Abstract: The invention relates to modified cationic photoinitiators which exhibit a reduced tendency to crystallize, to a process for reducing the crystallization tendency of cationic photoinitiators, and to the use of the photoinitiators of the invention for the radiation curing of cationically curing compositions. The inventive cationic photoinitiators have the formula (IV): [R1—I—R2]+X− where R1 is a radical R2 is a radical in which Ar is a monovalent aromatic hydrocarbon radical and D being a radical and the remaining variables are defined herein.

Abstract: Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.

Abstract: The invention provides an adhesive formulation for tacking and holding a nozzle plate in alignment on a semiconductor chip for an ink jet pen of an ink jet printer. The adhesive formulation includes a multifunctional epoxy material, a difunctional epoxy material, a fumed silica viscosity control agent, an imidazole-based thermal initiator and a mixed aryl sulfonium salt photoinitiator. Use of the adhesive formulation enables a nozzle plate to be assembled to a semiconductor chip with while substantially maintaining critical alignment between the nozzle plate and semiconductor chip.

Abstract: A radiation-curable composition in a liquid or solid form comprises at least one solid, non-crystalline radiation-transmissible material, dispersed in at least one cationic-curable or free-radical curable composition or mixture thereof. The solid, non-crystalline radiation-transmissible materials comprise glasses and other suitable materials that transmit (i.e., are transparent to) at least about 40% of radiation having a wavelength from about 180 to about 600 nanometers. The solid forms of the radiation-curable compositions of the invention are useful as powder coatings for coating decorative and functional objects and that would be cured by a thermal heating flow process followed by radiation exposure. The cured compositions of the invention are useful as coatings and inks for metal, paper, plastics, glass, ceramics, and wood, as adhesives, as sealants, and as composite materials and other articles and in biomedical and dental applications.

Abstract: A polymer for a photoresist composition is given by the formula (I): 1

Abstract: A photosensitive resin composition characterized by comprising (A) a resin having at least one aprotic onium salt represented by the general formula: —COO−·W+  (1) and/or the general formula: (in each of the above general formulas, W+ represents wherein, Z represents a nitrogen atom or phosphorus atom; Y represents a sulfur atom; R1, R2, R3 and R4 each represents an organic group having 1 to 30 carbon atoms), (B) a compound having two or more vinylether groups in a molecule and (C) a compound which generates an acid upon irradiation with actinic energy rays.

Abstract: The invention relates to an ionic compound corresponding to the formula [R1X1(Z1)—Q−—X2(Z2)—R2]m Mm+ in which Mm+ is a cation of valency m, each of the groups Xi is S═Z3, S═Z4, P—R3 or P—R4; Q is N, CR5, CCN or CSO2R5, each of the groups Zi is ═O, ═NC≡N, ═C(C≡N)2, ═NS(═Z)2R6 or ═C[S(═Z)2R6]2, each of the groups Ri, is Y, YO—, YS—, Y2N— or F, Y represents a monovalent organic radical or alternatively Y is a repeating unit of a polymeric frame.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: The invention relates to an ionic compound corresponding to the formula [R1X1(Z1)—Q−—X2(Z2)—R2]m Mm+ in which Mm+ is a cation of valency m, each of the groups Xi is S═Z3, S═Z4, P—R3 or P—R4; Q is N, CR5, CCN or CSO2R5, each of the groups Zi is ═O, ═NC≡N, ═C(C≡N)2, ═NS(═Z)2R6 or ═C[S(═Z)2R6]2, each of the groups Ri, is Y, YO—, YS—, Y2N— or F, Y represents a monovalent organic radical or alternatively Y is a repeating unit of a polymeric frame. The compounds are useful for producing ion conducting materials or electrolytes, as catalysts and for doping polymers.

Abstract: A stabilizer for thermally stabilizing an organic borate salt represented by formula (1) is disclosed, comprising a compound having one or two nitrogen-containing 5- or 6-membered heterocyclic ring having a double bond within the ring, a compound having a primary, secondary or tertiary amino group, or a compound having a thiol group. Also disclosed are a photosensitive composition comprising the stabilizer, an organic borate salt and if desired, a sensitizing dye or further a bisimidazole compound; a polymerizable composition comprising the photosensitive composition having added thereto at least one monomer having one or more ethylenically unsaturated bond and if desired, a high molecular polymer or further a pigment; and a colored pattern formed by using the polymerizable composition.

Abstract: Describes polymerizing with actinic radiation a cationically polymerizable organic composition comprising (a) at least one polyfunctional thiirane having at least two groups represented by the following general formula I, 1

Abstract: A photosensitive composition for short wave exposure use, which comprises (i) a sensitizing dye as a 1,3-dihydro-1-oxo-2H-indene derivative having a specified structure, (ii) an activator compound that generates chemical changes by its interaction with an electronic excitation condition induced by light absorption of the sensitizing dye represented by formula (I) and thereby produces at least any one of radicals, acids and bases and (iii) a compound whose physical or chemical characteristics are changed and maintained by undergoing reaction with at least one of radicals, acids and bases.

Abstract: A positive photoresist composition which comprises (A) a resin having a group which decomposes by the action of an acid to increase solubility in an alkaline developing solution, and (B) a compound which generates an aliphatic or aromatic carboxylic acid substituted with at least one fluorine atom upon irradiation with an actinic ray or radiation.

Abstract: The present photo-curable resin composition, at least one of which comprises an organic silicic compound, an epoxy resin and a photo initiator capable of polymerizing the organic silicic compound or epoxy resin upon absorption of actinic ray, undergoes polymerization and curing upon absorption of actinic ray, and is suitably applied to multilayered wiring boards and semiconductor devices because its cured product can maintain a desired modulus of elasticity at temperatures as high as or higher than Tg without any decrease in the bonding strength at elevated temperatures and with less development of cracks or peeling.

Abstract: Radiation-sensitive compositions comprising

Abstract: Radiation curable ink compositions for ink jet contain radiation curable monomers containing vinylether and acrylate functions.

Abstract: Radiation-sensitive compositions comprising (a1) a cationically or acid-catalytically polymerisable or crosslinkable compound or (a2) a compound that increases its solubility in a developer under the action of acid; and (b) at least one diaryliodonium salt of formula I X is branched C3-C20alkyl or C3-C8cycloalkyl; X1 is hydrogen, linear C1-C20alkyl, branched C3-C20alkyl or C3-C8cycloalkyl; with the proviso that the sum of the carbon atoms in X and X1 is at least 4; Y is linear C1-C10alkyl, branched C3-C10alkyl or C3-C8cycloalkyl; A− is a non-nucleophilic anion, selected from the group (BF4)−, (SbF6)−, (PF6)−, (B(C6F5))4−, C1-C20alkylsulfonate, C2-C20haloalkylsulfonate, unsubstituted C6-C10arylsulfonate, camphorsulfonate, and C6-C10arylsulfonate substituted by halogen, NO2, C1-C12alkyl, C1-C12halo-alkyl, C1-C12alkoxy or by COOR1; and R1 is C1-C20alkyl, phenyl, benzyl; or phenyl mono- or poly-substituted by C1-C12alkyl, C1-C12alkoxy or by halogen; with the

Abstract: Vinyl ether compounds having the formula: R—O—X—O—CH═CH2 wherein R is a radical having the formula: R1—CFH—CF2— or R1—CF═CF—, wherein R1 is an unsubstituted or substituted aliphatic radical, unsubstituted or substituted cyclic aliphatic radical, an unsubstituted or substituted aromatic radical, an unsubstituted or substituted araliphatic radical, or an unsubstituted or substituted heterocyclic radical, and X is an unsubstituted or substituted aliphatic radical, an unsubstituted or substituted cyclic aliphatic radical, unsubstituted or substituted aromatic radical, unsubstituted or substituted araliphatic radical or an unsubstituted or substituted heterocyclic radical. Curable compositions containing the vinyl ether compounds and methods in which the substrate coating layers of the vinyl ether compositions are cured, particularly on optical devices, are also disclosed, as well as polymers polymerized from the vinyl ether compounds.

Abstract: A positive photoresist composition for exposure to far ultraviolet light which comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, and (B) a resin which is decomposed by the action of an acid to increase its solubility in an alkaline developing solution and has a group represented by the following formula (1) connected to at least one terminal of the molecular chain thereof: —X—R  (1) wherein X represents —R1—, —S—R1—, —O—R1—, —NH—R1— or —NR2—R1—; R represents an alkoxy group, a hydroxy group, —COO—R2, —CONH—R2, —CONHSO2—R2 or —CONH2; R1 represents a divalent hydrocarbon group having from 1 to 20 carbon atoms; and R2 represents an alkyl group.

Abstract: A fluorine-containing epoxy resin composition at least contains: a fluorine-containing epoxy resin composition at least containing: a component (a) in an amount of from 5 to 80 parts by weight; a component (b) in an amount of from 5 to 40 parts by weight; and a component (c) in an amount of from 5 to 80 parts by weight, wherein the component (a) comprises a polyfunctional epoxy resin having two or more epoxy groups in one molecule and not containing F and Si; the component (b) comprises an epoxy compound having a perfluoro group at a terminal; and the component (c) comprises a compound containing in one molecule two or more of one kind or two or more kinds selected from an epoxy group, an alcohol group, a carboxylic acid group, and an amine group. The fluorine-containing epoxy resin composition is suitably usable for treating a specified surface of a member or device so as to impart a liquid repellent property thereto.

Abstract: The invention concerns a novel method for preparing non-toxic resins crosslinkable under radiation in the presence of an initiator system. Said resins are prepared from compositions of an organic and/or silicon type comprising monomers, oligomers and/or polymers with organofunctional groups, and are cross-linked in the presence of an initiator system consisting of an onium salt with low toxicity whereof the cationic structure is [(CH(CH3)2—C6H4—)—I—(—R1)]+(I).

Abstract: A positive photoresist composition comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, (B) a resin which is insoluble or sparingly soluble in alkali but becomes soluble in alkali by the action of an acid, and (C) a nitrogen-containing compound containing at least one partial structure represented by formula (I) shown below in its molecule: 1

Abstract: A method of priming a sheet molding compound (SMC) part. The method includes applying a photopolymerizable priming composition to a surface of the SMC part. The priming composition includes a polymerizable component, a photoinitiating component, and a conductive component. The method also includes irradiating the priming composition with light to initiate a polymerization reaction. The priming composition polymerizes on the SMC part substantially without releasing volatile solvents.

Abstract: A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Abstract: A method of accelerating the cure rate of an epoxy curing composition includes combining a cycloaliphatic epoxyalcohol monomer, a non-hydroxyl-containing epoxy monomer and a cationic photoinitiator to form an epoxy curing composition, and exposing the curing composition to a source of radiation. The resulting polymers and copolymers are branched polyethers containing hydroxyl functionality.

Abstract: Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.

Abstract: A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

Abstract: The invention concerns novel compositions containing at least a polyorganosiloxane (A) with crosslinkable functional groups, stable for use and storing, characterized in that said compositions contain at least a stabilizing amino agent consisting of a polyorganosiloxane (B) functionalised with at least an amino group, and a priming system for hardening by radiation, particularly UV radiation, the polyorganosiloxane (B) being miscible with the polyorganosiloxane (A). In general these stable and cross-linkable compositions are in liquid form and homogeneous.

Abstract: A positive photoresist composition for exposure to a far ultraviolet ray which comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, (B) a resin which contains a repeating unit corresponding to hydroxystyrene and solubility of which increases in an alkaline developing solution by the action of an acid, and (C) (1) at least one solvent selected from the group consisting of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether propionate, and (2) at least one solvent selected from the group consisting of propylene glycol monomethyl ether and ethoxyethyl propionate. The positive photoresist composition of the present invention is suitable for exposure to a far ultraviolet ray, particularly a KrF excimer laser beam, is improved in line edge roughness and micro grain, is excellent in uniformity of carting on a substrate and has less particles in its resist solution.

Abstract: The invention relates to a pressure-sensitive adhesive tape with improved room temperature handleability comprising an adhesive layer with at least one exposed surface and optionally a backing, wherein the pressure-sensitive adhesive layer comprises an epoxy/polyester based pressure sensitive adhesive which is crosslinkable upon exposure to actinic or e-beam irradiation and optionally heat, and comprises (i) 30-80% by weight of a polyester component comprising one or more amorphous polyesters compounds, (ii) 20-70% by weight of an epoxy component comprising one or more epoxy resins and/or monomers, (iii) 0-50% by weight of a hydroxyl-functional component containing one or more hydroxyl-containing compounds having a hydroxyl functionality of at least 1, and (iv) an effective amount of a photoinitiator component for crosslinking the pressure-sensitive adhesive, whereby the weight percentages refer to the total mass of components (i)-(iv) and add up to 100 wt.

Abstract: This invention related to a packaging container and a container closure having excellent curability, aesthetic beauty of an ultraviolet ray hardened coating, transferability of a container, heat-resistant treatability, retortability, and sanitary characteristics. The present invention provides to a packaging container and a container closure having, on the outer surface, a coating layer of a resin composition which comprises a cationic curable resin comprising an alicyclic epoxy resin, a photo-cationic-curing catalyst comprising a compound of the following formula (1), wherein each of R1 and R2 is an alkyl group, and they may be the same or different, and R3 is an alkyl group, a sensitizer comprising a thioxanthone sensitizer, and a pigment comprising titanium dioxide, wherein the amount of said titanium dioxide is at least 0.

Abstract: A photosensitive composition comprising (a) an ethylenically unsaturated double bond-containing compound, (b) a sensitizing dye and (c) a photopolymerization initiator, wherein the sensitizing dye is a phthalocyanine compound showing the maximum absorption within a range of from 750 to 1,200 nm.

Abstract: A stabilizer for thermally stabilizing an organic borate salt represented by formula (1) is disclosed, comprising a compound having one or two nitrogen-containing 5- or 6-membered heterocyclic ring having a double bond within the ring, a compound having a primary, secondary or tertiary amino group, or a compound having a thiol group. Also disclosed are a photosensitive composition comprising the stabilizer, an organic borate salt and if desired, a sensitizing dye or further a bisimidazole compound; a polymerizable composition comprising the photosensitive composition having added thereto at least one monomer having one or more ethylenically unsaturated bond and if desired, a high molecular polymer or further a pigment; and a colored pattern formed by using the polymerizable composition.

Abstract: An epoxy resin containing group(s) of formula (1) and having a number average molecular weight of 400-10,000, an epoxy equivalent of 100-5,000 and an average number of glycidyl ether groups per molecule of 2-50 wherein A is a group (wherein R3 is a saturated aliphatic polyhydric alcohol residue having 2 to 30 carbon atoms, D is oxyalkylene group, a, b, c and d are 0-25, e and f are 0-4, e+f equals 0-4 and a+b+c×e+d×f equals 0-50), and B is (g, h are 0-18), etc. and R1 and R2 are H, glycidyl or a group of the formula wherein A and B are as defined above, and R7, R8 and R9 are H or glycidyl group; its preparation, and photo-curable and powder coating resin compositions containing the same.

Abstract: The invention concerns a composition cross-linkable under radiation. The composition includes at least one polyorganosiloxane with cross-linkable functional groups, a stabilizing amino agent, and an initiator system for hardening under radiation. The composition is stable for use and storage.

Abstract: According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C.

Abstract: Disclosed is a photo-curable composition comprising the following components (A) to (C): (A) hydrolyzable silane compound represented by the general formula (1) or a hydrolyzate thereof: (R1)pSi(X)4−p (1) wherein R1 is a non-hydrolyzable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 0 to 3; (B) photo acid generator; and (C) dehydrating agent. By such constitution, it is possible to provide a photo-curable composition which has a rapid photo-curable rate, is excellent in characteristics such as storage stability, heat resistance, weather-ability, scratch resistance and the like, and is applicable to base materials having low heat resistance such as plastics, as well as a cured product obtained therefrom.

Abstract: A process for preparation of ceramic objects which comprises: (a) applying a layer of a high-solids photocurable ceramic composition, to a substrate, the composition comprising: (1) at least 10 percent by volume of water; (2) at least 0.05 percent by weight of photocurable compounds which are soluble or dispersible in water; and (3) at least 45 volume percent dispersed ceramic particles; and (b) subjecting the composition to sufficient ultraviolet radiation to react the compounds or polymers sufficiently to form a layer of the photocurable compounds or polymers, which is water-insoluble and non-dispersible in water, having the ceramic particles dispersed therein.

Abstract: The present invention provides a photosensitive resin composition capable of forming an insulating film, which is superior in both a roughening property and an adhesiveness, and a via-hole, which is highly reliable in connection, and a multilayer printed circuit board. The present invention provides a photosensitive resin composition containing a first resin, which is an epoxy resin, and a second resin having a N-substituted carbamic acid ester atomic group and a radical polymeric unsaturated bond in its side chain. The second resin is desirably an oligomer having a repeating unit expressed by the following general formula (chem. 1) or (chem. 3) by 3-10 units. Where, X is H or CH3, Y and Z is H or an alkyl group of carbon number 1-4, n is 0 or 1, a part of R1 is an atomic group expressed by the following general formula (chem. 2), the residual R1 is a hydroxyl group, and R2 is an alkylene group of carbon number 1-4.

Abstract: Photopolymerizable compositions that include free radically active and cationically active functional groups, and methods for polymerizing such compositions, in which the onset of cationic polymerization is controllably delayed to extend the time between formation of a moldable gel and formation of a hardened solid.

Abstract: This invention relates to a radiation curable silicone coating composition comprising an alkoxylated resin-polymer organosilicone network containing radiation curable functionality and a cationic photoinitiator. The radiation curable silicone compositions of this invention are useful as fast curing low and high release coating compositions which are especially suitable for release of pressure sensitive adhesives.

Abstract: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.

Abstract: Cationic and hybrid radiation-curable pressure sensitive adhesive compositions for digital versatile discs and other substrates, a method for bonding versatile digital disc layers together with a cationic or hybrid radiation-curable pressure sensitive adhesive, and a digital versatile disc bonded by cationic or hybrid radiation-curable pressure sensitive adhesive.

Abstract: Radiation polymerizable vinylether-based compositions, and cured vinylether-based formulations having a predetermined balance of tack, peel and shear particularly suitable for use in pressure sensitive adhesives are described.

Abstract: A UV curable, flexible, paintable composition is disclosed. The disclosed composition has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The disclosed composition reduces, if not eliminates, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.

Abstract: A positive acting, photoimageable composition having, a photoacid generator capable of generating an acid upon exposure to actinic radiation, an organic acid anhydride polymer, an epoxy, a nitrogen-containing curing catalyst, and an optional phenol-containing monomer or polymer. A photographic element has this composition coated and dried on a substrate. A positive acting image is produced by imagewise exposing the element to actinic radiation, optionally postbaking and development with a liquid developer.

Abstract: New initiators which are suitable for cationic polymerization have the following structure: ##STR1## such that following apply: R.sup.1 and R.sup.2 are alkyl or cycloalkyl or they, together with the S atom, form a heterocyclic ring,R.sup.3 is H or alkyl,R.sup.4, R.sup.5, R.sup.6, and R.sup.7 are H, alkyl, or alkoxy,X.sup.-- is a non-nucleophilic anion.Reaction resin mixtures with initiators of this type contain, in addition to a cationically polymerizable monomer and/or oligomer, 0.01 to 10% by mass of the initiator.

Abstract: In a first aspect, a method for treating hard tissue that includes: (a) applying to hard tissue a composition that includes a cationically active functional group, a free radically active functional group, and a polymerization initiator capable of initiating free radical polymerization, where the number of moles of cationically active functional groups per gram of composition is no greater than about 0.0075; and (b) exposing the composition to polymerization conditions to form an adhesive bonded to the hard tissue.

Abstract: Novel onium borates of an element of Groups 15 to 17 of the Periodic Table, or borates of an organometallic complex of an element of Groups 4 to 10 of the Periodic Table, well suited for the photochemical/electron beam cationic initiation of polymerization/crosslinking, the anionic borate moiety of which having the formula:[BX.sub.a R.sub.b ].sup.-in which a and b are integers ranging from 0 to 4 and a+b=4; the symbols X are each a halogen atom when a ranges up to 3 and an OH functional group when a ranges up to 2; and the symbols R, which may be identical or different, are each a phenyl radical substituted by at least one element or electron-withdrawing substituent or by at least two halogen atoms, or an aryl radical containing at least two aromatic ring members, or such aryl radical bearing at least one electron-withdrawing substituent.