Abstract: Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.

Abstract: The present invention provides a dental polishing article having excellent polishability, which can polish dental composite resin, porcelain, dental restorative and prosthetic materials and teeth at a low cost, conveniently in a short time. More specifically, the present invention provides a dental polishing article which comprises a polishing portion formed by compounding polishing grains in an elastomer binder, and the polishing portion further comprising spherical resin particles.

Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Abstract: The invention relates to a synthetic-resin-bonded grinding disk comprising a mixture of abrasive grain, binding agent, and pore formers, wherein the pore formers are plant seeds and are contained in the finished grinding disk. The grinding disk is composed of 60 to 90 wt % of abrasive grain and 10 to 40 wt % of a binding agent, wherein the plant seeds constitute up to 80 wt % of the binding agent. The plant seeds can contain oil and can be rape seeds, poppy seeds, clover seed, lupin seeds, mustard seeds, serradella vetch seeds, or similar plant seeds. The grinding disk can be produced by mixing abrasive grain, binding agent, and plant seeds, pouring the starting mixture into a mold provided therefor, pressing the mixture, pre-drying the mixture, and curing the grinding disk. The plant seeds are not burned in the production of the grinding disk. The grinding disk is cured at temperatures of up to 250° C., preferably of up to 200° C., more preferably of up to 180° C., and more preferably of up to 150° C.

Abstract: A system for preparing a microcellular polyurethane material, includes a froth, prepared, for instance, by inert gas frothing a urethane prepolymer, preferably an aliphatic isocyanate polyether prepolymer, in the presence of a surfactant; a filler soluble in a CMP slurry; and a curative, preferably including an aromatic diamine and a triol. To produce the microcellular material, the froth can be combined with the filler, e.g., PVP, followed by curing the resulting mixture. The microcellular material has a low rebound and can dissipate irregular energy and stabilize polishing to yield improved uniformity and less dishing. CMP pads using the microcellular material have pores created by inert gas frothing throughout the pad polymer body and additional surface pores created by dissolution of fillers during polishing, providing flexibility in surface softness and pad stiffness.

Abstract: An object of the invention is to provide a polishing pad that achieves a high polishing rate and has high thickness precision so that the break-in time (dummy polishing time) can be shortened, and to provide a method for producing same. The invention is directed to a polishing pad including a base material layer and a polishing layer provided on the base material layer, wherein the polishing layer includes a thermoset polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 200 ?m, and the polishing layer has a storage modulus E? (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (60° C.) at 60° C. [E?(30° C.)/E?(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (90° C.) at 90° C. [E?(30° C.)/E?(90° C.)] of 15 to 130.

Abstract: A method for making a polycrystalline diamond construction is disclosed, which includes the steps of treating a polycrystalline diamond body having a plurality of bonded together diamond crystals and a solvent catalyst material to remove the solvent catalyst material therefrom, wherein the solvent catalyst material is disposed within interstitial regions between the bonded together diamond crystals, replacing the removed solvent catalyst material with a replacement material, and treating the body having the replacement material to remove substantially all of the replacement material from a first region of the body extending a depth from a body surface, and allowing the remaining amount of the replacement material to reside in a second region of the body that is remote from the surface.

Abstract: A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing l

Abstract: The disclosure is directed to polishing pads with porous polishing elements, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which are porous, each polishing element affixed to a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis normal to a polishing surface of the polishing elements. In certain embodiments, the polishing pad may include a guide plate positioned to arrange and optionally affix the plurality of polishing elements on the support layer, and additionally, a polishing composition distribution layer. In some embodiments, the pores are distributed throughout substantially the entire porous polishing element. In other embodiments, the pores are distributed substantially at the polishing surface of the elements.

Abstract: A method for manufacturing a diamond composite, includes: a) mixing diamonds with additives, the mixture comprising at least 50 wt % and less than 95 wt % of diamonds and more than 5 wt % additives; b) forming a work piece from the mixture using a pressure of at least 100 Mpa; c) heating the formed work piece to at least 300° C. for removing possible water and wholly or partially removing additives; d) heating the work piece and controlling the heating temperature and heating time so that a certain desired amount of graphite is created by graphitization of diamonds, wherein the amount of graphite created by graphitization is 3-50 wt % of the amount of diamond; e) infiltrating silicon or silicon alloy into the work piece.

Abstract: A composite abrasive or finishing pad for use in sanding includes a sandpaper sheet having a paper based substrate having a front surface which has an abrasive grit adhered thereto and a back surface, a polyfoam backing reaction bonded to the back surface, wherein the polyfoam backing includes a first layer formed across the back surface of a first thickness sufficient enough to substantially aid in rendering the sandpaper tear-resistant and including a raised portion extending outward from the first layer a sufficient amount to form a wall portion against which lateral forces can be applied by one's fingers. A method of forming the pad is provided.

Abstract: A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane (“POSS”) molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections.

Abstract: Diamond bonded construction comprise a diamond body attached to a support. In one embodiment, an initial substrate used to sinter the body is interposed between the body and support, and is thinned to less than 5 times the body thickness, or to less than the body thickness, prior to attachment to the support to relieve stress in the body. In another embodiment, the substrate is removed after sintering, and the body is attached to the support. The support has a material construction different from that of the initial substrate, wherein the initial substrate is selected for infiltration and the support for end use properties. The substrate and support include a hard material with a volume content that may be the same or different. Interfaces between the body, substrate, and/or support may be nonplanar. The body may be thermally stable, and may include a replacement material disposed therein.

Abstract: A polycrystalline diamond (PCD) composite compact element 100 comprising a substrate 130, a PCD structure 120 bonded to the substrate 130, and a bond material in the form of a bond layer 140 bonding the PCD structure 120 to the substrate 130; the PCD structure 120 being thermally stable and having a mean Young's modulus of at least about 800 GPa, the PCD structure 120 having an interstitial mean free path of at least about 0.05 microns and at most about 1.5 microns; the standard deviation of the mean free path being at least about 0.05 microns and at most about 1.5 microns. Embodiments of the PCD composite compact element may be for a tool for cutting, milling, grinding, drilling, earth boring, rock drilling or other abrasive applications, such as the cutting and machining of metal.

Abstract: The present invention relates to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same, and more particularly, to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same in which the specific surface area of the powder is increased by preparing a cerium precursor, and then decomposing and calcinating the prepared cerium precursor. The pore distribution is controlled to increase the chemical contact area between a polished film and a polishing material, thereby reducing polishing time while the physical strength of powder is decreased, which remarkably reduces scratches on a polished film.

Abstract: A method for facilitating infiltration of an infiltrant material into a TSP material during re-bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.

Abstract: A polycrystalline diamond (PCD) material 10 comprising at least 88 volume percent and at most 99 volume percent diamond grains 12, the mean diamond grain contiguity being greater than 60.5 percent. The PCD material 10 is particularly but not exclusively for use in boring into the earth.

Abstract: The present invention relates to a method for manufacturing a polyurethane porous product, a polyurethane porous product according to the manufacturing method, and a polishing pad having the polyurethane porous product. According to the present invention, it is possible to manufacture a polishing pad that has excellent polishing efficiency and has a minimal difference in the polishing characteristic during a polishing process and improves uniformity in plane of material that will be polished because the polyurethane porous product of the present invention has small density difference, small hardness difference, and the stabilized quality of material.

Abstract: Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presence of a frothing agent metered into the tank by way of a dip tube or sparge. The nitrogen gas is sheared into small bubbles and is drawn off from the headspace of the tank creating a continuous flow of nitrogen. The pressure of the tank may vary from any absolute pressure down to near complete vacuum, thereby all but eliminating the pressure requirement. The froth of the present invention has a more consistent cell structure and increased cell count.

Abstract: A method of forming an abrasive article includes forming a mixture comprising a liquid carrier and a glass precursor material, wherein the glass precursor material comprises a material selected from the group of materials consisting of a hydrated metal compound, an organic silicate compound, or a combination thereof. The method further includes providing abrasive grains within the mixture, forming the mixture into a green ceramic body, and heating the green ceramic body to form a bonded abrasive article comprising the abrasive grains contained within a bond matrix, wherein the bond matrix comprises an amorphous phase formed from the glass precursor material.

Abstract: An abrasive comprising shaped abrasive particles each with an opening. The shaped abrasive particles are formed from alpha alumina and have a first face and a second face separated by a thickness t. The opening in each of the shaped abrasive particles can improve grinding performance by reducing the size of a resulting wear flat, can provide a reservoir for grinding aid, and can improve adhesion to a backing in a coated abrasive article.

Abstract: The present invention relates to a polishing pad having an insulation layer and a method for making the same. The polishing pad includes a bottom layer, an insulation layer, and an abrasive layer. The bottom layer includes a fabric layer wrapped in a high polymer. The insulation layer is disposed on the bottom layer. The abrasive layer is disposed on the insulation layer. The abrasive layer is a high polymeric elastomer and has a plurality of columnar-like cells. The insulation layer can prevent the slurry from infiltrating into the bottom layer during the polishing processs to improve the polishing effect and quality.

Abstract: In a vitrified bonded grinding wheel that is formed so that superabrasives formed of cubic boron nitride (CBN) grains or diamond grains are bonded and held with a vitrified binder, the vitrified binder is formed of oxide particles and amorphous glass, and the vitrified binder has no open pore that is in fluid communication with outside air.

Abstract: Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presence of a frothing agent metered into the tank by way of a dip tube or sparge. The nitrogen gas is sheared into small bubbles and is drawn off from the headspace of the tank creating a continuous flow of nitrogen. The pressure of the tank may vary from any absolute pressure down to near complete vacuum, thereby all but eliminating the pressure requirement. The froth of the present invention has a more consistent cell structure and increased cell count.

Abstract: A method for manufacturing a polishing pad containing substantially spherical cells and having high thickness accuracy includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition from a single discharge port to a substantially central portion in the width direction of a face material A, while feeding the face material A; laminating a face material B on the cell-dispersed urethane composition; then uniformly adjusting the thickness of the cell-dispersed urethane composition by thickness adjusting means; curing the cell-dispersed urethane composition with the thickness adjusted in the preceding step without applying any additional load to the composition so that a polishing sheet including a polyurethane foam is formed; and cutting the polishing sheet.

Abstract: Machining and cutting tools including, but not limited to, rotary drill bits, mining tools, milling tools, wood shredders, reamers and wire dies formed with at least one substrate having a layer of polycrystalline diamond disposed thereon. The polycrystalline diamond layer may be generally described as a polycrystalline diamond compact (PDC) or PDC layer. The PDC may be formed by using an intermetallic aluminide catalyst. One example of such catalyst may include nickel aluminide used to form diamond to diamond bonds between adjacent diamond particles.

Abstract: An abrasive article includes a carrier element, an abrasive component, and a bonding region between the abrasive component and the carrier element. The abrasive component includes abrasive particles bound in a metal matrix. The abrasive component further includes a network of interconnected pores substantially filled with an infiltrant. The infiltrant has an infiltrant composition containing at least one metal element. The bonding region includes a bonding metal having a bonding metal composition containing at least one metal element. The bonding region is a region distinct from the carrier element and is a separate phase from the carrier element. An elemental weight percent difference is the absolute value of the difference in weight content of each element contained in the bonding metal composition relative to the infiltrant composition. The elemental weight percent difference between the bonding metal composition and the infiltrant composition does not exceed 20 weight percent.

Abstract: A superabrasive product, such as a superabrasive tool, includes a superabrasive grain component and a porous continuous phase that includes a thermoplastic polymer component in which the superabrasive grain component is distributed. A superabrasive product precursor to the superabrasive product includes a superabrasive grain component, a bond component and a polymer blowing agent of encapsulated gas. A method of forming a superabrasive product includes combining a superabrasive, a bond component and a polymer blowing agent of encapsulated gas to form, for example, a superabrasive product precursor. The combined superabrasive, bond component and polymer blowing agent of encapsulated gas are heated to a temperature and for a period of time that causes release of at least a portion of the gas from encapsulation within the blowing agent.

Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed, wherein the vitrified bond component defines pores occupying greater than about 50% of the total volume of the vitrified superabrasive product. The vitrified superabrasive product can be in the form of a grinding tool, such as a grinding wheel. A superabrasive mixture includes a glass powder, a superabrasive grit, a binder and a silicon carbide. The mixture can be in the form of a green body, which is fired under an atmosphere and pressure, and at a temperature sufficient to form a porous vitrified superabrasive product.

Abstract: This invention is related to a polishing pad, and more particularly a polishing pad with flexible micro-structure. The polishing pad comprises a connecting surface and a polishing surface. The connecting surface is used to secure on a polishing device. The polishing surface with flexible micro-structure is used to grind and adequately press close to the surface of semiconductor piece. The present invention not only increases the area of polishing surface that contact with the semiconductor piece but also get over the difficulty in pressing close to different piece. It will save grinding time and have a better effect.

Abstract: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.

Abstract: In one aspect of the invention, a method of making a dense diamond body comprises the steps of: forming a sintered polycrystalline diamond body with the use of a catalyst; forming voids in the body by removing at least some of the catalyst; and reducing the overall volume of voids by applying pressure and temperature to the body in a vessel substantially free of additional catalysts.

Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: A method of creating pores in a CMP pad in-situ includes impregnating a first material with a second material to form a CMP pad. The second material can have a resistance to frictional erosion that is less than that of the first material. The CMP pad thus has two materials with differing frictional erosion resistances. The working surface of the CMP pad can be contacted to a wafer to be polished wherein the second material can be frictionally eroded during polishing.

Abstract: A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.

Abstract: By controlling the process parameters and by using a polymeric production tooling having a plurality of mold cavities, different types of shaped abrasive particles selected from the group consisting of abrasive shards, dish-shaped abrasive particles, and shaped abrasive particles with an opening can be produced from the exact same mold. In one embodiment, the mold comprised a plurality of equilateral triangles and fractured precursor abrasive particles, dish-shaped precursor abrasive particles, or precursor shaped abrasive particles with an opening were produced from the same mold.

Abstract: A cerium oxide powder for one-component CMP slurry, which has a specific surface area of 5 m2/g or more, and a ratio of volume fraction of pores with a diameter of 3 nm or more to that of pores with a diameter less than 3 nm of 8:2˜2:8, is disclosed. A method for preparing the same, a one-component CMP slurry comprising the same as an abrasive material, and a method of shallow trench isolation using the one-component CMP slurry are also disclosed. The CMP slurry causes no precipitation of the cerium oxide powder even if it is provided as a one-component CMP slurry, because the CMP slurry uses, as an abrasive material, cerium oxide powder that is obtained via a low-temperature calcination step, optionally a pulverization step, and a high-temperature calcination step and has a high pore fraction and low strength.

Abstract: Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix (e.g., fine nickel, tin, bronze and abrasives). The open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching of dispersoid), closed porosity (e.g., induced by adding a hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives, are below the melting point of the filler used, although sacrificial fillers may be used as well. The resulting abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values.

Abstract: There is provided a chemical mechanical polishing pad which has a circular polishing surface and a non-polishing surface that is the back side of the polishing surface and incorporates an information recording medium that is readable or readable/writable by an electromagnetic wave in a noncontact manner and in which the position of the center of gravity of the information recording medium in the radial direction of the polishing surface is preferably within a range of 0 to 10% or 80 to 100% of the radius of the polishing surface in the direction from the center on the radius of the polishing surface toward the periphery of the polishing surface.

Abstract: A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.

Abstract: An abrasive tool includes a superabrasive grain component, a filler component that comprises hollow bodies and a vitreous bond. Natural and synthetic diamond, cubic boron nitride and combinations thereof can be employed as the superabrasive grain component. The vitreous bond component includes zinc oxide and at least two alkali metal oxides. The vitreous bond component can further include barium oxide. A method for producing an abrasive tool includes combining a superabrasive grain component, a filler component that includes hollow bodies and a vitreous bond component that includes zinc oxide and at least two alkali metal oxides. The combined components are fired at a temperature in a range of between about 600° C. and about 850° C., preferably in an ambient air atmosphere.

Abstract: A superfinishing grindstone suitable for precision grinding, that contains either RB (rice bran) ceramic fine grains or CRB (carbonized rice bran) ceramic fine grains or a combination of both, for use as abrasive grains. The grains of RB ceramic fine grains and CRB ceramic fine grains have multiple small pores which allow the grains to be easily removed from a finished structure. These fine grains have a high Vickers hardness, which makes them highly resistant to bending, scratching, abrasion or cutting.

Abstract: An abrasive material comprises an integral mass of discrete lengths, not bonded to each other, of abrasive-coated non-woven synthetic fibres. In particular, the entanglement force between the said lengths is great enough to maintain a wad of the material when in use but small enough to allow the product to be shaped in the hand of a user.

Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, the abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is rheologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.