Abstract: A low temperature sealing glass composition comprises a glass powder comprising 20 to 55 wt. % of PbO, 20 to 55 wt. % of V.sub.2 O.sub.5, 5 to 40 wt. % of TeO.sub.2, and 0 to 8 wt. % of Al.sub.2 O.sub.3 or (i) 50 to 80 vol. % of a glass powder comprising 20 to 55 wt. % of PbO, 20 to 55 wt. % of V.sub.2 O.sub.5, 5 to 40 wt. % of TeO.sub.2, and 0 to 8 wt. % of Al.sub.2 O.sub.3, and (ii) 20 to 50 vol. % of low thermal expansion ceramic fillers.

Abstract: Glass compositions containing CaO, Al.sub.2 O.sub.3, B.sub.2 O.sub.3, SrO and BaO of various combinations of mole % are provided. These compositions are capable of forming stable glass-to-metal seals with titanium and titanium alloys, for use in components such as seals for battery headers.

Abstract: There is disclosed a sealing material based on a lead sealing glass having a mill addition of a crystalline material having the crystalline structure of magnesium pyrophosphate. The effective coefficient of thermal expansion in a seal is substantially reduced by the mill addition, thereby permitting use with low expansion materials.

Abstract: Mill additions are disclosed which lower the CTE of, and are compatible with, tin-phosphorus oxyfluoride glasses. The sealing materials provide fusion-type seals having a CTE not over about 110.times.10.sup.-7 /.degree.C. and a sealing temperature not over about 350.degree. C.Also disclosed is a family of glass compositions in the tin-phosphorus oxyfluoride system that exhibit very low glass transition temperatures and coefficients of thermal expansion not over about 160.times.10-7/.degree.C. (25.degree.-150.degree. C.). In addition to the four basic elements, the glasses contain up to 11% Nb, and may additionally contain up to 10%, taken individually or in combination, of V, Fe and/or Mo to further decrease the Tg and CTE values.

Abstract: A filler composition having a coefficient of thermal expansion substantially equivalent to that of SiC foam and capable of fusing and integrally bonding to SiC foam. The filler composition is useful for bonding a surface layer to a SiC foam core for optical mirrors which are used in space applications and cryogenic detectors.

Abstract: An encapsulant composition comprising a lead zinc silicoborate glass which forms a crystalline phase of Zn.sub.2 SiO.sub.4 and ZnB.sub.2 O.sub.4 when it is fired at 650.degree.-800.degree. C.

Abstract: A sealing material for sealing electronic parts is composed of a low-melting-point glass and a filler which has its surface modified by coating with ZnO and is compatible with low melting point glass.

Abstract: A ceramic material for electronic circuit devices is sintered at less than or equal to 1000.degree. C. temperature. A filler material such as quartz and a glassy binder RO--Al.sub.2 O.sub.3 --B.sub.2 O.sub.3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol% of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.

Abstract: Fluid, stable glasses useful for low-temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, phosphorus pentoxide, titania and/or zirconium oxide to the lead oxide vanadium oxide binary. The phosphorus pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum oxide.Sealing glass compositions comprising these low-melting lead-vanadia glasses in powder form and refractory fillers of lower thermal expansion for use in hermetically sealing semiconductor devices in ceramic packages are disclosed. Group V metal oxides, particularly niobium-containing oxides, are preferred fillers. Silver metal is a preferred filler for making die-attach compositions.

Abstract: A dental porcelain having the following composition:______________________________________ Ingredient Weight by Percent ______________________________________ SiO.sub.2 52.7%-64.6% Al.sub.2 O.sub.3 6.3%-16.4% Li.sub.2 O 0%-0.5% Na.sub.2 O 3.9%-14.2% K.sub.2 O 4.5%-11.7% MgO 0%-.3% CaO 1.6%-3.3% Sro 0.9%-2.3% BaO 0.3%-8.1% TiO.sub.2 0.1%-3.6% B.sub.2 O.sub.3 0.2%-5.0% ______________________________________made by blending powdered first-fire frit with pacifiers, heating this first-fire frit to 2000.degree. F., and rapidly cooling the charge.

Abstract: The soldering enamel is composed of a basic enamel consisting of aluminium oxide and a rare earth metal oxide and/or an alkali earth metal oxide and, in the given case, some other metallic or metalloid oxide, and of a ceramic filling material. The filling material is a zirconium-rare earth oxide of perovskite crystal structure. The quantity of the filling material amounts up to 5 mass % referred to the overall quantity of enamel.

Abstract: The invention relates to a composite body comprising a first part of ceramic material, a second part of metallic material, of ceramic material or of a mixture of metallic and ceramic material, and a third part of a melting ceramic which seals together the first and second parts, and comprises a frit of Al.sub.2 O.sub.3 and either one or more alkaline earth metal oxides or one or more rare earth metal oxides or a combination of these two oxides. According to the invention, the melting ceramic contains a filler material which occupies at least 20% and at most 50% of the volume of the melting ceramic.

Abstract: Dielectric ink, paste and tape compositions having controlled thermal expansion contain a mixture of glasses wherein at least one glass has a coefficient of thermal expansion (CTE) below the CTE of the substrate to which the dielectric composition is applied and at least one glass has a CTE above the CTE of said substrate. The dielectric compositions significantly reduce or eliminate warpage of the substrate.

Abstract: A material hermetically seals two members. One member may be titanium or a titanium alloy and the other member may be a noble metal such as platinum. The seal is resistant to acids and alkalis and is substantially impervious to shocks resulting from mechanical forces or abrupt changes in temperature. The material includes a pair of fluxes having different melting temperatures and oxides of zinc and zirconium. The oxides of zinc and zirconium become crystallized at the surface between one of the members and the material. An oxygen valence bond is also produced between the material and such member. The material becomes progressively amorphous with progressive distances from such member. The material is formed by progressive heatings for at least a pair of periods of time insufficient to crystallize all of the material and by rapid coolings of the material after each of such heatings.

Abstract: A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

Abstract: A sealing glass composition suitable for sealing members in semiconductor devices at a temperature below about 450.degree. C. and a comparatively low thermal expansion coefficient of about 35-50.times.10.sup.-7 /.degree.C. matching that of semiconductors. The sealing glass composition comprises 50-80 vol % solder glass powder and 20-50 vol % filler powder of a ceramic comprising, by weight, PbO 65-75%, TiO.sub.2 10-25%, Fe.sub.2 O.sub.3 1-10%, WO.sub.3 1-12%, and CaO 0-5%, so that Ti in the PbTiO.sub.3 filler is partially substituted by Fe and W. The filler powder has an average particle size of about 5 .mu.m. In use of the sealing glass composition, microcracks are absent in glass phase around the filler after sealing.

Abstract: Disclosed are an adhesive for oxide ceramics, which comprises as its effective ingredient a crystallized glass mainly comprising SiO.sub.2, Al.sub.2 O.sub.3, Li.sub.2 O, MgO and/or ZnO, and TiO.sub.2 and/or ZrO.sub.2, and also a method of bonding oxide ceramics together, which comprises heating oxide ceramics to be bonded together at 1200.degree. to 1600.degree. C. with the adhesive placed between the ceramics.

Abstract: This invention relates to a sealing glass for use in bonding glass, ceramics and metals and specifies the composition of a sealing glass which is workable at moderate temperatures and is excellent in transparency and strength. Amorphous magnetic materials have themselves a crystallization temperature and when used in a magnetic head, the amorphous materials undergo crystallization in assembling the head at a sealing temperature higher than the crystallization temperature and becomes not only brittle but also deteriorated in magnetic characteristics so that the head becomes unsuitable for use. The present glass is advantageously used in such a case.

Abstract: Glaze compositions for ceramic substrates such as an alumina substrate are described. In a first embodiment, the glaze composition consists of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO and 0.1 to 5 mol % Y.sub.2 O.sub.3. In a second embodiment, the glaze composition consists essentially of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO, 1 to 5 mol % Y.sub.2 O.sub.3, 25 mol % or less SrO, 7 mol % or less B.sub.2 O.sub.3, 2 mol % or less ZnO and 2 mol % or less MgO. In a third embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.3, 2 to 20 mol % CaO and 1 to 13 mol % BaO. In a fourth embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.

Abstract: A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.

Abstract: A matrix of a glass or a plastic is mixed with 1% to 10% of a niobium substance, 1% to 10% of a magnesium compound, 1% to 10% of barium fluoride, and 5% to 30% of lead, the percentages indicating the weight of these substances the matrix. The mixture is heat-molded to form an anti-fogging material.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. For extreme bonding conditions, a small amount of copper oxide is dissolved into the glass matrix.

Abstract: A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of at least one electrically insulating glass, at least one organic binder, at least one inorganic peroxide, and at least one material selected from the group which consists of: a metal selected from the platinum group; a compound of the platinum group; a manganese oxide; and a cobalt oxide.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. The glass composite is particularly useful as a semiconductor package sealant.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. The glass composite is particularly useful as a semiconductor package sealant.

Abstract: A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt % vitreous PbO-B.sub.2 O.sub.3 solder glass powder having a deformation point of 350.degree. C. or less, 0-45 wt % low thermal expansion ceramic powder and 2-40 wt % zircon powder. The zircon powder is of a synthetic zircon artificially prepared to eliminate radioactive impurities such as uranium and/or thorium and contains 0.5-7 wt % Fe.sub.2 O.sub.3, MnO and/or ZnO without alkali impurities and without non-reacted zirconium oxide. The composition has an improved flowability.

Abstract: To provide a melt glass (10) to seal capillary spaces (9) surrounding external current supply leads (8) of molybdenum passing to molybdenum foils (6) in a pinch or press seal (7) of a high temperature, for example incandescent halogen lamp, the melt glass (10) is made of 3-10% Bi.sub.2 O.sub.3, 25%-40% B.sub.2 O.sub.3, remainder PbO. The melt glass has low toxicity and is molybdenum-compatible. An additive of barium oxide, in up to 15% and preferably up to only about 10%, may be added to the PbO. All quantities in mol-percent.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. For extreme bonding conditions, a small amount of copper oxide is dissolved into the glass matrix.

Abstract: A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (T.sub.d) is 580.degree.-625.degree. C. and the softening point (T.sub.s) is 630.degree.-700.degree. C., and (T.sub.s -T.sub.d) is 50.degree.-75.degree. C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825.degree.-900.degree. C.

Abstract: Partially crystallized ceramic articles is prepared by firing at low temperatures of 800.degree. to 1100.degree. C., a mixture consisting essentially of, (a) 40 to 50 wt. % of powdered, noncrystalline glass consisting essentially of 10 to 55 wt. % of at least one selected from the group consisting of CaO and MgO, 45 to 70 wt. % of SiO.sub.2, 0 to 30 wt. % of Al.sub.2 O.sub.3, 0 to 30% of B.sub.2 O.sub.3 and up to 10% impurities, the powder size of said glass being at least 4.0 m.sup.2 /g in terms of specific surface area measured by the BET Method; and (b) 60 to 50 wt. % of powdered Al.sub.2 O.sub.3 and the ceramic article is composed essentially of a noncrystallized glass phase, alumina and at least one of crystallized glass phase among anorthite, wollastonite, cordierite and mullite formed by partially crystallizing the glass (a).

Abstract: In a multilayer ceramic circuit board comprising a substrate, an insulating layer on the substrate, and a conductive pattern on the insulating layer, an additive of Cr.sub.2 O.sub.3 or MnO.sub.2 is added to the insulating layer to reinforce adhesion between the insulating layer and the conductive pattern. Each of the substrate and the insulating layer is manufactured by firing at a temperature between 800.degree. C. and 1000.degree. C., alumina particles and a glass composition comprising an alumina component. When a total amount of alumina in the substrate is equal to or greater than that in the insulating layer, an amount of Cr.sub.2 O.sub.3 or MnO.sub.2 is restricted to a range between 0.1% and 10.0% by weight, with a difference between the total amounts of alumina falling within a range between 0% and 30% by weight. When the total amount of alumina in the substrate is smaller than that in the insulating layer, the amounts of Cr.sub.2 O.sub.3 and MnO.sub.2 may be between 0.1% and 10.

Abstract: Glaze compositions for ceramic substrates such as an alumina substrate are described. In a first embodiment, the glaze composition consists of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO and 0.1 to 5 mol % Y.sub.2 O.sub.3. In a second embodiment, the glaze composition consists essentially of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO, 1 to 5 mol % Y.sub.2 O.sub.3, 25 mol % or less SrO, 7 mol % or less B.sub.2 O.sub.3, 2 mol % or less ZnO and 2 mol % or less MgO. In a third embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.3, 2 to 20 mol % CaO and 1 to 13 mol % BaO. In a fourth embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.

Abstract: Fluid, stable glasses that are useful for low temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, and phosphorus pentoxide to the lead oxide-vanadium oxide binary. The phosphorous pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum pentoxide. Additives and fillers may be incorporated into the glass composition to enhance the fluidity or adhesive characteristics of the glass, alter its coefficient of linear thermal expansion or make it suitable for die attach application. Group V metal oxides, particularly niobium pentoxide, are preferred fillers for altering the coefficient of linear thermal expansion. Similarly these Group V metal oxides may also be added as particulate fillers to lead borate, lead borosilicate and zinc borate glasses. Silver metal is a preferred filler for making die attach compositions.

Abstract: A sealing glass composition suitable for sealing members in semiconductor devices at a temperature below about 450.degree. C. for a short time and a comparatively low thermal expansion coefficient of about 33-48.times.10.sup.-7 /.degree.C. matching with semiconductors. The sealing glass composition comprises 50-80 vol % solder glass powder and 20-50 vol % filler powder of lead calcium titanate represented by (Pb.sub.1-m Ca.sub.m)TiO.sub.3 where 0<m.ltoreq.0.4.

Abstract: A sealing glass composition comprising from 75 to 50% by volume of low-melting glass powder containing PbO as the main component, from 20 to 45% by volume of ceramics powder having a thermal expansion coefficient of at most 30.times.10.sup.-7 .degree. C..sup.-1 in a range of from room temperature to 300.degree. C. and from 5 to 30% by volume of TiO.sub.2 -SnO.sub.2 solid solution powder.

Abstract: Platinum corrosion reducing amounts of a premelted oxide mixture that is PbO and B.sub.2 O.sub.3, or PbO and SiO.sub.2, or PbO, SiO.sub.2 and B.sub.2 O.sub.3 are added to raw batch ingredients for a lead-containing solder glass. All or part of the Pb.sub.3 O.sub.4 or PbO normally used in the raw batch is replaced for advantages including reducing the amount of platinum corrosion in a platinum melter used to melt the raw batch to provide the glass.

Abstract: An arc discharge lamp is provided using sealing compositions comprising mainly Al.sub.2 O.sub.3 --SiO.sub.2 --MgO. Preferred compositions include between 25 to 28% by weight of MgO and 13 to 21% by weight of Al.sub.2 O.sub.3 since these have lower melting points than others in the group. The sealing compositions are used to seal end closure members of alumina or cermet to ceramic arc tubes for use in discharge lamps. The compositions are selected to have linear expansion co-efficients compatible with the materials of the end closures and arc tubes. The methods described give sealing times of between 3 and 4 minutes.

Abstract: A casting composition for making dielectric green tapes comprising a dispersion of finely divided solids of (a) a noncrystallizable glass and (b) a mixture of refractory oxides in a solution of (c) organic polymer, which is readily depolymerizable at 825.degree.-1025.degree. C. in a nonoxidizing atmosphere, dissolved in (d) volatile nonaqueous solvent.

Abstract: A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (T.sub.d) is 580.degree.-625.degree. C. and the softening point (T.sub.s) is 630.degree.-700.degree. C., and (T.sub.s -T.sub.d) is 50.degree.-75.degree. C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825.degree.-900.degree. C.

Abstract: A ceramic composition for dielectrics, consisting essentially of an inorganic dielectric material including at least one electrically insulating glass and at least one organic binder, and further comprising at least one inorganic peroxide. The inorganic peroxide serves to facilitate burnout or removal of the organic binder during firing of the ceramic composition and minimizes the content of residual carbon in the fired ceramic composition. The inorganic peroxide is preferably selected from the group consisting of calcium peroxide, strontium peroxide, barium peroxide, zinc peroxide and cadmium peroxide, and present preferably in an amount of 0.1-40% by weight. Also disclosed is a process of manufacturing a ceramic circuit board using the ceramic composition stated above.

Abstract: A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt % vitreous solder glass powder of PbO-B.sub.2 O.sub.3 system having a deformation point of 350.degree. C. or less, 1-35 wt % zinc material powder and 1-35 wt % zircon powder. The zircon powder is of a synthetic zircon artificially prepared to eliminate radioactive impurities such as uranium and/or thorium.

Abstract: A ceramic material for a honeycomb structure is prepared from a mixture of raw materials comprising per 100 parts by weight of the mixture 40 to 90 parts by weight of cordierite powder and 10 to 60 parts by weight of crystalline glass powder having a crystalline phase consisting mainly of a solid solution of .beta.-spodumene. The mixture consists essentially of 51.5 to 64.4% by weight of siO.sub.2, 24.8 to 33.7% by weight of Al.sub.2 O.sub.3, 5.5 to 12.4% by weight of MgO and 0.4 to 2.7% by weight of Li.sub.2 O. It may further contain up to 5.1% by weight of TiO.sub.2 and up to 1.8% by weight of ZrO.sub.2.

Abstract: An improved semiconductor die bonding structure and method for electrical devices is described which utilizes a ductile foil between the semiconductor die and the base of the device package. The die is sealed to the foil with a die bonding material formed from a titania free base glass to which has been added 23.6 to 36.4 weight percent lead titanate powder to give a glass plus ceramic mixture consisting essentially of (by weight percent) 2.5-10.7% GeO.sub.2, 0-2.3% SiO.sub.2, 58.6-78.5% PbO, 0-5.3% PbF.sub.2, 7-13% B.sub.2 O.sub.3, 2.5-6.9% Al.sub.2 O.sub.3, 0-5.3% ZnO, 0.4-2.3% V.sub.2 O.sub.5, 0-5.3% CdO, and 6.2-9.6% TiO.sub.2. The ductile foil is bonded to the ceramic package base directly without intermediate layers or alternatively by means of an improved foil bonding glass material consisting essentially of (by weight percent) 10-15% SiO.sub.2, 45-55% PbO, 8-12% ZnO, 2-5% Al.sub.2 O.sub.3, and 25-30% B.sub.2 O.sub.3.

Abstract: A crystallizable sealing glass composition in powered form that is a blend of a Pbo/ZnO/B.sub.2 O.sub.3 /SiO.sub.2 /BaO glass in the vitreous state and a small effective amount of finely divided zinc zirconium silicate as a nucleating agent. The zinc zirconium silicate has an average particle size of about 2 to 8 microns and is used alone, or in combination, with zirconium silicate having an average particle size of about 20 to 30 microns. The glass composition can be used to seal television picture tubes at 440.degree. C. or 460.degree. C. with excellent results, the early stages of crystallization showing large crystals and large glassy area, as well as DTA curve peaks at 15 to 25 minutes at 440.degree. C.

Abstract: An arc discharge lamp is provided using sealing compositions comprising mainly Al.sub.2 O.sub.3 --SiO.sub.2 --MgO. Preferred compositions include between 25 to 28% by weight of MgO and 13 to 21% by weight of Al.sub.2 O.sub.3 since these have lower melting points than others in the group. Additives of B.sub.2 O.sub.3, nucleating agents and HfO.sub.2 and other rare earth oxides are preferred. The sealing compositions are used to seal end closure members of alumina or CERMET to ceramic arc tubes for use in discharge lamps. The compositions are selected to have linear expansion co-efficients compatible with the materials of the end closures and arc tubes. The methods described give scaling times of between 3 and 4 minutes.

Abstract: A thick film conductor composition comprising an admixture of finely divided particles of noble metal and inorganic binder dispersed in organic medium in which the inorganic binder consists essentially of a bismuth silicate glass and/or bismuth germanate glass, ZnO and optionally Bi.sub.2 O.sub.3.

Abstract: Disclosed is a method for making glass bonded metal oxide electric resistors involving including in the mixture a refractory oxide for providing configuration stability during firing.

Abstract: A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt. % vitreous solder glass powder of PbO-B.sub.2 O.sub.3 system having a deformation point of 350.degree. C. or less, 1-35 wt. % first ceramic powder and 1-45 wt. % second ceramic powder. The total amount of the first and second ceramic powders is 20-50 wt. %. The first ceramic comprises 68-75 wt. % ZnO, 23-28 wt. % SiO.sub.2 and 0-8 wt. % Al.sub.2 O.sub.3, and the second ceramic comprises 98-99.9 wt. % SnO.sub.2 and 0.1-2 wt. % ZnO.

Abstract: A sealing glass composition comprising a lead borate glass matrix and a Willemite filler that provides a blended sealing glass composition with outstanding properties including excellent thermal (button flow and rod seal stress values) and chemical properties. A method of making the Willemite filler is described, the method including critical firing times and temperatures in order to produce the highly effective filler.

Abstract: A buffered glass ionomer cement for dental use, including in combination, a mixture of a fine particle, 5-10 microns, powder consisting essentially by weight of______________________________________ silica 20-30% boron oxide 1-10% aluminum oxide 10-20% aluminum fluoride 1-10% calcium fluoride 30-40% phosphorus pentoxide .[.1-5%.]..Iadd.1-10%.Iaddend. ammonium fluoride .[.1-10%.]..Iadd.1-5%.Iaddend. ______________________________________plus five to twenty percent of the weight of the above of zinc oxide and zero to ten percent of titanium dioxide, anda liquid component comprising, by weight polyacrylic acid of low molecular weight, 40% solution in water--100-80% by weight, d-tartaric acid--0-20%. The powder and the liquid component are mixed together in a ratio of from 1:1 to 5:3 by weight.