Abstract: A device used to smooth a material's surface with abrasion. More specifically, the device is in the form of a glove or mitten with an abrasive layer that is placed over, and secured on, a user's hand to protect the user's hand and to provide an agile and flexible range of motion while sanding a material's surface.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided.

Abstract: A surface cleaning system includes a retainer having a non-absorbing retaining surface and a surface cleaning compound retained at the retaining surface of the retainer and formed a cleaning surface overlapped thereat. The surface cleaning compound is a polymer having high density and high adhesive ability for removing imbedded contaminants from a working surface and grabbing the contaminants therefrom. The retainer is made of non-absorbing material that prevents lubricant and the surface cleaning compound being absorbed through the retainer.

Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.

Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.

Abstract: Provided is a durable abrasive article which can conform even to a surface of a complicated shape and has an excellent abrasive power and which does not give any deep flaw to become a problem at a subsequent step and is not broken even when used in sanding the surface of the complicated shape. The abrasive article comprises a flexible resin film, an abrasive grain layer formed on the surface of the resin film, and an extremely flexible resin layer formed on the abrasive grain layer, wherein the flexible resin film has a thickness of 10 to 200 ?m, a tensile strength of 30 to 130 MPa and an elongation of 3 to 250%, wherein the abrasive grains of the abrasive grain layer are of P280 to P12, and wherein the extremely flexible resin layer has a 100% M of 1 to 20 MPa, a tensile strength of 20 to 90 MPa and an elongation of 250 to 1000%.

Abstract: A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.

Abstract: The invention relates to a grinding device, comprising a mounting body which is detachably connected to a grinding element, said detachable connection being designed such that the mounting body has a first adhering arrangement and the grinding element has a second adhering element and the adhering elements correspond in the manner of a Velcro fastener. The aim of the invention is to improve the quality and efficiency of the detachable connection for exchange of the grinding element of the claimed grinding device. Said aim is achieved, wherein the first adhering element (1) and the second adhering element (2) comprise a number of projections (3) each with a cross-sectional widening in the direction of the free end (7) of the projection (3).

Abstract: A glove body, a barrier, and an abrasive layer form a flexible sanding device that fits over the hand of user to perform complex sanding operations on intricate or detailed objects. The glove body includes a palm portion, a plurality of finger portions, and a thumb portion. The finger portions and the thumb portion extend from the palm portion to form a continuous inner surface. The inner surface is covered by the barrier and is coextensive with the abrasive layer. The barrier is permanently attached to the glove body on one surface. The abrasive layer is releasably attached to the opposite surface of the barrier. The barrier is permanently attached to the glove body with a permanent adhesive or through sewing. The abrasive layer is releasably attached to the barrier through a releasable adhesive or through a hook and loop fastener.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: An attachment system for attaching an abrasive article, such as an abrasive sheet or disc, to a sanding tool includes an article having a first major surface including an attachment region with attachment material for attachment with an associated mating surface on the sanding tool, and a non-attachment region along at least a portion of an edge of the first major surface forming a sufficiently weak attachment with the associated mating surface to allow a user to grasp the abrasive article and separate the abrasive article from the sanding tool.

Abstract: A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.

Abstract: A method of manufacturing a chemical mechanical polishing pad is provided, comprising: providing a polishing layer; providing a chemical mechanical polishing pad manufacturing assembly, comprising: a subpad layer having a top surface, a bottom surface and at least two wrap around tabs; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of the subpad layer to the backing plate; an unset reactive hot melt adhesive applied to the top surface of the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate; stacking the polishing layer and the chemical mechanical polishing pad manufacturing assembly with the unset reactive hot melt adhesiv

Abstract: There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy. A chemical mechanical polishing pad produced by the above method has advantages that it is excellent in removal rate and scratches and in-plane uniformity on a polished surface and that it shows a stable removal rate even when polishing a number of objects to be polished successively.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.

Abstract: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.

Abstract: An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven filter medium to allow the flow of particles from an outer abrasive surface of the porous abrasive member to the porous attachment fabric. Methods of making and using the abrasive articles are included.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for nonadhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: An abrasive sanding work glove (12) has a fabric (13) with an inner first elastomeric cushion coat (18) and an harder cured coat (21) cured on the palm and finger fronts. Abrasive particles (22) are bonded to the cured coat (21) to provide for a sanding or gripping work tool. A sanding cloth (15) can be handled by the sanding work glove. The sanding cloth has an abrasive side (35) with abrasive particles (30) adhered to the cloth and a back side (36) that engages with the sanding work glove (12).

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a porous attachment interface. The screen abrasive has an abrasive layer comprising a plurality of erectly oriented abrasive particles and at least one binder. The porous attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: A direct-coated sponge abrasive material bearing a releasable securing means comprising one part of a two part hook and loop attachment system is provided.

Abstract: A method and system are disclosed. The system may include a device for sharpening a convex edge on the blade of a knife. The device may include a resilient material and a plurality of abrasive sheets of varying grit values. Each abrasive sheet may be removably attachable to a top of the resilient material. The method may include placing the blade against the abrasive surface at a small angle with a first side of an edge to be sharpened of the blade contacting the abrasive surface and a spine of the blade elevated above the abrasive surface, applying a downward force on the blade causing the edge to be sharpened to compress the resilient abrasive surface, and moving the first side of the edge to be sharpened along the abrasive surface in the direction of the spine.

Abstract: An improved sanding wheel configured to rotate axially for sanding or polishing milled contours that will provide sharp edges and corners in the workpiece. The preferred sanding wheel has a cylindrical body with a plurality of segments extending radially from the body that have vertical, horizontal, angled, convex, or concave faces that match the contour of the milled workpiece. The faces of each of the segments have abrasive that may have a generally horizontal or vertical lay and the segments may be alternated. In one embodiment, equal numbers of segments with horizontal, vertical arcuate or angular faced abrasive surfaces are provided.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a polymer netting with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The polymer netting cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and an apertured attachment interface with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The apertured attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: An abrasive pad for a manual grinding machine, in particular for an eccentric grinder, has a flat contact surface (13) on which an abrasive sheet is placed, and attachment means located on the contact surface (13) for creating an adhesive connection with the abrasive sheet. To reduce the production costs of the abrasive pad, it is made entirely—including the attachment means—of plastic using a single-component injection molding procedure, whereby the attachment means are designed preferably as hook-type fasteners (18) which extend out of the contact surface (13) (FIG. 1).

Abstract: A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

Abstract: Endless abrasive belt useful for polishing or otherwise abrading surfaces.

Abstract: An abrasive tool comprising of a base portion (2), having a foam layer (3) affixed to the abrasive tool base portion, and a plastic film layer (4) affixed, bonded or glued to the foam layer. This tool is adapted to receive an abrasive material layer (5) or sand paper or other abrasive material having a pressure sensitive adhesive applied to one side of the abrasive material, to allow said abrasive material to be stuck and affixed to the abrasive tool. The abrasive tool may be hand operated, or operated by electric power, air power, or other motive power.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: A back-up pad for supporting an abrasive article is disclosed. The back-up pad includes an engagement assembly bonded to a first major surface. The engagement assembly includes a first region including a plurality of first engagement means having a first durability. The engagement assembly also includes a second region including a plurality of second attachment means having a second durability. The first engagement means have a substantially higher durability than the second engagement means.

Abstract: An abrasive pad is suitable for the wet-chemical grinding of a substrate surface. The novel abrasive pad has a polymer matrix with a defined water-solubility. The water-solubility is realized by the level of nonpolar and polar repeat units in the polymers.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing using a polishing pad having a multi-layered structure of a polishing layer and a supporting layer, and a polishing process using thereof. The polishing pad of the present invention is characterized in that it is comprising a supporting layer which is a non-porous elastic body and a polishing layer which is laminated on one surface of the supporting layer, and a polishing process using thereof. Shore D hardness of the polishing layer is preferably 35 or more, and hardness of the supporting layer is preferably lower than that of the polishing layer.

Abstract: An intermediate lens pad having a side secured to curved surface of a lens tool when the pad is in use. The pad has a surface on its other side which is substantially smooth, but which is formed with a multiplicity of substantially uniformly distributed holes or recesses which are at least of an order of magnitude smaller than the pad itself, or the surface is defined by the outer surfaces of a multiplicity of protuberances uniformly distributed over the pad such that the minimum space between adjacent protuberances is of an order of magnitude smaller than the pad itself. A lens surfacing pad having a peel-off adhesive on one side and a working surface on its other side, can be secured by its adhesive side to the intermediate pad so that it inhibits movement between the pads during surfacing, whilst allowing manual removal of the surfacing pad for replacement.

Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.

Abstract: The present invention is related to a method for securing a polishing pad to the platen for use in chemical-mechanical polishing. Specifically, a polishing pad is attached to a platen using a reclosable, hook-and-pile fastener, whereby the platen-attachment fastener may be reused. Separate embodiments are disclosed for attaching porous and nonporous polishing pads.

Abstract: A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition.

Abstract: A polishing pad having a soft layer with a porous structure impregnated with a relatively hard material that locally deforms irreversibly under polishing pressure to a substantially flat polishing pad surface.

Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.

Abstract: A polishing cloth includes: a polishing cloth substrate; a first-pressure adhesive layer formed on a back face of the polishing cloth substrate; as support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-china crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain.

Abstract: A polishing pad for polishing glass and the like has a working layer with a plurality of polishing grains, an attaching layer with which the polishing pad is attachable to a polishing head of a power tool, and a connection layer which connects the working layer, with the attaching layer, and the connection layer is composed of vulcanizable material, which is vulcanized at certain temperature and under certain pressure and thereby connects the working layer with the attaching layer.

Abstract: The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shaped engaging elements that are one part of a two-part mechanical engagement system. An abrasive product is provided by coating at least the raised areas of the backing with an abrasive coating.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.