Abstract: A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.

Abstract: A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.

Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

Abstract: A method for pretexturing a polishing surface of a chemical mechanical polishing layer is provided.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: According to an embodiment, a method for manufacturing a semiconductor device includes polishing a metal layer provided on a surface of a wafer, while supplying slurry to a polishing pad and spraying gas to the polishing pad. The slurry includes an inorganic particle, a resin particle, an oxidant for oxidizing the metal layer, a complexing agent for forming an organic complex on a surface of the metal layer, and a surfactant for forming a hydrophilic film on a surface of the organic complex. The resin particle includes a functional group on a surface, the functional group having a same kind of polarity as that of the inorganic particle. The resin particle contains polystyrene incorporated at a concentration of 0.001% by weight or more and 0.1% by weight or less, and has an average particle diameter of 200 nm or more and 1 ?m or less.

Abstract: According to one embodiment, a semiconductor device manufacturing method comprises forming a film to be polished on a semiconductor substrate, and performing a CMP method on the film to be polished. The CMP method includes polishing the film to be polished by bringing a surface of the film to be polished into contact with a surface of a polishing pad having a negative Rsk value.

Abstract: According to one embodiment, a semiconductor device manufacturing method comprises conditioning a polishing pad by pressing a dresser against a surface of the polishing pad while keeping a surface temperature of the polishing pad at 40° C. or higher, and chemically mechanically polishing a polishing target film formed on a semiconductor substrate by pressing a surface of the polishing target film against the surface of the polishing pad having a negative Rsk value.

Abstract: A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 ?m. The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.

Abstract: A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.

Abstract: In one embodiment, a system for making a dental restoration is provided. The system includes a machine unit for processing a dental material to form the dental restoration, and a control unit for controlling the operation of the machine unit. An air channel for discharging a process-originated material from the machine unit provides an air connection between the machine unit and the control unit. Certain embodiments of invention are advantageous in that they help to increase the reliability of the machining operation.

Abstract: Full profile dressing roll (1) for dressing multi-start grinding worms for the generation grinding of small-module gears, comprising a groove-shaped axial section profile of the outer envelope surface (2), covered with hard material grains, and profile-cut hard-material profile combs (3) embedded in this envelope surface and having a multi-ribbed rack tooth system profile, the profile of which touches the outer envelope surface (2) of the dressing roll (1) only in sections of the axial section profile of the dressing roll (1) which do not participate in the generation of the grinding worm flanks. As a result, the profile sections, highly stressed during the dressing, at the crest and root of the profile grooves (4) are protected from high wear and premature grain loss and the service life of the dressing roll is effectively increased without the inhomogeneity of the flank surface of the dressing roll (1) being disturbed by the profile combs (3).

Abstract: The invention relates to a grinding head for a grinding machine. The grinding head comprises a tool holder, which in use is moved in a plane, in particular rotated or translated back and forth, by the grinding machine. The grinding head furthermore comprises at least two tools which are connectable to the tool holder by a releasable sticking connection. One of the tools or the tool holder is provided with at least one protrusion and the other one is provided with an associated cavity to lock which extend transverse to said plane of movement of the tool with respect to the tool holder in a direction parallel to said plane when the tool is connected to the tool holder.

Abstract: A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

Abstract: The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus.

Abstract: A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.

Abstract: A sharpening machine generally includes a grinding wheel having a perimeter that is rotatable about a first axis. The sharpening machine includes an adjustment device adapted to be coupled to a structure of the sharpening machine. A shaft, mounted to the adjustment device, defines a second axis that is generally parallel to the first axis when the adjustment device is coupled to the structure and is movable along a predetermined feed axis toward the grinding wheel. A carousel is rotatably connected to the shaft of the adjustment device. A contouring tool having a counter surface is rotatably connected to the carousel. Movement of the shaft of the adjustment device along the feed axis is configured to translate the carousel and move the contouring tool into and out of engagement with the grinding wheel to facilitate dressing of the perimeter of the grinding wheel to a grinding wheel contour.

Abstract: The present disclosure relates to a method for the manufacture of a workpiece having a corrected gear geometry and/or a modified surface structure, in particular by a hard finishing process, in particular generation grinding or honing. Provision is made in this respect that it is achieved by a direct generation of a wobble movement and/or of an eccentricity of the tool that a modification, in particular a profile modification or profile waviness, and/or a defined periodic flank waviness is generated on the active surface of the workpiece machined therewith.

Abstract: A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing pad, and a spraying mechanism (constructed, for example, from a washing water nozzle) that sprays liquid to the conditioning disc positioned at the standby position so as to wash or wet the conditioning disc.

Abstract: A finishing machine with at least two finishing stones and a stone turning unit is proposed, in which the stone turning unit may be coupled to a rotary drive of the workpiece holder. A separate drive for the stone turning unit may thus be omitted, which results in a reduced weight of the stone turning unit and therefore lower drive power requirement of the stone turning unit and an improved processing quality.

Abstract: Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.

Abstract: Disclosed is a method and apparatus for polishing an edge of an article involving providing at least one carrier including: first and second opposing surfaces defining a groove, the first and second opposing surfaces being spaced apart in a first direction to receive the edge; and magnetic field generator configured to provide a magnetic field in the groove to stiffen magnetorheological (MR) fluid disposed in the groove to provide at least one polishing zone; receiving the edge in the polishing zone; and driving relative motion between the at least one carrier and the edge in a second direction substantially transverse to the first direction.

Abstract: A sharpening apparatus having a slightly convexly or concavely curved abrasive surface, for use in sharpening woodworking tools or in other fields requiring such processing of precision parts or tools. The invention may further employ either cylindrical or conic abrasive surfaces. Cylindrical abrasive surfaces are desirable when a curvature of a fixed radius is desired, or where accuracy of the curvature radius is required. Conic or semi-conic surfaces may be used to enable a user, by means of short sharpening strokes, to achieve an approximate desired curvature among a range of possible curvatures provided along the length of the abrasive surface as the curvature radius progressively declines. In this way, one abrasive surface may be used to achieve a variety of curvatures.

Abstract: A dressing roll mounting device for mounting a dressing roll to a dresser shaft of a grinding wheel dressing unit is provided. The dressing roll mounting device includes a mounting sleeve to be positioned at a free end of the dresser shaft, the outer face of the mounting sleeve being provided with a conical mounting region serving as a centering and pushing-on aid during mounting of the dressing roll to the dresser shaft. The maximum outside diameter of the conical mounting region is smaller than or corresponding to a dressing roll reception diameter of the dresser shaft.

Abstract: A dressing apparatus is used in a polishing apparatus for polishing a substrate to planarize a surface of the substrate. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to press the dresser disk against the polishing pad through the dresser drive shaft, a pressure-measuring device configured to measure pressure of the gas supplied to the pneumatic cylinder, a load-measuring device configured to measure a load acting on the dresser drive shaft, and a pressure controller configured to control the pressure of the gas supplied to the pneumatic cylinder. The pressure controller is configured to establish a relationship between the pressure of the gas and a pressing force of the dresser disk against the polishing pad, based on measurement values of the pressure-measuring device and the load-measuring device.

Abstract: A method of fabricating a polishing pad for polishing an article is described. The method includes providing a semi-finished polishing pad and then forming a moving track on the surface of the semi-finished polishing pad. The moving track substantially coincides with a polishing track of the article on the polishing pad.

Abstract: Polycrystalline grits and methods of making grits which allow for self-sharpening are provided. In one aspect, for example, a method of sharpening a superabrasive cutting element during cutting can include abrading a self-sharpening superabrasive particle against a work piece to facilitate dulling of a cutting surface of the superabrasive particle, wherein the superabrasive particle includes a superabrasive material and a catalyst material, the catalyst material being located within inclusions in the superabrasive particle. The method can further include interacting the catalyst material and the superabrasive material to cause microfracturing of the superabrasive particle to expose a new cutting surface.

Abstract: The present disclosure relates to a two-phase cleaning element that enhances polishing pad cleaning so as to prevent wafer scratches and contamination in chemical mechanical polishing (CMP) processes. In some embodiments, the two-phase pad cleaning element comprises a first cleaning element and a second cleaning element configured to successively operate upon a section of a CMP polishing pad. The first cleaning element comprises a megasonic cleaning jet configured to utilize cavitation energy to dislodge particles embedded in the CMP polishing pad without damaging the surface of the polishing pad. The second cleaning element is configured to apply a high pressure mist, comprising two fluids, to remove by-products from the CMP polishing pad. By using megasonic cleaning to dislodge embedded particles a two-fluid mist to flush away by-products (e.g., including the dislodged embedded particles), the two-phase pad cleaning element enhances polishing pad cleaning.

Abstract: A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed.

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

Abstract: A method for manufacturing a polishing pad that has high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form water-impermeable film; and cutting the polishing

Abstract: Dual dressing systems for conditioning CMP pads, including associated methods, are provided. In one aspect, for example, a method of dressing a CMP pad can include applying a deglazing dresser to a working surface of a CMP pad, deglazing the working surface of the CMP pad with the deglazing dresser, applying an asperity-forming dresser to the working surface of the CMP pad, and forming asperities in the working surface of the CMP pad with the asperity-forming dresser.

Abstract: A method of producing a grinding wheel is provided. An outer profile of an outer surface of the grinding wheel is formed with a rotary dresser element, so that the outer profile corresponds to a dressing profile of the rotary dresser element. An inner profile of an inner surface of the grinding wheel is formed with the rotary dresser element, so that the inner surface corresponds to the dressing profile of the rotary dresser element.

Abstract: In a method of dressing a barrel worm-shaped tool, a disc-shaped disc dresser (13) meshes with a barrel worm-shaped grinding wheel (12) having its diameter gradually increasing from the two end portions in the axial direction thereof towards the middle portion thereof and used to grind an internal gear (11). The barrel worm-shaped grinding wheel (12) rotates around a tool-rotating shaft (B) disposed at a predetermined shaft angle (A1) with a vertical work-rotating shaft (C1) for the internal gear (11). The disc dresser (13) rotates around a dresser-rotating shaft (D), the disc dresser (13) being disposed at an angle equal to a helix angle of the internal gear (11). While the barrel worm-shaped grinding wheel (12) and the disc dresser (13) mesh with each other and are rotating, the barrel worm-shaped grinding wheel (12) and the disc dresser (13) revolve relative to each other within a horizontal plane.

Abstract: A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet.

Abstract: Disclosed is a method for dressing a threaded grinding stone for internal gear grinding, by which a threaded grinding stone for grinding an internal gear can be dressed with a high degree of accuracy by using a dressing gear that has been produced with a high degree of accuracy.

Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof.

Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.

Abstract: A structured abrasive article comprises a backing, and an abrasive layer disposed on and secured to the backing. The abrasive layer comprises shaped abrasive composites, each comprising abrasive particles dispersed in a binder. Each the shaped abrasive composites independently comprises: a base disposed on the backing; a plurality of walls extending away from the base, and a grinding surface not contacting the base. Adjacent walls share a common edge. Each wall independently forms a dihedral angle with the base of less than or equal to 90 degrees. The grinding surface has a plurality of: cusps, and facets that contact a recessed feature. At least a portion of the recessed feature is disposed closer to the base than each of the cusps. Each cusp is formed by an intersection of two of the walls and at least one of the facets. Use of the structured abrasive article to abrade a workpiece is also disclosed.

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract: A grinding machine for grinding a workpiece comprises a machine frame, a bearing device provided on the machine frame and movable along guides, in which a cup-shaped grinding wheel is rotatably drivable about a grinding wheel axis and electrically insulated. The grinding wheel is electrically connected to a generator. The device for profile dressing, sharpening and cleaning the grinding wheel consists of a single cup-shaped electrode, which is drivable about its central axis and is placed on a slide, which allows a working gap to exist between the machining surface of the cup-shaped electrode and the annular abrasive surface. A spark erosion discharge occurs in the gap when a voltage is applied. The grinding wheel can thereby be optimally conditioned by electric discharge machining.

Abstract: A method of creating pores in a CMP pad in-situ includes impregnating a first material with a second material to form a CMP pad. The second material can have a resistance to frictional erosion that is less than that of the first material. The CMP pad thus has two materials with differing frictional erosion resistances. The working surface of the CMP pad can be contacted to a wafer to be polished wherein the second material can be frictionally eroded during polishing.

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

Abstract: A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.

Abstract: A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

Abstract: A chemical mechanical polishing (CMP) apparatus is provided that includes a conditioning disc for conditioning a polishing pad of the CMP apparatus. The conditioning disc includes a plurality of portions of subsystem discs. The portions may be regions of the disc that are concentric. Each portion of the disc is operable to rotate at a different angular velocity. In some embodiments, a different applied loading is provided to each of the portions of the disc in addition to or in lieu of the different angular velocities.

Abstract: An apparatus dresses a polishing pad. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the dresser flange and configured to allow the dressing member to tilt with respect to the dresser drive shaft, and a spring mechanism configured to generate a force against a tilting motion of the dressing member.

Abstract: A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consisting of carbon nanotubes and diamond, and may be arranged in a ordered array or desired pattern. The CMP pad conditioner also includes a bonding layer overlying the three dimensional structures and the surface of the substrate. The condition may include a reinforcing layer disposed within gaps between the three dimensional structures. Techniques for manufacture and use are also disclosed.

Abstract: A substrate processing apparatus is disclosed for bringing a substrate from a carrier, by a substrate transfer portion inside a transfer chamber, into a processing module to perform a process therein. The substrate processing apparatus includes a substrate storing chamber coupled to an exterior of the transfer chamber via a transfer opening to be in communications with the transfer chamber; a first storing shelf in the substrate storing chamber to store substrates for a first storing purpose; a second storing shelf in the substrate storing chamber to store substrates for a second storing purpose different from the first storing purpose; and a shifting mechanism that shifts the first and the second storing shelves to position a substrate storing area of one of the first and the second storing shelves so that substrate transferring is enabled between the substrate storing area and the substrate transfer portion via the transfer opening.