Abstract: Disclosed herein is a composition comprising a compatible blend of i) 60 to 85 weight percent of a linear poly(arylene sulfide), ii) 15 to 40 weight percent of a polyetherimide sulfone; and iii) 1 to 3 weight percent of a novolac resin having an average of 2 or more epoxy groups per molecule. Weight percent is based on the total weight of the composition. An article made from the composition has a tensile strength greater than or equal to 70 megaPascals (MPa), as determined by ASTM D638, an impact strength of greater than or equal to 3 kiloJoules per square meter (kJ/m2), as determined by ASTM D256, and an elongation at break greater than or equal to 3% as determined by ASTM D638. Methods of making the composition are also disclosed.

Abstract: The invention relates to matted UV overprint varnishes comprising silicon dioxides, the surface of which has been modified by means of treatment with an organopolysiloxane containing multiple bonds so as to be particularly well suited for use as matting agents for UV varnishes and printing inks. The invention also relates to a method for producing said varnishes.

Abstract: A composite is provided that has a structured sol-gel layer on a substrate. The sol-gel layer is extremely resistant against mechanical stress and other influences from outside due to its production method. The composite is suitable for use in a lot of technical fields, since the sol-gel layer can be provided with nearly any arbitrary structure. For example, the structure may result in optical effects and may be used in optical systems.

Abstract: Siloxane-based coatings for providing writable-erasable surfaces are provided. The coatings have many desirable characteristics and advantages over known coatings for writable-erasable surfaces. For example, the coatings cure rapidly under ambient conditions, have low VOC emissions upon curing, and have reduced tendency to form ghost images, even after prolonged normal use.

Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.

Abstract: A sulfopolyester containing residues of 2,2,4,4-tetralkylcyclobutane-1,3-diol such as 2,2,4,4-tetramethylcyclobutane-1,3-diol is highly water dispersible in water. This allows one to reduce the content of sulfonate groups or reduce the amount of ethylene glycol or other hydrophilic glycols to retain good water resistance in cured coatings.

Abstract: An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 below, is satisfied. Adsorption coefficient=Amount(parts by mass)of the thermoplastic resin C adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin C/DBP oil absorption(mL/100 g)of the filler.

Abstract: The present invention relates to a unique polymer dispersant mixture to be incorporated into a carbon black ink formulation. More particularly, the a polymeric dispersant mixture consists of a first polymer dispersant having moieties of methacrylic acid; poly(propylene glycol)-4-nonylphenyl ether acrylate; and poly(ethylene glycol)2,4,6-tris-(1-phenylethyl)phenyl ether methacrylate in combination with a second polymer dispersant selected from the group consisting of a copolymer of methacrylic acid and benzyl methacrylate and a terpolymer of styrene, alpha-methyl styrene and acrylic acid. Carbon black inkjet inks having this particular polymer dispersant mixture exhibit improved text quality when compared to carbon black inks not having this polymer dispersant mixture.

Abstract: A heat-curable composition comprises from 25 to 65% by weight of a mixture of epoxy-functional monomers, said mixture consisting of at least one polyfunctional epoxy monomer selected from monomers comprising from 4 to 8 glycidyl groups and/or cycloaliphatic epoxy groups, and at least one bi- or tri-functional epoxy monomer selected from monomers comprising two or three glycidyl groups and/or cycloaliphatic epoxy groups, from 25 to 70% by weight of at least one organic solvent selected from glycol monoethers, from 2.5 to 5% by weight, relative to the total weight of epoxyfunctional monomers (a) and (b), of at least one blocked strong acid catalyst, said heat-curable composition not containing any non-epoxyfunctional monomers, in particular not containing any acrylic, methacrylic or silane monomers.

Abstract: A coating composition comprising a resinous binder and up to 10 percent by weight of the reaction product of (i) a phosphorus acid, and (ii) a polyglycidyl ether of cyclohexane dimethanol. The compositions are useful for coating containers of all sorts, such as food and beverage containers, and the reaction product provides enhanced adhesion of the coating to the substrate. The compositions can be formulated to be substantially free of bisphenol A (BPA) and derivatives thereof such as bisphenol A diglycidyl ether (BADGE).

Abstract: A composition for a wire coating member having flame retardancy that is heat resistant and productive without using electron irradiation crosslinking, and an insulated wire and a wiring harness having the same. The insulated wire includes a wire coating member containing the composition for the wire coating member that contains water-crosslinkable polyolefin containing polyolefin that is modified by a silane coupling agent, unmodified polyolefin, modified polyolefin that is modified by a functional group, a bromine flame retardant, a cross-linking catalyst, a phenolic antioxidant, and either one of a zinc sulfide, and a zinc oxide and an imidazole compound. The insulated wire is prepared by extrusion-coating a conductor with the composition to form the wire coating member around the conductor, and the wire coating member is water-crosslinked.

Abstract: An aircraft component wherein the component is a partition or a light cover, and wherein the aircraft component is molded or formed from a thermoplastic polymer composition including: a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.

Abstract: Compositions comprising surface-modified calcite nanoparticles dispersed in a curable resin and to coatings and fibrous composites incorporating such compositions are described. The nanocalcite particles have a high magnesium to calcium surface concentration ratio. The surface-modifying agents include a binding group ionically associated with the nanoparticles, and a compatiblizing segment compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites, and coatings and fibrous composites prepared from such nanocalcite composites are also described.

Abstract: A polymer adhesive includes a polymeric binder, optional reinforcing fibers dispersed through the polymer binder and solids dispersed in the polymeric binder. The solids are effective to cause decomposition of the polymer adhesive at a temperature between 200° F. and 500° F. with a generation of gaseous products at a predetermined temperature. One suitable composition includes siloxirane, graphite, glass beads, potassium nitrate, silver nitrate and lactose and decomposes at a temperature of about 318° F. The polymer adhesive may be used in the assembly of a housing for rocket motor or a warhead. Decomposition of the polymer adhesive when the housing is exposed to sufficient external heat to cause a rocket propellant or warhead explosive to decompose, referred to as cook-off, enables venting of the rocket propellant or warhead without uncontrolled destructive rupture of the housing.

Abstract: An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1): wherein R1 to R4 each represent a monovalent hydrocarbon group, m is 1 to 100, a, b, c and d indicate ratios of respective repeating units based on a number of all repeating units and each stand for 0 or a positive number with a proviso that c and d are not 0 at the same time and 0<(c+d)/(a+b+c+d)?1.0 is satisfied, and X and Y are phenolic hydroxyl-containing, divalent aromatic groups.

Abstract: Hydrophobic coating compositions are provided as are processes to coat articles with the compositions. Extremely hydrophobic coatings are provided by the compositions. Durable, weatherable and scratch-resistant coatings are provided by compositions comprising a fluorinated component and an adhesion promoter compound. The adhesion promoter compound can include an alkoxy group, a furfuryl-containing ring structure, and a reactive group.

Abstract: Resin compositions comprise an epoxy thermosetting resin; and at least two types of interlaminar toughening particles; wherein a first type of interlaminar toughening particles are insoluble in said epoxy thermosetting resin; wherein a second type of interlaminar toughening particles are partially soluble or swellable in said epoxy thermosetting resin. Prepregs and structural compounds contain these resin compositions, which are useful in the aerospace industry.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E):(A) an epoxy resin; (B) a phenol resin other than component (C); (C) a silane-modified phenol resin represented by Formula (1) as defined in the specification; (D) a curing accelerator; and (E) an inorganic filler; wherein the component (C) is contained in an amount of 0.8 to 30.0% by weight based on a total weight of organic components in the epoxy resin composition.

Abstract: There may be provided a process for producing a polyimide siloxane solution composition having a further improved long-term viscosity stability; and a polyimide siloxane solution composition. In the process for producing the polyimide siloxane solution composition by polymerizing/imidizing a tetracarboxylic acid component and a diamine component consisting of (a) a diaminopolysiloxane, (b) a diamine having a polar group and (c) a diamine other than (a) and (b) in a solvent, the tetracarboxylic acid component and the diamine component excluding (b) the diamine having a polar group are polymerized/imidized to provide a reaction mixture solution, and then (b) the diamine having a polar group is added to the reaction mixture solution last, and the mixture is polymerized/imidized.

Abstract: The invention relates to a two-component composition consisting of a component A containing a polymer with a molecular weight of 250 to 5000 g/mol which has at least 2 epoxy groups per molecule, a component B containing a compound of the formula (I) R1-phenyl-(—O—R2)a where R1=H, C1 to C6-alkyl, a=1, 2, or 3, R2=—O—CH2—CHOH—CH2—NH—CH2-phenyl-CH2—NH2, wherein the epoxy/NH ratio of the components A to B is between 0.75:1 to 1.25:1.

Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.

Abstract: The invention relates to the use of amino terminated phosphonamides and their oligomers, as flame retardant additives for a variety of polymers to impart flame retardancy while maintaining or improving processing characteristics and other important properties.

Abstract: The present invention deals with a methodology of incorporating carbon nanotubes (CNTs) into an epoxy matrix and thereby producing epoxy-based CNT nanocomposites. Both the pristine and ozonized CNTs are almost homogeneously dispersed into the resin by this approach. Compared with the pristine CNTs (p-MWCNTs), the ozonized ones (f-MWCNTs) offer considerable improvements on mechanical properties within the epoxy resin.

Abstract: A coating forming composition that includes: (a) a silane derivative of Formula (I) wherein R1, R2, R3 and R4 that can be the same or different are selected from alkyl, acyl, alkylene acyl, cycloalkyl, aryl or alkylene aryl that can where necessary be substituted, and/or a hydrolysis product and/or condensation product of the silane derivative of Formula (I), (b) a silane derivative of Formula (II) R6R73-nSi(OR5)n??(II) wherein R5 is an unsubstituted or substituted alkyl, acyl, alkylene acyl, cycloalkyl, aryl or alkylene aryl group, R6 is an organic residue that contains an epoxide group, R7 is an unsubstituted or substituted alkyl, cycloalkyl, aryl or alkylene aryl group, n is 2 or 3, and/or a hydrolysis product and/or condensation product of the silane derivative of Formula (II), (c) a colloidal inorganic oxide, fluoride or oxyfluoride, (d) a cycloaliphatic or aromatic epoxide, and (e) a solvent.

Abstract: An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 ?m to 10 ?m, boehmite particles having an average particle diameter of 0.2 ?m to 5 ?m, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.

Abstract: The present invention provides a surface protective agent having good hard coating properties and good adhesion properties to metal. The surface protective agent comprises: a polymer comprising a reaction product obtained by reacting (a) a silane compound containing an amino group represented by the following formula: R4-n—Si—(OR?)n (wherein R represents an organic group containing an amino group; R? represents methyl, ethyl or propyl; and n is an integer selected from 1 to 3) with (b) at least one boron compound selected from the group consisting of H3BO3 and B2O3, in an amount of the component (b) being 0.02 mol or larger per mol of the component (a); (c) a metal alkoxide and/or a condensation product of a metal alkoxide; and (d) a phosphorus compound.

Abstract: The invention includes a thermosetting film-forming composition comprising a polytrialkanolamine reacted with a crosslinking agent composition. The composition forms a three-dimensional crosslinked network having atrane-containing linkages.

Abstract: A resin composition is provided.

Abstract: A coating composition including a functionalized resin selected from at least one of polyurethanes, epoxies, polyamides, chlorinated polyolefins, acrylics, polyesters, or mixtures or copolymers thereof, wherein the resins comprises at least one of (meth)acryl or acetoacetyl functionality; a (meth)acryl functional compound; and a functionalized silicone compound.

Abstract: Compositions, thermoset compositions, and methods of forming the same, including an epoxy resin, a curing agent, and a silicone-acrylate core/shell rubber are disclosed.

Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.

Abstract: Diethylene glycol monomethyl ether resistant coatings include a base component including a sulfur-containing, epoxy functional polyol, and an activator component including an isocyanate curing agent.

Abstract: Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4?-Bis(p-aminophenoxy)biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.

Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.

Abstract: The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better -anti-yellowing performance.

Abstract: An improved coating system for an ophthalmic lens that provides improved characteristics in the form of abrasion resistance, while also providing improved manufacturability and rapid curing as compared to prior art coating systems. The coating system is a composite coating that hybridizes both epoxy and acrylate coating materials into a single coating system. The coating material of the present disclosure includes at least a poly (meth) acrylate polymer, a polymerizable monomer containing at least one epoxy group and a cationic polymerization initiator. The coating may be further enhanced by the addition of colloidal nano-silica particles that serve to reinforce the mechanical properties of the coating system without compromising the overall transparency and optical clarity of the coating.

Abstract: An acrylic-fiber finish for use in carbon-fiber production contributes to high tenacity of resultant carbon fiber. The acrylic-fiber finish for carbon-fiber production includes an epoxy-polyether-modified silicone and a surfactant. The weight ratios of the epoxy-polyether-modified silicone and the surfactant in the total of the non-volatile components of the finish respectively range from 1 to 95 wt % and from 5 to 50 wt %. The carbon fiber production method includes a fiber production process for producing an acrylic fiber for carbon-fiber production by applying the finish to an acrylic fiber which is a basic material for the acrylic fiber for carbon-fiber production; an oxidative stabilization process for converting the acrylic fiber produced in the fiber production process into oxidized fiber in an oxidative atmosphere at 200 to 300 deg.C.; and a carbonization process for carbonizing the oxidized fiber in an inert atmosphere at 300 to 2,000 deg.C.

Abstract: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.

Abstract: An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.

Abstract: Novel particles and composite particles, their uses and a novel process for producing them from alkoxysilyl-group-carrying alkoxylation products.

Abstract: Curative fibre components comprise one or more fibres for filaments of curative suitable to cure curable resins such as thermoset resin. In curative fibre components comprising a plurality of fibres of curative, the fibres can be commingled, such as twisting, to form a thread or yarn. Curative fibre components can be used to form a material in the form of a sheet, fabric, layer, textile or mat of woven or non-woven curative fibres. Curative fibre components can be used to produce composite materials such as fibre reinforced resinous composite materials. The curative fibre components can be commingled, including interwoven, stitched and layered with other fibres or fibrous materials, such as fibrous reinforcement, fibrous curable resin, fibrous thermoplastic, other non-reinforcing fibres to form composite materials, prepregs, preforms and articles.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following ingredients A to E: A: an epoxy resin; B: a silicone mixture containing the following ingredients b1 and b2, with a weight ratio of the ingredients b1 and b2 being from 5/95 to 25/75 in terms of b1/b2: b1: a silicone compound having an amino group in both ends thereof and having a weight average molecular weight of from 600 to 900, and b2: a silicone compound having an amino group in both ends thereof and having a weight average molecular weight of from 10,000 to 20,000; C: a phenol resin; D: a curing accelerator; and E: an inorganic filler containing the following ingredients e1 and e2: e1: a crystalline silica, and e2: a fused silica.

Abstract: The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.

Abstract: A composition including the reaction product of at least a vinylamine-vinyl alcohol copolymer; an epoxyalkane; and a fluorocarbon that includes a reactive portion capable of reacting with the vinylamine-vinyl alcohol copolymer. Articles including coatings of such compositions, methods of preparing antimicrobial water-repellant surfaces and methods of preparing an antimicrobial water-repellant composition are also included.

Abstract: Curable organosilicon compositions with good adhesion to substrates and good workability contain a condensable base organopolysiloxane, a carbamato-alkyl-functional alkoxysilane, and a heterocycle substituted at a heteroatom by an alkoxysilylmethyl group.

Abstract: Oligomers and polymers containing epoxide groups and silane groups and preparable by reacting (A) at least one low molecular mass, oligomeric or polymeric compound containing at least two epoxide groups (a1) with (B) at least one silane containing (b1) at least one at least divalent organic radical which per se is not hydrolyzable, (b2) at least one cyclic dicarboxylic anhydride group and (b3) at least one silane group containing at least one hydrolyzable group (b31), the cyclic dicarboxylic anhydride groups (b2) being attached to the silane groups (b3) via the radicals (b1), the equivalent ratio of epoxide groups (a1) to dicarboxylic anhydride groups (b2) being 0.7 to 100; processes for preparing them, and their use for preparing anhydrous curable compositions.

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: A method comprising (a) mixing a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, into a dispersant to provide a dispersion; and (b) adding the dispersion to a varnish, is disclosed.

Abstract: There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2), wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne/cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.

Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.