Abstract: An improved combination air sanitizer, soft surface sanitizer, soft surface deodorizer and hard surface disinfectant is disclosed. The preferred active ingredient for the air sanitization and soft surface odor treatment functions is triethylene glycol (TEG). The preferred active ingredient for soft surface sanitization and hard surface disinfection functions is a mixture of various alkyl dimethyl benzyl ammonium saccharinates. The formulation may be provided in an aerosol spray form and is useful for sanitizing and removing bacteria and malodorant molecules from the air as well as disinfecting hard surfaces. A unique combination of corrosion inhibitors is disclosed for convention steel or tin-plated steel cans. A single produce can be used as an air sanitizer/air freshener, a soft surface sanitizer, a soft-surface odor remover/reducer and, a hard surface disinfectant.

Abstract: The present invention relates to methods and compositions for treating a surface of a substrate by foam technology that includes at least one treatment chemical. The invention more particularly relates to the removal of undesired matter from the surface of substrates with small features, where such undesired matter may comprise organic and inorganic compounds such as particles, films from photoresist material, and traces of any other impurities such as metals deposited during planarization or etching. A method according to the present invention for treating a surface of a substrate comprises generating a foam from a liquid composition, wherein the liquid composition comprises a gas; a surfactant; and at least one component selected from the group consisting of a fluoride, a hydroxylamine, an amine and periodic acid; contacting the foam with the surface of a substrate; and, removing the undesired matter from the surface of the substrate.

Abstract: Through-the-wash automatic dishwashing detergent compositions, especially detergent compositions comprising zinc-containing materials, are provided for protecting glassware from surface corrosion during automatic dishwashing.

Abstract: The polishing solution is useful for preferentially removing barrier materials in the presence of nonferrous interconnect metals with limited erosion of dielectrics. The polishing solution comprises 0 to 20 weight percent oxidizer, at least 0.001 weight percent inhibitor for reducing removal rate of the nonferrous interconnect metals, 10 ppb to 4 weight percent complexing agent, 0 to 50 weight percent abrasive and balance water; and the solution having a pH of less than 7.

Abstract: A method of treating the surfaces of medical instruments which are contaminated with prions includes contacting the surface with a composition containing a source of peroxide ions, such as hydrogen peroxide, at a molar concentration of at least 1.5M peroxide (equivalent to approximately 5% hydrogen peroxide) and preferably, about 2M peroxide (approximately 7% hydrogen peroxide). The composition is optionally in the form of a gel. The composition is retained in contact with the surfaces for about 1–2 hours until all or substantially all prion contamination is removed.

Abstract: A remover composition and method for removing resists from substrates containing nucleophilic amine and at least one solvent is described. Optionally, a chelating agent can also be included in the remover composition. The remover composition is especially suitable for removing a variety of resists from substrates at different stages in the process of manufacturing integrated circuits.

Abstract: A composition and method for cleaning surfaces having deposits, such as drink water tanks, supply water wells, water filter systems, and distributor water lines. The composition contains in combination a cleaning solution and a disinfectant, such as hydrogen peroxide or peracidic acid. The cleaning solution can includes hydrochloric acid and/or phosphoric acid in combination with inhibitors, dyes and water. The composition is applied to deposits which have formed on these surfaces.

Abstract: A new cleaning chemistry based on a choline compound, such as choline hydroxide, is provided in order to address the problem of dual damascene fabrication. An etch stop inorganic layer at the bottom of a dual damascene structure protects the underlying interconnect of copper and allows a better cleaning. A two step etch process utilizing the etch stop layer is used to achieve the requirements of ULSI manufacturing in a dual damascene structure.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: The present invention is directed to resist and etching residue removing compositions containing at least one nucleophilic amine compound possessing reduction and oxidation potentials, a two-carbon atom linkage alkanolamine compound, and optionally water and/or one or more corrosion inhibitors. The compositions may be substantially free of hydroxylamine, polar organic solvents, water, corrosion inhibitors, or a combination thereof. The compositions are useful in processes for removing resists and etching residue from metal or metal alloy substrates or substrate layers used in micro-circuitry fabrication.

Abstract: The invention provides an adsorbate which comprises a soluble zinc compound of a polycarboxylic acid adsorbed on crystalline alkali metal phyllosilicate, and the use thereof.

Abstract: A composition including supercritical fluid and at least one additive selected from fluoro species, and primary and/or secondary amines, optionally with co-solvent, low k material attack-inhibitor(s) and/or surfactant(s). The composition has particular utility for cleaning of semiconductor wafers to remove post-ashing residues therefrom.

Abstract: A water-treating microbicide, containing an inorganic acid and a corrosion inhibitor, and further containing a carboxylic acid having 8 or less carbon atoms or any of alkali metal salts thereof. The present invention can provide a water-treating microbicide, water treatment method and water treatment apparatus exhibiting a high sterilization effect in a membrane separation device for seawater desalination, etc.

Abstract: The cleaning composition of the present invention is characterized by containing N-hydroxyformamide. The cleaning composition is capable of easily removing patterned photoresist masks or resist residues remaining on substrates after the etching process or removing resist residues remaining after the etching process and the subsequent ashing process within a short period of time without causing the corrosion of wiring materials and insulating films, thereby ensuring the fine processing to provide high-precision wiring circuits.

Abstract: Cleaning solutions for removing photoresist resins remaining on the underlying layer patterns formed by photolithography process using the photoresist patterns as etching mask. The cleaning solution for removing photoresist comprises H2O as solvent, amine compounds, hydrazine hydrate, transition metal-removing material and alkali metal-removing material. Photoresist coated on the top portion of underlying layers can be rapidly and effectively removed by the disclosed cleaning solution. In addition, the cleaning solution is environment-friendly because H2O is used as the solvent, and has little effect on metal layers when underlying layers are formed of metals.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: The photoresist stripping composition of the present invention contains at least one oxymethylamine compound represented by the following formula 1: wherein R1 to R3 are as defined in the specification. Of the oxymethylamine compound of the formula 1, the compound represented by the following formula 7: wherein R2 to R5 and n are as defined in the specification, is a novel compound.

Abstract: An aqueous polishing composition comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH. The composition includes an organic-containing ammonium salt formed with R1, R2, R3 and R4 are radicals, R1 has a carbon chain length of 2 to 15 carbon atoms. The organic-containing ammonium salt has a concentration that accelerates TEOS removal and decreases removal of at least one coating selected from the group consisting of SiC, SiCN, Si3N4 and SiCO.

Abstract: The present invention is directed to a gas turbine cleaner. The composition of the present invention includes a glycol alkyl ether compound, an alkoxylated surfactant with an alkyl chain length of from about 3 to 18 carbons and a metal corrosion inhibitor component.

Abstract: A composition for removing resist, polymeric material and/or etching residue from a substrate comprising titanium or an alloy thereof, the composition comprising hydroxylamine or a derivative thereof and at least one compound having the general formula (I) wherein: R1 and R3 are each independently selected from H, OH, CO2H, halogen, C1–C3 alkyl, C1–C3 alkoxy or (CH2)nOH wherein n is 1, 2 or 3; and R2 is selected from C9–C16 alkyl, or C9–C16 alkoxy

Abstract: A stripping composition comprising (a) an anticorrosive agent, (b) a stripping agent and (c) a solvent, wherein the anticorrosive agent (a) is a heterocyclic compound having a nitrogen atom-containing six-membered ring.

Abstract: Silane type polyfunctional coupling agents and adhesion promoters are added to major amounts by volume of environmentally-safe organic wipe solvents generally having a low vapor pressure to form novel wipe solvent compositions for cleaning and priming the surface of a substrate such as that of metal, composite, glass, plastic or other material prior to the application of coatings of paint, adhesive and/or similar layers and/or prior to the lamination of such substrates to each other or to support structures such as honeycomb bodies, while simultaneously depositing and bonding the coupling agent and adhesion promoter to the cleaned surface of the substrate.

Abstract: The invention provides etching liquid compositions for transparent conducting films wherein foaming is suppressed and residues do not occur after etching. The etching liquid compositions include an etching liquid for transparent conducting films and one or more compounds selected from the group consisting of polysulfonic acid compounds and polyoxyethylene-polyoxypropylene block copolymers.

Abstract: An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

Abstract: Cleaning solutions for removing photoresist materials and a method of forming underlying layer patterns of semiconductor devices using the same. The cleaning solutions for removing photoresist include a solvent mixture of H2O and an organic solvent, an amine compound, a transition metal-removing material and an alkali metal-removing material, and may further include a hydrazine hydrate.

Abstract: In an apparatus, after completion of a CMP (i.e., chemical mechanical polishing) operation of a semiconductor wafer, the thus polished wafer is temporarily stored in a water tank before it is subjected to a post-CMP cleaning operation. During its storage period in the water tank, the wafer is prevented from being chemically attacked by an oxidizing agent contained in an abrasive used in the CMP operation. The apparatus includes: the water tank for storing the wafer therein; a pure water supply pipe for supplying pure water to the water tank; an anticorrosion agent supply pipe for supplying an anticorrosion agent to the pure water; a drain pipe connected with a lower portion of the water tank to discharge the water from the water tank; a return pipe for returning the discharged water to an upper portion of the water tank through a pump and a filter, the return pipe branching-off from the drain pipe; and, valves mounted on these pipes.

Abstract: A cleaning composition comprising (1) at least one of fluoride salts and hydrogendifluoride salts; (2) an organic solvent having a hetero atom or atoms; and (3) water; a method of cleaning metal gate, contact hole, via hole and capacitor using the composition; a method of cleaning a residual polymer derived from a resist using the composition; and a method of cleaning after CMP using the composition.

Abstract: Brass articles having leachable lead are contacted with an aqueous caustic solution that contains a chelating agent. A brass article can optionally be post-treated by contacting it with an aqueous solution containing anazole.

Abstract: A residue remover for removing polymeric material and etch residue includes 2-(2-aminoethylamino)-ethanol and optionally another two-carbon atom linkage alkanolamine compound, gallic acid or catechol, water, a polar organic solvent, and hydroxylamine. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, includes the steps of contacting the substrate with the above composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of 2-(2-aminoethylamino)-ethanol in the composition and process provides superior residue removal without attacking titanium or other metallurgy on the substrate. The composition preferably has a flash point greater than about 130° C.

Abstract: An environmentally friendly decontaminant solution, which may be disposed of after use without posing significant environmental hazards, is formulated without molybdenum-based corrosion inhibitors and preferably is free of all heavy metals. A zeolite-based buffering system optionally replaces phosphate buffers for maintaining the pH of the decontaminant solution at an appropriate pH for effective antimicrobial decontamination. Molybdenum-free decontaminant solutions containing peracetic acid retain their peracetic acid levels, and thus their antimicrobial effectiveness, for longer periods than comparable solutions formulated with a molybdate corrosion inhibitor.

Abstract: The invention relates to a TFT-LCD high-performance stripper composition for a photoresist, and more particularly to a stripper composition for a photoresist comprising: 20-60 wt % of monoethanolamine, 15-50 wt % of N,N-dimethylacetamide, 15-50 wt % of carbitol, and 0.1-10 wt % of gallic acid. The invention also provides a stripper composition for a photoresist comprising: 20-60 wt % of monoethanolamine, 15-50 wt % of N,N-dimethylacetamide, and 15-50 wt % of carbitol. The stripper composition for a photoresist of the invention significantly reduces stripping time when applied to the TFT-LCD manufacturing process and leaves no impurity particles. By allowing the hard baking and ashing processes to be omitted, the gate process line can be simplified, which enables cost reduction. In addition, when it is applied to a process wherein silver (Ag) is used as reflective/transflective layer, it offers stripping ability and corrosion resistance of the pure Ag layer.

Abstract: A semi-aqueous cleaning formulation useful for removing particles from semiconductor wafer substrates formed during a dry etching process for semiconductor devices, the cleaning formulation comprising a buffering system a polar organic solvent, and a fluoride source.

Abstract: Agents for cleaning hard surfaces, such as crockery, containing a &bgr;-glucanase and compatible cleaning constituents, and having good cleaning effect on polysaccharide stains.

Abstract: The present invention relates to a water-soluble composition for removing rust from steel bars and steel frames, which is environmentally harmless and permits improving work efficiency by allowing work to be conducted in a state where rust was simply removed from the steel bars and frames by applying it on the steel bars or frames with a spray or brush. The rust-removing preparation of the present invention comprises a mixture of 10-11% by weight of phosphoric acid, 6-7% by weight of sodium pyrophosphate, 6-7% by weight of a hard water softener, 7-8% by weight of zeolite, 2-3% by weight of xanthan, 2-3% by weight of a surfactant, 4-5% by weight of stearic acid, 6-7% by weight of methyl alcohol and 2-3% by weight of a defoamer in 50-51% by weight of water.

Abstract: An alkaline sensitive metal cleaning composition is provided. The alkaline sensitive metal cleaning composition contains an alkaline concentrate and a corrosion inhibitor concentrate. The alkaline concentrate includes a source of alkalinity in an amount sufficient to provide a use solution having a pH of at least 10.0, and a first chelant component that exhibits soil removal properties when used at a pH of at least 10.0. The corrosion inhibitor concentrate includes a corrosion inhibitor component for reducing corrosion of alkaline sensitive metals when used in a use solution having a pH of at least 10.0, a second chelant component for stabilizing the corrosion inhibitor in the corrosion inhibitor concentrate when the corrosion inhibitor concentrate is provided at a pH that is less than 8.0, and a surfactant component for providing cleaning properties when used at a pH of at least 10.0.

Abstract: This invention relates to improved stabilizing compositions for n-propyl bromide. More particularly, the cleaning composition includes about 0.1 to 5% Butylene oxide, about 0.1 to 5.0% t-butanol, about 0.1 to 5% acetonitrile, about 0.1 to 5% nitromethane; and the remainder n-propyl bromide. These mixtures are useful as cleaning solvents for the electronic, aerospace, and general manufacturing industries, especially in the area of vapor degreasing.

Abstract: Methods and solutions for cleaning a polished aluminum-containing layer, and the structures formed by these methods. The method for cleaning the polished aluminum-containing layer is practiced by contacting a polished aluminum-containing layer with a solution comprising water and a corrosion-inhibiting agent. In these methods and solutions, the water may be deionized water, the corrosion-inhibiting agent may be citric acid or one of its salts, and the solution may contain additional additives, such as chelating agents, buffers, oxidants, antioxidants, and surfactants. These methods and solutions reduce the corrosion caused by DI water used in cleaning polished aluminum-containing layers and maintain a passivative environment which protects the exposed aluminum structures.

Abstract: A dishwashing cleaning wipe comprising a fabric wherein the fabric is impregnated with a cleaning composition.

Abstract: An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

Abstract: A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: In a method of cleaning a metallic article, in particular for removing oxide deposits, whereby the metallic article is made of a hardenable steel having a carbon content of at least 0.1% by weight and is at least partially hardened, the metallic article is placed in a vessel containing a liquid cleaning agent with a pH value in the range of 4 to 8, and exposed to sound waves.

Abstract: A stripping and cleaning composition for the removal of residue from metal and dielectric surfaces in the manufacture of semi-conductors and microcircuits. The composition is an aqueous system including organic polar solvents including corrosive inhibitor component from a select group of aromatic carboxylic acids used in effective inhibiting amounts. A method in accordance with this invention for the removal of residues from metal and dielectric surfaces comprises the steps of contacting the metal or dielectric surface with the above inhibited compositions for a time sufficient to remove the residues.

Abstract: A stripping composition is provided for removing polymeric organic substances from an inorganic substrate. The stripping composition comprises about 3 to about 15 weight percent aromatic quaternary ammonium hydroxide, preferably benzyltrimethylammonium hydroxide (BTMAH), about 50 to about 87.5 weight percent alkylsulfoxide, a co-solvent preferably a glycol, and, desirably, a suitable corrosion inhibitor and a non-ionic surfactant. Also provided is a method for stripping polymeric organic substances (i.e., negative-tone novolak and acrylic photoresists and post-etch residue) from inorganic substrates by contacting the polymeric organic substance with the organic stripping the BTMAH composition for a period of time sufficient to remove said polymeric substances.

Abstract: A composition useful as a paint remover, including alkylene carbonate such as propylene carbonate or ethylene carbonate, and an alcohol such as benzyl alcohol. Also, a process for removing paint, comprising: applying a composition containing alkylene carbonate and an alcohol to a painted surface for a time and under conditions effective to reduce adhesion between the top coats and the primer or undercoat of the paint. In another aspect, this paint remover includes dialkyl carbonate and an alcohol, optionally containing a glycol ether. In another aspect, the process includes applying a composition containing dialkyl carbonate and an alcohol. This paint remover may include a thickener, a surfactant, or a corrosion inhibitor.

Abstract: The corrosion of metal equipment which is cleaned with an inorganic acid is inhibited by treating the equipment with a corrosion inhibitor composition containing at least one quaternary ammonium compound, a sulfur-containing compound and a nonionic surfactant in a solvent.

Abstract: Disclosed are compositions useful for the removal of polymeric material from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for removing polymer residues from advanced magnetic devices. Also disclosed are methods of removing such polymeric material.

Abstract: A cleaning corrosion inhibitor based on N-alkyl-beta-alanine derivatives and their salts.

Abstract: This invention relates to a process for removing rust from metal surfaces. The process uses an aqueous solution of a benzoate.

Abstract: An ethylenediaminetetraacetic acid or a mono- di- tri- or tetraammonium salt thereof residue cleaning composition removes photoresist and other residue from integrated circuit substrates. The balance of the composition is desirably made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the ethylenediaminetetraacetic acid or a mono- di- tri- or tetraammonium salt thereof in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: Aqueous cleaning compositions in which the pH is controlled comprise an acidic metal cleaning compound; at least one nitrogen containing compound to provide a stabilized pH; an emulsifier, a nonionic surfactant and optionally at least one water soluble solvent having a vapor pressure of less than 4 mm Hg at 20° C.