Abstract: Abrasive articles having a compressible composite layer are described. The compressible composite layers include a compressible binder and abrasive agglomerates. Methods of using such abrasive articles to modify the edge of a workpiece are also described.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: A structured abrasive article, methods of making an abrasive article, and methods of using an abrasive article. The abrasive composites forming the abrasive article have a height of at least 500 micrometers, and the abrasive particles in the composites have an average particle size of at least 40 micrometers, in some embodiments, at least about 85 micrometers. The large topography composites, together with the large ceramic abrasive particles, provides an abrasive article that has a more consistent cut, a longer cutting life, and a more consistent surface finish than conventional make/coat abrasive articles with the same size and type of abrasive particles. Additionally, the large topography composites, together with the large ceramic abrasive particles, provide an abrasive article that has a more consistent cut, a longer cutting life, and a more consistent surface finish than structured abrasive articles having a smaller topography, even with the same abrasive particles.

Abstract: The present invention provides an aqueous slurry composition that comprises cerium oxide and/or cerium oxide-containing mixed rare earth oxide abrasive particles, a polyacrylate, and an agent that retards hard settling. The agent that retards hard settling is preferably a polysaccharide such as xanthan gum, microcrystalline cellulose and/or sodium alginate, the latter of which may be treated with a divalent metal salt such as calcium carbonate. The slurry composition according to the invention can be used to polish glass and glass ceramics at a high removal rate, but does not hard settle upon extended static conditions and can be easily resuspended. The present invention also provides a method of polishing a glass or glass ceramic substrate using the slurry composition.

Abstract: Methods for making glass-ceramics comprising Al2O3, REO, at least one of ZrO2 or HfO2 and at least one of Nb2O5 or Ta2O5. Glass-ceramics according to the present invention can be made, formed as, or converted into glass beads, articles (e.g., plates), fibers, particles, and thin coatings. Some embodiments of glass-ceramic particles according to the present invention can be are particularly useful as abrasive particles.

Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a temporary layer comprising said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; embossing the layer comprising softened particulate curable binder material and abrasive particles to provide a pattern of raised areas and depressed areas and curing the softened particulate curable binder material to convert the embossed layer into a permanent embossed layer comprised of cured particulate binder material and abrasive particles and cure the at least partially cured primer coati

Abstract: An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the make coat to provide an abrasive surface and a size coat arranged over at least a portion of the abrasive surface, wherein the size coat has a Young's modulus of less than 100,000 psi.

Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a plurality of temporary shaped structures comprised of said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; and curing the softened particulate curable binder material to convert said temporary shaped structures into permanent shaped structures and cure the at least partially cured primer coating on the first surface of the backing. The invention also provides an abrasive product made by the method.

Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: A resilient hand-held abrasive article includes a flexible conformable backing layer having opposed first and second major surfaces, a flexible reinforcing layer affixed to at least one of the backing layer first and second major surfaces, and abrasive particles arranged on the reinforcing layer, thereby defining an abrasive surface. The backing layer comprises a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern that provides open spaces between adjacent connected bodies.

Abstract: A toothbrush with bristles containing a far-infrared emitting material and multi-element minerals is disclosed. The negative ions and radiation emitted from the bristles stimulate the cells of the gums and help prevent periodontal conditions.

Abstract: An abrasive article and methods of making and using the same are disclosed. The abrasive article includes a plurality of features on a backing. The features have a base and a body. The body is defined by sidewalls having parabolic sections. In some embodiments, the sidewalls are defined by a series of inner-connected lines segments approximating a parabolic section.

Abstract: The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydroxybutyric acid, hydroxyvaleric acid, caprolactone, p-dioxanone, trimethylene carbonate, butylene succinate, butylene adipate, monosaccharides, dicarboxylic acid anhydrides, enantiomers thereof, and combinations thereof. The invention is further directed to methods of its use.

Abstract: Al2O3—La2O3—Y2O3—MgO ceramics (including glasses, crystalline ceramics, and glass-ceramics) and methods of making the same. Ceramics according to the present invention can be made, formed as, or converted into glass beads, articles (e.g., plates), fibers, particles, and thin coatings. The particles and fibers are useful, for example, as thermal insulation, filler, or reinforcing material in composites (e.g., ceramic, metal, or polymeric matrix composites). The thin coatings can be useful, for example, as protective coatings in applications involving wear, as well as for thermal management. Some embodiments of ceramic particles according to the present invention can be are particularly useful as abrasive particles.

Abstract: CMP pad dressers and their methods of manufacture are disclosed. One aspect of the present invention provides a CMP pad dresser having improved superabrasive grit retention in a resin layer. The CMP pad includes a resin layer, superabrasive grit held in the resin layer such that an exposed portion of each superabrasive grit protrudes from the resin layer, and a metal coating layer disposed between each superabrasive grit and the resin layer, where the exposed portions are substantially free of the metal coating layer. The metal coating layer acts to increase the retention of the superabrasive grit in the resin layer as compared to superabrasive grit absent the metal coating layer.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a polymer netting with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The polymer netting cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and an apertured attachment interface with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The apertured attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e.g., tungsten CMP).

Abstract: A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 ?m or greater and less than 0.5 ?m, and preferably in the range of 0.005 ?m or greater and 0.2 ?m or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

Abstract: A method of producing abrasive tools with abrasive particles consisting of Al2O3 has the steps of producing a mixture of initial components with particles of Al(OH)3, forming blanks of an abrasive tool from the mixture of the initial components with the particles of AL(OH)3, subsequently producing the abrasive tools with the abrasive particles of Al2O3 by subjecting the blanks to a heat treatment such that the particles of Al(OH)3 are converted into the abrasive particles of Al2O3 in the tools, wherein the forming includes rolling a sheet from the mixture of the initial components with the particles of Al(OH)3 before the heat treatment and conversion of the particles of Al(OH)3 the abrasive particles of Al2O3 which particles of Al(OH)3 are softer than the abrasive particles of Al2O3 and therefore do not damage a rolling equipment, and thereafter separating the blanks of the abrasive tools from the sheet for the subjecting to the heat treatment.

Abstract: A resilient flexible abrasive article includes a continuous backing layer including a support layer coated with foam, the continuous backing layer having opposed major surfaces, at least one of the major surfaces including a three dimensional surface topography including raised and recessed regions, and wherein the raised and recess regions are at least partially coated with abrasive particles, thereby defining an abrasive surface.

Abstract: The present invention is directed to an abrasive article and methods of making the abrasive article. An abrasive coating on the abrasive article comprises at least 20% by weight of a superabrasive particle. The abrasive coating is derived from an abrasive slurry. The abrasive slurry may comprise and a dispersant having an AV wherein AV=1000*[(Amine Value)/(Mw)]. The dispersant comprises a polymer having a molecular weight (Mw) of greater than 500 g/mol and an AV of greater than 4.5, a polymer having a molecular weight (Mw) of greater than 10,000 g/mol and an AV of greater than 1.0, or a polymer having a molecular weight (Mw) of greater than 100,000 g/mol and an AV of greater than 0.

Abstract: A planarizing slurry for mechanical and/or chemical-mechanical polishing of microfeature workpieces. In one embodiment, the planarizing slurry comprises a liquid solution and a plurality of abrasive elements mixed in the liquid solution. The abrasive elements comprise a matrix material having a first hardness and a plurality of abrasive particles at least partially surrounded by the matrix material. The abrasive particles can have a second hardness independent of the first hardness of the matrix material. The second hardness, for example, can be greater than the first hardness. The matrix material can be formed into a core having an exterior surface and an interior. Because the abrasive particles are at least partially surrounded by the matrix material, the abrasive particles are at least partially embedded into the interior of the core.

Abstract: A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 90° C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

Abstract: An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, ?-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 ?m and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained.

Abstract: An antiloading composition includes a first organic compound. The compound has a water contact angle criterion that is less than a water contact angle for zinc stearate. The first compound also satisfies at least one condition selected from the group consisting of a melting point Tmelt greater than about 40° C., a coefficient of friction F less than about 0.3, and an antiloading criterion P greater than about 0.3. Another embodiment includes a second organic compound, having a different water contact angle from that of the first organic compound. The composition has a particular water contact angle W°p that is determined, at least in part, by the independent W°g of each compound and the proportion of each compound in the composition. Also, an abrasive product includes the antiloading composition. A method of grinding a substrate is disclosed that includes employing effective amount of an antiloading composition. Further disclosed is a method of selecting an antiloading compound.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad.

Abstract: A chemical mechanical polishing slurry contains an alumina powder including ?-alumina particles and at least one other alumina particles having a crystal structure different from that of ?-alumina, and resin particles.

Abstract: The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The polymeric shell has a solid structure and a hardness lower than the hardness of the particle core. The abrasive particles have an average particle size of less than or equal to about 2 micrometers dispersed in the liquid media.

Abstract: A curable emulsion comprises: an oil phase comprising blocked polyisocyanate and curative; and an aqueous phase comprising at least partially neutralized crosslinked copolymer of monomers comprising at least one free-radically polymerizable carboxylic acid and at least one of an alkyl or alkaryl (meth)acrylate. In some embodiments, the curable emulsion further comprises nonionic surfactant. Methods of making the curable emulsions and their use in the manufacture of abrasive articles are also disclosed.

Abstract: The present invention is directed to an abrasive article comprising a fixed abrasive layer and a subpad. The fixed abrasive element is co-extensive with the subpad. The subpad comprises a resilient element. The resilient element has a Shore A hardness of no greater than 60 as measured using ASTM-2240.

Abstract: It is an object of the invention to provide an aqueous dispersion for CMP that produces no scratches on polishing surfaces and that polishes with an adequate rate, when used for polishing of copper and the like. The aqueous dispersion of the invention contains water and polymer particles composed of a polymer with a specific functional group, and it may also contain a complexing agent, a compound that forms a passivation film on polishing surfaces and/or an oxidizing agent. The specific functional group is a functional group that can react with the metals of polishing surfaces or that can form a cation, and it is preferably selected from among amino, pyridyl and acrylamide groups. The polymer can be obtained using a initiator and/or monomer possessing the specific functional group. The polymer may also have a crosslinked structure.

Abstract: Coated abrasive articles have a composite tie layer. The composite tie layer is preparable by disposing a first polymerizable composition comprising a polyfunctional aziridine on a backing, and disposing a second polymerizable composition comprising at least one acidic free-radically polymerizable monomer and at least one oligomer having at least two pendant free-radically polymerizable groups on the first polymerizable composition, at least partially polymerizing the first and second polymerizable compositions, wherein homopolymerization of the oligomer results in a polymer having a glass transition temperature of less than 50 degrees Celsius.

Abstract: Coated abrasive articles have a tie layer that is preparable by at least partially polymerizing an isotropic polymerizable composition comprising a polyfunctional aziridine, an acidic free-radically polymerizable monomer, and an oligomer having at least two pendant free-radically polymerizable groups, wherein homopolymerization of the oligomer results in a polymer having a glass transition temperature of less than 50 degrees Celsius.

Abstract: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Abstract: Polishing slurry has abrading particles dispersed in a liquid dispersant. The abrading particles are composite particles each having a first particle and a plurality of second particles smaller than the first particles attached to the surface of the first particle through a metal oxide membrane. The first particles have average diameter of 0.1–20 ?m and the second particles have average diameter of 0.001–0.5 ?m. Elastic particles may be used as the first particles such as polymer particles.

Abstract: A flowable, granular abrasive material and method of manufacture thereof. The material is comprised of at least one abrasive grain selected from aluminum oxide, silicon carbide, cubic boron nitride and/or diamond and has a organic or inorganic coating comprised of a binder and an abrasive filling material in the amounts of 0.5 to 8% and 1 to 15% by weight, respectively. The filling material may include sulfides, phosphates, carbonates, halogenides, and/or sulfide-, carbonate- and/or halogenide-containing complex compounds. The binder may include a low-viscosity phenol resin, epoxy resin and/or polyurethane resin.

Abstract: A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology.

Abstract: An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or less when a test piece comprising the water-insoluble matrix material is broken at 80° C. according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.

Abstract: A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintered agglomerates having a loose packing density of ?1.6 g/cc and three-dimensional shape; a bond material; and about 35–80 volume % total porosity, including at least 30 volume % interconnected porosity. Methods for making the sintered agglomerates and abrasive tools containing the sintered agglomerates are described.

Abstract: The foot smoothing pad has a polyurethane foamed core which is coated with particulate abrasive material. The pad is water resistant and completely washable and may be used either wet or dry. It is used to remove buildup of rough, dry skin, especially on the feet and hands. The soft and resilient texture of the pad insures comfort and ease in smoothing the skin. The large inside curved surfaces are used to smooth the heels, and the rounded sides may be used for smaller areas, such as the toes.

Abstract: The present invention is directed, in general, to a chemical mechanical polishing pad comprising a polishing body and a backing material coupled to the polishing body. The polishing body comprising a compacted thermoplastic foam substrate, wherein the compacted thermoplastic foam substrate has a density that is as at least about 1.1 times greater than an uncompacted thermoplastic foam substrate density. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.

Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a temporary layer comprising said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; embossing the layer comprising softened particulate curable binder material and abrasive particles to provide a pattern of raised areas and depressed areas and curing the softened particulate curable binder material to convert the embossed layer into a permanent embossed layer comprised of cured particulate binder material and abrasive particles and cure the at least partially cured primer coati

Abstract: A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge, such that nearby particles repel one another. Accordingly, aggregation of polymer particles may be reduced, minimized or eliminated. The composition may additionally comprise an oxidizing agent. A method of using the composition to polish a substrate surface, such as a substrate surface having a metal surface feature or layer, is also described. A substrate so polished may exhibit good surface characteristics, such as a relatively smooth surface or a reduced number of, or a lack of, microscratches on the surface of the substrate.

Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.

Abstract: An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, ?-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 ?m and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.

Abstract: A curable composition comprises: blocked polyisocyanate, curative, and a crosslinked copolymer of monomers comprising at least one free-radically polymerizable carboxylic acid and at least one of an alkyl or alkaryl(meth)acrylate. Methods of making the curable compositions and their use in the manufacture of abrasive articles are also disclosed.