for chemical mechanical polishing of a substrate surface is described. The polishing pad surface includes a first area on the surface exposed to and capable of contacting a first amount of the substrate surface during chemical-mechanical polishing and a second area on the surface exposed to and capable of contacting a second amount of the substrate surface during chemical-mechanical polishing, wherein the second amount is larger than the first amount of the substrate surface to produce a more uniformly polished substrate surface.

Abstract: A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface of an abrasive article, the abrasive article comprising a phase separated polymer having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry.

Abstract: A polishing pad having a uniform, continuously interconnected porous surface. The pad is produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering process is conducted at a pressure in excess of 100 psi and in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other.

Abstract: The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing of a glass workpiece comprising a backing and at least one polishing layer. The polishing layer comprises cerium oxide particles dispersed within a binder. The binder provides the attachment means of the at least one polishing layer to the backing. The abrasive article is capable of reducing an initial Rtm of about 0.8 .mu.m or greater on a glass test blank to a final Rtm of about 0.3 .mu.m or less in about one minute using an RPE procedure defined herein. The present invention is also directed to a method of polishing a glass workpiece using the present abrasive article.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: The disclosed polishing apparatus includes a lower pad and an upper pad. The upper pad is disposed over the lower pad and has an upper abrasive surface. The lower pad has an upper surface defining one or more grooves. When the upper pad is placed over the lower pad, channels may form in the upper pad abrasive surface over the grooves. These channels improve the distribution of slurry in the polishing apparatus. The upper pad may define a first polishing region and a second polishing region, the total area of channels in the first polishing region being greater than the total area of the channels in the second polishing region.

Abstract: This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifically, fixed abrasive articles comprise an abrasive composite that is coextensive with a backing and at least one fluorochemical agent associated with the composite. The invention further relates to methods of making fixed abrasive articles comprising at least one fluorochemical agent.

Abstract: Improved abrasive tools and apparatus and method for the manufacture of the improved abrasive tools and the like which includes apparatus and a method for the creation of a structurally viable matrix having a pattern of abrasive elements which can be shaped, cut and positioned for permanent disposition on a rigid tool body. The apparatus includes a release layer on a transversely magnetized base surface with magnetic protrusions to provide a mosaic-like surface. Magnetizable abrasive particles applied to the release layer orient themselves magnetically to form generally conic stacks which having a stack axis and a distal working portion. The stacks define a working surface which is then coated. Prior to solidification of the coating the cones may be shaped or raked magnetically. A braze paste is applied to encapsulate the cones and form a flexible support web between the cones.

Abstract: A flexible abrasive member comprises a porous sheet carrying deposits which consist of a metal containing abrasive particles. The deposits have been applied to the porous sheet by electroplating and the sheet has been impregnated with a coating for stabilizing the deposits, The deposits comprise at least one hollow space through which the sheet extends, which hollow space is filled with coating material.

Abstract: This invention is of an automated flash removal apparatus which features counter-rotating trimming wheels which are positioned against the molded flexible urethane part or the molded flexible polyvinyl chloride part. The force of the trimming wheels against the part undergoing the flash removal process is adjustable and is controlled by opposing tension springs. The trimming wheels may by set at any angle to the part so as to enhance the flash removal characteristics. The trimming wheels are guided along the sides of the part by interchangeable guide bars which may be profiled to accommodate parts which present surfaces that are not substantially straight. The trimming wheels utilize a textured pattern which operate to abrade the flash from the part, thereafter polishing the part on the return pass.

Abstract: A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.

Abstract: The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing of a glass workpiece comprising a backing and at least one polishing layer. The polishing layer comprises cerium oxide particles dispersed within a binder. The binder provides the attachment means of the at least one polishing layer to the backing. The abrasive article is capable of reducing an initial Rtm of about 0.8 .mu.m or greater on a glass test blank to a final Rtm of about 0.3 .mu.m or less in about one minute using an RPE procedure defined herein. The present invention is also directed to a method of polishing a glass workpiece using the present abrasive article.

Abstract: A coated abrasive having a backing and an abrasive layer coated on the first major of the backing, wherein a cross-section of the abrasive layer normal to the thickness and at a center point of the thickness has a total cross-sectional area of abrasive agglomerates which is substantially the same as that at a point along the thickness which is 75% of a distance the same as that at a point and the contact side; a coated abrasive article having a bond system with a Knoop hardness number of at least 70; a coated abrasive article comprising abrasive agglomerates in the shape of a truncated four-sided pyramid; a method of making the coated abrasive article; and a method of abrading a hard workpiece using a coated abrasive article.

Abstract: The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing of a glass workpiece comprising a backing and at least one polishing layer. The polishing layer comprises cerium oxide particles dispersed within a binder. The binder provides the attachment means of the at least one polishing layer to the backing. The abrasive article is capable of reducing an initial Rtm of about 0.8 .mu.m or greater on a glass test blank to a final Rtm of about 0.3 .mu.m or less in about one minute using an RPE procedure defined herein. The present invention is also directed to a method of polishing a glass workpiece using the present abrasive article.

Abstract: A tool for cleaning semiconductor wafers includes a cleaning head with a flat face bounded by an edge. A tubular drive shaft is connected to the cleaning head and provides a conduit through which a cleaning fluid can flow. An opening into the shaft is provided in the flat face which also has a plurality of channels to distribute the cleaning fluid across the flat face. A brush is formed as a single piece of porous, elastic material with a substrate portion that has a first major surface abutting the cleaning head face. A lip of the brush extends from the substrate portion around the edge of the flat face to removably secure the brush to the cleaning head. The brush has a plurality of cylindrical nubs on the second major surface forming projections for scrubbing surfaces of semiconductor wafers.

Abstract: For producing an abrasive tape (11) including a film substrate (2) and a polishing abrasive layer (10) laminated on one surface of the film substrate (2) and having on the outer surface thereof a plurality of recessed parts (9), the film substrate (2) is wrapped partially around the outer peripheral surface of a roll formplate (1) having on the surface thereof a plurality of concavities (5), and, as the roll formplate (1) is rotated, the film substrate (2) is fed thereto. On one hand, an ionizing radiation curing type resin (3) is supplied into the interface between the roll formplate (1) and the film substrate (2) therearound to be formed by the concavities (5), and the recessed parts (9) are formed on the resin surface. During this forming, radiation rays (R) are projected from an ionizing radiation ray source (8) toward the resin (3) thereby to cure the resin (3) and, at the same time, to render the resin (3) and the film substrate (2) into an integral structure.

Abstract: A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.

Abstract: The present invention provides a method of forming an abrasive article comprising the steps of providing an embossed carrier web having a plurality of recesses formed in the front surface thereof; filling the recesses with an abrasive composite slurry that includes a plurality of abrasive grains dispersed in a hardenable binder precursor, hardening the binder precursor to form individual abrasive composite members, laminating a backing sheet to the front surface of the embossed carrier web. The resulting article includes a plurality of precisely spaced abrasive composite members, positioned in a predetermined pattern and orientation on a backing sheet.

Abstract: A scented fingernail file and buffer for contacting and filing a target surface includes a base structure and a substrate layer disposed on the base structure. The scented fingernail file and buffer further includes an abrasive material and fragrance capsules. Both the abrasive material and the fragrance-filled capsules are disposed within the substrate layer. This substrate layer may comprise two coats of resin, for example. The abrasive material includes abrasive particles, and the fragrance-filled capsules are adapted for being ruptured by the abrasive particles, when the scented fingernail file and buffer is frictionally placed into contact with the target surface. The fragrance-filled capsules may also be ruptured by the target surface, or a combination of both the abrasive particles and the target surface, upon such contact.

Abstract: An abrasive coating is formed on the tip of a component of a drive unit for abrading an abradable coating during a stripping operation by thermal spraying a ceramic layer on the component, the ceramic layer being profiled and providing a succession of abrading edges and intermediate spaces between the abrading edges to take up and remove abraded material. The abrading edges can be formed as deposits of ceramic material on the component or, as a ceramic layer applied on a profiled surface etched on the component.

Abstract: For producing an abrasive tape (11) including a film substrate (2) and a polishing abrasive layer (10) laminated on one surface of the film substrate (2) and having on the outer surface thereof a plurality of recessed parts (9), the film substrate (2) is wrapped partially around the outer peripheral surface of a roll formplate (1) having on the surface thereof a plurality of concavities (5), and, as the roll formplate (1) is rotated, the film substrate (2) is fed thereto. On one hand, an ionizing radiation curing type resin (3) is supplied into the interface between the roll formplate (1) and the film substrate (2) therearound to be formed by the said concavities (5), and the recessed parts (9) are formed on the resin surface. During this forming, radiation rays (R) are projected from an ionizing radiation ray source (8) toward the resin (3) thereby to cure the resin (3) and, at the same time, to render the resin (3) and the film substrate (2) into an integral structure.

Abstract: An abrasive article is provided having a sheet-like structure having a major surface having deployed in fixed position thereon a plurality of abrasive three-dimensional abrasive composites, each of the composites comprising abrasive particles dispersed in a binder and having a precise shape defined by a distinct and discernible boundary which includes specific dimensions, wherein the precise shapes are not all identical.

Abstract: A nail tool comprising a substrate having a major surface and an abrasive article attached onto the major surface of the substrate, where the abrasive article is provided having a sheet-like structure having a major surface having deployed in fixed position thereon a plurality of abrasive three-dimensional abrasive composites, each of the composites comprising abrasive particles dispersed in a binder and having a precise shape defined by a distinct and discernible boundary that includes specific dimensions, wherein the precise shapes are not all identical. The invention also relates to a method for using such a nail tool to abrade the surface of a fingernail or toenail.

Abstract: A flexible abrasive member comprising a first porous layer of mesh, non-woven or perforated sheet, conductive or non-conductive material to which on one side deposits are deposited by way of any metal plating technique of either the electrolytic, electroless or vacuum deposition type, or any galvanic process, abrasive particles being embedded in the metal deposits, a layer of filling material, such as a resin, being present between the deposits which filling material is bonded to said first porous layer and/or the deposits, and at least a second porous layer of mesh, non-woven or perforated sheet, conductive or non-conductive material being present and being laid substantially along one side of the first porous layer. The side edge of the deposit has at least one annular groove along at least part of the circumference of the deposit.

Abstract: The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface.