Abstract: A resin composition comprising a nylon-4,6 resin, an epoxy compound having two epoxy groups and at least one polymer selected from halogenated polystyrenes and halogenated poly-alpha-methylstyrenes, represented by the following general formula (I) ##STR1## (wherein R is a hydrogen atom or a methyl group; X is a bromine or chlorine atom; p is an integer of 1 to 5; and n is an integer of 2 or more).

Abstract: A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.

Abstract: The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.

Abstract: A fiber reinforced composite structure having a glass transition temperature greater than 150.degree. C. is comprised of:a) reinforcing fiber andb) a curable epoxy resin composition comprising(i) one or more epoxides having more than one epoxide group per molecule, of which epoxides at least 10 percent by weight is a 9,9-bis[4-(2,3-epoxypropoxy)phenyl]fluorene, all of the fluorene epoxy present being free of ortho substitution;(ii) an effective amount of one or more epoxy curing agents.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.

Abstract: An epoxy resin composition comprising (A) an epoxy resin having three or more epoxy groups per a molecule and (B) a reactive oligomer having in its molecule an aromatic residue connected thereto by --O-- or --S-- linkage and having at the terminal of the molecule a phonolic hydroxyl group.

Abstract: Thermoplastic molding materials contain, as essential components,(A) from 2 to 97.9% by weight of a nylon,(B) from 2 to 97.9% by weight of a polyaryl ether sulfone(C) from 0.1 to 30% by weight of a polymeric component having hydroxyl groupsand in addition(D) from 0 to 50% by weight of a rubber impact modifier and(E) from 0 to 60% by weight of reinforcing fillers.

Abstract: Polyethers end-blocked with hydrolyzable silyl groups are manufactured by reacting an epoxy end-blocked linear polyoxyalkylene, a mono-epoxy substituted hydrolyzable silane and an aromatic diamine and compounded with filler to produce a room temperature curable elastomer.

Abstract: Thermoplastic polyarylate compositions having improved flame retardancy consisting essentially of polyacrylate, epoxy-containing polymer, brominated polystyrene and sodium antimonate.

Abstract: A method for making a one package heat curable (i.e. thermosetting) composition which, on heating, forms a urethane/epoxy/silicone interpenetrating polymer network (IPN) system; one package heat curable compositions made by such a method; metal reinforcing patches, directly adherent to an oily metal surface such as an oily steel surface, comprising a sheet-like carrier having thereon such a one package heat curable composition in combination with a filler admixed therewith, said filler possibly including magnetic particles; a method for reinforcing metal which comprises applying thereto such a metal reinforcing patch and curing said heat curable composition at an elevated temperature to form a urethane/epoxy/silicone interpenetrating polymer network.

Abstract: An epoxy resin composition is provided for encapsulating a semiconductor. The resin composition contains an epoxy resin, a phenol resin, a phenol-modified silicon-containing compound and an inorganic filler. The phenol-modified silicon-containing compound is obtained by reacting a first and/or second organic silicone compound (formulae (1-a), (1-b) and (2)) with an organic silicon compound (formula (3)) and with a phenol resin: ##STR1## wherein X stands for an organic group containing an epoxy group, Y for a polyoxyalkylene group and Z for a mercapto group, an amino group or a ureido group.

Abstract: Epoxy ester-modified alkyd resin formulations are provided comprising:(i) from about 70 to 80 wt % soya modified alkyd resin;(ii) from about 4.75 to 10 wt % epoxy ester resin;(iii) from about 4.75 to 10 wt % silicone modified alkyd resin; and(iv) from about 0.5 to 10 wt % compatible solvent.These alkyd resin formulations can be pigmented to provide a wide variety of pigmented, epoxy ester modified, air dry alkyd enamels.

Abstract: Curable compositions are prepared from reinforced epoxy resin compositions comprising (A) a filler material such as silica flour, (B) one or more epoxy resins at least one of which is a hydrocarbon novolac epoxy resin such as a phenol-dicyclopentadiene epoxy novolac resin and (C) one or more epoxy resin curing agents such as phenol-formaldehyde novolac resin. These compositions are particularly suitable for use in electrical applications such as the encapsulation and subsequent protection of electrical and micro-electronic devices and circuitry and in adhesive formulations.

Abstract: An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.

Abstract: Rapid air drying thermosetting solvent solution primer compositions are disclosed which comprise volatile polar organic solvent having dissolved therein a fluorocarbon polymer in an amount of from 20% to 45% of total resin solids, a solvent-soluble, hydroxy-functional copolymer of monoethylenically unsaturated monomers containing from 5% to 30% of hydroxy-functional monoethylenic monomer in an amount of from 0.7 to 1.5 parts of hydroxy-functional copolymer per part of fluorocarbon resin, a resinous polyepoxide in an amount providing from 0.1 to 0.6 part of polyepoxide per part of hydroxy-functional copolymer, and a curing agent reactive with hydroxy functionality, preferably an aminoplast resin, for curing the hydroxy-functional acrylic copolymer and the polyepoxide. The primer is pigmented with inorganic pigment in a weight ratio with respect to the resin solids of from 0.2:1 to 0.8:1.

Abstract: Disclosed are multiphase epoxy thermosets having improved toughness and peel strength levels. The epoxy thermoset resin can serve as a matrix resin for composite structures and as a high temperature adhesive in bonding bodies together. The matrix comprises a crosslinked continuous phase and crosslinked discontinuous phase which contains the rubber phase.

Abstract: A coating composition comprises(A) a polyol resin obtained by the reaction of a prepolymer of epoxy resin and phosphorus compound having at least one P--OH bond, such as acids of phosphorus, and one or more compounds having one or more amino groups reactive with the epoxy group,(B) a compound having more than one isocyanate groups or groups which change to isocyanate groups under hardening condition, and(C) a bituminous material and/or its substitute.This coating composition can be coated on rusty metal surfaces.

Abstract: In a coating composition for application to a substrate for curing thereon to form an ablative coating of the type including a reactive mixture of epoxy and polysulfide resins, an amine curing agent, and inorganic materials serving as a source of one or more Lewis acids and being capable of forming a glassy reaction product when exposed to heat, the improvement comprising adding carbonaceous pre-ox fibers thereto in a weight amount between about 15 to 40%. When applied to a substrate, the solvent-free composition cures to a tightly adhering, flexible coating capable of providing thermal protection in a very high temperature, erosive environment.

Abstract: New and improved heat curable compositions are disclosed comprising epoxidic resin(s) and aromatic ether-sulfone polyamines, alone or in combination with other diamine curing agents and/or curing catalysts alone, or in further combination with reinforcements, e.g., graphite fibers and, optionally modified with second resins. The cured neat resins and fiber resin matrix compositions exhibit high toughness, compression strength and short beam shear strength under dry, wet and hot/wet conditions.

Abstract: An epoxyester linear block oligomer made with n-1 moles fatty acid units terminated with carboxylic acid groups and n moles of epoxy oligomer is particularly suited for chip-resistant paints made with a low pigment volume concentration.

Abstract: A coating composition for application to a substrate for curing thereon to form an ablative coating. The composition comprises a reactive mixture of epoxy and polysulfide resins, an amine curing agent, refractory fibers and inorganic materials serving as a source of one or more Lewis acids and being capable of forming a glassy reaction product when exposed to heat. When applied to a substrate, the solvent-free composition cures to a tightly adhering, flexible coating capable of providing thermal protection in a very high-temperature, erosive environment.

Abstract: Curable thermosetting resin compositions comprising an epoxy resin having at least two 1,2-epoxy groups per molecule, an aromatic diamine hardener, and as a cure accelerator an aromatic trihydroxy compound are disclosed. The aromatic trihydroxy compound, such as for example, phloroglucinol, n-propyl gallate, or pyrogallol, improves the cure speed of the epoxy/aromatic diamine resin system, while at the same time producing cured compositions having excellent mechanical and thermal properties. The disclosed compositions find particular application in the preparation of composites by, e.g., filament winding procedures.

Abstract: A coating composition containing 10-80% by weight of binder and 20-90% by weight of an organic solvent in which the binder is(1) a chlorosulfonated ethylene vinyl acetate polymer,(2) an epoxy resin,(3) a polyamine curing agent, and(4) a bicyclic amidine.The composition is used as a primer or topcoating for metal substrates and curings at ambient temperatures and provides a finish that has excellent adhesion to the substrate and is tough, durable, weatherable and when pigmented with electrically conductive pigments, can be used as a coating for electrodes used in electrochemical reactions such as grids used in lead acid storage batteries.

Abstract: Flame retardant reinforced with thermoplastic polyester resin compositions are disclosed glass fiber and a system of flame retardants represented by the following general formulas (I) and (II), together with antimony trioxide. The flame retardant system is a blend of 1-20 parts by weight of component (I), and 2-40 parts by weight of component (II), provided the weight ratio (I)/(II) of the flame retardant components (I) to (II) is in the range of 0<(I)/(II).ltoreq.5, and that the total amount of flame retardants (I) plus (II) is in the range of 3-40 parts by weight. From 2 to 3 parts by weight of antimony trioxide is present and 5 to 60% by weight of glass fiber is also present, these two percentages being expressed on the basis of the weight of the total resin composition. The resin compositions exhibit outstanding mechanical, thermal, forming and machining properties in addition to being fire retardant.

Abstract: A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

Abstract: A hardenable epoxy resin comprising a curable epoxy resin, a hardener for the epoxy resin and a polymer of epihalohydrin which composition is characterized in that the amount of the polymer of epihalohydrin in the composition is from 1 to 6 parts per one hundred parts by weight of the epoxy resin and in that the composition also comprises from 2 to 25 parts by weight per hundred parts by weight of the epoxy resin, of a polycarbonate having the general formula: ##STR1## where R.sub.1 and R.sub.2 are the same or different and are phenyl or cyclohexyl groups, R.sub.3 and R.sub.4 are the same or different and are hydrogen, methyl or cyclohexyl groups and n is from 60 to 400 and represents the average number of monomer units in the polymer chain.

Abstract: A surface hard coating composition for a synthetic resin lens including:(A) at least one organic silicon compound represented by the general formula ##STR1## wherein R.sup.1 is a hydrocarbon group having from one to six carbon atoms or an organic group including vinyl, methacryloyloxy or an epoxy radical, R.sup.2 is a hydrocarbon group having from one to four carbon atoms, R.sup.3 is a hydrocarbon or alkoxy alkyl group having from one to five carbon atoms or a hydrogen atom and l is 0 or one;(B) colloidal silica;(C) at least one poly functional epoxy compound; and(D) magnesium perchlorate.

Abstract: A modified polyepoxide is disclosed which cures with an amine-functional curing agent at room temperature to form coatings having better flexibility and resistance to Skydrol hydraulic fluid. This modified polyepoxide is the reaction product of a diurethane diisocyanate with a resinous polyepoxide having a molecular weight of from about 500 to about 1000 and a 1,2-epoxy equivalency of from about 1.5 to about 2.0. The diurethane diisocyanate is reacted with the resinous polyepoxide in an amount of from about 1.5 moles to about 16 moles per 100 moles of the polyepoxide. The diurethane diisocyanate is itself the reaction product of a dicarbinol-terminated polydimethyl polysiloxane having a molecular weight of from about 1000 to about 4000 with substantially a 2:1 stoichiometric excess of an organic diisocyanate.

Abstract: The degree of thixotropic character exhibited by curable compositions comprising specified epoxide reactants, organosilicon reactants and fillers can be varied by varying the weight ratio of epoxide reactant to organosilicon reactant between values represented by r.sub.1 and r.sub.2 wherein said values are within the range of from 1:1 to 8:1. The compositions are particularly useful as extrudable coatings for solid state electronic devices.

Abstract: A coating composition containing 10-80% by weight of binder and 20-90% by weight of an organic solvent in which the binder is(1) a chlorosulfonated polyethylene,(2) an epoxy resin,(3) a polyamine curing agent, and(4) a bicyclic amidine.The composition is used as a primer or topcoating for metal substrates and curings at ambient temperatures and provides a finish that has excellent adhesion to the substrate and is tough, durable, weatherable and corrosion resistant.

Abstract: A rotary compressor comprises a housing having a cylindrical inner wall surface, a rotatable sleeve having an inner and outer surfaces and disposed in the housing for rotation about a first longitudinal axis, a rotor disposed in the sleeve for rotation about a second longitudinal axis which is offset from the first longitudinal axis, a plurality of vanes carried by the rotor to extend substantially in radial directions and having radially outer edges maintained in contact with the inner surface of the sleeve so that the sleeve is rotated as the rotor and the vanes rotate. One or each of the inner wall surface of the housing and the outer surface of the sleeve has a coating comprised of a wear-resistant resin dispersed with 10 to 120 volume part of a solid lubricant and 5 to 50 volume part of metal flakes for 100 volume part of the resin.

Abstract: A method of improving weather resistant adhesion of curable composition on a glass surface, encompassing use of a primer composition utilizable on glass surfaces, comprising a film forming component and an ultraviolet light absorbing component, and capable of shielding light having wavelengths of 380 nm or less. The primer composition protects curable compositions coated on top of the primer from adverse weather effects, such as on adhesion properties of the curable composition onto a glass surface, the adhesion being maintained for substantially long periods of time.

Abstract: Fast-curing resin compositions for coating metal surfaces are described. They comprise a low molecular weight methylated melamine-formaldehyde resin, an epoxy resin, such as a bisphenol-epichlorohydrin resin, a silicone fluid and an organopolysiloxane release resin, with a zing-iron organometallic curing agent and a solvent. In addition to curing rapidly (one minute or less), the resin compositions are flexible and metal sheets coated therewith can be pressed or bent into various shapes and forms without the resin coating cracking or chipping.

Abstract: A heat-resistant composition containing an organic or elemento-organic binder and a filler. As a binder the composition contains at least one compound of the formula: ##STR1## wherein R is an organic radical with a number of carbon atoms of from 2 to 1,000; a radical with a number of carbon atoms of from 2 to 1,000 containing 1 to 1,000 atoms of silicon and/or1 to 1,000 atoms of fluorine, and/or1 to 1,000 atoms of chlorine, and/or1 to 1,000 atoms of bromine, and/or1 to 1,000 atoms of nitrogen, and/or1 to 1,000 atoms of sulphur, and/or1 to 1,000 atoms of phosphorus, and/or1 to 1,000 atoms of boron, and/or1 to 1,000 atoms of oxygen,X and Y are each --NH.sub.2, --OH, --SH, --NCO, --NSO, --NCS, said X and Y may be the same or different; Z is --C.tbd.N, --C.tbd.CH and is located in the same or different positions selected from alpha-, beta-, ortho- and peri- positions relative to X and Y; n.gtoreq.1, m.gtoreq.1, p.gtoreq.

Abstract: A coating composition having a liquid carrier and a binder of a blend ofa. an acrylic polymer containing glycidyl groups andb. a crosslinkable polysiloxane having attached to the silicone atoms of its backbone alkyl groups, phenyl groups and hydroxyl groups;optionally, a fluorocarbon polymer can be added to the composition;the composition cures at ambient temperatures and provides a finish that is durable, weatherable and heat resistant and is particularly useful for coating pipes, tanks, vessels and stacks of plants and refineries that are subjected to weathering, chemicals and heat.

Abstract: Improved reinforcing fibers such as carbon fibers are provided which may be employed in composites to improve the impact resistance thereof. The fibers disclosed are coated with a sizing composition comprised of a blend of an epoxy resin and a organophosphazene elastomer.

Abstract: Single package, thermosetting epoxy resin-based coating compositions are provided which contain a polyepoxide and a curing agent system therefor which comprises an aromatic urea. At composition curing times and temperatures, the aromatic urea reacts with a portion of the polyepoxide to thereby form in situ a primary or secondary amine which can then function as a coreactive curing agent to complete the cure of the epoxy resin coating.

Abstract: A mold release composition consisting essentially of:(A) a fluorine-containing polyether comprising 3-perfluoroalkyl-1,2-epoxypropane having the formula ##STR1## wherein R.sub.f represents a perfluoroalkyl group containing from 5 to 13 carbon atoms and(B) at least one additive selected from the group consisting of a silicone oil, silicone varnish, a wax and a highly fluorinated organic compound having a boiling point above 100.degree. C.

Abstract: Fast-curing resin compositions for coating metal surfaces are described. They comprise a high molecular weight epoxy resin, an etherified resol phenolic resin, a silicone fluid and an organopolysiloxane release resin, with an zinc-iron organometallic curing agent and a solvent. In addition to curing rapidly (one minute or less), the resin compositions are flexible and metal sheets coated therewith can be pressed or bent into various shapes and forms without the resin coating cracking or chipping.

Abstract: Addition of controlled amounts of perfluorinated alkyl ether diacyl fluoride to epoxy resin systems prior to cure results in a formulation which, when cured with or without reinforcing, exhibits improved energy absorbing properties.

Abstract: The invention provides a novel means for solving the problem of poor adhesion between the surface of a substrate of a metal or a plastic resin, e.g. polycarbonate resin, and a cured coating film of an organopolysiloxane formed thereon to impart good surface properties, e.g. hardness and weathering resistance, to the substrate surface by use of an adhesion improver as a primer which comprises a copolymer of an organosilicon compound having a hydrolyzable group and an ethylenic unsaturation in the molecule, glycidyl methacrylate and an organic monomer, e.g. methyl methacrylate and vinyl acetate, a reaction product of an aminoalkyl-containing organosilane compound and an acid anhydride and, optionally, an ultra-violet light absorber in a limited proportion.

Abstract: Coating compositions especially useful as primers for metal substrates consist essentially of polyepoxide resin, acrylic resin and fluorocarbon resin.

Abstract: Fast-curing resin compositions for coating metal surfaces are described. They comprise a high molecular weight epoxy resin, a low molecular weight epoxy resin, an etherified resol phenolic resin, a silicone fluid and an organopolysiloxane release resin, with an organometallic curing agent and a solvent. In addition to curing rapidly (one minute or less), the resin compositions are flexible and metal sheets coated therewith can be pressed or bent into various shapes and forms without the resin coating cracking or chipping.

Abstract: The invention relates to a composition for the protection of materials against contaminations, spots and stains.This liquid composition comprises by weight 0.1 to 1% of at least one fluorinated resin based on acrylic or methacrylic esters of fluorinated sulfonamido-alcohol, associated or not with non-fluorinated monomers, 0.4 to 10% of at least one adjuvant selected from aminoplast resins based on melamine, thermoplastic resins and waxes, and 89 to 99.5% of at least one organic solvent.Applied on materials such as walls, facades, monuments or sculptures in cement, bricks, concrete or stones and other construction elements, the composition according to the invention confers on the materials an excellent protection against natural or artificial contaminations.

Abstract: The blending of small amounts of a polyurethane elastomer with an internally plasticized vinyl chloride copolymer improves the abrasion resistance, elasticity, softness or "hand", and low temperature flexibility of films made from the resulting blend.

Abstract: Certain aluminum compounds, such as aluminum alkoxides, chelates and acylates, catalyst the reaction of .tbd.SiOH with ##STR1## to yield compositions containing ##STR2## linkages.