Abstract: A cleaning agent for use in the manufacture of a semiconductor device comprising an aqueous solution containing a quarternary ammonium salt and a fluoro compound, or an aqueous solution containing a quarternary ammonium salt and a fluoro compound, as well as an organic solvent selected from the group consisting of amides, lactones, nitriles, alcohols and esters. In the semiconductor device manufacturing process, after forming a mask with a photoresist, a wiring structure is formed by dry etching of a conductive layer, wherein a protecting deposition film has been formed on side walls of the conductive layer. Use of the cleaning agent enables the protecting deposition film to be removed in a highly reliable manner with the surface of the conductive layer being decontaminated and cleaned such that no corrosion of the conductive layer occurs.

Abstract: Cleaning and deoxidizing aluminum surfaces can be accomplished simultaneously by contacting the surfaces with an aqueous liquid composition that contains as its cleaning active ingredients (i) alcohols and/or ether alcohols, (ii) alkaline builders, and (iii) alkali stable surfactants, and, optionally but preferably, also contains fluoride and chelating agents.

Abstract: The invention provides a solvent mixture including n-propyl bromide, a mixture of low boiling solvents and, preferably, a defluxing and/or ionics removing additive and/or at least one saturated terpene. The invention also provides a method of cleaning an article (e.g., an electrical, plastic, or metal part) in a vapor degreaser using the solvent mixture. The solvent mixture of the invention is non-flammable, non-corrosive, and non-hazardous. In addition, it has a high solvency and a very low ozone depletion potential. Thus, using the solvent mixture of the invention, oil, grease, rosin flux, and other organic material can be readily removed from the article of interest in an environmentally safe manner.

Abstract: A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.

Abstract: An ethylenediaminetetraacetic acid or a mono-, di-, tri- or tetraammonium salt thereof residue cleaning composition removes photoresist and other residue from integrated circuit substrates. The balance of the composition is desirably made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the ethylenediaminetetraacetic acid or a mono-, di-, tri- or tetraammonium salt thereof in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: A composition for selective etching of oxides over a metal. The composition contains water, hydroxylammonium salt, carboxylic acid, a fluorine containing compound, and optionally, a base. The pH of the composition is about 2 to 6.

Abstract: A cleaning composition and method are provided for removing iron stains and scale from the external surfaces of duck decoys. An illustrative composition contains hydrochloric acid, stannous chloride, ammonium bifluoride, and water. The compositions are applied to the duck decoys with a pressurized sprayer to discolor and dislodge the stain and scale and thereafter the decoys are water rinsed with a garden hose or the like to remove the dislodged material.

Abstract: A water based cleaning solvent primarily containing urea hydrochloride and also containing, in lesser amounts, an amphoteric and/or nonionic surfactant, an ethylamine, and a lesser amount of corrosion inhibitor based upon butyne cleans stainless steel and aluminum surfaces, especially exterior and interior surfaces associated with transportation of both materials, edible and otherwise, and people, most particularly railway transportation comprehensive of both tanks for liquids and other containers for fluent materials, and also including passenger rail cars possessing polycarbonate glazed acrylic windows. This solvent is proposed as a replacement for phosphate based cleaners as an environmentally superior alternative and when used in a conventional pressurized spraying system is effective in obtaining a bright finish on stainless steel and aluminum surfaces with consequent corrosion of neither of these nor polycarbonate surfaces if present.

Abstract: An aqueous resist stripping composition contains (a) an oxidizing agent, (b) a chelating agent, (c) a water-soluble fluorine compound, and optionally (d) an organic solvent. Also provided is a process of stripping resist films and resist residues remaining after etching treatment utilizing the aqueous resist stripping composition. In the process, corrosion of semiconductor materials, circuit-forming materials, insulating films, etc. is minimized and the rinsing is sufficiently made with only water without needing organic solvent such as alcohol.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: Disclosed in the present application is a composition that is useful for rust and/or corrosion removal that contains a reducing agent, a chelating agent, a surfactant, and a dispersant. Disclosed also are processes for using this composition in aqueous systems and metal surface treatment.

Abstract: For the stripping of photoresists, the invention proposes to use a mixture of dimethyl sulphoxide DMSO) or N-methylpyrrolidone (NMP) and 3-methoxypropylamine (MOPA). Advantageously, a little water and a corrosion inhibitor, such as sodium tolyltriazolate, are added to the mixture.

Abstract: An ethylenediaminetetraacetic acid or a mono- di- tri- or tetraammonium salt 5 thereof residue cleaning composition removes photoresist and other residue from integrated circuit substrates. The balance of the composition is desirably made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the ethylenediaminetetraacetic acid or a mono- di- tri- or tetraammonium salt thereof in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: An aqueous liquid composition for cleaning and degreasing metal surfaces consists essentially of water and the following dissolved stably dispersed, or both dissolved and stably dispersed components: A) alkali metal borate salts; B) boric acid in excess of any generated by reaction of anions of component a) with water; C) nonionic surfactant; and D) anionic and/or amphoteric surfactants.

Abstract: Coupling elements of a slide fastener or stringer thereof manufactured by cutting and forming a multiplicity of coupling elements from a linear material of copper or a copper alloy and fixing the coupling elements as spaced with a prescribed interval to the longitudinal edge of a fastener tape are immersed in an acidic treating liquid containing hydrogen peroxide, sulfuric acid, phosphoric acid, a surfactant, and an aliphatic alcohol to effect acid treatment thereby smoothing the outer surfaces of the coupling elements. The acid-treated outer surfaces of the coupling elements of the slide fastener or stringer thereof may be further subjected to a rustproofing treatment. The rustproofed outer surfaces of the coupling elements may be further subjected to a clear coating treatment. The acid-treated outer surfaces of the coupling elements may be further plated.

Abstract: A method for removing a resist from a substrate comprising contacting a substrate having a resist coating present thereon with a composition comprising hydroxylamine and at least one alkanolamine which is miscible with hydroxylamine is described. Optionally, the composition may comprise one or more polar solvents. The method is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.

Abstract: A composition for the cleaning of residues from substrates from about 0.01 percent by weight to about 10 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by weight to about 80 percent by weight of an lactam solvent and from 0 to about 50 weight percent of an organic sulfoxide or glycol solvent. The composition has a pH between about 6 and about 10. Additionally, the composition optionally contains corrosion inhibitors, chelating agents, surfactants, acids and bases. In use of the composition, a substrate is contacted with the composition for a time and at a temperature that permits cleaning of the substrate.

Abstract: A surface treatment composition containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative of the following general formula (1) or its salt: wherein X1 and X2 are hydroxyl groups; Y1 to Y8 are respectively independently a hydrogen atom, a hydroxyl group, a halogen atom, a carboxyl group, a phosphonic acid group, a sulfonic acid group, a carbonyl group, a nitro group, a nitroso group, an amino group, an imino group, a nitrilo group, a nitrile group, a thiocyanate group, a hydroxyamino group, a hydroxyimino group, or an alkyl or alkoxy group which may have a substituent, provided that at least one of Y1 to Y8 is not a hydrogen atom; Z1 to Z4 are respectively independently a hydrogen atom, a carboxyl group or a sulfonic acid group; and R1 to R4 are respectively independently a hydrogen atom or an alkyl group which may have a substituent.

Abstract: A hydroxylamine-gallic compound composition comprises a hydroxylamine compound, at least one alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound. A process for removing photoresist or other polymeric material or a residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, in accordance with this invention comprises contacting the substrate with a hydroxylamine compound, an alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound for a time and at a temperature sufficient to remove the photoresist, other polymeric material or residue from the substrate. Use of a gallic compound in place of catechol in the composition and process reduces attack on titanium metallurgy by, e.g., about three times.

Abstract: An acidic aqueous liquid composition for deburring/degreasing/cleaning metal, in particular aluminum, parts by mass finishing has as its active ingredients: (A) a nonionic surfactant containing halogen atoms, (B) nitrogen based surfactants such as n-alkyl pyrrolidone, builders such as silicates and boric acid, hydrotropes, corrosion inhibitors, and sequestering agents.

Abstract: A cleaning composition that can be dissolved in water to form a cleaning solution for cleaning metal articles, comprises 10% (m/m) iodine, 65% (m/m) tartaric acid, 5% (m/m) sodium lauryl sulphate and 20% (m/m) citric acid. The cleaning solution can be applied to the surface of a metal article for cleaning it. The invention extends to the cleaning solution which includes 20 grams of the chemical composition dissolved in one litre of water.

Abstract: A solvent that is biodegradable, provides effective solvency for a broad range of tasks and is generally benign to human health is disclosed. This solvent is a mixture of a lactate ester and an edible oil ester having a closed cup flash point in excess of 60° C., and can include other non-halogenated solvents and surfactants.

Abstract: A cleaning agent concentrate is presented having (a) at least one glycol ether corresponding to the formula: R—O—(CH2—CH(CH3)O)n—H where R is an alkyl group having 1 to 4 carbon atoms or a phenyl group, and n is a number of from 1 to 5; and (b) at least one cationic surfactant, where the weight ratio of (a) to (b) is from 8:1 and 100:1, and where the cleaning agent concentrate comprises less than 0.1 percent by weight of fatty alcohol alkoxylates, amphoteric surfactants, or mixtures thereof. When diluted to 0.5 to 5% by weight with water, a cleaning agent is formed that is low-foaming. The cleaning agent is especially useful for cleaning and passivating metal surfaces using a spray application.

Abstract: The invention provides a solvent mixture including n-propyl bromide, a mixture of low boiling solvents and, preferably, a defluxing and/or ionics removing additive and/or at least one saturated terpene. The invention also provides a method of cleaning an article (e.g., an electrical, plastic, or metal part) in a vapor degreaser using the solvent mixture. The solvent mixture of the invention is non-flammable, non-corrosive, and non-hazardous. In addition, it has a high solvency and a very low ozone depletion potential. Thus, using the solvent mixture of the invention, oil, grease, rosin flux, and other organic material can be readily removed from the article of interest in an environmentally safe manner.

Abstract: Silver tarnishing is inhibited when using ether stabilized, n-propyl bromide based cleaning compositions by including a saturated aliphatic alcohol in the compositions.

Abstract: A water free solution for decontaminating copper surfaces (e.g. circuits of an electronic card) from copper salts which includes an alcohol and at least one neutral ammonium salt of an organic acid.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: Non-corrosive cleaning compositions that are useful for removing photoresist and/or plasma etch residues from a substrate. The cleaning composition comprises: (i) a hydroxy-(lower alkyl)-hydrazine, (ii) water, and (iii) at least one compound selected from the group consisting of a carboxylic acid, a water-miscible organic solvent and mixtures thereof.

Abstract: A solvent that is biodegradable, provides effective solvency for a broad range of tasks and is generally benign to human health is disclosed. This solvent is a mixture of a lactate ester and an edible oil ester that has a flash point greater that 93.degree. C., and can include other non-halogenated solvents and surfactants.

Abstract: The present invention provides an aqueous cleaning solution for aluminum-based metals which comprises an inorganic acid in an amount to provide a pH value of 2 or less, an oxidized form metal ion and a surfactant represented by the following formula (I)R--O--(EO).sub.n H (I)wherein R represents an alkyl group having on average 10 to 18 carbon atoms per molecule, n represents an integer of 8 or greater, and EO represents an ethyleneoxy group which may contain a small proportion of a propyleneoxy group. The degradation of cleaning properties due to the accumulation of lubricating oil or decomposition of surfactants is lessened even when the cleaning operation is carried out for a long period of time.

Abstract: The present invention relates to a cleaning solution for cleaning substrates, to which a metallic wiring has been applied, being capable of easily removing the metallic impurities of the substrate surface without corroding the metal, not putting a strain on the environment, and not causing a shelf life problem.The cleaning solution comprising at least one member selected from a group consisting of oxalic acid, ammonium oxalate and polyaminocarboxylic acids, but contains no hydrogen fluoride.

Abstract: A cleaning solution including a brominated hydrocarbon and an ester. The cleaning solution is especially useful for cleaning high-voltage power cables prior to splicing.

Abstract: A method for forming a patterned metal layer within a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then formed over the substrate a blanket metal layer. There is then formed over the blanket metal layer a patterned photoresist layer. There is then etched through use of a plasma etch method while employing the patterned photoresist layer as a photoresist etch mask layer the blanket metal layer to form a patterned metal layer. The patterned metal layer so formed has a metal impregnated carbonaceous polymer residue layer formed upon a sidewall of the patterned metal layer. There is then stripped from the patterned metal layer the patterned photoresist layer through use of an oxygen containing plasma while simultaneously oxidizing the metal impregnated carbonaceous polymer residue layer to form an oxidized metal impregnated polymer residue layer upon the sidewall of the patterned metal layer.

Abstract: A process of treating a substrate having photoresist applied thereto, comprising the steps of:(a) removing said photoresist from said substrate by a method selected from the group consisting of photoresist stripping, plasma etch residue cleaning, or a combination thereof; and(b) rinsing said substrate with a non-corrosive rinsing composition comprising(1) water; and(2) one or more water-soluble corrosion inhibitors selected from the group consisting essentially of hydroxylamine, at least one hydroxylammonium salt, at least one water-soluble organic acid, at least one amino acid, and combinations thereof.

Abstract: Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound;(ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.

Abstract: Method for applying an aqueous benzyl alcohol paint strippling composition to the surface of a high strength steel substrate or of an assembly containing high strength steel components, such as steel fasteners on the surface of aircraft assemblies, while minimizing the effect of hydrogen-induced embrittlement, hydrogen-induced cracking and corrosion normally caused by aqueous benzyl alcohol. The invention comprises applying a liquid silane to the surface of the steel substrate or components immediately before and/or as an ingredient of a novel aqueous benzyl alcohol composition of the present invention which contains from about 1% to 10% by volume of the liquid silane.

Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.

Abstract: A sterilant-disinfectant solution which may be used in the cleaning of metallic objects, particularly medical instruments. Medical instruments, which may included brass, copper, aluminium, stainless steel, carbon steel or plastic parts are sterilized or disinfected in an anti-microbial solution. The solution includes a triazole or other component for inhibiting the corrosion of copper or brass. Phosphates or other buffering agents adjust the solution pH in order to prevent the corrosion of steel. Molybdates or analogous compounds may be used to buffer the pH and have been found to inhibit the corrosion of aluminium by oxidizing agents. A sequestering agent is preferably provided for inhibiting hard water precipitation.

Abstract: There are provided cleaning compositions for removing soils from a substrate. These compositions comprise(a) at least one C.sub.10 or higher terpene hydrocarbon solvent,(b) at least one surfactant,(c) at least one metal corrosion inhibiting agent,(d) at least one hard surface stress crazing inhibiting agent, and(e) water,wherein, if the soil comprises oil, the composition forms an oil-removing oil and water emulsion with said oil for a time sufficient to remove the oil from the substrate, the oil removing emulsion releasing free water within twenty-four hours after formation, the composition having a pH of less than about 10.

Abstract: Silver tarnishing is inhibited when using ether stabilized, n-propyl bromide based cleaning compositions by including a small amount of an acetylenic compound in the compositions.

Abstract: A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofuctional, difunctional or trifunctional organic acid and a buffering amount of a quaternary amine, ammonium hydroxide, hydroxylamine, hydroxylamine salt, hydrazine or hydrazine salt base. A method in accordance with the invention for removal of chemical residues from a metal or dielectric surface comprises contacting the metal or dielectric surface with the above composition for a time sufficient to remove the chemical residues. A method in accordance with the invention for chemical mechanical polishing of a copper surface comprises applying the above composition to the copper surface, and polishing the surface in the presence of the composition.

Abstract: A chemical cleaning composition for silver- or copper-containing surfaces consists of a water-soluble solid or powder comprising thiourea or a derivative thereof, and is formulated in unit application form, e.g. in tablet or sachet form. A preferred composition comprises up to 60% thiourea or a derivative thereof; up to 4% surfactant; not more than 40% acidifier; less than 20% disintegrant; up to 10% binder; 0-1% lubricant; and up to 40% diluent.

Abstract: The present invention relates to a cleaning composition for cleaning airct wheel wells. The cleaning composition broadly comprises from about 0.1 to about 15% of a D-limonene composition, containing less than 0.5% of a stabilizing anti-oxidant, acting as a solvent for said greasy soils, from about 0.1% to about 5.0% of a material for increasing the flash point of said cleaning composition above 140.degree. F., such as an isoparrafinic hydrocarbon solvent, from about 10% to about 50% of a mixture of linear alcohol ethoxylates having a HLB in the range of 2 to 15 as a stabilizer, and the balance water. The cleaning composition may also contain from 0.1% to about 10% capryolamphopropionate, from about 0.1% to about 15% dipropylene glycol, from about 0.1% to about 5.0% benzotriazole, and 0.1% to about 5.0% sodium bicarbonate.

Abstract: The invention provides a solvent mixture including n-propyl bromide, a mixture of low boiling solvents and, preferably, a defluxing and/or ionics removing additive and/or at least one saturated terpene. The invention also provides a method of cleaning an article (e.g., an electrical, plastic, or metal part) in a vapor degreaser using the solvent mixture. The solvent mixture of the invention is non-flammable, non-corrosive, and non-hazardous. In addition, it has a high solvency and a very low ozone depletion potential. Thus, using the solvent mixture of the invention, oil, grease, rosin flux, and other organic material can be readily removed from the article of interest in an environmentally safe manner.

Abstract: A liquid cleaning composition includes a carboxylic acid, surfactant and organic solvent. The composition is particularly effective for removing soap scum, limescale and hard water spots from tubs, tiles and showers.

Abstract: A remover solution composition for resist which comprises (a) a salt of hydrofluoric acid with a metal-free base, (b) a water-soluble organic solvent, and (c) water and optionally (d) an anticorrosive, and has a pH or 5 to 8. A method for removing resist which comprises the steps of (I) forming a resist layer on a substrate having a metal film, (II) light-exposing the resist layer through a mask pattern and subsequently developing the resist layer to form a resist pattern, and (III) dry-etching the substrate using the resist pattern as a mask and then removing the unnecessary resist and modified resist film with the remover solution composition.

Abstract: An alkali metal cleaning composition for cleaning metal and for inhibiting corrosion of metal. The composition is composed of an alkali carbonate salt, a surfactant, and a corrosion inhibitor. A preferred corrosion inhibitor is an alkali metal silicate. Additional metal corrosion inhibitors such as a combination of a triazole compound and an alkali metal borate also can be employed. Such alkali carbonate compositions are readily water soluble and remain in solution over prolonged storage periods.

Abstract: A process for inhibiting the corrosion of silver in a dishwashing detergent solution by adding to the solution an inorganic redox-active substance.

Abstract: The present invention relates to a cleaning composition having utility in eaning aircraft exterior surfaces. The cleaning composition comprises from about 15% to about 40% of a mixture of linear alcohol ethoxylates having a HLB in the range of about 5.0 to about 15.0, from about 5% to about 25% capric diethanolamide, and the balance water. The mixture of linear alcohol ethoxylates comprises from about 5% to about 15% of a first linear alcohol ethoxylate having a HLB in the range of about 5.0 to 9.5 and from about 10% to about 25% of a second linear alcohol ethoxylate having a HLB in the range of about 10 to 15. The cleaning composition also includes from about 0.1% to about 5% of capryloamphopropionate, from about 0.1% to about 5.0% benzotriazole, from about 0.1% to about 5.0% of an inhibitor for reducing corrosion of magnesium parts, and from about 0.1% to about 5.0% of an inhibitor for reducing corrosion of cadmium plated steel parts.