Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

Abstract: A multi-carriage dual-spindle symmetrical grinding processing center, wherein: A work table with a rotary table therein is positioned on a first carriage which is attached to a front base; first and second upright posts are positioned in a gantry form on a back base; a horizontal grinding head is connected to a second carriage between the upright posts; a third left carriage and a third right carriage are slidingly connected to the first and second upright posts, respectively, and a left slider and a right slider are connected to the third left carriage and the third right carriage, respectively; a vertical grinding head is installed at the front end of the right slider; an automatic tool changing device is equipped with the vertical grinding head, and a grinding wheel profile dressing device can be installed on the second carriage and on the left slider.

Abstract: The present disclosure provides a cleaning unit for a chemical mechanical polishing (CMP) process. The cleaning unit comprises a cleaning solution; a brush configured to scrub a wafer during the CMP process; and a spray nozzle configured to apply the cleaning solution to the wafer when the brush scrubs the wafer during the CMP process. In some embodiments, the spray nozzle includes an inlet where the cleaning solution enters the spray nozzle and an outlet where the cleaning solution exits the spray nozzle. In some embodiments, an inlet area (A0) is different from an outlet area (A1).

Abstract: A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad.

Abstract: The invention relates to devices, systems and methods for restoring optical discs, including CD's, DVD's and Blu-ray discs. The invention provides an easy to use device for user's to repair optical discs without having to clean or remove rotating pads in the device between uses for the life of the pads of about 84 cycles.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: The present disclosure provides a method of fabricating a semiconductor device with metal interconnections and a design of a tool for performing such a method. In one embodiment, a method of fabricating a semiconductor device, the method includes providing a semiconductor substrate, depositing a dielectric layer over the semiconductor substrate, forming at least one trench in the dielectric layer, and forming a metallization layer in the trench and over the dielectric layer. The method further includes performing a chemical mechanical polishing process to planarize the metallization layer and the dielectric layer, performing a surface treatment on the planarized dielectric layer to form a protection layer, cleaning the planarized metallization layer and the treated dielectric layer to remove residue from the chemical mechanical polishing process, and drying the cleaned metallization layer and dielectric layer in an inert gas environment.

Abstract: A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The positioning assembly includes a first positioning plate and a second positioning plate mounted on the bracket and opposite to the first positioning plate. The first positioning plate and the second positioning plate are clamped into two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate.

Abstract: A substrate cleaning apparatus for reducing a limitation of a layout of a chemical liquid nozzle and a rinsing liquid nozzle, while enabling a load cell to be installed at an optimal location and achieving a larger adjustment range, is disclosed. The substrate cleaning apparatus includes a roll assembly including at least a roll cleaning member to be brought into contact with a substrate and a roll arm that rotatably supports the roll cleaning member, a support arm for supporting the roll assembly; an adjustment screw extending through the support arm and screwed into the roll assembly; and a screw support that fixes a relative position of the adjustment screw in a vertical direction with respect to the support arm and rotatably supports the adjustment screw.

Abstract: In a semiconductor wafer manufacturing apparatus, a rotation module is provided to hold the semiconductor wafer at a plane. The semiconductor wafer is revolved by the rotation module around a first axis. The first axis is substantially perpendicular to the plane. A cleaning module is configured to revolve around a second axis when the cleaning module contacts the surface of the semiconductor wafer. A mechanism is further provided to enable the rotation module and/or the cleaning module to move along a direction substantially perpendicular to the first axis. Consequently, the relative velocities at the contact points between the semiconductor wafer and the cleaning module are changed. Moreover, no relative velocity at any contact point between the semiconductor wafer and the cleaning module is zero or close to zero.

Abstract: Manufacturing methods are provided. A component may be polished to remove defects thereon. An identifier may be added to the polishing material employed to polish the component. A detector may detect the identifier. For example, the identifier may be a fluroescing material that may illuminate in the presence of a fluorescent light. A determining apparatus may determine a status of the component based on the presence or absence of the identifier. For example, the determining apparatus may determine that the component needs to be re-cleaned based on presence of the identifier. Related systems and computer program products are also provided.

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract: The invention relates to a method for the multi-stage grinding of workpieces (20) made of hard mineral materials using a robot (10). To this end, the workpiece (20) is moved into a processing region (21) and measured and/or oriented there by the robot (10). The robot (10) comprises a grinding head (11) by way of which it then takes up a first abrasive (14) preferably from a storage container (30) and starts a first grinding process. After the first grinding process is complete, the robot (10) releases the first abrasive (14) again and then takes up a second abrasive (14), preferably from the same or some other storage container (30). Then the robot (10) starts a second grinding process, and after the latter is complete, releases the second abrasive (14) again. One or more further grinding processes may be provided, but the grinding method can also be finished after the second grinding process.

Abstract: Among other things, one or more systems and techniques for increasing temperature for chemical mechanical polishing (CMP) are provided. For example, a liquid heater component is configured to supply heated liquid to a polishing pad upon which a semiconductor wafer is to be polished, resulting in a heated polishing pad having a heated polishing pad temperature. The increased temperature of the heated polishing pad increases oxidation of the semiconductor wafer, which improves a CMP removal rate of material from the semiconductor wafer due to a decreased oxidation timespan and a stabilization timespan for reaching a stable CMP removal rate during CMP. In this way, the semiconductor wafer is polished utilizing the heated polishing pad, such as by a tungsten CMP process.

Abstract: Embodiments of mechanisms for performing a chemical mechanical polishing (CMP) process are provided. A method for performing a CMP process includes polishing a wafer by using a polishing pad. The method also includes applying a cleaning liquid jet on the polishing pad to condition the polishing pad. A CMP system is also provided.

Abstract: A polishing apparatus which can remove slurry which has entered into a gap between an elastic membrane for pressing a substrate such as a wafer and a retaining ring is disclosed. The polishing apparatus includes a top ring which has an elastic membrane configured to form a pressure chamber for pressing the substrate against a polishing pad, and a retaining ring disposed around the elastic membrane and configured to press the polishing pad, a top ring rotating device configured to rotate the top ring about an axis of the top ring, and a cleaning brush configured to be brought into contact with a peripheral portion of a lower surface and an outer circumferential surface of the elastic membrane.

Abstract: A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus includes a substrate stage configured to support a substrate horizontally, a rinsing water supply structure configured to supply rinsing water onto an entire surface of the substrate on the substrate stage, a film-thickness measuring head configured to transmit light to a measurement area of the surface of the substrate on the substrate stage, produce a spectrum of reflected light from the measurement area, and determine a film thickness of the substrate from the spectrum, and a fluid supply structure configured to form a flow of a gas on a path of the light and supply the flow of the gas onto the measurement area.

Abstract: A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness.

Abstract: An apparatus for grinding a surface of a substrate, the apparatus including an inlet through which a jig accommodating the substrate is put; a grinding part that grinds the substrate conveyed from the inlet; and a washing part that washes the substrate conveyed from the grinding part, wherein the grinding part includes a plurality of rollers, the plurality of rollers having a protruding curved surface facing the jig and rotating on a surface of the substrate to grind the substrate, and the inlet, the grinding part, and the washing part are continuously conveyed by a conveyor.

Abstract: A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.

Abstract: The present invention relates a grinding device 1 for the machine-based grinding of rotor blades 100 for wind energy systems, comprising a belt grinding unit 10 with a circulating grinding belt 12.

Abstract: This invention relates to an apparatus and method for refurbishing lacrosse balls by using a fast, convenient, automated, entertaining, energy efficient, portable, and modular machine/method of removing a thin layer of rubber from the surface of a used lacrosse ball, by applying even pressure and random rotation of abrasive, one to four cups or rings, utilizing a combination of gravity and/or force of the cups against the surface of the ball, and the introduction of a solvent at various speeds, volume, and concentration, during and after the removal of a thin layer of rubber, to maximize the restoration of the rubber surface.

Abstract: A system includes: a cup attaching unit configured to attach a cup to a surface of an eyeglass lens; a processing apparatus main body that includes a housing in which a lens processing mechanism with a processing tool configured to process the eyeglass lens held by a lens chuck shaft is arranged; a display which is arranged at the housing and is configured to display an operation step; a signal input unit configured to input a switching signal to switch a screen of the display from a screen for a current operation step to a screen for a next operation step; and a controller configured to control the display to switch displaying the screen of the display from the screen for the current operation step to the screen of the next operation step based on the switching signal input by the signal input unit.

Abstract: A programmable coolant nozzle system and method for grinding wheel machines. The system comprises a fluid manifold block that automatically or manually follows the wear of the grinding wheel, to position coolant jets tangential to the wheel surface throughout the life of the grinding wheel. The positioning is by an arcuate motion, through a parallelogram mechanism, to ensure that the coolant jets remain at the same angle to the grinding wheel surface throughout the entire range of motion.

Abstract: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover.

Abstract: A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet.

Abstract: Disclosed is a method and apparatus for polishing an edge of an article involving providing at least one carrier including: first and second opposing surfaces defining a groove, the first and second opposing surfaces being spaced apart in a first direction to receive the edge; and magnetic field generator configured to provide a magnetic field in the groove to stiffen magnetorheological (MR) fluid disposed in the groove to provide at least one polishing zone; receiving the edge in the polishing zone; and driving relative motion between the at least one carrier and the edge in a second direction substantially transverse to the first direction.

Abstract: The present invention provides a method of working a high hardness material including the steps of heating the high hardness material, working the high hardness material by using a polishing tool, cooling the polishing tool at a position which is different from a worked part, and washing the polishing tool at a position which is different from the worked part.

Abstract: Floor grinding- and cleaning body (1) for machine-based processing of structured floorings (2) comprising a base body (10) which is provided on a first side (12) with a resilient, textured surface (14), a processing layer (20) that is arranged on the textured surface (14) of the base body (10) and a hook-and-loop adaption layer (30), which is arranged on a second side (16) of the base body (10) opposed to the first side (12), wherein the textured surface (14) comprises a resilient burling structure, wherein the burls (18) thereof are designed to be able to treat deep areas (4) of a structured surface (3) of a flooring (2).

Abstract: A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet.

Abstract: A pressure detection device includes a pressure detector, a bearing member, at least two guiding rods passing through the bearing member and connecting with the pressure detector, at least two elastic elements sleeving on the at least one guiding rod and resisting between the bearing member and the pressure detector for transferring forces from the bearing member to the pressure detector.

Abstract: A machine tool with an ultrasonic device includes a machine tool unit, a fastening unit, and an ultrasonic unit. The machine tool unit includes a working device and a worktable. The working device has a working member to process a workpiece. The fastening unit is disposed on the worktable to mount and fasten the workpiece. The ultrasonic unit is located between the worktable and the fastening unit. When the working member and the ultrasonic unit are activated, the workpiece is processed by the working member, and the ultrasonic unit generates ultrasonic vibrations to the fastening unit and the workpiece placed on the fastening unit to clear filings from the workpiece during operation to enhance the work efficiency greatly.

Abstract: The present invention relates a grinding device 1 for the machine-based grinding of rotor blades 100 for wind energy systems, comprising a belt grinding unit 10 with a circulating grinding belt 12.

Abstract: Grinding device 1 for machine-based grinding of rotor blades 100 for wind energy systems, comprising at least one industrial robot 30 and a grinding unit 10, 50, 70 that is guided by the industrial robot 30, wherein the grinding unit 10, 50, 70 comprises a grinding means, 12, 52 and a cleaning device 20, that cleans the grinding means 12, 52 at its grinding surface 64, 53.

Abstract: When the remaining slurry and polishing residue are removed by cleaning with a cleaning liquid (preferably a cleaning liquid containing a surfactant), organic matter in the cleaning liquid containing a surfactant seeps into the interlayer insulating film 3. Therefore, the substrate is subsequently washed with an organic solvent or a solution containing an organic solvent, thus washing away the organic matter that has seeped into the interlayer insulating film 3. Although the interlayer insulating film 3 is subjected to a hydrophobic treatment, since the solvent used is an organic solvent, this solvent is able to seep into the interlayer insulating film 3, dissolve the organic matter, and wash the organic matter away without being affected by this hydrophobic treatment. Afterward, the substrate 1 is dried, and the organic solvent or solution containing an organic solvent that is adhering to the surface is removed.

Abstract: Floor grinding- and cleaning body (1) for machine-based processing of structured floorings (2) comprising a base body (10) which is provided on a first side (12) with a resilient, textured surface (14), a processing layer (20) that is arranged on the textured surface (14) of the base body (10) and a hook-and-loop adaption layer (30), which is arranged on a second side (16) of the base body (10) opposed to the first side (12), wherein the textured surface (14) comprises a resilient burling structure, wherein the burls (18) thereof are designed to be able to treat deep areas (4) of a structured surface (3) of a flooring (2).

Abstract: The invention relates to a method for the production of a rotor of a rotary screw compressor (1) with a cylindrical basic shape, which has a helical profile (2) at its outer circumference, wherein the method comprises the steps of: a) Pre-processing of the workpiece (1) by bringing in the profile (2), wherein the profile (2) has a stock compared with the finished shape, b) Pre-grinding of the profile (2) by a rough-machining process in a grinding machine, wherein a part of the stock is removed and c) Finish-grinding of the profile (2) by a finish-machining process in the grinding machine, wherein the remainder of the stock is removed and the finished shape of the profile (2) is produced. To improve the efficiency of the production especially of rotors of rotary screw compressors and ensure a high quality of the production the invention is characterized in that the pre-grinding and/or the finish-grinding is carried out with a grinding worm (3) by a continuous generative grinding process.

Abstract: In one aspect, the invention is directed to a sharpener for sharpening a corner edge of a snow travel member, which may be, for example, a ski or a snowboard. The corner edge is between a bottom face and a side face of the snow travel member. The sharpener includes an angle adjustment mechanism to adjust the angle between surfaces on the sharpener that support the bottom face and side face of the snow travel member, in order to accommodate different snow travel members, that may have different angles between their bottom face and their side face. For example, the angle adjustment member may be capable of adjusting the angle between a bottom face orienting surface on the sharpener and a side face orienting surface on the sharpener between a range of angles. The range of angles may be, for example, a range from 85 degrees and 90 degrees.

Abstract: An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being pro

Abstract: An apparatus for grinding a cam having an outer surface with outwardly convex and outwardly concave portions has a frame and a main drive on the frame for holding the cam and rotating it about a main axis. A pair of drive motors having respective output axes generally diametrally flank the main axis. Respective carriages carrying the drive motors are shiftable on the frame radially of the main axis. One of the motors is shiftable into an inner position in which the main axis extends through the one drive motor. Respective grinding wheels are rotatable by the motors about the respective axes, and the wheel of the one motor is of substantially smaller diameter than the wheel of the other motor.

Abstract: A swing arm for managing a power cord to an electric vehicle has a proximate arm member with a pivotable connection about a vertical axis for connection to the vehicle in proximity to a longitudinal center line of the vehicle. A distal arm member is pivotably connected about a pivot vertical axis to the proximate arm member and resiliently biased to extend straight out with respect to the proximate arm member. The swing arm is dimensioned to extend the distal arm member beyond a side of the vehicle when the swing arm extends laterally with respect to the vehicle. A spring member is connected to the distal arm member for resiliently biasing the distal arm member to extend straight out with respect to the proximate arm member against a side force below a predetermined amount and yieldable to bending of the distal arm member upon exertion of a side force above the predetermined amount.

Abstract: A self-propelled mobile marking removal system which comprises a mobile vehicle assembly including a chassis, a high pressure liquid pump in fluid connection with a liquid reservoir contained within said chassis, said high pressure liquid pump is further in fluid connection with a blast head, said blast head having at least one high pressure nozzle for delivering liquid at high pressure to a marked surface, a waste removal hose fluidly coupled with said blast head and a sump for collection of liquid and debris, said blast head positionable along a left or a right side of said chassis, a mechanical abrasion means, said mechanical abrasion means positionable along a left or a right side of said chassis in front of said blast head, said mechanical abrasion means is constructed and arranged to substantially remove marking material protruding above said marked surface and said blast head constructed and arranged to substantially remove any marking material extending below said marked surface.

Abstract: In a scrubber adapted to clean a semiconductor wafer, the torque of a brush rotation motor is monitored while a scrubber brush is in contact with the wafer and is being rotated by the motor. The position of the brush relative to the wafer may be adjusted based on the monitored torque to regulate the pressure applied to the wafer by the brush. Open loop positioning or closed loop control may be employed.

Abstract: A lap platen has a lapping surface contacting a surface of a work piece. A lap base has a support surface brought into contact with and supported by the lapping surface. An adapter has a first support part, a second support part and an arm part. The first support part is supported by the lap base. The work piece is attached to the second support part so that a surface of the work piece to be processed contacts the lapping surface. The arm part extends between the first and second support parts. A height adjusting mechanism adjusts a height from the lapping surface to the first support part. An inclination detector is provided to the adapter to detect an inclination of the adapter. The inclination of the adapter relative to the lapping surface is adjusted by adjusting the height of the first support part by the height adjusting mechanism.

Abstract: An apparatus for processing an inside of a pipe which performs various works from an inside of a pipe, includes traveling drive units, a working device, rotation support mechanisms, a coupling mechanism, and suspension devices. The traveling drive units are inserted into the inside of the pipe, and the working device is moved in a circumferential direction along the inside of the pipe by the traveling drive units.

Abstract: An abrasive tool utilized to remove material from a workpiece is formed to comprise fluid-dynamically-designed features (apertures, airfoils) configured to efficiently remove abraded material and waste from the surface of the workpiece. An abrasive component (and/or backing plate) is formed to include fluid-dynamically-designed features that create an air flow stream/pressure differential which draws the created debris (variously referred to as “swarf”, meaning in general any material removed by an abrading tool) away from the grinding surface.

Abstract: A honing machine 1 is provided with a honing zone 5 for subjecting a work 2 to a liquid honing process and a washing zone 6 for subjecting the work 2 to which the liquid honing process was executed at the honing zone 5 to a washing process in a housing 4 shielded from an external air, the honing zone 5 and the washing zone 6 being disposed adjacently. A partition wall 7 for preventing an ambient gas of the honing zone 5 from entering into the washing zone 6 is disposed between the honing zone 5 and the washing zone 6 in the housing 4. An in-liquid conveying apparatus 10 for conveying the work 2 to which the liquid honing process was executed at the honing zone 5 from the honing zone 5 to the washing zone 6 with the work kept immersed in the liquid 72 in a carrying bath 11 is disposed in the housing 4.

Abstract: A grinding method includes the steps of: enabling an image-capturing device to capture a set of consecutive images containing a workpiece being ground by a grinding device; enabling an image-processing device to identify the workpiece from the images, to detect a top edge of the identified workpiece from a latest one of the images, to locate a set of image pixels that lie on the top edge of the workpiece, and to determine relative heights of the image pixels; and enabling a controlling device to control grinding operation of the grinding device with reference to the relative heights of the image pixels. A system that performs the grinding method is also disclosed.