Comprising Fibers Patents (Class 451/532)
  • Publication number: 20110003536
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Publication number: 20100330882
    Abstract: A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 ?m, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.
    Type: Application
    Filed: May 5, 2010
    Publication date: December 30, 2010
    Applicant: SILTRONIC AG
    Inventors: Juergen Schwandner, Roland Koppert
  • Patent number: 7828634
    Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: November 9, 2010
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bo Jiang, Gregory P. Muldowney
  • Patent number: 7824249
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles, whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid scratching of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: November 2, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Publication number: 20100221983
    Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
    Type: Application
    Filed: January 5, 2010
    Publication date: September 2, 2010
    Applicant: INNOPAD, INC.
    Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Xuechan Zhao
  • Patent number: 7762873
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a first concentration of ultrafine fibers by volume higher than 80% a total volume of the polishing layer. The first ultrafine fibers of the polymer layer have a second concentration of ultrafine fibers by volume to a total volume of the polymer layer. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 27, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, I-Peng Yao
  • Publication number: 20100173573
    Abstract: Disclosed are a polishing pad used in a CMP process of a planar material such as a silicon wafer, plate glass for a display, etc. and a method for manufacturing the same. The polishing pad comprises a non-woven fabric consisting of ultrafine fibers and elastomeric polymer impregnated into the fabric, on which the ultrafine fibers are raised and arranged to simultaneously satisfy the following conditions (I) to (III) such that the ultrafine fibers are oriented in a longitudinal direction to a central axis: The polishing pad of the present invention includes ultrafine fibers, which are arranged at a relatively wide orientation angle and have pores formed therebetween without requiring alternative processes for forming the pores, thus, exhibits excellent polishing performance and low occurrence of scratches during a polishing process.
    Type: Application
    Filed: June 28, 2008
    Publication date: July 8, 2010
    Inventors: Won-Joon Kim, Yeong-Nam Hwang
  • Publication number: 20100151776
    Abstract: A polishing body for removing stains is provided. The polishing body includes a fiber material or a fabric and a concave is formed in the polishing body to achieve the effects of slowly releasing polishing agent and effort-saving.
    Type: Application
    Filed: February 9, 2009
    Publication date: June 17, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Hung-Chiao Cheng, Yeu-Kuen Wei, Wen-Hann Chou
  • Patent number: 7736215
    Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: June 15, 2010
    Assignee: Disco Corporation
    Inventors: Sinnosuke Sekiya, Setsuo Yamamoto, Yutaka Koma, Masashi Aoki
  • Publication number: 20100144257
    Abstract: An abrasive pad is adapted to be removably attachable to a device. The abrasive pad has one side being adapted for scrubbing and the other side has a water resistant adhesive attached thereto. A removable cover is releasably attached to the adhesive whereby the removable cover is adapted to be removed and the adhesive attached to the abrasive pad is thereafter attached to the cleaning device.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 10, 2010
    Inventor: Bart Donald Beaumont
  • Publication number: 20100099343
    Abstract: The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers.
    Type: Application
    Filed: June 29, 2009
    Publication date: April 22, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Kun-Cheng Tsai, Chih-Yi Lin
  • Publication number: 20100015895
    Abstract: Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates.
    Type: Application
    Filed: July 15, 2008
    Publication date: January 21, 2010
    Inventors: Jeffrey J. Hendron, Mary Jo Kulp, Craig Sungail, Fengii Yeh
  • Patent number: 7628829
    Abstract: An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven filter medium to allow the flow of particles from an outer abrasive surface of the porous abrasive member to the porous attachment fabric. Methods of making and using the abrasive articles are included.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: December 8, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Edward J. Woo, Thomas W. Rambosek, Seyed A. Angadjivand, Mary B. Donovan, Rufus C. Sanders, Jr., Yeun-Jong Chou
  • Publication number: 20090170409
    Abstract: A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matrix.
    Type: Application
    Filed: August 15, 2008
    Publication date: July 2, 2009
    Applicant: IV TECHNOLOGIES CO., LTD.
    Inventors: Chao-Chin Wang, Wen-Chang Shih
  • Publication number: 20090170410
    Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 2, 2009
    Applicant: INNOPAD, INC.
    Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Publication number: 20090142989
    Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.
    Type: Application
    Filed: July 24, 2008
    Publication date: June 4, 2009
    Applicant: INNOPAD, INC.
    Inventors: Paul LEFEVRE, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN
  • Patent number: 7534163
    Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: May 19, 2009
    Assignee: innoPad, Inc.
    Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
  • Publication number: 20090098814
    Abstract: Polishing tools and their methods of manufacture and use are disclosed. In one aspect, a polishing device is provided, including a plurality of polymeric fibers longitudinally arranged and embedded in a polymeric binder, the polymeric binder having a stiffness that is less than a stiffness of the polymeric fibers, and a working end of the plurality of polymeric fibers configured such that tips of the polymeric fibers are oriented to contact a work piece.
    Type: Application
    Filed: October 6, 2008
    Publication date: April 16, 2009
    Inventor: Chien-Min Sung
  • Patent number: 7517277
    Abstract: The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of polishing filaments, the multiple layers of polishing filaments (200, 300, 400, 500) having a sequential stacked formation with each layer of the polishing filaments being above and attached to a lower polishing filament, the multiple layers of polishing filaments (200, 300, 400, 500) being parallel to a polishing surface of the polishing pad (104) and wherein individual polishing filaments (202, 302, 402) of the multiple layers of polishing filaments (200, 300, 400, 500) are above an average of at least three polishing filaments (202, 302, 402), to form the polishing pad having an open lattice structure of interconnected polishing filaments (210, 310, 410, 510, 610).
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: April 14, 2009
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Gregory P. Muldowney
  • Publication number: 20090047883
    Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).
    Type: Application
    Filed: August 16, 2007
    Publication date: February 19, 2009
    Inventors: Bo Jiang, Gregory P. Muldowney
  • Publication number: 20090047877
    Abstract: The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of polishing filaments, the multiple layers of polishing filaments (200, 300, 400, 500) having a sequential stacked formation with each layer of the polishing filaments being above and attached to a lower polishing filament, the multiple layers of polishing filaments (200, 300, 400, 500) being parallel to a polishing surface of the polishing pad (104) and wherein individual polishing filaments (202, 302, 402) of the multiple layers of polishing filaments (200, 300, 400, 500) are above an average of at least three polishing filaments (202, 302, 402), to form the polishing pad having an open lattice structure of interconnected polishing filaments (210, 310, 410, 510, 610).
    Type: Application
    Filed: August 16, 2007
    Publication date: February 19, 2009
    Inventor: Gregory P. Muldowney
  • Publication number: 20080318504
    Abstract: An abrasive sander includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut chips from the work piece and for allowing the cut chips to be received and engaged in the eyelets of the net member. The abrading particles may be applied onto an outer portion or an inner portion of the net member. A base member may be attached to the net member for securing the net member to a sanding machine, and may include a number of openings for allowing the cut chips to flow through the base member.
    Type: Application
    Filed: April 1, 2008
    Publication date: December 25, 2008
    Inventor: Ching-Chi Chao
  • Patent number: 7458885
    Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.
    Type: Grant
    Filed: August 15, 2007
    Date of Patent: December 2, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Ravichandra V. Palaparthi
  • Publication number: 20080287047
    Abstract: The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHEN-HSIANG CHAO, YUNG-CHANG HUNG
  • Publication number: 20080261498
    Abstract: An abrasive belt includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut chips from the work piece and for allowing the cut chips to be received and engaged in the eyelets of the net member. The abrading particles may be applied onto an outer portion or an inner portion of the net member. A base member may be attached or engaged in the net member for supporting the net member which may include a number of longitudinal cords and lateral cords secured together.
    Type: Application
    Filed: April 1, 2008
    Publication date: October 23, 2008
    Inventor: Ching-Chi Chao
  • Patent number: 7438635
    Abstract: The invention relates to an abrasive product intended to be driven in a particular grinding direction over the object to be abraded. The abrasive product is composed of parallel threads placed at a distance from one another and running in the grinding direction and transverse abrasive threads provided with an abrasive coating placed at a distance from one another and fastened to the parallel threads. The open structure allows to easily remove the grindings from the abrasive product during abrasion, thus extending the working life of the abrasive product.
    Type: Grant
    Filed: October 4, 2004
    Date of Patent: October 21, 2008
    Assignee: OY KWH Mirka AB
    Inventor: Göran Johannes Höglund
  • Publication number: 20080227375
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a concentration of ultrafine fibers by volume higher than 80% and higher than that of the first ultrafine fibers of the polymer layer.
    Type: Application
    Filed: May 13, 2008
    Publication date: September 18, 2008
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, J-Peng Yao
  • Publication number: 20080188168
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a high polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The high polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Application
    Filed: February 5, 2007
    Publication date: August 7, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Publication number: 20080171493
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The non-woven fabric is made of a long fiber and the elastomer is embedded into the fabric.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Publication number: 20080127572
    Abstract: Lofty open nonwoven abrasive articles, unitized abrasive wheels, and convolute abrasive wheels include a dipodal aminosilane. Methods of making the abrasive articles are also included.
    Type: Application
    Filed: December 4, 2006
    Publication date: June 5, 2008
    Inventor: Bret W. Ludwig
  • Patent number: 7374474
    Abstract: In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, e.g. a silicon oxide film, are planarized efficiently at a high speed while suppressing the occurrence of polishing flaws on the substrate by employing a polishing pad having organic fibers exposed on the surface thereof abutting against the matter being polished.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: May 20, 2008
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Masaya Nishiyama, Masanobu Habiro, Yasuhito Iwatsuki, Hirokazu Hiraoka
  • Patent number: 7357704
    Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: April 15, 2008
    Assignee: innoPad, Inc.
    Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
  • Patent number: 7267608
    Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: September 11, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Stephen J. Kramer
  • Patent number: 7258705
    Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a polymer netting with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The polymer netting cooperates with the screen abrasive to allow the flow of particles through the abrasive article.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: August 21, 2007
    Assignee: 3M Innovative Properties Company
    Inventors: Edward J. Woo, Charles R. Wald, Curtis J. Schmidt
  • Patent number: 7252694
    Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and an apertured attachment interface with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The apertured attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: August 7, 2007
    Assignee: 3M Innovative Properties Company
    Inventors: Edward J. Woo, Charles R. Wald, Curtis J. Schmidt
  • Patent number: 7186166
    Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: March 6, 2007
    Assignees: International Business Machines Corporation, Freudenberg Nonwovens Ltd.
    Inventors: Shyng-Tsong Chen, Kenneth Davis, Oscar Kai Chi Hsu, Kenneth Rodbell, Jean Vangsness
  • Patent number: 7160183
    Abstract: A buff is made from a non-woven fabric where the fibers are first carded and formed into a fairly thick fleece. The fleece is passed over a topographical surface on, for example, a moving belt or a drum. The fleece is subject to a bow-tie hydroentanglement process where many fine jets of water entangle the fibers on the topographical surface. Excess water is vacuumed from the system. The fabric is dried and chemically treated. With the fabric a variety of buffing tools are made, in wheel, belt or roll form. Tests against standard and mill treatment buffs show a remarkably lower fabric weight loss percentage and lower or normal operating temperatures. The fabric has exceptional mechanical strength having a tensile strength in excess of 650 N/50 mm according to DIN 29073/3. Preferably the fabric has a tensile strength of at least 1,000 N/50 mm in the machine direction and in excess of 900 N/50 mm in the cross direction according to such DIN.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: January 9, 2007
    Assignee: Jason Incorporated
    Inventor: Robert J. Weber
  • Patent number: 7134953
    Abstract: Endless abrasive belt useful for polishing or otherwise abrading surfaces.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: November 14, 2006
    Assignee: 3M Innovative Properties Company
    Inventor: Paul R. Reinke
  • Patent number: 7131900
    Abstract: A combination between a grinding ring and a grinding wheel is disclosed, wherein the grinding ring has a centrally defined hole, a tubular extension extending from a periphery defining the hole, an annular extension extending from an outer periphery of the tubular extension, a skirt formed adjacent to the annular extension, teeth formed by pressing at a joint between the annular extension and the skirt and barbs each formed on a free end of the teeth. The grinding wheel is made of cloth so that the teeth together with the bars are able to extend into the grinding wheel when the skirt is pressed and engagement between the grinding ring and the grinding wheel is enhanced by applying an adhesive.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: November 7, 2006
    Inventor: Samuel Chou
  • Patent number: 7086932
    Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: August 8, 2006
    Assignee: Freudenberg Nonwovens
    Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
  • Patent number: 7077737
    Abstract: A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form a web that can be loaded into a dispenser either on a spindle or folded for easy dispensing of files as they are needed. The dispenser can have optional blades for separating the files as they are dispensed. Various methods can be used to attach the files into a web for easy dispensing and later separation including attach strips with cut or break points.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: July 18, 2006
    Inventor: Guenter Manigel
  • Patent number: 7037184
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: May 2, 2006
    Assignee: Raytech Innovation Solutions, LLC
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Patent number: 6991527
    Abstract: This tool applies treatments to surfaces by rubbing. It employs a mildly abrasive body of compacted non-woven fibres to carry and release fluids onto a surface as it cleans and massages the surface. It comprises a spill proof rubbing applicator capable of dispensing chemical substances ranging from low viscosity liquids to fine dry particulate and includes slumes and gels. The tool is provided with means of removing dirty used fibres from its treatment face.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: January 31, 2006
    Inventor: Geoffrey Robert Linzell
  • Patent number: 6979248
    Abstract: An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: December 27, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Rashid Mavliev, Liang-Yuh Chen, Ratson Morad, Sasson Somekh
  • Patent number: 6964603
    Abstract: A dental polishing tip is adapted to be coupled to a dental drive apparatus. The apparatus rotates the tip, thereby polishing the teeth. The tip includes: (i) a post having a proximal end and an opposing distal end, the proximal end being adapted to be coupled to the dental drive apparatus; (ii) an electrostatically flocked polishing head. The electrostatic flocking material on the polishing head at least temporarily increases the retention of the polishing material on the polishing head, thereby deceasing splattering.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: November 15, 2005
    Assignee: Ultradent Products, Inc.
    Inventors: Dan E. Fischer, Paul Lewis
  • Patent number: 6964604
    Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: November 15, 2005
    Assignees: International Business Machines Corporation, Freudenberg Nonwovens Ltd.
    Inventors: Shyng-Tsong Chen, Kenneth Davis, Oscar Kai Chi Hsu, Kenneth Rodbell, Jean Vangsness
  • Patent number: 6951506
    Abstract: The present invention describes a method for creating a differential polish rate across a semiconductor wafer. The profile or topography of the semiconductor wafer is determined by locating the high points and low points of the wafer profile. The groove pattern of a polish pad is then adjusted to optimize the polish rate with respect to the particular wafer profile. By increasing the groove depth, width, and/or density of the groove pattern of the polish pad the polish rate may be increased in the areas that correspond to the high points of the wafer profile. By decreasing the groove depth, width, and/or density of the groove pattern of the polish pad the polish rate may be decreased in the areas that correspond to the low points of the wafer profile. A combination of these effects may be desirable in order to stabilize the polish rate across the wafer surface in order to improve the planarization of the polishing process.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: October 4, 2005
    Assignee: Intel Corporation
    Inventors: Ebrahim Andideh, Matthew J. Prince
  • Patent number: 6951829
    Abstract: A nonwoven scouring fabric, including a fabric made of coarse fibers interconnected to one another to form a three-dimensional network; a continuous or a discontinuous layer of synthetic resin, or the like, adhering to the fibers, which has a content of abrasive grains; reflectors being additionally bonded at the surface of the layer, which are incorporated in the network by a scattering procedure via at least one side of the nonwoven scouring fabric.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: October 4, 2005
    Assignee: Carl Freudenberg KG
    Inventors: Thomas Schindler, Vanessa Lutzmann
  • Patent number: 6915796
    Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: July 12, 2005
    Inventor: Chien-Min Sung
  • Patent number: 6846232
    Abstract: The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shaped engaging elements that are one part of a two-part mechanical engagement system. An abrasive product is provided by coating at least the raised areas of the backing with an abrasive coating.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: January 25, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Ehrich J. Braunschweig, Daidre L. Syverson, Edward J. Woo, Michael J. Annen