Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

Abstract: The present invention relates to a polishing pad and method for making the same. The polishing pad comprises a plurality of fibers and a high polymeric elastomer compound. The fibers cross each other to form a fabric substrate. The high polymeric elastomer compound includes a first high polymeric elastomer resin and a second high polymeric elastomer resin. The weight-average molecular weight of the first high polymeric elastomer resin is 100,000 to 300,000. The second high polymeric elastomer resin is a two-component high polymeric elastomer resin, and includes a first component and a second component. The first component is polyol with a molecular weight of 1,500 to 2,500 and 1 wt % to 15 wt %. The second component is polyol with a molecular weight of 3,500 to 4,500 and 85 wt % to 99 wt %. Therefore, the polishing pad has better stiffness, a plurality of communicating holes and active fibers, so that a workpiece to be polished will have excellent surface quality.

Abstract: Disclosed herein is a polishing pad having a substrate woven in a network form, capable of adsorbing dust generated during polishing of an object into meshes formed in the substrate to discharge the adsorbed dust to an external dust suction system or receive the dust in the meshes in a pocket form, in turn improving polishing efficiency of the polishing pad. In addition, polishing yarns are solidly adhered to a face part with relatively wider area on one side of the substrate so as to enhance durability of the pad.

Abstract: A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.

Abstract: An abrasive article includes a fabric comprising a front face and a back face. The front face is formed of first knitted yarns. Each yarn of the first knitted yarns includes a plurality of filaments. A plurality of threads intertwines with the first knitted yarns and extending between the front face and the back face. The plurality of threads defines a hollow space between the front face and the back face. The abrasive article also includes abrasive grains adhered to the front face of the fabric.

Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.

Abstract: A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 ?m, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.

Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).

Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles, whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid scratching of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a first concentration of ultrafine fibers by volume higher than 80% a total volume of the polishing layer. The first ultrafine fibers of the polymer layer have a second concentration of ultrafine fibers by volume to a total volume of the polymer layer. The first concentration is higher than the second concentration.

Abstract: Disclosed are a polishing pad used in a CMP process of a planar material such as a silicon wafer, plate glass for a display, etc. and a method for manufacturing the same. The polishing pad comprises a non-woven fabric consisting of ultrafine fibers and elastomeric polymer impregnated into the fabric, on which the ultrafine fibers are raised and arranged to simultaneously satisfy the following conditions (I) to (III) such that the ultrafine fibers are oriented in a longitudinal direction to a central axis: The polishing pad of the present invention includes ultrafine fibers, which are arranged at a relatively wide orientation angle and have pores formed therebetween without requiring alternative processes for forming the pores, thus, exhibits excellent polishing performance and low occurrence of scratches during a polishing process.

Abstract: A polishing body for removing stains is provided. The polishing body includes a fiber material or a fabric and a concave is formed in the polishing body to achieve the effects of slowly releasing polishing agent and effort-saving.

Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.

Abstract: An abrasive pad is adapted to be removably attachable to a device. The abrasive pad has one side being adapted for scrubbing and the other side has a water resistant adhesive attached thereto. A removable cover is releasably attached to the adhesive whereby the removable cover is adapted to be removed and the adhesive attached to the abrasive pad is thereafter attached to the cleaning device.

Abstract: The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers.

Abstract: Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates.

Abstract: An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven filter medium to allow the flow of particles from an outer abrasive surface of the porous abrasive member to the porous attachment fabric. Methods of making and using the abrasive articles are included.

Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.

Abstract: A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matrix.

Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.

Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

Abstract: Polishing tools and their methods of manufacture and use are disclosed. In one aspect, a polishing device is provided, including a plurality of polymeric fibers longitudinally arranged and embedded in a polymeric binder, the polymeric binder having a stiffness that is less than a stiffness of the polymeric fibers, and a working end of the plurality of polymeric fibers configured such that tips of the polymeric fibers are oriented to contact a work piece.

Abstract: The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of polishing filaments, the multiple layers of polishing filaments (200, 300, 400, 500) having a sequential stacked formation with each layer of the polishing filaments being above and attached to a lower polishing filament, the multiple layers of polishing filaments (200, 300, 400, 500) being parallel to a polishing surface of the polishing pad (104) and wherein individual polishing filaments (202, 302, 402) of the multiple layers of polishing filaments (200, 300, 400, 500) are above an average of at least three polishing filaments (202, 302, 402), to form the polishing pad having an open lattice structure of interconnected polishing filaments (210, 310, 410, 510, 610).

Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).

Abstract: The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of polishing filaments, the multiple layers of polishing filaments (200, 300, 400, 500) having a sequential stacked formation with each layer of the polishing filaments being above and attached to a lower polishing filament, the multiple layers of polishing filaments (200, 300, 400, 500) being parallel to a polishing surface of the polishing pad (104) and wherein individual polishing filaments (202, 302, 402) of the multiple layers of polishing filaments (200, 300, 400, 500) are above an average of at least three polishing filaments (202, 302, 402), to form the polishing pad having an open lattice structure of interconnected polishing filaments (210, 310, 410, 510, 610).

Abstract: An abrasive sander includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut chips from the work piece and for allowing the cut chips to be received and engaged in the eyelets of the net member. The abrading particles may be applied onto an outer portion or an inner portion of the net member. A base member may be attached to the net member for securing the net member to a sanding machine, and may include a number of openings for allowing the cut chips to flow through the base member.

Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.

Abstract: The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.

Abstract: An abrasive belt includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut chips from the work piece and for allowing the cut chips to be received and engaged in the eyelets of the net member. The abrading particles may be applied onto an outer portion or an inner portion of the net member. A base member may be attached or engaged in the net member for supporting the net member which may include a number of longitudinal cords and lateral cords secured together.

Abstract: The invention relates to an abrasive product intended to be driven in a particular grinding direction over the object to be abraded. The abrasive product is composed of parallel threads placed at a distance from one another and running in the grinding direction and transverse abrasive threads provided with an abrasive coating placed at a distance from one another and fastened to the parallel threads. The open structure allows to easily remove the grindings from the abrasive product during abrasion, thus extending the working life of the abrasive product.

Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a concentration of ultrafine fibers by volume higher than 80% and higher than that of the first ultrafine fibers of the polymer layer.

Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a high polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The high polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.

Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The non-woven fabric is made of a long fiber and the elastomer is embedded into the fabric.

Abstract: Lofty open nonwoven abrasive articles, unitized abrasive wheels, and convolute abrasive wheels include a dipodal aminosilane. Methods of making the abrasive articles are also included.

Abstract: In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, e.g. a silicon oxide film, are planarized efficiently at a high speed while suppressing the occurrence of polishing flaws on the substrate by employing a polishing pad having organic fibers exposed on the surface thereof abutting against the matter being polished.

Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a polymer netting with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The polymer netting cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and an apertured attachment interface with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The apertured attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.

Abstract: A buff is made from a non-woven fabric where the fibers are first carded and formed into a fairly thick fleece. The fleece is passed over a topographical surface on, for example, a moving belt or a drum. The fleece is subject to a bow-tie hydroentanglement process where many fine jets of water entangle the fibers on the topographical surface. Excess water is vacuumed from the system. The fabric is dried and chemically treated. With the fabric a variety of buffing tools are made, in wheel, belt or roll form. Tests against standard and mill treatment buffs show a remarkably lower fabric weight loss percentage and lower or normal operating temperatures. The fabric has exceptional mechanical strength having a tensile strength in excess of 650 N/50 mm according to DIN 29073/3. Preferably the fabric has a tensile strength of at least 1,000 N/50 mm in the machine direction and in excess of 900 N/50 mm in the cross direction according to such DIN.

Abstract: Endless abrasive belt useful for polishing or otherwise abrading surfaces.

Abstract: A combination between a grinding ring and a grinding wheel is disclosed, wherein the grinding ring has a centrally defined hole, a tubular extension extending from a periphery defining the hole, an annular extension extending from an outer periphery of the tubular extension, a skirt formed adjacent to the annular extension, teeth formed by pressing at a joint between the annular extension and the skirt and barbs each formed on a free end of the teeth. The grinding wheel is made of cloth so that the teeth together with the bars are able to extend into the grinding wheel when the skirt is pressed and engagement between the grinding ring and the grinding wheel is enhanced by applying an adhesive.

Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

Abstract: A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form a web that can be loaded into a dispenser either on a spindle or folded for easy dispensing of files as they are needed. The dispenser can have optional blades for separating the files as they are dispensed. Various methods can be used to attach the files into a web for easy dispensing and later separation including attach strips with cut or break points.

Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.

Abstract: This tool applies treatments to surfaces by rubbing. It employs a mildly abrasive body of compacted non-woven fibres to carry and release fluids onto a surface as it cleans and massages the surface. It comprises a spill proof rubbing applicator capable of dispensing chemical substances ranging from low viscosity liquids to fine dry particulate and includes slumes and gels. The tool is provided with means of removing dirty used fibres from its treatment face.

Abstract: An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

Abstract: A dental polishing tip is adapted to be coupled to a dental drive apparatus. The apparatus rotates the tip, thereby polishing the teeth. The tip includes: (i) a post having a proximal end and an opposing distal end, the proximal end being adapted to be coupled to the dental drive apparatus; (ii) an electrostatically flocked polishing head. The electrostatic flocking material on the polishing head at least temporarily increases the retention of the polishing material on the polishing head, thereby deceasing splattering.