Abstract: The present disclosure provides a semiconductor manufacturing method. The method includes defining a plurality of time regions of pad life for a polishing pad in a chemical mechanical polishing (CMP) system; assigning a ladder coefficient to the polishing pad according to the plurality of time regions of pad life; defining a plurality of endpoint windows to the plurality of time regions, respectively, according to pad life effect; applying a CMP process to a wafer positioned on the polishing pad; determining a time region of a polishing signal of the wafer based on the ladder coefficient; associating one of the endpoint windows to the polishing signal according to the time region; and ending the CMP process at an endpoint determined by the endpoint window.

Abstract: The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.

Abstract: The present invention comprises of a process for lapping a high-throughput of ultra-flat wafers by utilizing a lapping apparatus containing a rotary flat, grooved polishing platen, at least two rotating pressurized heads each having a polishing wafer carrier that is adapted to receive a plurality of mounted wafers, and a plurality of concentric conditioning rings surrounding each pressurized head. The rotating pressurized heads are counterbalanced throughout the inventive process, and the lapping platen is continuously conditioned by simultaneously rotating the concentric conditioning rings over the lapping platen. This process allows continuous and controllable planarization thus allowing for a high throughput of wafers, while at the same time it prevents distortions in the lapping platen which reduces maintenance by providing continuous conditioning of the lapping platen.

Abstract: A sharpening machine generally includes a grinding wheel having a perimeter that is rotatable about a first axis. The sharpening machine includes an adjustment device adapted to be coupled to a structure of the sharpening machine. A shaft, mounted to the adjustment device, defines a second axis that is generally parallel to the first axis when the adjustment device is coupled to the structure and is movable along a predetermined feed axis toward the grinding wheel. A carousel is rotatably connected to the shaft of the adjustment device. A contouring tool having a counter surface is rotatably connected to the carousel. Movement of the shaft of the adjustment device along the feed axis is configured to translate the carousel and move the contouring tool into and out of engagement with the grinding wheel to facilitate dressing of the perimeter of the grinding wheel to a grinding wheel contour.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×105 G.

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.

Abstract: The scribing wheel achieves increase in its longevity and ensures high strength in end face of segmented substrate obtained by severing brittle material-made substrate scribed by the scribing wheel. Disc-shaped scribing-wheel base material in use is so designed that mid-portion of disc periphery has the largest diameter. Diamond film is formed on the periphery by CVD method. The periphery is ground in the middle so that a plane including a circle defined by ridge line becomes perpendicular to the central axis of the scribing wheel. This helps reduce the roughness of ridge part. When the scribing wheel is used for scribing on brittle material-made substrate, upon severing of the scribed substrate, the end face of the segmented substrate can be made with greater accuracy and higher strength. The scribing wheel suffers little from abrasion at its ridge part even under continuous scribing, and thus enjoys longer operating life.

Abstract: The present invention provides a method capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

Abstract: A method for dressing a tool of a gear grinding machine, including a workpiece holder and a tool holder, is provided. The tool holder, arranged on a machining head, is rotatable about a first axis of rotation, and is linearly movable via a first linear axis of movement, wherein a workpiece clamped in the workpiece holder can be machined by a tool clamped in the tool holder. The machine furthermore includes a dressing unit with a dressing tool holder rotatable about a second axis of rotation, wherein a dressing tool accommodated in the dressing tool holder is used for dressing the tool clamped in the tool holder. During the dressing operation the machining head is pivoted about the swivel axis in dependence on a tool profile and is linearly moved with the first linear axis of movement.

Abstract: A gear grinding tool can be trued and re-profiled. The geometry of the individual profiles in the direction of the tool axis is designed so that at least more than two, preferably all, flanks of the tool are used for rough machining of the work piece flanks, and that during finishing the re-profiled flanks provided only for roughing are set back far enough so that during finishing they do not come into contact with the work piece flanks.

Abstract: A method of fabricating a semiconductor device includes dressing a surface of a polishing pad with a conditioning disk held by an arm while rotating a platen that holds the polishing pad in a chemical mechanical polishing apparatus, wherein the dressing is performed by pressing the conditioning disk to the polishing pad, and rotating the arm around a rotational axis of the arm thereby to move the conditioning disk substantially along a radius direction of the platen between a center part and a circumferential part of the platen, and wherein torque N applied to the arm is measured at plural positions of the conditioning disk along the substantial radius direction during the dressing, and it is determined whether maintenance to the arm is necessary in accordance with an average value <N> of the measured torques N and a fluctuation range Y of the measured torques N.

Abstract: Low scatter water clear zinc sulfide with reduced metal contamination is prepared by coating a chuck which holds zinc sulfide and machining the zinc sulfide with uncoated particles. An inert foil is cleaned with an acid cleaning method and also cleaning the zinc sulfide. The zinc sulfide is wrapped in the inert foil and then treated by a HIP process to provide a low scatter water-clear zinc sulfide. The low scatter water-clear zinc sulfide may be used in articles such as windows and domes.

Abstract: An apparatus and associated method for dressing a workpiece. A first annular abrasive dressing element is attached to a base, an inner arcuate edge of the first annular abrasive dressing element defining a cavity. A second annular abrasive dressing element is also attached to the base and disposed in the cavity, an outer arcuate edge of the second annular abrasive dressing element noncontactingly separated from the inner arcuate edge of the first annular abrasive dressing element defining a circumferential space therebetween.

Abstract: A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall. The platen is positioned lower than the inwardly-extending upper portion. The first brush brushes the side wall. The first brush is fixed to a side surface of the platen. The second brush brushes a side surface of the platen. The second brush is fixed to the bottom wall. The polishing pad is attached to the platen. The carrier presses a workpiece to be polished against the polishing pad. The slurry supplier supplies a slurry onto the polishing pad.

Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life.

Abstract: CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear.

Abstract: A conditioning process includes rotating a polishing pad about an axis of rotation, conditioning the polishing pad by sweeping an abrasive disk in a path across a surface of the polishing pad between an inner radial distance from the axis of rotation and an outer radial distance from the axis of rotation, sweeping a sensor across the polishing pad while conditioning the polishing pad, measuring a thickness of the polishing pad at a plurality of positions between the inner radial distance and the outer radial distance with the sensor, and adjusting at least one of a dwell time or a pressure of the abrasive disk against the polishing pad for a portion of the path based on measurements of the thickness by the sensor such that the polishing pad wears to a more uniform thickness than without such adjustment.

Abstract: A polishing pad includes a guide plate, a compressible foam under layer disposed adjacent to a lower surface of the guide plate, and a plurality of polishing elements that extend in a first direction substantially normal to a plane defined by the guide plate and through the guide plate. The pad further includes an optical path along the first direction and which is defined by an aperture in the compressible foam under layer and the guide plate. The optical path includes a transparent window that extends above an upper surface of the guide plate but below tips of the polishing elements, the upper surface of the guide plate being opposite the lower surface thereof. An optional slurry distribution layer may be disposed on the upper surface of the guide plate, in which case the polishing elements extend through the slurry distribution layer and the transparent window extends beyond a top surface thereof.

Abstract: A method of sharpening blades of a hair cutting device includes providing a sharpening composition in substantially crystalline form, activating a hair cutting device, submerging a working end of the hair cutting device at least partially into the sharpening composition, and viewing the sharpening composition. Sharpening is complete when the sharpening composition is substantially transformed to powder form.

Abstract: Provided is a method of making a barrel-shaped worm-like tool whereby a barrel-shaped worm-like tool capable of efficiently performing grinding without unequal wear can easily be made. The aforementioned method comprises making the barrel-shaped worm-like tool (12) by using a dressing gear (11) to dress the barrel-shaped worm-like tool (12), which is used for machining an internal gear and has a diameter that gradually increases from the ends (12b, 12c) to the center (12a) in the axial direction. On the basis of data wherein the number of teeth is less than that of the internal gear to be machined, the dressing gear (11) and the barrel-shaped worm-like tool (12) are engaged with each other at the same axial intersection angle as during gear-machining performed by the barrel-shaped worm-like tool (12).

Abstract: A method of making shape memory chemical mechanical polishing pads is provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided is a method for using the shape memory chemical mechanical polishing pads to polish substrates.

Abstract: A sharpening machine generally includes a grinding wheel having a perimeter that is rotatable about a first axis. The sharpening machine includes an adjustment device adapted to be coupled to a structure of the sharpening machine. A shaft is mounted to the adjustment device. The shaft defines a second axis that is generally parallel to the first axis when the adjustment device is coupled to the structure. The shaft is movable along a predetermined feed axis toward the grinding wheel. A carousel is rotatably connected to the shaft of the adjustment device. A contouring tool is rotatably connected to the carousel. The contouring tool has a contour surface. Movement of the shaft of the adjustment device along the feed axis is configured to translate the carousel and move the contouring tool into and out of engagement with the grinding wheel to facilitate dressing of the perimeter of the grinding wheel to a grinding wheel contour.

Abstract: An ultrasonic trimming apparatus is composed of an articulated robot, a cutting apparatus, and a grindstone. The cutting apparatus is composed of an ultrasonic oscillator which is supported by the end portion of the articulated robot, a cutter blade which is supported by the ultrasonic oscillator, and a workpiece securing portion which secures a workpiece. The grindstone serving as a grinding member is disposed within the movable range of the cutter blade driven by the robot and is placed in a position at which the cutter blade can pressure contact the cutter blade. The cutter blade is ultrasonically vibrated by the ultrasonic oscillator and is ground while being pressed against the grindstone by means of the articulated robot.

Abstract: The invention relates to a grinding head for a grinding machine. The grinding head comprises a tool holder, which in use is moved in a plane, in particular rotated or translated back and forth, by the grinding machine. The grinding head furthermore comprises at least two tools which are connectable to the tool holder by a releasable sticking connection. One of the tools or the tool holder is provided with at least one protrusion and the other one is provided with an associated cavity to lock which extend transverse to said plane of movement of the tool with respect to the tool holder in a direction parallel to said plane when the tool is connected to the tool holder.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel.

Abstract: A method of producing equal-sized spherical shaped beads of a wide range of materials is described. These beads are produced by forming the parent bead material into a liquid solution and by filling equal volume cells in a sheet with the liquid solution. The sheet cells establish the volumes of each of the cell mixture volumes which are then ejected from the cells by an impinging fluid. Surface tension forces acting on the ejected equal sized solution entities form them into spherical beads. The ejected beads are then subjected to a solidification environment which solidifies the spherical beads. The beads can be solid or porous or hollow and can also have bead coatings of multiple material layers.

Abstract: Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad.

Abstract: The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member and the polishing pad. Specifically, a moveable weight member is provided that can be selectively moved along a length of a support arm in the conditioning apparatus. The position of the weight member relative to the position at which the abrasive conditioning member is mounted alters the resultant pressing force in view of the change in moment created. In a particular example, the positioning of the weight member can be automatically controlled using a drive mechanism controlled by a control unit, such as a computer.

Abstract: A shaft motion detection mechanism capable of detecting the displacement of a rotating body in a direction along a rotational axis and the rotation of the rotating body is disclosed. In one embodiment, the invention is a conditioner head capable of detecting the displacement of a polishing disk in a direction along a rotational axis and the rotation of the polishing disk. A shaft rotates around a rotational axis and a cylindrical shaft is attached to the shaft so that the shaft can be displaced along the rotational axis. A first plurality of projections are formed on the surface of the shaft so as to be aligned in a circumferential direction. A second projection is formed around the entire circumference on the surface of the shaft. Proximity sensors arranged around the rotational axis sense the first and second projections to detect displacement and rotation of the rotating body.

Abstract: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.

Abstract: The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein.

Abstract: The present invention is a wafer production method at least comprising a chamfering step of chamfering a wafer sliced from an ingot using a grindstone for chamfering, and a step of obtaining a product wafer thinner than the chamfered wafer by performing at least one or more than one of the following processes on the chamfered wafer: flattening, etching, and polishing, the method at least comprising a correction step of chamfering a dummy wafer equivalent in thickness to the product wafer, measuring the chamfered dummy wafer for its chamfered shape, and correcting the shape of the grindstone for chamfering based on the measured chamfered shape of the dummy wafer, at least before the chamfering step, thereby chamfering the wafer sliced from the ingot using the grindstone for chamfering having its shape corrected. Thus, it is possible to provide a wafer production method allowing a product wafer with a desired chamfered shape to be obtained in a short period of time.

Abstract: A CMP apparatus is provided with a polishing pad, a film thickness sensor for measuring a thickness of a film being polished on a wafer via the polishing pad, a polishing pad thickness measuring unit for measuring the thickness of the polishing pad, a dresser for dressing the polishing pad, and a polishing control unit for switching polishing conditions in response to a fact that an output value from the film thickness sensor has exceeded a threshold value. The polishing control unit has a memory unit for storing a threshold value corresponding to the thickness of the polishing pad after dressing when the polishing pad is dressed.

Abstract: The present disclosure provides a CMP pad conditioning tool with at least one integral abrasive protrusion. The present disclosure further provides a method for preparing this CMP pad conditioning tool, along with a method for using said tool to condition a CMP pad.

Abstract: A method for cleaning a polishing pad includes dispensing a first amount of deionized water on the polishing pad; cleaning the polishing pad with an acidity/alkalinity solution after dispensing the first amount of deionized water on the polishing pad; rinsing the polishing pad with a second amount of deionized water after cleaning the polishing pad with the acidity/alkalinity solution; removing the acidity/alkalinity solution from the polishing pad. In a subsequent CMP process, the method includes polishing a GST material device for obtaining an improved performance of the GST material device.

Abstract: A polishing method is disclosed, which includes: conditioning a polishing pad, after polishing metal material of a previous wafer; spraying organic acid solution to the polishing pad; spraying deionized water to the polishing pad; performing a water-removing treatment on the polishing pad; and spraying polishing liquid to the polishing pad and polishing metal material of a next wafer. The method can prevent scratches on the surface of metal material of wafers and improve yield rate.

Abstract: A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1×Y1?0 and the relationship X2×Y2>0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide.

Abstract: A CMP polishing pad with an optical sensor assembly embedded in the pad, connected to a transceiver and/or power supply mounted at the center of the pad or at the outer edge of the pad which communicates wirelessly with a control system.

Abstract: An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 ?m/m-° C. to about 5.0 ?m/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.

Abstract: A mechanical polishing apparatus includes a polishing pad, at least one carrier head positioned over and off center relative to the polishing pad and configured for holding at least one substrate against the polishing pad within a first annular region of the polishing pad when the polishing pad is rotating. At least one conditioning head is positionable over and off center relative the polishing pad at a plurality of first positions and configured for applying a contacting surface of at least one conditioning pad against the polishing pad when the polishing pad is rotating, where the conditioning pad is applied to a second annular region of the polishing pad and moves between the plurality of first positions. In the apparatus, the diameter of the conditioning pad?a difference between a radius of the polishing pad and a width of the first annular region.

Abstract: CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear.

Abstract: The invention is directed to a method for polishing a surface comprising tungsten carbide, comprising contacting a surface comprising tungsten carbide with an oxidizing agent, a polishing component, and a liquid carrier, and abrading at least a portion of the surface to polish the surface. The invention further provides a method for reconditioning a workpiece comprising tungsten carbide. The invention also provides a cutting tool insert having a highly polished surface.

Abstract: Methods and apparatus for making and using tools, for example concrete cutting blades, may use laminations. They may also include inserts, such as structural inserts, damping inserts and fluid flow elements. Fluid flow elements may include a tube, a transition element including an inlet fitting, a fluid pressure containment structure inserted into the channel of the blade, an added material resistant to effects of the fluid including plastics, coatings and films, and other structures. Additional nozzle structures may be included. Methods and apparatus for making and using tools including concrete cutting blades having improved damping characteristics may include inserts, plugs and other structures, including those made from materials softer or more ductile than the tool material.

Abstract: The invention relates to a method and machine for the dressing of a grinding tool (1), which has at least one tooth-shaped profile (2) with a first flank (3) and an opposing second flank (4). A disk-shaped dressing tool (5) used for dressing of the grinding tool (2) has a first abrasive area (6) and a second abrasive area (7). To allow a faster and thus more economical dressing of the grinding tool, the first abrasive area (6) contacts the first flank (3) and the second abrasive area (7) contacts the second flank (4) simultaneously, and the disc-shaped dressing tool (5) and/or the grinding tool (1) are pivoted relatively to another around an axis (A) being arranged perpendicular to the axis of rotation (C) of the grinding tool (1), so that both flanks (3, 4) are dressed simultaneously.

Abstract: The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein.

Abstract: Components, turbochargers, and methods of forming components are provided. In an embodiment, by way of example only, a method of forming a component is provided. The method includes applying a plurality of coated particles to a substrate, wherein each coated particle comprises a solid film lubricant particle and a layer surrounding an entire surface of the solid film lubricant particle, each solid film lubricant particle comprises at least one compound, and the layer comprises a coating material having a greater resistance to oxidation than the compound when subjected to a predetermined processing temperature and heating the substrate to the predetermined processing temperature to form a portion of a coating over the substrate.

Abstract: An apparatus for dressing a grinding wheel mounted on a flex-arm, the apparatus including a base, a post, a dresser and a guide, wherein when the flex-arm is in an unengaged position with the apparatus, the flex-arm is capable of movement along at least two directional axes, and wherein when the flex-arm is in an engaged position with the apparatus, the flex-arm is restricted to movement along one directional axis.