Abstract: The disclosure relates to a curable composition comprising: a polymerizable epoxy-acrylate resin composition having a complex viscosity at 25° C. and 1 Hz frequency of at least about 4500 Pa-s and a probe tack peak force of at least about 300 kPa; and abrasive particles partially or fully embedded in the polymerizable epoxy-acrylate resin composition. The disclosure also relates to cured compositions formed from such curable compositions, wherein the abrasive particles are partially or fully embedded in the cured composition. In addition, the disclosure relates to abrasive articles made from such cured compositions as well as methods for making abrasive articles.

Abstract: A turning tool includes: a holder portion; and a cutting edge portion fixed to the holder portion, wherein the cutting edge portion is composed of a synthetic single-crystal diamond, and the cutting edge portion has a nose curvature having a curvature radius of more than or equal to 0.1 mm and less than or equal to 1.2 mm, and the nose curvature satisfies at least one of a condition that a direction of a line of intersection between the rake face and a bisecting cross section of a vertex angle of the nose curvature is within ±10° relative to a <110> direction of the synthetic single-crystal diamond, and a condition that the direction of the line of intersection between the rake face and the bisecting cross section of the vertex angle of the nose curvature is within ±10° relative to a <100> direction of the synthetic single-crystal diamond.

Abstract: A shaped abrasive particle including a body comprising a first major surface, a second major surface, and a side surface extending between the first major surface and the second major surface, the body comprising a sharpness-shape-strength factor (3SF) within a range between about 0.7 and about 1.7 and a Shape Index within a range between at least about 0.01 and not greater than about 0.49.

Abstract: This disclosure relates to a polycrystalline diamond (PCD) body comprising a PCD material formed of intergrown diamond grains forming a diamond network, and an iron-containing binder.

Abstract: A method for preparing a polishing pad includes: preparing a polishing pad transition structure formed with a plurality of grooves, openings of the plurality of grooves being all located on a same side surface of the polishing pad transition structure; filling the plurality of grooves of the polishing pad transition structure with inorganic nanoparticles; pouring a mixture of a liquid polymer and a curing agent on the polishing pad transition structure, and evacuating air in the liquid polymer and the plurality of grooves; and placing the polishing pad transition structure in an environment at a temperature higher than or equal to a first temperature threshold, and the cured liquid polymer and the polishing pad transition structure constituting the polishing pad.

Abstract: A method of producing a machining segment, in which a green body (51) is constructed from a machining zone (54), wherein the machining zone (54) is produced from a first metallic powder material (56) and hard material particles (58), the green body (51) is compacted under pressure with a compression pressure to result in a compact body and the compact body is sintered thermally at a sintering temperature to result in the finished machining segment, wherein the machining zone (54) is produced by layer-by-layer application of material layers of the first metallic powder material (56) and particle layers of the hard material particles (58), wherein the hard material particles (58) in one particle layer are placed into the previously applied material layer of the first metallic powder material (56).

Abstract: A super hard polycrystalline construction is disclosed as comprising a body of super hard material having a first fraction of super hard grains in a matrix of a second fraction of super hard grains. The average grain size of the first fraction is between around 1.5 to around 10 times the average grain size of the second fraction and the first fraction comprises around 5 vol % to around 30 vol % of the grains of super hard material in the body.

Abstract: An excellent abrasive blade tip is provided by a two-layer coating system consisting of a brazing solder coating and an NiCoCrAlY coating containing cBN (cubic Boron Nitride).

Abstract: A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode such that a voltage is generated between the polycrystalline diamond table and the electrode and the voltage is applied to the processing solution.

Abstract: In an abrasive body used for polishing by a CMP method, provided with a resin structure, a plurality of abrasive grains, and a plurality of longitudinal pores, and made in a form of disc, the longitudinal pore has a length in a thickness direction of the abrasive body longer than a length in a planar direction of the abrasive body, the resin structure includes communicating pores each of which communicating with the longitudinal pore and/or communicating with other communicating pore, the communicating pores include at least one of the abrasive grains in the pores respectively, and the average diameter of the communicating pores is not more than 18 times larger than the average diameter of the abrasive grains.

Abstract: Embodiments relate to a polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table having at least two regions and being bonded to a fine grained cemented tungsten carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate having a cobalt-containing cementing constituent cementing tungsten carbide grains together that exhibit an average grain size of about 1.5 ?m or less, and a PCD table having at least one upper region including diamond grains exhibiting an upper average grain size and at least one lower region adjacent to the upper region a lower average grain size that may be at least two times greater than the upper average grain size. The cemented carbide substrate includes an interfacial surface and a depletion zone depleted of the cementing constituent that extends inwardly from the interfacial surface to a depth of, for example, about 30 ?m to about 60 ?m.

Abstract: The disclosure relates to a multiple ridge diamond compact for a drill bit, comprising a hard alloy substrate (cemented carbide substrate) (102) and a diamond composite layer (101), wherein an end surface of the diamond composite layer is provided with at least two ridges angled relative to each other, and converging ends of two adjacent ridges extend to an edge of the diamond composite layer (101) so as to form a concave cutting edge portion on the edge.

Abstract: An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one electronic device. In an embodiment, the electronic assembly is coupled to the abrasive body in a tamper-proof manner.

Abstract: The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

Abstract: The present inventive subject matter provides an abrasive particle. The abrasive particle can include an elongated body that is defined between opposed first and second ends. Each end defines a substantially planar surface. An axis extends through the first and second ends, and each end has a respective first and second cross-sectional area. At least one of the first and second ends is oriented at an angle relative to the axis that is less than 90 degrees. The elongated body has a variable cross-sectional area centered along the axis. At least one cross-sectional area between the first and second ends represents a local minimum cross-sectional area.

Abstract: An abrasive article includes a body having a bond material extending throughout the body and abrasive particles contained in the bond material. The bond material can include aluminum oxide (Al2O3) and lithium oxide (Li2O). In an embodiment, the bond material can include a ratio (Al2O3/Li2O) of a content of aluminum oxide (Al2O3) relative to a content of lithium oxide (Li2O), based on weight percent, of greater than 11.5 and at most 20. In another embodiment, the abrasive article can have a versatility factor of greater than 1.90.

Abstract: An ultra-fine nanocrystalline diamond precision cutting tool and a manufacturing method therefor. A diamond cutter is made of a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick film having a thickness of 100-3000 microns, where 1 nanometer?diamond grain size?20 nanometers. In the manufacturing method, the growth of ultra-fine nanocrystalline diamond on a silicon substrate is accomplished by means of two steps of direct current hot cathode glow discharge chemical vapor deposition and hot filament chemical vapor deposition, then the silicon substrate is separated from the diamond to obtain a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick self-supporting film of ultra-fine nanocrystalline diamond is laser cut and then welded to a cutter body, and then by means of edging, rough grinding and fine grinding, an ultra-fine nanocrystalline diamond precision cutting tool is obtained.

Abstract: Superhard compacts, assemblies including the same, and methods of using the same are disclosed herein. An example assembly includes at least one superhard compact secured to a support body. The support body includes at least one exterior surface and defines at least one recess extending inwardly from the exterior surface. The recess is configured to receive at least a portion of the superhard compact. The assembly includes at least one magnet that secures the superhard compact to the support body. For example, the magnet may form part of the superhard compact, the support body, or both.

Abstract: An abrasive particle including a shaped abrasive particle including a body having a plurality of abrasive particles bonded to at least one surface of the body of the shaped abrasive particle.

Abstract: The disclosure provides a pulsed-power drill bit including a bit body, an electrode, and a ground ring coupled to the bit body proximate to the electrode and having a first portion and a second portion located between the first portion and the bit body, the first portion including first composite material including a reinforcement material and an abrasive material infiltrated through at least one region of the reinforcement material, the second portion including a second composite material including the reinforcement material and a binder material infiltrated through the reinforcement material, the second composite material having a different composition than the first composite material. The disclosure further provides a pulsed-power drilling system containing such a bit and a method of pulsed-power drilling using such a bit.

Abstract: A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10?12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.

Abstract: Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductor devices. The polishing pad may secure excellent polishing rate and within-wafer non-uniformity by controlling the physical properties such as initial load resistivity and compressive elasticity of the cushion layer and/or the laminate as defined by Equations 1 and 2: L ? R L ? ( % ) = T ? 1 ? L - T ? 2 ? L T ? 1 ? L - T ? 3 ? L × 100 [ Equation ? ? 1 ] C ? E L ? ( % ) = T ? 4 ? L - T ? 3 ? L T ? 2 ? L - T ? 3 ? L × 1 ? 00.

Abstract: The present invention relates generally to coated abrasive articles, such as coated abrasive film belts having improved strength and durability, as well as methods of making and using said coated abrasive articles.

Abstract: Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition.

Abstract: There is provided a nitride semiconductor laminate, including: a substrate; an electron transit layer provided on the substrate and containing a group III nitride semiconductor; and an electron supply layer provided on the electron transit layer and containing a group III nitride semiconductor, wherein a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A?B| of a difference between them is 30 ?N or more.

Abstract: A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

Abstract: The disclosed technology includes an abrasive cutting tool having a plurality of segments arranged around a periphery of the cutting tool. The plurality of segments can include a first segment having a first portion having a first concentration of abrasive material, and a second portion having a second concentration of abrasive material. The second concentration can be less than the first concentration. The cutting tool can have a second segment having a third portion having a concentration of abrasive material that can be similar to the concentration of the first portion, and a fourth portion having a concentration of abrasive material that can be similar to the concentration of the second portion. The first portion and the second portion can be reciprocally arranged in relation to the third portion and the fourth portion around the periphery of the cutting tool.

Abstract: A nanometer niobium carbide/carbon nanotube reinforced diamond composite and a preparation method thereof, belonging to the field of materials science. The nanometer niobium carbide/carbon nanotube reinforced diamond composite is composed of nanometer niobium carbide/carbon nanotube composite powders, matrix powders and diamond grains, wherein the nanometer niobium carbide/carbon nanotube composite powders are the composites of nanometer niobium carbide which are evenly distributed in the surface defects and interior of the carbon nanotube, the nanometer niobium carbide/carbon nanotube reinforced diamond composite is prepared by mixing the nanometer niobium carbide/carbon nanotube composite powders, matrix powders and diamond grains uniformly and sintering with a hot pressing technique.

Abstract: A rotary cutting tool includes a main body and a shank. The main body has a tip end. The shank is continuous with the main body on the side opposite to the tip end. The main body is provided with a first cutting edge having a positive twist angle, and a second cutting edge having a negative twist angle and separated from the first cutting edge. Each of the first cutting edge and the second cutting edge extends continuously from the tip end to the shank.

Abstract: A method of processing a polycrystalline diamond element may include providing a protective leaching cup having a rear wall, an opening defined by a portion of the protective leaching cup opposite the rear wall, and a side wall extending between the opening and the rear wall, the side wall and the rear wall defining a cavity within the protective leaching cup. The method may further include positioning a polycrystalline diamond element in the cavity defined within the protective leaching cup. Positioning the polycrystalline diamond element in the cavity may include expanding at least a portion of the opening outward from a center of the opening. The method may additionally include exposing at least a portion of the polycrystalline diamond element to a leaching agent.

Abstract: A method is disclosed for crushing material to be ground with a mill which contains a grinding chamber which is connected to a feed for material to be ground and to an outlet for ground particles, and contains grinding devices for producing particles of the desired fineness from the fed material to be ground, wherein the grinding takes place in a reducing atmosphere which contains a reduction gas. Also disclosed, is a mill having a grinding chamber which is connected to a feed for material to be ground and to an outlet for ground particles, and contains grinding devices for producing particles of the desired fineness from the fed material to be ground, wherein the grinding chamber contains a reducing atmosphere in which the grinding takes place and which contains a reduction gas.

Abstract: The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 ?m to about 22 ?m. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 ?m to about 50 ?m. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.

Abstract: In an embodiment, a protective leaching cup may include a base portion, at least one sidewall defining an opening general opposite the base portion, and a receiving space in communication with the opening and at least partially defined by the base portion and the sidewall. The receiving space is sized and configured to receive at least a portion of the superabrasive element. A seal contact portion is located on an inner surface of the sidewall. The seal contact portion is configured to form a seal against the superabrasive element that is at least partially impermeable to fluid(s). At least one of the seal contact portion or the sidewall includes material(s) exhibiting a flexural modulus greater than about 150,000 psi at room temperature.

Abstract: A cutting wheel includes a body having a bond material. The bond material comprises at least about 31 vol % of a total volume of the body. Additionally, the body includes abrasive particles contained within the bond material. The abrasive particles include a first type of abrasive particle including black alumina with at least about 10 vol % of a total volume of the abrasive particles including black alumina. In some instances the cutting wheel can include a chop saw, while in other situations, the cutting wheel can include a cut-off wheel.

Abstract: An abrasive grain is disclosed and may include a body. The body may define a length (l), a height (h), and a width (w). In a particular aspect, the length is greater than or equal to the height and the height is greater than or equal to the width. Further, in a particular aspect, the body may include a primary aspect ratio defined by the ratio of length:height of at least about 2:1. The body may also include an upright orientation probability of at least about 50%.

Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.

Abstract: In an embodiment, a polycrystalline diamond table includes a plurality of bonded diamond grains and a plurality of interstitial regions defined by the plurality of bonded diamond grains. The polycrystalline diamond table may be at least partially leached such that at least a portion of at least one interstitial constituent has been removed from at least a portion of the plurality of interstitial regions by exposure to a leaching agent. The leaching agent may include a mixture having a ratio of weight % hydrofluoric acid to weight % nitric acid of about 1.0 to about 2.4, and water in a concentration of about 50 weight % to about 85 weight %. Various other materials, articles, and methods are also disclosed.

Abstract: Embodiments disclosed herein are directed to tilting pad bearing assemblies, bearing apparatuses including the tilting pad bearing assemblies, and methods of using the bearing apparatuses. The tilting pad bearing assemblies disclosed herein include a plurality of tilting pads. At least some of the superhard tables exhibit a thickness that is at least about 0.120 inch and/or at least two layers having different wear and/or thermal characteristics.

Abstract: The present invention relates to a polishing pad that minimizes the occurrence of defects and a process for preparing the same, Since the polishing pad comprises fine hollow particles having shells, the glass transition temperature (Tg) of which is adjusted, the hardness of the shells and the shape of micropores on the surface of a polishing layer are controlled. Since the content of Si in the polishing layer is adjusted, it is possible to prevent the surface damage of a semiconductor substrate caused by hard additives. As a result, the polishing pad can provide a high polishing rate while minimizing the occurrence of defects such as scratches on the surface of a semiconductor substrate during the CMP process.

Abstract: An abrasive coating for a substrate of a component in a gas path exposed to a maximum temperature of 1750 degree Fahrenheit, comprising a plurality of grit particles adapted to be placed on a top surface of the substrate; a matrix material bonded to the top surface; the matrix material partially surrounds the grit particles, wherein the grit particles extend above the matrix material relative to the top surface; and a film of oxidant resistant coating applied over the plurality of grit particles and the matrix material.

Abstract: Methods of making an abrasive article. Abrasive particles are loaded to a distribution tool including a plurality of strips defining a plurality of channels. Each channel is open to a lower side of the tool. The loaded particles are distributed from the distribution tool to a major face of a backing web below the lower side. At least a majority of the particles distributed from the tool undergo an orientation sequence in which each particle first enters one of the channels. The particle then passes partially through the channel such that a first portion is beyond the lower side and in contact with the major face, and a second portion within the channel. The sequence then includes the particle remaining in simultaneous contact with one of the strips and the major face for a dwell period.

Abstract: A grinding wheel includes an elastomerically deformable supporting layer, at least a first metallic surface fastened to the elastomerically deformable supporting layer, the metalic surface being an elastically deformable metal foil and includes abrasive particles attached to the at least one metalic surface. The particles may include at least one of: cubic boron nitride or diamonds. The metal foil may have a thickness of less than 1 mm. The abrasive particles may be bonded galvanically on the metallic surface. The abrasive particles may be bonded on the metalic surface in a plurality of areas having regions without abrasive particles therebetween. The metal foil may be adhesively bonded onto the elastomerically deformable supporting layer. The elastomerically deformable supporting layer may be plastic foam. The elastomerically deformable supporting layer may be adhesively bonded onto a metallic supporting body.

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Abstract: Comminuted polysilicon with reduced contamination is prepared using multi-step comminution employing comminution with comminution tools of differing tungsten carbide content and/or grain size.

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Abstract: A polycrystalline diamond and a polycrystalline diamond compact comprise nanostructured polycrystalline diamond particles (aggregates) and binder material. The nanostructured polycrystalline diamond particles (aggregates) are from starting raw materials of nanostructured polycrystalline diamond particles (aggregates) with a size of between 1 ?m-40 ?m. The polycrystalline diamond and the polycrystalline diamond compact may comprise micrometer-sized monocrystalline diamond particles. The binder material in the polycrystalline diamond or the polycrystalline diamond compact may be removed partially or completely by a leaching process. The method of making the polycrystalline diamond or the polycrystalline diamond compact comprises sintering diamond particles comprising the nanostructured polycrystalline diamond particles (aggregates) with a size of between 1 ?m-40 ?m under high temperature and high pressure in the presence of the binder material.

Abstract: A compensating pad for applying to an ophthalmic lens blank to be blocked, or for interposing between an ophthalmic lens blank and a block piece. The compensating pad comprises a main body that is designed to be elastic having a maximum thickness corresponding to a maximum layer thickness difference of the ophthalmic lens blank, in order to locally compensate for the layer thickness difference of the blocked ophthalmic lens blank.