Pore Forming Patents (Class 51/296)
  • Patent number: 11529715
    Abstract: A free standing PCD body comprises a PCD material formed of combination of intergrown diamond grains forming a diamond network and an interpenetrating metallic network, the PCD body not being attached to a second body or substrate formed of a different material. The diamond network is formed of diamond grains having a plurality of grain sizes, and comprises a grain size distribution having an average diamond grain size, wherein the largest component of the diamond grain size distribution is no greater than three times the average diamond grain size. The PCD material forming the free standing PCD body is homogeneous, such that the PCD body is spatially constant and invariant with respect to diamond network to metallic network volume ratio. The homogeneity is measured at a scale greater than ten times the average grain size and spans the dimension of the PCD body. The PCD material is also macroscopically residual stress free at said scale.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: December 20, 2022
    Assignee: ELEMENT SIX ABRASIVES S.A.
    Inventors: Moosa Mahomed Adia, Geoffrey John Davies
  • Patent number: 11478898
    Abstract: An abrasive article can include an abrasive component including a body. The body can include a bond matrix and abrasive particles contained in the bond matrix. In an embodiment, the body can include an interconnected phase extending through at least a portion of the bond matrix. The body can include a discontinuous phase including a plurality of discrete members. At least one of the discrete member can include a macroscopic pore. In another embodiment, the body can include a porosity of at least 15 vol % for a total volume of the body.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: October 25, 2022
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Ji Xiao, Aiyun Luo, Gwenaëlle Ringenbach, Ignazio Gosamo, Lise Lauvergeon
  • Patent number: 10843970
    Abstract: The invention concerns thermally insulating materials comprising the aforementioned particles, a process for the preparation of these particles and materials obtained by incorporation of these particles into matrices. The present invention also concerns inorganic spherical and hollow inorganic particles with low apparent density imparting thermal properties to various types of matrices in which they are dispersed.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: November 24, 2020
    Assignee: PYLOTE
    Inventors: Loïc Marchin, Marie-Laure Desse
  • Patent number: 10589402
    Abstract: An abrasive article is provided that may include a body. The body may include a bond component and abrasive particles within the bond component. The bond component may include a Fe—Co—Cu—Ni—Sn based bond material and a performance enhancing material. The performance enhancing material may include hex-boron nitride. The content of the performance enhancing material may be at least about 6 vol. % and not greater than about 14 vol. % for a total volume of the bond component.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: March 17, 2020
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Naresh Saha, Varadharajan Ranganathan, Sabine Schmidt
  • Patent number: 10507566
    Abstract: In-line processes for producing scrubby substrates, and related scrubby substrate cleaning articles. The process may include melting a polymer resin material, and extruding or otherwise dispensing the molten polymer resin material through one or more orifices of a heated nozzle, into a stream of hot inert gas, which attenuates the molten resin, so that the resin forms into elongated globules (rather than fibers or filaments). Such globules may have irregular cross-section and/or irregular thickness along a length of the globules. Alternatively, the molten resin may be formed into substantially continuous or discontinuous string or chain pattern of abrasive fibers, exhibiting a high frequency, low amplitude substantially linear pattern on the base substrate. In either case the globules or abrasive fibers are collected onto at least a portion of a base substrate layer to form a scrubby substrate that is more abrasive than typical meltblown materials.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: December 17, 2019
    Assignee: The Clorox Company
    Inventors: Edward Jason White, Samuel Hugley
  • Patent number: 10251266
    Abstract: Provided is a wearable flexible printed circuit board, in which a conductive circuit pattern is formed on a fiber web formed by accumulating fibers, and thus a base substrate has flexibility, resilience, waterproofness and air-permeability so as to be applied to future-oriented devices, a manufacturing method thereof, and a wearable smart device using the same. The wearable flexible printed circuit board includes: a base substrate made of a fiber web that is formed by accumulating spun fibers made of a fiber-forming polymer material and having a diameter of 3 ?m or less; and a conductive circuit pattern formed on the base substrate.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 2, 2019
    Assignee: AMOGREENTECH CO., LTD.
    Inventor: In Yong Seo
  • Patent number: 9938930
    Abstract: A composite wear pad for being coupled to a slider block of a convergent nozzle of a gas turbine engine includes a high heat capacity composite having a resin and a plurality of carbon fibers bonded together by the resin. The composite wear pad also includes a first rod coupled to the high heat capacity composite at a first axial end of the composite wear pad such that a first end thickness. The composite wear pad also includes a second rod coupled to the high heat capacity composite at a second axial end of the composite wear pad such that the first axial end and the second axial end of the composite wear pad each have an end thickness that is greater than a middle thickness of the composite wear pad.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: April 10, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Donald W. Peters, Emma J. Place
  • Patent number: 9238755
    Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: January 19, 2016
    Assignee: FUJIMA INCORPORATED
    Inventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
  • Publication number: 20150133039
    Abstract: Polishing pad and method of manufacturing the same, the method, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method including: grinding organic materials by using a physical method so as to form micro-organic particles; mixing the micro-organic particles formed in the operation with the materials for forming the polishing layer; mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in the operation so as to form gaseous pores; performing gelling and hardening of the mixture generated in the operation so as to form a polishing layer; and processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.
    Type: Application
    Filed: February 12, 2013
    Publication date: May 14, 2015
    Inventors: Bong-Su Ahn, Young-Jun Jang, Jin-Su Jeong, Sang-Mok Lee, Kee-Cheon Song, Seung-Geun Kim, Jang-Won Seo, Jeong-Seon Choo, Hak-Su Kang, Gyoung-Pyo Kong
  • Patent number: 9018099
    Abstract: An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: April 28, 2015
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Kazuyuki Ogawa, Atsushi Kazuno, Tsuyoshi Kimura, Tetsuo Shimomura
  • Patent number: 9011212
    Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: April 21, 2015
    Assignee: Fujibo Holdings, Inc.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Publication number: 20150099439
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
    Type: Application
    Filed: August 26, 2014
    Publication date: April 9, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20150083502
    Abstract: A polycrystalline diamond (PCD) composite compact element 100 comprising a substrate 130, a PCD structure 120 bonded to the substrate 130, and a bond material in the form of a bond layer 140 bonding the PCD structure 120 to the substrate 130; the PCD structure 120 being thermally stable and having a mean Young's modulus of at least about 800 GPa, the PCD structure 120 having an interstitial mean free path of at least about 0.05 microns and at most about 1.5 microns; the standard deviation of the mean free path being at least about 0.05 microns and at most about 1.5 microns. Embodiments of the PCD composite compact element may be for a tool for cutting, milling, grinding, drilling, earth boring, rock drilling or other abrasive applications, such as the cutting and machining of metal.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 26, 2015
    Inventors: Danny Eugene Scott, Kurtis Karl Schmitz, Clement David Van Der Riet, Antionette Can
  • Publication number: 20150068129
    Abstract: Provided are a method for producing a finish polishing pad and the polishing pad which allow formation of a stable film and enables polishing with fewer polishing scratches. The method comprises the steps of: dissolving a composition for forming polyurethane resin film containing a polyurethane resin and an additive(s) in a solvent capable of dissolving the resin; removing an insoluble component(s) to make the content of the insoluble component(s) in the solution less than 1% by mass relative to the total mass of the composition; adding a poor solvent to the solution from which the insoluble component(s) has(have) been removed, followed by mixing, the amount of the poor solvent added being calculated according to a defined Formula 1; and forming a film from the mixture solution on the film formation substrate by a wet coagulation method, to thereby form the polyurethane resin film.
    Type: Application
    Filed: March 26, 2013
    Publication date: March 12, 2015
    Inventors: Teppei Tateno, Hirohito Miyasaka, Ryuma Matsuoka, Yoshie Kanazawa, Fumio Miyazawa
  • Publication number: 20150059253
    Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
    Type: Application
    Filed: November 10, 2014
    Publication date: March 5, 2015
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventors: Yoshiyuki NAKAI, Tsuyoshi KIMURA, Atsushi KAZUNO, Kazuyuki OGAWA, Tetsuo SHIMOMURA
  • Publication number: 20150052821
    Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.
    Type: Application
    Filed: November 5, 2014
    Publication date: February 26, 2015
    Inventors: Parul Walia, Srinivasan Ramanath, Richard W. J. Hall
  • Publication number: 20150056895
    Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad.
    Type: Application
    Filed: August 22, 2013
    Publication date: February 26, 2015
    Inventors: George Fotou, Achla Khanna, Robert Vacassy
  • Publication number: 20150050866
    Abstract: The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 19, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEN-CHIEH WU
  • Publication number: 20150047266
    Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of (a) providing a releasing carrier; (b) providing a foaming resin composition; (c) coating the foaming resin composition of the step (b) on the carrier of the step (a); and (d) curing the foaming resin composition of the step (c). The invention also provides a process for manufacturing a polishing apparatus.
    Type: Application
    Filed: August 8, 2014
    Publication date: February 19, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEN-CHIEH WU
  • Publication number: 20150038066
    Abstract: Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Inventors: Ping Huang, William C. Allison, Richard Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott
  • Publication number: 20140364044
    Abstract: Polishing pad and method of manufacturing the same, the method including: (a) mixing materials for forming a polishing layer; (b) mixing at least two from among inert gas, a capsule type foaming agent, a chemical foaming agent, and liquid microelements that are capable of controlling sizes of pores, with the mixture in (a) so as to form two or more types of pores; (c) performing gelling and hardening of the mixture generated in (b) so as to form a polishing layer including the two or more types of pores; and (d) processing the polishing layer so as to distribute micropores defined by opening the two or more types of pores on a surface of the polishing layer.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Inventors: Bong-Su AHN, Young-Jun JANG, Sang-Mok LEE, Hwi-Kuk CHUNG, Kee-Cheon SONG, Seung-Geun KIM, Jang-Won SEO, Jeong-Seon CHOO
  • Publication number: 20140349554
    Abstract: A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.
    Type: Application
    Filed: December 4, 2013
    Publication date: November 27, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Takashi Watanabe
  • Patent number: 8894731
    Abstract: Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix (e.g., fine nickel, tin, bronze and abrasives). The open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching of dispersoid), closed porosity (e.g., induced by adding a hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives, are below the melting point of the filler used, although sacrificial fillers may be used as well. The resulting abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: November 25, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Srinivasan Ramanath, Parul Walia
  • Publication number: 20140342641
    Abstract: An object of the present invention is to provide a polishing pad which hardly generates scratches on the surface of an object to be polished, and has improved dressability. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the polishing pad. A polishing pad of the present invention includes a polishing layer made of a fine cell-containing polyurethane resin foam, wherein the polyurethane resin foam contains a polyurethane resin having an Asker D hardness of 20 to 60 degrees and an abrasion parameter, which is expressed by the following equation, of 1 to 3.
    Type: Application
    Filed: December 14, 2012
    Publication date: November 20, 2014
    Inventor: Shinji Shimizu
  • Patent number: 8882868
    Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: November 11, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Parul Walia, Srinivasan Ramanath, Richard W. Hall
  • Publication number: 20140311043
    Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
    Type: Application
    Filed: June 30, 2014
    Publication date: October 23, 2014
    Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN
  • Patent number: 8864859
    Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: October 21, 2014
    Assignee: NexPlanar Corporation
    Inventors: Pradip K. Roy, Manish Deopura, Sudhanshu Misra
  • Patent number: 8858662
    Abstract: Methods of forming a polycrystalline table comprise disposing a plurality of particles comprising a superabrasive material, a substrate comprising a hard material, and a catalyst material in a mold. The plurality of particles is partially sintered in the presence of the catalyst material to form a brown polycrystalline table having a first permeability attached to an end of the substrate. The substrate is removed from the brown polycrystalline table and catalyst material is removed from the brown polycrystalline table. The brown polycrystalline table is then fully sintered to form a polycrystalline table having a reduced, second permeability. Intermediate structures formed during a process of attaching a polycrystalline table to a substrate comprise a substantially fully leached brown polycrystalline table. The substantially fully leached brown polycrystalline table comprises a plurality of interbonded grains of a superabrasive material.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: October 14, 2014
    Assignee: Baker Hughes Incorporated
    Inventors: Anthony A. DiGiovanni, Nicholas J. Lyons, Derek L. Nelms, Danny E. Scott
  • Patent number: 8845773
    Abstract: Abrasive particles which are shaped abrasive particles each with an opening are described. The shaped abrasive particles are formed from alpha alumina and have a first face and a second face separated by a thickness t. The opening in each of the shaped abrasive particles can improve grinding performance by reducing the size of a resulting wear flat, can provide a reservoir for grinding aid, and can improve adhesion to a backing in a coated abrasive article.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: September 30, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Dwight D. Erickson, Scott R. Culler, Negus B. Adefris, John T. Boden, John D. Haas
  • Publication number: 20140251698
    Abstract: Polycrystalline compacts include a hard polycrystalline material comprising first and second regions. The first region comprises a first plurality of grains of hard material having a first average grain size, and a second plurality of grains of hard material having a second average grain size smaller than the first average grain size. The first region comprises catalyst material disposed in interstitial spaces between inter-bonded grains of hard material. Such interstitial spaces between grains of the hard material in the second region are at least substantially free of catalyst material. In some embodiments, the first region comprises a plurality of nanograins of the hard material. Cutting elements and earth-boring tools include such polycrystalline compacts.
    Type: Application
    Filed: May 20, 2014
    Publication date: September 11, 2014
    Applicant: Baker Hughes Incorporated
    Inventors: Danny E. Scott, Anthony A. DiGiovanni
  • Publication number: 20140245667
    Abstract: A hardfacing material includes a metal matrix material and particles of crushed polycrystalline diamond material embedded within the metal matrix material. An earth-boring tool includes a body comprising particles of fragmented polycrystalline diamond material embedded within a metal matrix material. The particles of fragmented polycrystalline diamond material include a plurality of inter-bonded diamond grains. A method includes forming an earth-boring tool including a metal matrix material and particles of crushed polycrystalline diamond material.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: Baker Hughes Incorporated
    Inventors: Nicholas J. Lyons, Danny E. Scott
  • Publication number: 20140242894
    Abstract: Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method for producing the polishing pad. The polishing pad is for polishing a semiconductor device and includes a polishing layer having a polyurethane-polyurea resin molded body containing cells of a substantially spherical shape. The polyurethane-polyurea resin molded body has a ratio of closed cells of 60 to 98%. The polyurethane-polyurea resin molded body has a ratio tan ? of a loss modulus E? to a storage modulus E? (loss modulus/storage modulus) of 0.15 to 0.30. The storage modulus E? is 1 to 100 MPa. The polyurethane-polyurea resin molded body has a density D of 0.4 to 0.8 g/cm3.
    Type: Application
    Filed: October 12, 2012
    Publication date: August 28, 2014
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Publication number: 20140223832
    Abstract: A polyurethane is produced by reacting a mixture including at least (A) a diisocyanate, (B) a polyol, and (C) a chain extender, the polyol (B) having the number average molecular weight of 400 to 5000, the chain extender (C) including (C1) a compound shown by the following general formula (1) and (C2) a compound shown by the following general formula (2), the compound (C1) and the compound (C2) having a number average molecular weight of less than 400, and a ratio “M1/(M1+M2)” calculated by using the number of moles (M1) of the compound (C1) and the number of moles (M2) of the compound (C2) being 0.25 to 0.9.
    Type: Application
    Filed: April 16, 2014
    Publication date: August 14, 2014
    Applicant: JSR CORPORATION
    Inventors: Takahiro OKAMOTO, Rikimaru Kuwabara
  • Patent number: 8784519
    Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed. The vitrified bond includes an oxide of a lanthanoid. Additionally, the vitrified bond component defines pores that can be essentially all less than 800 ?m in diameter. Seventy percent of the pores are in a range of between about 40 ?m and about 500 ?m and have an average aspect ratio less than about 2. The porosity is in a range of between about 50% and about 90% of the total volume of the superabrasive product.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: July 22, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Ramanujam Vedantham, Rachana Upadhyay, Gilles Querel
  • Patent number: 8784518
    Abstract: Herein are disclosed an apparatus and method for reaction injection molding of polyurethane foam. In the method, a recirculation loop containing polyols along with an effective amount of water, and a recirculation loop containing isocyanates, are each partially evacuated.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: July 22, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Elizabeth Anna Benson-Sargent, David R. Dow, Grady A. Dunham, Douglas E. Earl, Jeffrey P. Lenzendorf
  • Patent number: 8771390
    Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed, wherein the vitrified bond component defines pores occupying greater than about 50% of the total volume of the vitrified superabrasive product. The vitrified superabrasive product can be in the form of a grinding tool, such as a grinding wheel. A superabrasive mixture includes a glass powder, a superabrasive grit, a binder and a silicon carbide. The mixture can be in the form of a green body, which is fired under an atmosphere and pressure, and at a temperature sufficient to form a porous vitrified superabrasive product.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: July 8, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Rachana D. Upadhyay, Gilles Querel, Pradyumna Gupta, Richard W. J. Hall
  • Publication number: 20140166371
    Abstract: A method of manufacturing a polycrystalline diamond (PCD) cutting element used as drill bit cutting elements (10) is disclosed. The method comprises leaching a PCD body formed from diamond particles (202) using a binder-catalyzing material so as to remove substantially all of the binder-catalyzing material from portions of a cutting surface of the PCD body. A portion (24) of the cutting surface is identified as a cutting area which, in use of the cutting element to cut material, is heated by the cutting action of the cutting element. Leaching of the PCD body includes performing a relatively deep leach in the portion of the cutting surface identified as the cutting area and performing a relatively shallow leach in at least the portion (26) of the cutting surface surrounding the identified cutting area.
    Type: Application
    Filed: April 20, 2012
    Publication date: June 19, 2014
    Inventor: Malcolm E. Whittaker
  • Publication number: 20140123563
    Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: NEXPLANAR CORPORATION
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson
  • Publication number: 20140106652
    Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.
    Type: Application
    Filed: April 16, 2012
    Publication date: April 17, 2014
    Applicant: FUJIBO HOLDINGS INC.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Publication number: 20140102010
    Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Application
    Filed: December 6, 2013
    Publication date: April 17, 2014
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson
  • Patent number: 8696409
    Abstract: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: April 15, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Muthu Jeevanantham, Xavier Orlhac
  • Publication number: 20140090305
    Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 3, 2014
    Applicant: Trade Associates, Inc.
    Inventor: Bang Fang Lin
  • Publication number: 20140033615
    Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a hard segment content (HSC) in a range from 26 to 34%, and has a density D in a range from 0.30 to 0.60 g/cm3, the hard segment content (HSC) being determined by the following formula (1): HSC=100×(r?1)×(Mdi+Mda)÷(Mg+r×Mdi+(r?1)×Mda)??(1).
    Type: Application
    Filed: April 16, 2012
    Publication date: February 6, 2014
    Applicant: FUJIBO HOLDINGS, INC.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Publication number: 20140038493
    Abstract: It is an object of the invention to provide a tank for use in making high-quality, air void-less, polishing pads, to provide a method for producing a polishing pad using the tank, and to provide a polishing pad obtained by such a production method. A tank for holding a resin composition, the tank comprising two or more body components and joint parts, wherein the two or more body components are joined by the joint parts to form a frame-shaped body, at least one of the joint parts includes an opening and closing member that joins adjacent ones of the body components in such a way that the adjacent body components can swing open, and at least another one of the joint parts includes a joint member that joins adjacent ones of the body components in such a way that the adjacent body components can swing about the joint member.
    Type: Application
    Filed: April 25, 2011
    Publication date: February 6, 2014
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventor: Hiroshi Seyanagi
  • Publication number: 20140038503
    Abstract: A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 ?s, the polyurethane-polyurea resin foam has a storage elastic modulus E? of 1 to 30 MPa, the storage elastic modulus E? being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.
    Type: Application
    Filed: April 16, 2012
    Publication date: February 6, 2014
    Applicant: FUJIBO HOLDINGS, INC.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Publication number: 20140013671
    Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 16, 2014
    Applicant: SMITH INTERNATIONAL, INC.
    Inventors: J. DANIEL BELNAP, GEORGIY VORONIN, FENG YU, PETER T. CARIVEAU, YOUHE ZHANG, YUELIN SHEN, GUODONG ZHAN
  • Publication number: 20130340351
    Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.
    Type: Application
    Filed: June 14, 2013
    Publication date: December 26, 2013
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventors: Takeshi FUKUDA, Tsuguo WATANABE, Junji HIROSE, Kenji NAKAMURA, Masato DOURA
  • Publication number: 20130324020
    Abstract: Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.
    Type: Application
    Filed: June 4, 2012
    Publication date: December 5, 2013
    Inventors: Paul Andre Lefevre, William C. Allison, James P. LaCasse, Diane Scott, Alexander William Simpson, Ping Huang, Leslie M. Charns
  • Publication number: 20130292184
    Abstract: The disclosure provides a PCD element containing a substrate and a PCD layer. The PCD has a top surface, a side surface, an intermediate surface, an unleached region containing a diamond body matrix and an interstitial matrix including a catalyst, and a leached region containing a diamond body matrix and empty space in the place of the interstitial matrix. The catalyst has been leached from the empty space in the place of the interstitial matrix. The unleached region is adjacent to a substantial portion of the side surface and the leached region is not adjacent to a substantial portion of the side surface, and the leached region is adjacent to the top surface or the intermediate surface. The disclosure also provides a system and method for leaching a PCD element including a liquid able to leach a catalyst and a protective member.
    Type: Application
    Filed: May 1, 2012
    Publication date: November 7, 2013
    Inventor: Gary E. Weaver
  • Patent number: 8557005
    Abstract: The present invention provides a polyurethane foam, which, despite having a low specific gravity, has a hardness and an elasticity favorable for a polishing pad, and a polishing pad made using the polyurethane foam. The polyurethane foam is obtained by reacting a blend composition containing (A) a polyisocyanate, (B) a polyol, (C) a chain extender with a molecular weight of equal to or smaller than 400, and (D) water, and in the blend composition, MDI is blended as a main component of the component (A) and a blending amount of the MDI is 45 to 70 parts by weight when a total weight of the respective components (A), (B), and (C) is taken as 100 parts by weight.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: October 15, 2013
    Assignees: Toyo Polymer Co., Ltd., Nitta Haas Incorporated
    Inventors: Michiro Goto, Kazuo Takemoto, Nobuyuki Ooshima, Shin-ichi Haba, Kouichi Yoshida, Norio Kawai