Abstract: A device for cleaning griddles and grills has a heat resistant pad carried by a carriage, which in turn is manipulated by a motor to move in an oscillating and/or planar agitating motion, analogous to a hand-held motorized sander. A dispensing container with liquid for shocking the grill is mounted on the device or provided internally. A scraper can be attached to the device.

Abstract: A polishing apparatus for polishing a workpiece has a polishing unit and a cleaning unit. The polishing unit has a polishing table having a polishing surface thereon, and a top ring for pressing the workpiece against the polishing surface. The cleaning unit has a rotatable shaft configured to be vertically movable, a holding mechanism mounted to the rotatable shaft for detachably holding the workpiece, and a plurality of cleaning devices disposed around the rotatable shaft for cleaning the workpiece which has been polished in the polishing unit.

Abstract: A system and method for rinsing and cleaning a wafer carrier and a semiconductor wafer mounted thereon during a chemical mechanical planarization (CMP) process is provided. The system includes a head spray assembly that comprises a plurality of spray nozzles positioned therein. The head spray assemble is moveably positionable between a park position and a spray position. The spray position is adjacent the wafer carrier such that liquid discharged from the spray nozzles is in liquid communication with the wafer carrier, the semiconductor wafer and the interior of the head spray assembly. The system provides aggressive and uniform cleaning and rinsing while containing and collecting the liquid discharged from the spray nozzles and the materials rinsed from the wafer carrier and semiconductor wafer.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.

Abstract: A processing system for increasing the quality of a gear having a shot peening apparatus for subjecting, to shot peening, a gear after tooth-forming and surface hardening; a barreling apparatus positioned adjacently to the shot peening apparatus, for subjecting, to barreling, the gear which has been subject to shot peening by the shot peening apparatus; and a gear feeding apparatus positioned adjacently to the shot peening apparatus and the barreling apparatus, for feeding, to the barreling apparatus, the gear which has been subjected to the shot peening by the shot peening apparatus. Thus, a gear of high quality can be efficiently produced, and the working environment can be cleaned at low cost by a dust collecting apparatus.

Abstract: A carrier rinse unit comprising a plurality of nozzles prepositioned to eject a cleaning fluid against a surface of a wafer while the wafer is rotated within a wafer carrier. The prepositioned nozzles may be angled to spray a leading edge, a trailing edge, an outer edge of the wafer, or any desired point on the surface of the wafer.

Abstract: A carrier rinse unit comprising a plurality of nozzles prepositioned to eject a cleaning fluid against a surface of a wafer while the wafer is rotated within a wafer carrier. The prepositioned nozzles may be angled to spray a leading edge, a trailing edge, an outer edge of the wafer, or any desired point on the surface of the wafer.

Abstract: A modified chemical-mechanical polishing apparatus is described. The apparatus includes: (i) a polishing pad 104 providing a surface against which a surface of an integrated circuit substrate 116 is polished; (ii) an anode 103 on which the polishing pad is secured, the anode including an electrolyzable conductive material; and (iii) a voltage source 106 electrically connecting the anode to the integrated circuit substrate in such a way that when a voltage is applied from the voltage source in the presence of slurry 114 admixed with an electrolyte composition on the polishing pad, an electrolytic cell results in which the conductive material deposits on the surface of the integrated circuit substrate. A process of depositing a conductive material on and polishing a surface of an integrated circuit substrate simultaneously is also described.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

Abstract: The process and device (1) for positioning several single crystals (2) on a support (3) for their simultaneous cutting in directions well defined relative to the crystal structure of each single crystal; they avoid the adjustment in the machine and minimize the cutting time by providing a positioning outside the machine about angles of rotation (d,g) obtained mathematically from measured and/or given data and which position each geometric single crystal in a plane perpendicular to the cutting direction (z'") whilst bringing the cutting plane of each single crystal (2) parallel to the cutting direction of the machine. The device for practicing the process comprises a frame (5), a gripping device (8) mounted rotatably on the frame and carrying single crystals (2) and a rotatable plate (11) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and to the cutting machine.

Abstract: A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

Abstract: A device for magnetic-abrasive machining of a part has the steps of forming a magnetic field, arranging a part to be machined in the magnetic field, supplying a magnetic-abrasive powder in a machining zone toward a surface of the part to be machined, and supplying a fluid jet under pressure toward the magnetic-abrasive powder so as to move the magnetic-abrasive powder relative the surface of the part to be machined.