Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.

Abstract: The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a activator. The activator comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The composition further comprises at least one oxidizing agent. The composition is believed to be effective by virtue of the interaction between the activator coated on the surface of the abrasive particles and the oxidizing agent, at the activator surface, to form free radicals. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A tearable abrasive article is provided which includes a backing comprising a polymer film having a scrim partially embedded therein and an abrasive coating comprising a plurality of abrasive articles and a binder bonded to at least one side of the backing.

Abstract: Brush bristles include filaments of synthetic resin material containing two or more types of abrasive particles selected from among diamond powder, stainless-steel powder, titanium powder, silicon carbide powder and aluminum oxide powder or silicon carbide or alumina abrasive grains.

Abstract: Fused abrasive particles comprising eutectic colonies. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

Abstract: Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

Abstract: A non-woven abrasive article of interlaced fibers and abrasive particles and a binder which is preformed into a predetermined three dimensional shape and a method for manufacturing the same. The abrasive article is preformed by a thermal setting the abrasive article while it is maintained in a predetermined three dimensional shape or by heating the article to its glass transition temperature and then cooling the article below the glass transition temperature while it is maintained in a predetermined three dimensional shape. This method allows the manufacture of preformed abrasive articles in various three dimensional shapes, including, for example, a bull nosed shape suitable for finishing a concavely curved surface.

Abstract: A non-asbestos friction material is made by molding and curing a composition which includes a fibrous base other than asbestos, a binder, an organic filler, an inorganic filler and an abrasive. The abrasive is composed of one or more inorganic substance selected from among inorganic substances having a Mohs hardness of at least 4.5 and inorganic substances having a Mohs hardness of less than 4.5 and containing at least 50 wt % of a component having a Mohs hardness of at least 4.5. The total amount of organic substances and the total amount of abrasive are in a volumetric ratio of from 1.5/1 to 3.5/1. The friction material thus constituted generates little squeal or other undesirable noise and has a good wear resistance.

Abstract: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Abstract: A polishing liquid for metal containing a metal-oxidizing agent, an oxidized metal dissolving agent, a protective film forming agent, a water-soluble polymer and water, the polishing liquid being used for producing a wiring pattern having a metal-embedded wiring portion of 10 to 100 &mgr;m width and an insulating portion of 10 to 100 &mgr;m width in which pattern the wiring portion is arranged at a wiring density of 40 to 60%, the polishing liquid for metal being comprising in that, when a surface to be polished of a metal film embedded in the wiring portion and a surface to be polished of an insulating film formed at both side portions of the metal film is polished substantially flush, wherein (width of the metal-embedded wiring portion)/(magnitude of dishing (depth)) is no less than 103.

Abstract: A nonwoven composite cleaning pad is disclosed. The cleaning pad includes a first nonwoven layer having an absorbent surface. A second nonwoven layer is laminated to the first layer, and a plurality of abrasive polymer formations are provided on the exposed surface of the second layer.

Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination using wet grinding, and products thereof. The abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is theologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.

Abstract: Novel coated abrasives comprising abrasive agglomerate grains characterized by a high porosity and low ratio of solid volume to nominal volume provide exceptionally useful medium to low pressure grinding characteristics.

Abstract: Abrasive articles abrasive articles (e.g., abrasive wheels) comprised of abrasive agglomerate particles dispersed within cellular polymeric material, and methods of making and using the abrasive articles.

Abstract: Plastic abrasives for sandblasting, in particular, those to be used in sandblast processing for forming barrier ribs and priming ribs; a sandblast processing method with the use of the same; and a method for treating sandblasting waste matters. A plastic abrasive for sandblasting characterized by being soluble in organic solvents or water/organic solvent mixtures and comprising plastic particles having an average particle size of 5 to 100 &mgr;m; a method for sandblast processing a plasma display panel substrate by using the plastic abrasive; and a method for treating sandblasting waste matters.

Abstract: Abrasive articles (e.g., abrasive wheels) comprised of abrasive particles and polymeric material such as a polymeric reaction product of components comprising saturated polyol, saturated polyisocyanate, and a free radical source, and methods of making and using the abrasive articles.

Abstract: A coating composition for forming abrasion-resistant, high clarity coatings is described. It has been found that a macrocrystalline or single crystal mineral abrasive can be added at high levels, about 5 to about 80 percent by weight, to art-recognized film-forming resin compositions for producing coatings exhibiting exceptional abrasion resistance and clarity. Such a coating composition is useful for application to surfaces including wood, vinyl, tile, rubber modified cement, marble, metal, plastic, and laminated surfaces.

Abstract: New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements and finishing surfaces can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Abstract: The invention provides a chemical-mechanical polishing system, and a method of polishing using the system, comprising (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) iodine, (c) an iodine vapor-trapping agent, and (d) a liquid carrier.

Abstract: Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planarizing surfaces, and preventing delamination and scratches.

Abstract: A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.

Abstract: Coated abrasive articles comprise a backing and an abrasive layer, and optionally at least one of a backsize layer, tie layer, supersize layer, presize layer, or saturant.

Abstract: A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.

Abstract: A method for producing organically bonded abrasive article includes combining an abrasive grain component and a phenol-based resin component. The combined components are molded and thermally cured in an atmosphere that comprises humidity, wherein the atmosphere contacts the molded components, thereby producing the organically bonded abrasive grain. The abrasive grain optionally can first be combined with an organosilicon compound, to form organosilicon-treated abrasive grain, and then with the phenol-based resin component. In one example, the phenol-based resin is thermally cured in the presence of steam. Abrasive articles produced by the method of the invention generally have improved properties under wet grinding conditions. In one example, an abrasive article produced by the method of the invention includes ammonia in an amount less than about 50 ppm. In another example, an abrasive grinding wheel produced by the method of the invention has a strength retention greater than about 57 percent.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: Disclosed are a mixture of a stone polishing pad, a stone polishing pad made of the mixture and a method for manufacturing the stone polishing pad. Instead of planar structure, the stone polishing pad has polishing protrusions and an uneven surface formed on the surface of the polishing protrusions that contacts with the polished object. The stone polishing pad is formed by charging a mould with the mixture of the stone polishing pad that includes cork powder, and forming the same under high temperature and high pressure.

Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

Abstract: Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in a substrate, at least partially curing the ceramic aggregate precursor particles, and heating the ceramic aggregate precursor particles to provide ceramic aggregate particles wherein solid particulates are bonded together by ceramic binder.

Abstract: A composition is provided in the present invention for polishing a composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or titanium nitride), and an insulating layer (such as SiO2). The composition comprises an aqueous medium, an oxidant, an organic polymer that attenuates removal of the oxide film. The composition may optionally comprise a complexing agent and/or a dispersant.

Abstract: An abrasive article comprising a backing material having first and second opposed major surfaces and an abrasive layer comprising abrasive particles and binder secured to the said first major surface, the article also bearing a hydrophilic/lipophilic urethane material to enhance dimensional and conformational stability of the abrasive article.

Abstract: A process for coating a surface which comprises applying a composition comprising an amine aldehyde resin, a reactant bearing carboxylic acid groups or derivatives thereof and a Lewis acid, followed by thermal curing. The process is of value, for example, in the manufacture of abrasive products, where the composition serves as a make composition or size composition, or both, to hold abrasive particles on the surface of a backing.

Abstract: The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern which provides open spaces between adjacent connected bodies, each body having a first surface and an opposite second surface; and abrasive particles to cause at least the first surface to be an abrasive surface. A method of making the abrasive is provided by providing the substrate and providing abrasive particles to at least the first surface to provide an abrasive surface.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

Abstract: The present invention provides abrasive articles having projections attached to a major surface thereof, and methods of making such articles. The articles include (1) a reaction product of components that include (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom; and/or (2) a polymeric material preparable by combining at least (a) an epoxy-functional material, and (b) at least one of a cyclic anhydride or a diacid derived therefrom.

Abstract: A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.

Abstract: A magnetic-abrasive powder has a magnetic component, an abrasive component, an adhesive component which connects particles of the magnetic component with particles of the abrasive component, the adhesive component being a light curing adhesive component which contains catalysts and is polymerizable under the action of ultraviolet and visible light.

Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

Abstract: Fused abrasive particles comprising eutectic material comprising Al2O3—MgO-REO eutectic. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

Abstract: Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad.

Abstract: A homogeneous fixed abrasive polishing article, or pad, including a matrix of a cured resin coated soft filler material having at least one working surface and an abrasive uniformly distributed throughout the filler material. A method for manufacturing the polishing pad includes the steps of mixing a binder, solvent and filler material together; drying the resin coated filler material; grinding the resin coated filler material; sieving the resin coated filler material; mixing an abrasive material with the resin coated filler material; sieving the abrasive material and the resin coated filler material thereby creating a powder material; transferring the powder material to a mold to form a working surface for the polishing pad; compressing the powder material; and curing the powder material. Alternatively, the abrasive may be mixed with the binder, solvent and filler material in the first step instead of later in the process.

Abstract: A method of bonding an abrasive solid mass to a desired member with an adhesive, wherein the abrasive solid mass has a porous abrasive structure in which a multiplicity of abrasive grains are held together by a bonding agent. The method includes a sealing-film forming step of forming a sealing film on a surface of the abrasive solid mass, for preventing the adhesive from penetrating into pores formed in the porous abrasive structure.

Abstract: The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern which provides open spaces between adjacent connected bodies, each body having a first surface and an opposite second surface; and abrasive particles to cause at least the first surface to be an abrasive surface. A method of making the abrasive is provided by providing the substrate and providing abrasive particles to at least the first surface to provide an abrasive surface.

Abstract: The present invention provides discrete particles and methods of preparing the discrete particles. The discrete particles include a plurality of abrasive grits and a polymeric material that includes a reaction product of components including (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom, and optionally (c) a polyfunctional (meth)acrylate. The invention also provides articles made from the discrete particles and methods of making such articles. Preferably, the articles are abrasive articles.

Abstract: A metal-bonded grinding tool including a base, and abrasive grains bonded to the base by a bond matrix containing Cu alloy as a main component. The bond matrix further contains a powder selected from the group consisting of Ti, Al, and a mixture thereof. An average grain protrusion is set to 30% or more of an average grain diameter, and an average grain spacing is set to 200% or more of the average grain diameter.

Abstract: Abrasive articles comprising abrasive particles and at least one of (a) a reaction product of components comprising a resole phenolic resin and a bisphenol/fornaldehyde resin, (b) a bond system is derived by curing a mixture of a resole phenolic resin and a bisphenol/formaldehyde resin, and/or (c) a bond system comprising polymeric material preparable by combining components comprising a resole phenolic resin and a bisphenol/formaldehyde resin.

Abstract: A method for making a polymeric blast media, and a product of this method. The first step involves blending a melamine compound with a cellulosic material and compression molding said first blend to produce a compression molded first blend. This first blend is then cooled and then ground. In the next step of this method, a urea compound is blended with a nano-clay material to produce a second blend and compression molded. This compression molded second blend is then ground to produce a particulate second blend. The particulate first blend is then blended with the particulate second blend. A blast media product of this method is also disclosed.

Abstract: A hybrid type resinoid grindstone including abrasive agglomerates which are held together by a thermosetting synthetic resin used as a bonding agent, wherein each of the abrasive agglomerates includes sol-gel abrasive grains which are held together by a vitrified bonding agent. In the present hybrid type resinoid grindstone of the present invention, each of the sol-gel abrasive grains, which are held together by the vitrified bonding agent, restores its sharpness as a result of each of the successive removals of fine crystals with application of an impact or shock to the sol-gel abrasive grain, as in a vitrified grindstone, during a grinding operation.