Miscellaneous Patents (Class 51/293)
  • Patent number: 7097678
    Abstract: A metal-coated cubic boron nitride abrasive grain obtained by forming grooves, in which the ratio (w/d) of the width (w) to the depth (d) is less than 1, and the ratio (w/L) of the width (w) to the length (L) is less than 0.1, on the surface of a cubic boron nitride abrasive grain. In this cubic boron nitride abrasive grain, the retention force (bonding strength) between the metallic coating and the cubic boron nitride abrasive grain is improved; therefore, it is possible to fabricate a resin bonded grinding wheel, in which a high grinding ratio (long life) and a low grinding power (superior grinding performance) are achieved, using such cubic boron nitride abrasive grains.
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: August 29, 2006
    Assignee: Showa Denko K.K.
    Inventors: Hirohiko Ohtsubo, Eiji Ihara, Tatsuya Shimidzu
  • Patent number: 7097679
    Abstract: A flowable, granular abrasive material and method of manufacture thereof. The material is comprised of at least one abrasive grain selected from aluminum oxide, silicon carbide, cubic boron nitride and/or diamond and has a organic or inorganic coating comprised of a binder and an abrasive filling material in the amounts of 0.5 to 8% and 1 to 15% by weight, respectively. The filling material may include sulfides, phosphates, carbonates, halogenides, and/or sulfide-, carbonate- and/or halogenide-containing complex compounds. The binder may include a low-viscosity phenol resin, epoxy resin and/or polyurethane resin.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: August 29, 2006
    Assignee: Treibacher Schleifmittel GmbH
    Inventors: Thomas Wurzer, Franz Skale
  • Patent number: 7074247
    Abstract: There is provided a method of making a composite abrasive compact which comprises an abrasive compact bonded to a substrate. The abrasive compact will generally be a diamond compact and the substrate will generally be a cemented carbide substrate. The composite abrasive compact is made under known conditions of elevated temperature and pressure suitable for producing abrasive compacts. The method is characterised by the mass of abrasive particles from which the abrasive compact is made. This mass has three regions which are: (i) an inner region, adjacent the surface of the substrate on which the mass is provided, containing particles having at least four different average particle sizes; (ii) an outer region containing particles having at least three different average particle sizes; and (iii) an intermediate region between the first and second regions.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: July 11, 2006
    Inventors: Klaus Tank, Moosa Mahomed Adia, Roy Derrick Achilles, Paul Machael Daniel
  • Patent number: 7070635
    Abstract: A polycrystalline diamond compact for use in cutting operations with a renewable sharp cutting edge, high abrasion resistance and high impact strength. The polycrystalline diamond is a composite composed of a matrix of coarse diamond interspersed with large agglomerated particles of ultra fine diamond. The agglomerated particles produce sharp cutting edges that are protected from impact forces by the overall uniform matrix of coarse diamond crystals. The self-sharpening cutter is highly resistant to spalling and catastrophic fracture.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: July 4, 2006
    Assignee: Diamond Innovations, Inc.
    Inventor: Robert H. Frushour
  • Patent number: 7044989
    Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a temporary layer comprising said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; embossing the layer comprising softened particulate curable binder material and abrasive particles to provide a pattern of raised areas and depressed areas and curing the softened particulate curable binder material to convert the embossed layer into a permanent embossed layer comprised of cured particulate binder material and abrasive particles and cure the at least partially cured primer coati
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: May 16, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Dennis G. Welygan, Jason A. Chesley, Louis S. Moren
  • Patent number: 6979357
    Abstract: A method of producing a plurality of discrete ultra-hard abrasive particles includes the steps of providing a plurality of granules, each comprising at least one ultra-hard abrasive particle, a precursor for the abrasive particle and a solvent/catalyst for the abrasive particle or precursor of such a solvent/catalyst, placing the granules with a separating medium between adjacent granules in the reaction zone of a high pressure/high temperature apparatus, subjecting the contents of the reaction zone to elevated temperature and pressure conditions at which the ultra-hard abrasive particle is crystallographically stable, recovering thus treated material from the reaction zone and removing the separating medium in the treated material to produce a plurality of discrete abrasive particles.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: December 27, 2005
    Assignee: Mehmet Serdar Ozbayraktar
    Inventors: Robert Fries, Iakovos Sigalas, Manfred Nebelung, Geoffrey John Davies
  • Patent number: 6953489
    Abstract: Capsulated abrasive compositions and a polishing pad using the same. More specifically, a polishing pad coated with compositions, which contain a capsulated abrasive, thereby used for planarizing interlayer insulating film formed on a semiconductor substrate by chemical mechanical polishing.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: October 11, 2005
    Assignee: Hynix Semiconductor Inc.
    Inventors: Yong Soo Choi, Hyung Soon Park
  • Patent number: 6949129
    Abstract: A method for producing organically bonded abrasive article includes combining an abrasive grain component and a phenol-based resin component. The combined components are molded and thermally cured in an atmosphere that comprises humidity, wherein the atmosphere contacts the molded components, thereby producing the organically bonded abrasive grain. The abrasive grain optionally can first be combined with an organosilicon compound, to form organosilicon-treated abrasive grain, and then with the phenol-based resin component. In one example, the phenol-based resin is thermally cured in the presence of steam. Abrasive articles produced by the method of the invention generally have improved properties under wet grinding conditions. In one example, an abrasive article produced by the method of the invention includes ammonia in an amount less than about 50 ppm. In another example, an abrasive grinding wheel produced by the method of the invention has a strength retention greater than about 57 percent.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: September 27, 2005
    Assignee: Saint-Gobain Abrasives, Inc.
    Inventor: Mark W. Simon
  • Patent number: 6949128
    Abstract: The invention provides a method of making an embossed abrasive article comprising providing a sheet-like foam backing having a first surface and an opposite second surface; providing an abrasive coating comprising abrasive particles and binder over said first surface to provide an abrasive article; and applying under pressure a patterned embossing tool having an embossing surface including at least a pattern of raised areas to the abrasive coating of the abrasive article to provide an embossed pattern at least including depressed areas corresponding to the raised areas of the embossing surface in said abrasive coating and said foam backing to provide an embossed abrasive article.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: September 27, 2005
    Assignee: 3M Innovative Properties Company
    Inventor: Michael J. Annen
  • Patent number: 6946010
    Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, the abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is Theologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: September 20, 2005
    Assignee: J.M. Huber Corporation
    Inventor: Yung-Hui Huang
  • Patent number: 6913633
    Abstract: A method is provided for producing a plurality of polycrystalline ultra-hard abrasive grit. The method includes the steps of providing a mass of ultra-hard abrasive particles or a mass of a combination of a precursor for such particles and a suitable solvent/catalyst, forming the mass into a plurality of green state granules, placing the granules with a separating medium between adjacent granules in the reaction zone of a high pressure/high temperature apparatus, subjecting the contents of the reaction zone to elevated temperature and pressure conditions which the ultra-hard abrasive particle is crystallographically stable, recovering the thus sintered material from the reaction zone and removing the separating medium in the sintered material to produce a plurality of crystalline abrasive grit. The ultra-hard abrasive is generally diamond or cubic boron nitride.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: July 5, 2005
    Inventors: Robert Fries, Iakovos Sigalas, Manfred Nebelung
  • Patent number: 6902590
    Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: June 7, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc
    Inventors: Barry Weinstein, Tirthankar Ghosh
  • Patent number: 6887287
    Abstract: An abrasive tool includes a superabrasive grain component, a filler component that comprises hollow bodies and a vitreous bond. Natural and synthetic diamond, cubic boron nitride and combinations thereof can be employed as the superabrasive grain component. The vitreous bond component includes zinc oxide and at least two alkali metal oxides. The vitreous bond component can further include barium oxide. A method for producing an abrasive tool includes combining a superabrasive grain component, a filler component that includes hollow bodies and a vitreous bond component that includes zinc oxide and at least two alkali metal oxides. The combined components are fired at a temperature in a range of between about 600° C. and about 850° C., preferably in an ambient air atmosphere.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: May 3, 2005
    Assignee: Saint-Gobain Abrasives, Inc.
    Inventors: Rounan Li, Leonard G. Pukaite
  • Patent number: 6887288
    Abstract: A superfinishing grindstone suitable for precision grinding, that contains either RB (rice bran) ceramic fine grains or CRB (carbonized rice bran) ceramic fine grains or a combination of both, for use as abrasive grains. The grains of RB ceramic fine grains and CRB ceramic fine grains have multiple small pores which allow the grains to be easily removed from a finished structure. These fine grains have a high Vickers hardness, which makes them highly resistant to bending, scratching, abrasion or cutting.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: May 3, 2005
    Assignee: Minebea Co., Ltd.
    Inventors: Kazuo Hokkirigawa, Motoharu Akiyama, Noriyuki Yoshimura
  • Patent number: 6875098
    Abstract: Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered. Solution mechanism: The whetstone particle layer (13), which consists of multiple whetstone particle layer units (12), . . . , is configured on the surface (11a) of the whetstone substrate (11) while the respective whetstone particle layer units (12) are being mutually linked via the bridge unit (9). The non-whetstone particle unit (22) is configured between whetstone particle layer units (12) and (12). Whetstone particle layer unit (12) is obtained by configuring the superwhetstone particles (14) densely in the central unit (12a) and by configuring them sparsely in the peripheral unit (12b). The metal coupling phase (17), to which the superwhetstone particles (14) are fixed, is formed by the first and second metal plate phases (15) and (16), respectively. The thickness of the first metal plate phase (15) decreases from the central unit (12a) toward the peripheral unit (12b) in the shape of a mountain.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: April 5, 2005
    Assignee: Mitsubishi Materials Corporation
    Inventors: Tsutomu Takahashi, Naoki Shimomae, Hanako Hata
  • Patent number: 6866691
    Abstract: An abrasive product is formed, in a blanket making machine, into a layer forming a blank including at least abrasive grains. The layer is then set atop on at least another material layer and assembled thereto. The installation includes, besides at least a blank making machine, an assembly line along which successive posts are provided at the site whereof the elements designed to form the grinder are set on top of one another to form a stack, a station for heating the stack, and at least a pressing machine to compress the heated stack. An embodiment need not include the heating station. The grinder is a thin grinder that can include at least a reinforcing layer pierced with a hole wherein the abrasive product is distributed. The process is useful for making grinders for parting, machining, or pumicing.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: March 15, 2005
    Assignee: Saint-Gobain Abrasifs Technologie et Services
    Inventors: Georges Bancon, Jean-Marie Albrecht, Jean-Jacques Bris, Nicolas Faures
  • Patent number: 6860959
    Abstract: An abrasive material comprises an integral mass of discrete lengths, not bonded to each other, of abrasive-coated non-woven synthetic fibres. In particular, the entanglement force between the said lengths is great enough to maintain a wad of the material when in use but small enough to allow the product to be shaped in the hand of a user.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: March 1, 2005
    Assignee: SIA Abrasives Holding AG
    Inventors: Neill Rawson, Richard Lees
  • Patent number: 6860914
    Abstract: An abrasive product which comprises a polycrystalline mass of self-bonded abrasive particles of irregular shape, the product being substantially free of a second phase and containing substantial plastic deformation of the abrasive particles. The abrasive particles are preferably diamond or cubic boron nitride and the plastic deformation of the particles is preferably at least 0.3 percent. The abrasive product may be made by subjecting a mass of the particles to elevated temperature and pressure conditions.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: March 1, 2005
    Inventors: Geoffrey John Davies, Raymond Albert Chapman
  • Patent number: 6860912
    Abstract: An abrasive filament, a cloth or non-woven made of the filament and an abrasive device, e.g., sanding disk, incorporating the fabric, cloth or non-woven and methods of producing the same are disclosed. The filament has an outer surface to which plural small size particles of an abrasive material are secured. The filament is formed from a mass of a molten polymer material, e.g., nylon, that has been extruded through a small diameter opening to form a hot elongated filamentary body. The abrasive particles, e.g., grit, are applied as a cloud or spray to the outer surface of the hot elongated filamentary body, whereupon they adhere to that surface and remain permanently secured thereto.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: March 1, 2005
    Assignee: Webb Manufacturing Corporation
    Inventor: Steven Krupnick
  • Patent number: 6858292
    Abstract: The present invention is directed to abrasive articles comprising a resin transfer additive and methods of abrading a workpiece with the abrasive article. The resin control additive is a metal salt of a long chain fatty acid. The abrasive article comprises a backing having a major surface, and an abrasive layer secured to at least a portion of the major surface. The abrasive layer comprises a binder, abrasive particles distributed in the binder, and a resin control additive distributed in the binder, and wherein the abrasive layer has a substantially uniform thickness.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: February 22, 2005
    Assignee: 3M Innovative Properties Company
    Inventor: Philip E. Kendall
  • Patent number: 6846340
    Abstract: A method of manufacturing a grinding wheel which includes a cylindrical core body and a plurality of part-cylindrical abrasive segment chips bonded to an outer circumferential surface of the cylindrical core body. The method includes: a firing step of firing an unfired part-cylindrical precursor to prepare each part-cylindrical abrasive segment chips, by using a supporting member whose coefficient of thermal expansion is different from that of each abrasive segment chip; and a bonding step of bonding the abrasive segment chips to the outer circumferential surface of the cylindrical core body with an adhesive interposed therebetween, by forcing each abrasive segment chip against the outer circumferential surface of the cylindrical core body, such that a force acting on the outer circumferential surface of the cylindrical core body is evenly distributed in an axial direction of the cylindrical core body while the adhesive is being hardened.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: January 25, 2005
    Assignee: Noritake Co., Ltd.
    Inventors: Kazumasa Yoshida, Takeshi Nonogawa, Yasuteru Kubota
  • Patent number: 6846341
    Abstract: An ultra-hard semiconductive polycrystalline diamond (PCD) material formed with semiconductive diamond particles doped with Li, Be or Al and/or insulative diamond particles having semiconductive surfaces, tools incorporating the same, and methods for forming the same, are provided. The ultra-hard PCD material may be formed using a layer of insulative diamond grit feedstock that includes additives therein, then sintering to convert a plurality of the diamond crystals to include a semiconductive surface. In another embodiment, the ultra-hard PCD material is formed by sintering semiconductive diamond grit feedstock consisting of diamond crystals doped with Li, Al or Be. The ultra-hard semiconductive PCD cutting layer exhibits increased cuttability, especially in EDM and EDG cutting operations.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: January 25, 2005
    Assignee: Smith International, Inc.
    Inventor: Stewart Middlemiss
  • Patent number: 6833014
    Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a plurality of temporary shaped structures comprised of said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; and curing the softened particulate curable binder material to convert said temporary shaped structures into permanent shaped structures and cure the at least partially cured primer coating on the first surface of the backing. The invention also provides an abrasive product made by the method.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: December 21, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Dennis G. Welygan, Jason A. Chesley, Louis S. Moren
  • Publication number: 20040242399
    Abstract: Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5-8 GPa, T=1400K-2300K) to form composites having high fracture toughness. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa·m1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness. X-ray diffraction patterns and Raman spectra indicate that amorphous silicon is partially transformed into nanocrystalline silicon at 5 GPa/873K, and nanocrystalline silicon carbide forms at higher temperatures.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Inventors: Jiang Qian, Yusheng Zhao
  • Patent number: 6821309
    Abstract: A slurry for chemical mechanical polishing (CMP) of a copper or silver containing film provides at least one reactant for reacting with the copper or silver film to form a soft layer on the surface of the copper or silver film. The soft layer has a hardness less than the copper or silver film. The slurry preferably includes either no particles or particles which are softer than the copper or silver layer. A method for chemical mechanical polishing (CMP) a copper or silver containing film includes the steps of providing a slurry for reacting with the copper or silver film to form a soft layer on the surface of the copper or silver film and uses either no particles or particles softer than the copper or silver film, applying the slurry to the copper or silver film to form the soft layer, and removing the soft layer using a polishing pad.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: November 23, 2004
    Assignee: University of Florida
    Inventors: Rajiv K. Singh, Seung-Mahn Lee
  • Patent number: 6818029
    Abstract: A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of an uniformed height on at least one of its sides, and a cutting portion having a diamond layer of an uniformed thickness formed substantially on a whole surface of the side of the substrate having the geometrical protrusions. The geometrical protrusions have a flat upper surface or the upper surface may comprise a plurality of smaller geometrical protrusions formed by recessed grooves. The substrate is made from ceramic or cemented carbide materials and has a shape of a disk, a plate having multiple corner, a cup, a segment, or a doughnut with flattened upper and lower surfaces. The conditioner may further comprise a body portion being fixedly attached to the substrate at a side opposite to the side having formed with geometrical protrusions for linking the cutting portion to conditioning equipment.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: November 16, 2004
    Assignee: Hunatech Co., Ltd.
    Inventors: Bum Young Myoung, Su Nam Yu
  • Patent number: 6811579
    Abstract: A method for fabricating an abrasive tool having a work surface commences by applying an electrically non-conductive layer the work surface of the abrasive tool. A pattern is etched in the work surface preferably using a laser beam. Metal and abrasive particles are electroplated or electroless plated onto the work surface pattern. The non-conductive layer is removed from the work surface. Alternatively, an adhesive can be applied as a layer on the work surface. A negative pattern then is etched in the adhesive layer, i.e., the adhesive where no abrasive is desired is etched away. Abrasive particles then can contact the work surface to be adhered thereon to the remaining adhesive. Metal again can be electroplated or electrolessly plated onto the work surface. By multiple repetitions of both methods, different sizes and types of abrasive particles in different concentrations may be applied to different areas of the work surface.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: November 2, 2004
    Assignee: Diamond Innovations, Inc.
    Inventors: Jurgen von Dungen, York Falkenberg, Dirk Heinemann
  • Patent number: 6811582
    Abstract: A flowable, granular abrasive material and method of manufacture thereof. The material is comprised of at least one abrasive grain selected from aluminum oxide, silicon carbide, cubic boron nitride and/or diamond and has a organic or inorganic coating comprised of a binder and an abrasive filling material in the amounts of 0.5 to 8% and 1 to 15% by weight, respectively. The filling material may include sulfides, phosphates, carbonates, halogenides, and/or sulfide-, carbonate- and/or halogenide-containing complex compounds. The binder may include a low-viscosity phenol resin, epoxy resin and/or polyurethane resin.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: November 2, 2004
    Assignee: Treibacher Schleifmitte AG
    Inventors: Thomas Wurzer, Franz Skale
  • Publication number: 20040211123
    Abstract: A method of manufacturing a grinding wheel which includes a cylindrical core body and a plurality of part-cylindrical abrasive segment chips bonded to an outer circumferential surface of the cylindrical core body. The method includes: a firing step of firing an unfired part-cylindrical precursor to prepare each part-cylindrical abrasive segment chips, by using a supporting member whose coefficient of thermal expansion is different from that of each abrasive segment chip; and a bonding step of bonding the abrasive segment chips to the outer circumferential surface of the cylindrical core body with an adhesive interposed therebetween, by forcing each abrasive segment chip against the outer circumferential surface of the cylindrical core body, such that a force acting on the outer circumferential surface of the cylindrical core body is evenly distributed in an axial direction of the cylindrical core body while the adhesive is being hardened.
    Type: Application
    Filed: November 18, 2002
    Publication date: October 28, 2004
    Applicant: NORITAKE CO., LIMITED
    Inventors: Kazumasa Yoshida, Takeshi Nonogawa, Yasuteru Kubota
  • Patent number: 6805722
    Abstract: An apparatus and method for forming an endless spiral wound abrasive article and the resulting article. The apparatus includes first and second spaced-apart hubs, configured so that a portion of first and second webs passing between the first hub and the second hub is oriented substantially in a plane which remains stationery even if a position of a hub is changed. The apparatus further includes winders and a web joiner. The method includes providing a second web which includes an adhesive disposed on a first surface and a liner releasably affixed to the adhesive. The method includes removing the liner from the second web before positioning the second web adjacent the first web. The first and second webs are wound about the first and second hubs to form a spiral wound article having a desired circumference.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: October 19, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Douglas C. Hunt, Ann M. Hawkins, Gary L. Heacox, Robert A. Follensbee, Stephen J. Yoos
  • Patent number: 6802878
    Abstract: Sintered alpha alumina-based abrasive particles comprising alpha alumina, Gd2O3, and ZnO, and methods of making the same. The abrasive particles can be incorporated, for example, into a variety of abrasive articles, including bonded abrasives, coated abrasives, nonwoven abrasives, and abrasive brushes.
    Type: Grant
    Filed: April 17, 2003
    Date of Patent: October 12, 2004
    Assignee: 3M Innovative Properties Company
    Inventor: Larry D. Monroe
  • Publication number: 20040182011
    Abstract: The present invention relates to a method for producing cubic boron nitride abrasive grains used for producing a grinding wheel, etc., and to cubic boron nitride abrasive grains. The method comprises maintaining a mixture containing hexagonal boron nitride and seed crystals of cubic boron nitride under pressure and temperature conditions where cubic boron nitride remains thermodynamically stable, characterized in that the seed crystals contain cubic boron nitride twin crystals.
    Type: Application
    Filed: May 10, 2004
    Publication date: September 23, 2004
    Inventors: Hirohiko Ohtsubo, Eiji Ihara, Takuya Okubo, Makoto Kasahara, Makoto Iizuka
  • Publication number: 20040172885
    Abstract: An ultra-hard semiconductive polycrystalline diamond (PCD) material formed with semiconductive diamond particles doped with and additive, as for example, Li, Be or Al and/or insulative diamond particles having semiconductive surfaces, tools incorporating the same, and methods for forming the same, are provided. The ultra-hard PCD material may be formed using a layer of insulative diamond grit feedstock that includes additives therein, then sintering to convert a plurality of the diamond crystals to include a semiconductive surface. In another embodiment, the ultra-hard PCD material is formed by sintering semiconductive diamond grit feedstock consisting of diamond crystals doped with an additive as for example Li, Al or Be. The ultra-hard semiconductive PCD cutting layer exhibits increased cuttability, especially in EDM and EDG cutting operations. A cutting element is provided having such a PCD layer. Furthermore, a bit is provided having a cutting element having such a PCD layer.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 9, 2004
    Inventor: Stewart Middlemiss
  • Patent number: 6783562
    Abstract: A nonwoven composite cleaning pad is disclosed. The cleaning pad includes a first nonwoven layer having an absorbent surface. A second nonwoven layer is laminated to the first layer, and a plurality of abrasive polymer formations are provided on the exposed surface of the second layer.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: August 31, 2004
    Assignee: Reemay, Inc.
    Inventor: Howell N. Smith
  • Patent number: 6773474
    Abstract: Coated abrasive articles comprise a backing and an abrasive layer, and optionally at least one of a backsize layer, tie layer, supersize layer, presize layer, or saturant. The coated abrasive article comprises a reaction product of components comprising: polyfunctional acrylate; polyfunctional cationically polymerizable material; free radical photoinitiator; triarylsulfonium salt having the formula wherein R1, R2 and R3 independently represent an, optionally substituted, aromatic group having from about 4 to about 20 carbon atoms, and Y− represents a non-interfering anion; and quaternary ammonium salt having the formula wherein X− is a non-interfering anion.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: August 10, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Gregory A. Koehnle, Edward J. Woo
  • Patent number: 6773473
    Abstract: A method is provided for fabricating an abrasive article having porosity. The method includes blending a mixture of abrasive grain, bond material, and pore inducer, in which the pore inducer is soluble in a supercritical fluid, and the abrasive grain and bond material are substantially insoluble in the supercritical fluid. The mixture is pressed into an abrasive laden composite and exposed to the supercritical fluid for a period of time suitable to dissolve at least a portion of the pore inducer. The composite is thermally processed.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: August 10, 2004
    Assignee: Saint-Gobain Abrasives Technology Company
    Inventors: Thomas G. Kinisky, Jodi Ann Vecchiarelli, David A. Sheldon
  • Patent number: 6773475
    Abstract: To provide an abrasive material which is excellent in loading resistance and durability, allows no attachments to attach to an abraded surface even when the end surface of the optical fiber is abraded, and is particularly suited for use in abrading a hard material such as an end surface of an optical fiber connector effectively and smoothly into a predetermined shape. The present invention provides an abrasive material for abrading an end surface of an optical fiber connector into a predetermined shape, the abrasive material having a base material (101) and an abrasive layer (102) disposed on the base material, the abrasive layer having a top layer (105) comprising an abrasive composite containing abrasive grains and a binder and a foot portion (106) comprising a binder in the absence of abrasive particles, the abrasive layer having a three-dimensional structure constructed with a plurality of regularly arranged three-dimensional elements (104) having a predetermined shape.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: August 10, 2004
    Assignee: 3M Innovative Properties Company
    Inventor: Michihiro Ohishi
  • Publication number: 20040148866
    Abstract: An abrasive filament, a cloth or non-woven made of the filament and an abrasive device, e.g., sanding disk, incorporating the fabric, cloth or non-woven and methods of producing the same are disclosed. The filament has an outer surface to which plural small size particles of an abrasive material are secured. The filament is formed from a mass of a molten polymer material, e.g., nylon, that has been extruded through a small diameter opening to form a hot elongated filamentary body. The abrasive particles, e.g., grit, are applied as a cloud or spray to the outer surface of the hot elongated filamentary body, whereupon they adhere to that surface and remain permanently secured thereto.
    Type: Application
    Filed: February 4, 2003
    Publication date: August 5, 2004
    Applicant: Webb Manufacturing Corporation
    Inventor: Steven Krupnick
  • Patent number: 6770107
    Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: August 3, 2004
    Assignee: General Electric Company
    Inventors: Erich Otto Teutsch, Gary William Yeager, Kenneth Paul Zarnoch, Steven William Webb, Hua Guo
  • Publication number: 20040107648
    Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.
    Type: Application
    Filed: July 25, 2003
    Publication date: June 10, 2004
    Inventor: Chien-Min Sung
  • Patent number: 6746311
    Abstract: A multi-layered polishing pad for modifying a surface of a workpiece, such as a semiconductor wafer, that reduces the effort, time and cost involved with pad replacement. The polishing pad includes a polishing layer, at least one sub-pad layer adjacent the polishing layer, and an attachment layer interposed between and releasably joining the polishing layer and at least a portion of the at least one sub-pad layer. The at least one sub-pad layer may include a plurality of layers, such as at least one resilient layer, at least one rigid layer, and/or at least one layer that has both rigid and resilient characteristics. The release layer may be interposed between the polishing layer and the sub-pad or between adjacent layers of the sub-pad. Multiple release layers may be included that are interposed between the polishing layer and layers of the sub-pad, as desired.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: June 8, 2004
    Assignee: 3M Innovative Properties Company
    Inventor: Carl R. Kessel
  • Publication number: 20040098923
    Abstract: Nonwoven abrasive articles comprise a porous reinforcing material, a fiber web affixed to the porous reinforcing material, abrasive particles, and a non-elastomeric binder. Methods of making and using nonwoven abrasive articles are also disclosed.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 27, 2004
    Applicant: 3M Innovative Properties Company
    Inventors: Sherri D. Hood, Loc X. Van
  • Publication number: 20040093803
    Abstract: A cerium-based abrasive and a production method of the cerium-based abrasive excellent in polishing properties of a high polishing speed and scarce formation of polishing scratches are provided by keeping the color of the abrasive in specified ranges or stably making fluorine be contained in the abrasive. For example, as such a cerium-based abrasive, examples include a cerium-based abrasive containing cerium oxide as a main component and having an L* value in a range not lower than 65 and or lower 90, an a* value in a range 0 or higher but 15 or lower, and a b* value in a range 10 or higher but 30 or lower in the case the color is expressed by an L*a*b* color system.
    Type: Application
    Filed: August 7, 2003
    Publication date: May 20, 2004
    Inventors: Terunori Ito, Naoyoshi Mochizuki, Hiroyuki Watanabe, Yoshitsugu Uchino, Akira Shimogawara
  • Publication number: 20040093802
    Abstract: The present invention provides an abrasive which can prevent any change in its quality, and which can also grind a work piece in a short time in a manner that achieves high quality and high yields, as well as improves a blast effect and productivity in a blast step. This invention also provides an abrasive manufacturing method and device capable of preventing the existence of agglomerated particles and improving the blast effect and the productivity in the blast step. Molten metal M contained in a tundish 100, which comprises an ejecting nozzle 110, is heated by a heating coil 120 and is then caused to eject from the ejecting nozzle 110.
    Type: Application
    Filed: October 21, 2003
    Publication date: May 20, 2004
    Inventor: Tokihiro Shimura
  • Patent number: 6736869
    Abstract: A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a support material. At least a portion of the discrete elements are spaced apart from each other on the support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the support material, and the discrete elements can be directly affixed to the support material or affixed to the support material with an adhesive.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: May 18, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Vishnu K. Agarwal, Dinesh Chopra
  • Publication number: 20040088926
    Abstract: A method is provided for fabricating an abrasive article having porosity. The method includes blending a mixture of abrasive grain, bond material, and pore inducer, in which the pore inducer is soluble in a supercritical fluid, and the abrasive grain and bond material are substantially insoluble in the supercritical fluid. The mixture is pressed into an abrasive laden composite and exposed to the supercritical fluid for a period of time suitable to dissolve at least a portion of the pore inducer. The composite is thermally processed.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 13, 2004
    Inventors: Thomas G. Kinisky, Jodi Ann Vecchiarelli, David A. Sheldon
  • Publication number: 20040079033
    Abstract: The present invention relates to a structure and manufacturing method of an abrasive article. In this method, a base layer is first formed to affix abrasive particles on a substrate. Gaps between the abrasive particles are then filled with corrosion-resistant particles and a fixation layer is formed to affix the corrosion particles on the base layer. Further, a binding layer is formed on the base layer. Finally, the substrate, the base layer and the fixation layer are removed to expose the abrasive particles, and the binding layer is the bottom of the abrasive article formed thereby. An abrasive surface formed by the abrasive particles is at about the same level. The binding layer surrounding the abrasive particles form a concave surface and increase adhesion.
    Type: Application
    Filed: October 24, 2003
    Publication date: April 29, 2004
    Inventor: Alex Long
  • Patent number: 6723143
    Abstract: An aqueous metal oxide sol slurry has been developed for removal of low dielectric constant materials. The slurry is formed directly in solution utilizing non-dehydrated chemically active metal oxide sols which are formed in a colloidal suspension or dispersion. The oxide sols have not undergone any subsequent drying and the particles are believed to be substantially spherical in structure, dimensionally stable and do not change shape over time. The sol particles are mechanically soft and heavily hydrated which reduces surface damage even in the case where soft polymer or porous dielectric films are polished. The sol particles are formed of a chemically active metal oxide material, or combinations thereof, or can be coated on chemically inactive oxide material such as silicon dioxide or can be coformed therewith. The oxide sols can include a bi-modal particle distribution. The slurry can be utilized in CMP processes, with or without conditioning.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: April 20, 2004
    Assignee: Honeywell International Inc.
    Inventors: Daniel Towery, Michael Fury
  • Patent number: 6716092
    Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: April 6, 2004
    Assignee: Applied Materials, Inc.
    Inventor: Robert D. Tolles
  • Publication number: 20040060243
    Abstract: A method is provided for producing a plurality of polycrystalline ultra-hard abrasive grit. The method includes the steps of providing a mass of ultra-hard abrasive particles or a mass of a combination of a precursor for such particles and a suitable solvent/catalyst, forming the mass into a plurality of green state granules, placing the granules with a separating medium between adjacent granules in the reaction zone of a high pressure/high temperature apparatus, subjecting the contents of the reaction zone to elevated temperature and pressure conditions which the ultra-hard abrasive particle is crystallographically stable, recovering the thus sintered material from the reaction zone and removing the separating medium in the sintered material to produce a plurality of crystalline abrasive grit. The ultra-hard abrasive is generally diamond or cubic boron nitride.
    Type: Application
    Filed: October 29, 2003
    Publication date: April 1, 2004
    Inventors: Robert Fries, Iakovos Sigalas, Manfred Nebelung