Comprising Fibers Patents (Class 451/532)
  • Patent number: 9815170
    Abstract: A metallic abrasive pad for use in a smoothing operation applied to a worked surface of a workpiece by a catalyst-supported chemical machining method, the metallic abrasive pad including a compression-formed compact of one or more metal fibers made of a transition-metal catalyst, wherein a contact spot of the one or more metal fibers intersecting each other is sintered, the one or more metal fibers are fixed to each other, and the metallic abrasive pad has a prescribed void ratio.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: November 14, 2017
    Assignees: NAGOYA INSTITUTE OF TECHNOLOGY, SINTOKOGIO, LTD.
    Inventors: Osamu Eryu, Eiji Yamaguchi
  • Patent number: 9572471
    Abstract: An abrasive article comprising a nonwoven substrate material impregnated with a first and second formulation. The first and second formulations have broad spectrum antimicrobial effectiveness against one or more microbial organisms. The first and second formulations include the same or different polymer compositions, which include one or more antimicrobial agents and abrasive particles uniformly dispersed in the polymer compositions.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: February 21, 2017
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Soumyajit Basu, Kottotil Mohan Das, Rishwanth Sathyamurthy, Anindya Agasty, Abhay Jain
  • Patent number: 9387565
    Abstract: Provided is an abrasive apparatus with a drive shaft terminating with a working head, where this working head is removably attach to an abrasive attachment. Also provided is a drive system arranged to rotate the drive shaft, the drive system being connected to the drive shaft distal from the working head. The abrasive apparatus also includes at least one fluid supply conduit having an inlet and at least one outlet, with the at least one outlet being located adjacent to the working head of the drive shaft and arranged to deliver fluid to the abrasive attachment and/or an immediate working area.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: July 12, 2016
    Assignee: ALDERSON (NZ) LIMITED
    Inventor: John Anthony Haywood
  • Patent number: 9186816
    Abstract: An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: November 17, 2015
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Yinggang Tian, Arup K. Khaund, Krishnamoorthy Subramanian, John Pearlman
  • Patent number: 9004984
    Abstract: The present invention discloses a cleaning cloth, an abrasive cloth, a cleaning buff and an abrasive buff which are each formed by knitting/weaving bamboo fibers having excellent cleaning, abrasive capacity and excellent ignition resistance.
    Type: Grant
    Filed: March 6, 2000
    Date of Patent: April 14, 2015
    Inventors: Tomoko Suzuki, Yoko Miyaoka
  • Publication number: 20150099439
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
    Type: Application
    Filed: August 26, 2014
    Publication date: April 9, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20150050866
    Abstract: The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 19, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEN-CHIEH WU
  • Publication number: 20150017888
    Abstract: For the manufacture of an abrasive bristle, a plastic material is melted, and a granular material made of abrasive particles is mixed into the melt. The melt is extruded together with the abrasive particles into a filament, and the filament is subsequently treated and cut up. The plastic material may be a high-temperature-resistant polymer with a continued use temperature of ?150° C. and for the melt with the abrasive particles to be extruded at a temperature of ?280° C. A brush equipped with corresponding abrasive bristles can be used for the surface treatment of a workpiece, whereby the brush is rotated with a speed in the range of 3,000 rpm to 12,000 rpm and is brought into contact with the surface to be treated.
    Type: Application
    Filed: January 18, 2013
    Publication date: January 15, 2015
    Inventors: Jürgen Idzko, Dieter Baur, Stefan Kenzelmann, Holger Meid, Günter Muckenfuss
  • Patent number: 8932115
    Abstract: An abrasive article is provided. The article includes (a) a flexible backing having opposing first and second surfaces; (b) an abrasive layer comprising plurality of abrasive particles disposed on the first surface of the flexible backing; and (c) an adhesive layer comprising load bearing particles and an adhesive matrix, the adhesive layer disposed on the second surface of the polymer layer. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: January 13, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Zine-Eddine Boutaghou, Paul S. Lugg
  • Publication number: 20140364043
    Abstract: The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.
    Type: Application
    Filed: January 29, 2014
    Publication date: December 11, 2014
    Applicant: Apple Inc.
    Inventors: Simon Regis Louis Lancaster-Larocque, Collin D. Chan
  • Patent number: 8900036
    Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: December 2, 2014
    Assignee: FNS Tech No., Ltd.
    Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
  • Publication number: 20140213161
    Abstract: A tungsten jewelry resurfacing kit for consumer end use comprises a buffing cloth; a container of tungsten resurfacing compound having less than 50 ml of resurfacing compound, wherein the resurfacing compound comprises a mixture of i) a diamond powder of at least 1000 grit size; and ii) a binder, such as a fat, which is a semi-solid at ambient temperatures. The kit may further include a plurality of swabs for removing the resurfacing compound from the container. The compound may be a mixture of about 25 to 75% by volume of a diamond powder of at least 1000 grit size; and about 25 to 75% by volume a binder, such as a fat, which is a semi-solid at ambient temperatures.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 31, 2014
    Inventor: Samuel P Hopkins
  • Patent number: 8790165
    Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: July 29, 2014
    Assignee: FNS Tech Co., Ltd.
    Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
  • Patent number: 8734205
    Abstract: A macro-porous abrasive article includes a spun lace substrate having a macro-porous structure and a coating. The coating is made of a resin binder and abrasive aggregates. The abrasive aggregates are formed from a composition of abrasive grit particles and a nanoparticle binder. The coating is at least partially embedded in the substrate. A method for making the macro-porous abrasive article includes combining abrasive aggregates of abrasive grit particles and a nanoparticle binder with a resin binder to form a slurry. The slurry is applied to a macro-porous support structure so that the slurry at least partially penetrates the substrate. The resin is then cured to bond the aggregate grains to the substrate.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: May 27, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Paul S. Goldsmith, Anthony C. Gaeta, James J. Manning, Kamran Khatami
  • Publication number: 20140099871
    Abstract: A self-contained fibrous buffing article including at least one layer of a fibrous nonwoven fabric; the nonwoven fabric having a hardened adherent coating including a crosslinked binder, abrasive particles, and a lubricant blend; and the lubricant blend including at least a fatty acid, mineral oil and glycerin.
    Type: Application
    Filed: June 13, 2012
    Publication date: April 10, 2014
    Inventors: Louis S. Moren, Scott M. Mevissen, Jasmeet Kaur, Jaime A. Martinez
  • Publication number: 20140080393
    Abstract: A nonwoven abrasive article formed from a nonwoven web and agglomerates comprising formed ceramic abrasive particles bound together by a first flexible binder, and a second binder binding the agglomerates to the nonwoven fiber web.
    Type: Application
    Filed: March 29, 2012
    Publication date: March 20, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Bret W. Ludwig
  • Publication number: 20140065935
    Abstract: A self-contained fibrous buffing article. The self-contained fibrous buffing article includes at least one layer of a spunlaced nonwoven fabric having a hardened adherent coating comprising a thermosetting binder, abrasive particles, and a lubricant.
    Type: Application
    Filed: December 2, 2011
    Publication date: March 6, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Francisco T. Ramal, JR.
  • Patent number: 8651921
    Abstract: A surface treatment device includes an enclosure which has an opening through which the leading edge of an aerofoil passes. A sealing element is provided on the enclosure to seal the device to the surfaces of the aerofoil. An abrasive is located within the enclosure and two fluid openings are also provided through which a chemical accelerant can be pumped. In operation the enclosure is oscillated relative to the component so that material is abraded. Whilst the enclosure is oscillated a chemical accelerant is simultaneously pumped through it. The device allows for the local application of a surface treatment on a component.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: February 18, 2014
    Assignee: Rolls-Royce PLC
    Inventors: Daniel Clark, Stephen John Tuppen
  • Patent number: 8636563
    Abstract: In a rotating grinding- or cutting tool, in particular a grinding wheel or grinding roller, on one body, a coating of abrasive material, e.g. cubic boron nitride (CBN) or diamond is applied. The body (2, 12, 22, 32, 42) has two side walls (2a, 12a, 22a, 32a, 42a; 2a, 12a, 22a, 32a, 42a) which are connected to each other on their peripheral region, with the side walls being constructed with fiber-reinforced composite, in particular carbon fiber-, glass fiber- or synthetic fiber-reinforced composite.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: January 28, 2014
    Inventor: Norbert Asen
  • Publication number: 20130331014
    Abstract: A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 ?m or more and 8.0 ?m or less, preparing a polishing pad base by impregnating the nonwoven fabric with a polyurethane based elastomer in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and laminating the polishing pad base with a porous polyurethane layer containing wet-solidified polyurethane as primary component which has openings with an average opening diameter of 10 ?m or more and 90 ?m or less in its surface to serve as polishing surface layer.
    Type: Application
    Filed: January 30, 2012
    Publication date: December 12, 2013
    Applicants: TORAY INDUSTRIES, INC., TORAY COATEX CO., LTD
    Inventors: Kuniyasu Shiro, Masaharu Wada, Hiroyasu Kato, Hajime Nishimura, Satoshi Yanagisawa, Yukihiro Matsuzaki
  • Patent number: 8579677
    Abstract: An abrasive brush includes a securing element and a plurality of abrasive filaments secured to the securing element to form a brush. Each abrasive filament includes a matrix of thermoplastic polymer and a plurality of alumina abrasive particles interspersed throughout at least a portion of the matrix. The abrasive particles comprising a polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm. The alumina abrasive particles further include a pinning agent comprising a dispersed phase in the polycrystalline alpha alumina.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: November 12, 2013
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventor: Trinity J. Boudreau
  • Patent number: 8556686
    Abstract: A sharpening device with an abrasive material, a polishing coat encapsulating the abrasive material and an instruction card coupled to the polishing coat. The abrasive material having a property of conforming to the shape of a pointed article penetrating the abrasive material and a property of applying resistance pressure to the pointed article. The sharpening pad may be used in the sharpening and polishing of conically and other shaped points as found on various articles such as machine and hand sewing needles, quilting needles, pins, darts, miscellaneous tools, barb-less fishhooks and the like, including various fine pointed articles.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: October 15, 2013
    Assignee: AFAB Innovations, Inc.
    Inventor: William S. Scott
  • Publication number: 20130260657
    Abstract: A method for making a polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a polymer precursor. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer precursor has cured. The rotating of the cylinder may be continued until the polymer has cured. The method may include forming at least two distinct layers in the polishing pad by casting and curing sequentially at least two different polymer precursors. A system for manufacturing a polishing pad includes a centrifugal caster adapted to rotate. A polishing pad made by a method is provided.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 3, 2013
    Inventors: Thomas West, Peter McKeever, Kevin Song, Donald Dietz, Long Nguyen, Matt Richardson
  • Publication number: 20130252520
    Abstract: A self-contained fibrous buffing article comprising at least one layer of a fibrous nonwoven fabric comprising lyocell fiber and having a hardened adherent coating comprising a crosslinked binder, abrasive particles, and a lubricant.
    Type: Application
    Filed: December 2, 2011
    Publication date: September 26, 2013
    Applicant: 3M=INNOVATIVE PROPERTIES COMPANY
    Inventor: Jaime A. Martinez
  • Patent number: 8491360
    Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: July 23, 2013
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Marc C. Jin, John Erik Aldeborgh
  • Patent number: 8491359
    Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: July 23, 2013
    Assignee: Bestac Advanced Material Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang, Wen-Chieh Wu
  • Patent number: 8485869
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: July 16, 2013
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Publication number: 20130157551
    Abstract: A high performance polishing cloth having a densified surface state with ultrafine fiber bundles uniformly dispersed therein and having excellent smoothness is provided. The polishing cloth comprises a nonwoven fabric formed by entangling the ultrafine fiber bundles formed by bundling ultrafine fibers with an average single fiber diameter of 0.05 to 2.0 ?m and a polymeric elastic material, wherein the average size of the surface fiber-napped portions constituted by the aforementioned ultrafine fiber bundles of the aforementioned nonwoven fabric in the width direction of the ultrafine fiber bundles is 50 to 180 ?M.
    Type: Application
    Filed: August 18, 2011
    Publication date: June 20, 2013
    Applicant: Toray Industries, Inc.
    Inventors: Masanori Endo, Hajime Nishimura, Satoshi Yanagisawa, Yukihiro Matsuzaki
  • Publication number: 20130157544
    Abstract: A nonwoven abrasive wheel comprising one or more layers of a nonwoven fiber web, a plurality of super abrasive particles having a Vickers hardness greater than 40 GPa, a polyurethane binder adhering the plurality of super abrasive particles to the nonwoven fibers and adhering the layers of the nonwoven fiber web to each other, and wherein the nonwoven abrasive wheel comprises a Flexural Modulus from 4.0 to 128.0 lb/inch of thickness per inch of displacement.
    Type: Application
    Filed: June 27, 2011
    Publication date: June 20, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: James L. McArdle, Alice B. Moris, Ann M. Hawkins, Carl P. Erickson
  • Publication number: 20130148079
    Abstract: Systems and methods for polishing a lens having a freeform design cut into a surface of the lens are provided. The system may include a lap blank having a substantial inverse of the freeform design cut into a surface of the lap blank, or a conformable lap blank having an inverse of the freeform design molded into a surface of the lap blank. The system also includes a deformable pad mounted on the surface of the lap blank. The surface of the lens is separated from the surface of the lap blank by the deformable pad, and the lens and the lap blank are arranged such that the freeform design of the surface of the lens is substantially aligned with the substantial inverse of the freeform design of the surface of the lap blank.
    Type: Application
    Filed: March 16, 2011
    Publication date: June 13, 2013
    Applicant: Coburn Technologies, Inc.
    Inventors: Matthew John Brown, Steven Glenn Bedford
  • Publication number: 20130137344
    Abstract: Disclosed herein are abrasive filaments with improved stiffness and industrial brushes comprising the same, wherein the abrasive filaments are formed of polyamide compositions comprising, (a) at least one polyamide; (b) about 0.1-1 wt % of at least one linear chain extending compound that has a molecular weight of 1000 Daltons or lower; (c) about 0.1-1 wt % of at least one antioxidant; and (d) about 10-40 wt % of abrasive particles, with the total wt % of all components in the composition totaling to 100 wt %.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 30, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: E I DU PONT DE NEMOURS AND COMPANY
  • Patent number: 8449357
    Abstract: Polishing tools and their methods of manufacture and use are disclosed. In one aspect, a polishing device is provided, including a plurality of polymeric fibers longitudinally arranged and embedded in a polymeric binder, the polymeric binder having a stiffness that is less than a stiffness of the polymeric fibers, and a working end of the plurality of polymeric fibers configured such that tips of the polymeric fibers are oriented to contact a work piece.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: May 28, 2013
    Inventor: Chien-Min Sung
  • Patent number: 8435099
    Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: May 7, 2013
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, David Adam Wells, Oscar K. Hsu, Xuechan Zhao
  • Patent number: 8430719
    Abstract: To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: April 30, 2013
    Assignees: Kuraray Co., Ltd., Maruishi Sangyo Co., Ltd.
    Inventors: Takashi Katayama, Tetsuya Watanabe, Yukio Goto, Shinya Kato, Toshiyasu Yajima
  • Publication number: 20130040542
    Abstract: An abrasive article including a flexible backing having opposing first and second surfaces. The first surface of the flexible backing includes abrasive features. An adhesive layer including load bearing particles and an adhesive matrix is disposed on the second surface of the flexible backing. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate. A rigid support is preferably attached to the adhesive layer including the load bearing particles. At least a portion of the load bearing particles is preferably in contact with the rigid support.
    Type: Application
    Filed: June 8, 2012
    Publication date: February 14, 2013
    Inventor: Karl Schwappach
  • Publication number: 20130012112
    Abstract: Abrasive articles including a non-woven web of staple fibers that form a single layer that is free of any additional layers of non-woven webs of staple fibers. The abrasive articles contain abrasive particles bound to the non-woven web. The abrasive articles can be compressed abrasive articles that include a non-woven web of staple fibers, including blends of staple fibers having a first portion of fibers having a first linear density and a second portion of fibers having a second linear density.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 10, 2013
    Applicants: SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC.
    Inventors: Shyiguei Hsu, Alejandro Gomez, Godofredo Vela
  • Publication number: 20130012108
    Abstract: The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network.
    Type: Application
    Filed: December 20, 2010
    Publication date: January 10, 2013
    Inventors: Naichao Li, William D. Joseph
  • Publication number: 20120302142
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a plurality of bundles of first long fibers and an elastomer embedded into the bundles. The bundles of first long fibers are entangled with each other.
    Type: Application
    Filed: July 23, 2012
    Publication date: November 29, 2012
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHEN-HSIANG CHAO, YUNG-CHANG HUNG
  • Patent number: 8308531
    Abstract: Disclosed are a polishing pad used in a CMP process of a planar material such as a silicon wafer, plate glass for a display, etc. and a method for manufacturing the same. The polishing pad comprises a non-woven fabric consisting of ultrafine fibers and elastomeric polymer impregnated into the fabric, on which the ultrafine fibers are raised and arranged to simultaneously satisfy the following conditions (I) to (III) such that the ultrafine fibers are oriented in a longitudinal direction to a central axis: The polishing pad of the present invention includes ultrafine fibers, which are arranged at a relatively wide orientation angle and have pores formed therebetween without requiring alternative processes for forming the pores, thus, exhibits excellent polishing performance and low occurrence of scratches during a polishing process.
    Type: Grant
    Filed: June 28, 2008
    Date of Patent: November 13, 2012
    Assignee: Kolon Industries, Inc.
    Inventors: Won-Joon Kim, Yeong-Nam Hwang
  • Publication number: 20120196515
    Abstract: To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.
    Type: Application
    Filed: April 11, 2012
    Publication date: August 2, 2012
    Applicants: MARUISHI SANGYO CO., LTD., KURARAY CO., LTD.
    Inventors: Takashi KATAYAMA, Tetsuya Watanabe, Yukio Goto, Shinya Kato, Toshiyasu Yajima
  • Patent number: 8215051
    Abstract: A pest control material (11), such as mosquito netting, has a surface (12) with abrasive/absorptive microprojections (13). Insect pests such as mosquitoes suffer damage to their cuticle, resulting in dehydration and/or invasion by microbial pathogens. The material is made by coating a fabric with abrasive and/or absorptive materials.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: July 10, 2012
    Assignee: Insectshield Limited
    Inventors: Bruce Alexander, Stephen John Russell
  • Patent number: 8172648
    Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: May 8, 2012
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Oscar K. Hsu, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Patent number: 8137166
    Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: March 20, 2012
    Assignee: Innopad, Inc.
    Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
  • Publication number: 20110223844
    Abstract: The present invention relates to a polishing pad and method for making the same. The polishing pad comprises a plurality of fibers and a high polymeric elastomer compound. The fibers cross each other to form a fabric substrate. The high polymeric elastomer compound includes a first high polymeric elastomer resin and a second high polymeric elastomer resin. The weight-average molecular weight of the first high polymeric elastomer resin is 100,000 to 300,000. The second high polymeric elastomer resin is a two-component high polymeric elastomer resin, and includes a first component and a second component. The first component is polyol with a molecular weight of 1,500 to 2,500 and 1 wt % to 15 wt %. The second component is polyol with a molecular weight of 3,500 to 4,500 and 85 wt % to 99 wt %. Therefore, the polishing pad has better stiffness, a plurality of communicating holes and active fibers, so that a workpiece to be polished will have excellent surface quality.
    Type: Application
    Filed: May 10, 2010
    Publication date: September 15, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, KUN-CHENG TSAI, YUNG-CHANG HUNG, I-PENG YAO
  • Publication number: 20110195646
    Abstract: Disclosed herein is a polishing pad having a substrate woven in a network form, capable of adsorbing dust generated during polishing of an object into meshes formed in the substrate to discharge the adsorbed dust to an external dust suction system or receive the dust in the meshes in a pocket form, in turn improving polishing efficiency of the polishing pad. In addition, polishing yarns are solidly adhered to a face part with relatively wider area on one side of the substrate so as to enhance durability of the pad.
    Type: Application
    Filed: September 10, 2009
    Publication date: August 11, 2011
    Inventor: Myung Mook Kim
  • Publication number: 20110171831
    Abstract: A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.
    Type: Application
    Filed: September 3, 2009
    Publication date: July 14, 2011
    Applicant: INNOPAD, INC.
    Inventors: Oscar K. Hsu, Paul Lefevre
  • Publication number: 20110159794
    Abstract: An abrasive article includes a fabric comprising a front face and a back face. The front face is formed of first knitted yarns. Each yarn of the first knitted yarns includes a plurality of filaments. A plurality of threads intertwines with the first knitted yarns and extending between the front face and the back face. The plurality of threads defines a hollow space between the front face and the back face. The abrasive article also includes abrasive grains adhered to the front face of the fabric.
    Type: Application
    Filed: December 28, 2010
    Publication date: June 30, 2011
    Applicants: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Mervyn Chung-Fat, Virginie Vaubert, Sergio Rodrigues
  • Publication number: 20110003536
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Publication number: 20100330882
    Abstract: A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 ?m, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.
    Type: Application
    Filed: May 5, 2010
    Publication date: December 30, 2010
    Applicant: SILTRONIC AG
    Inventors: Juergen Schwandner, Roland Koppert
  • Patent number: 7828634
    Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: November 9, 2010
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bo Jiang, Gregory P. Muldowney