Abstract: A composition including the reaction product of at least a vinylamine-vinyl alcohol copolymer; an epoxyalkane; and a fluorocarbon that includes a reactive portion capable of reacting with the vinylamine-vinyl alcohol copolymer. Articles including coatings of such compositions, methods of preparing antimicrobial water-repellant surfaces and methods of preparing an antimicrobial water-repellant composition are also included.

Abstract: Curable organosilicon compositions with good adhesion to substrates and good workability contain a condensable base organopolysiloxane, a carbamato-alkyl-functional alkoxysilane, and a heterocycle substituted at a heteroatom by an alkoxysilylmethyl group.

Abstract: Oligomers and polymers containing epoxide groups and silane groups and preparable by reacting (A) at least one low molecular mass, oligomeric or polymeric compound containing at least two epoxide groups (a1) with (B) at least one silane containing (b1) at least one at least divalent organic radical which per se is not hydrolyzable, (b2) at least one cyclic dicarboxylic anhydride group and (b3) at least one silane group containing at least one hydrolyzable group (b31), the cyclic dicarboxylic anhydride groups (b2) being attached to the silane groups (b3) via the radicals (b1), the equivalent ratio of epoxide groups (a1) to dicarboxylic anhydride groups (b2) being 0.7 to 100; processes for preparing them, and their use for preparing anhydrous curable compositions.

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: A method comprising (a) mixing a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, into a dispersant to provide a dispersion; and (b) adding the dispersion to a varnish, is disclosed.

Abstract: There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2), wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne/cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.

Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.

Abstract: A process comprising: contacting a) an epoxy resin; b) a compound selected from the group consisting of a phenol-containing compound, an isocyanate-containing compound, and mixtures thereof and c) a stabilizer comprising a metal-containing compound, said metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof; in the presence of a catalyst in an advancement reaction zone under advancement reaction conditions to produce an advancement reaction product is disclosed.

Abstract: Self-assembled silica condensates are described as well as their use in coating compositions. The self-assembled silica condensates can be formed from the hydrolysis of medium to long chain trialkoxy silane compounds. Coating compositions containing the self-assembled silica condensates can provide coatings having improved scratch and mar resistance and can have excellent recoat adhesion.

Abstract: A fabricating method and apparatus of a thin film pattern improves the reliability of forming the thin film pattern by a resist printing method. The apparatus includes a print roller device of a roll shape around which a blanket is wound; a spray device located around the print roller device for spraying an etch resist solution to the blanket; and a print plate of an engraved shape where a groove of a desired thin film shape and a projected part except the groove are formed, and the etch resist solution has a surfactant inclusive of an ethylene oxide fluorinated polymer material.

Abstract: A resin composition for optical lenses and optical packaging includes (1) 1 to 99.99 wt % mixture of epoxy, siloxane and epoxy-siloxane copolymers, (2) 0.01 to 5 wt % catalyst and (3) 0 to 40 wt % curing agent. The mixture of epoxy, siloxane and epoxy-siloxane copolymers includes (1) 1 to 85 wt % epoxy and siloxane oligomers, based on total weight of the mixture; (2) 1 to 90 wt % siloxane containing at least one alkoxy group, based on total weight of the mixture; (3) 1 to 80 wt % a epoxy resin having a benzene ring with at least one epoxy group or a hydrogenated benzene ring, or aliphatic epoxy resin, based on total weight of the mixture; (4) 1 to 70 wt % epoxy resin containing at least one hydroxyl group and at least an epoxy group, based on total weight of the mixture.

Abstract: Certain exemplary embodiments can provide a composition, system, machine, device, manufacture, circuit, and/or user interface adapted for, and/or a method and/or machine-readable medium comprising machine-implementable instructions for, activities that can comprise, after removing a cast device from a stack-lamination-derived mold, said cast device formed from a molding composition, applying a desired shape to said cast device to form a shaped cast device, said molding composition comprising: a ceramic composition comprising silica; an cycloaliphatic epoxy binder composition, said cycloaliphatic epoxy binder composition present in said molding composition in an amount up to 30% by weight of said molding composition; a silicone composition comprising a siloxane resin, said silicone composition present in said molding composition in an amount up to 30% by weight of said molding composition; and a solvent composition adapted to dissolve said cycloaliphatic epoxy binder composition and said silicone composition.

Abstract: The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group.

Abstract: Disclosed is a vulcanizable rubber composition for use in an air spring, which has excellent low-temperature behavior, and a vulcanized rubber formed product for air springs, which is obtained by vulcanization of the rubber composition. Also disclosed is a vulcanizable rubber composition for use in an air spring, comprising: an epihalohydrin-based copolymer comprising 50 to 70 mol % of a constituent unit derived from ethylene oxide and/or propylene oxide, 20 to 50 mol % of a constituent unit derived from epihalohydrin, and 0 to 15 mol % of a constituent unit derived from allyl glycidyl ether; a vulcanizing agent; a plasticizer; and an acid acceptor, and a rubber formed product for air springs, which is obtained by vulcanization of the composition.

Abstract: Coating compositions for cementitious substrates may be made from a multistage latex polymer; silane; and a water-soluble acid, acid anhydride or acid salt capable of etching or otherwise reacting with the surface of the substrate to provide improved coating adhesion. The silane my may be present as a silane coupling agent distinct from the multistage latex polymer, or may be present as silane functionality on the multistage latex polymer. The coating compositions adhere well to cementitious substrates and have a self-etching capability which improves coating adhesion, especially near edges and corners.

Abstract: A compound for filling small gaps in a semiconductor device, a composition for filling small gaps in a semiconductor device, and a method of fabricating a semiconductor capacitor, the compound including hydrolysates prepared by hydrolysis, in the presence of an acid catalyst, of compounds represented by Formulae 1, 2, and 3: [RO]3Si—[CH2]nR???(1) wherein, in Formula 1, n is an integer from 0 to about 10, and R and R? are each independently a hydrogen atom, a C1-C12 alkyl group, or a C6-C20 aryl group; HOOC[CH2]nR2Si—O—SiR?2[CH2]nCOOH??(2) wherein, in Formula 2, each n is independently an integer from 0 to about 10, and R and R? are each independently a C1-C12 alkyl group or a C6-C20 aryl group; and R3Si—O—X??(3) wherein, in Formula 3, X is R? or SiR?3, and R and R? are each independently a C1-C12 alkyl group or a C6-C20 aryl group, or a polycondensate prepared by polycondensation of the hydrolysates represented by Formulae 1, 2, and 3.

Abstract: Two component coatings having a viscosity range of 6 to 9 wet mils of sag consisting of a base component and an activator component. The base component comprises an epoxy siloxane resin and an alkyl quaternary ammonium clay rheology agent, and the activator component is an amino silane.

Abstract: Compositions which have i) at least one mercaptosilane MS, as well as ii) at least one polysilane PS, as well as iii) at least one aromatic secondary aminosilane AS, as well as iv) at least one organotitanium compound.

Abstract: The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better-anti-yellowing performance.

Abstract: The present invention relates to a paint composition comprising a component A, being a basic binder, and a component B, being an isocyanate compound. The present invention also relates to the use of the present paint composition as a paint or top coat. The present invention moreover relates to an object of which at least one surface is coated with at least one layer of the present paint composition.

Abstract: Disclosed are high solids, one-component, storage stable coating compositions that include an epoxy resin comprising more than one 1,2-epoxy groups per molecule; a hydrocarbon compound having a softening point of from 50° C. to 140° C.; an alkoxy-functional and/or silanol-functional silicone; and a ketimine curing agent comprising a reaction product of reactants comprising a polyalkyldiamine component and a ketone component. Also disclosed are substrates at least partially coated with a coating deposited from such composition and methods for coating substrates with such compositions.

Abstract: One or more embodiments provide for a light emitting diode device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols and epoxy-phosphorus acid reaction products are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: The invention is to provide an epoxy compound or an actinic energy radiation hardenable composition each having high safety and stability, and to provide an actinic energy radiation hardenable composition with excellent photo-hardenability under high humidity, which gives high solvent resistance, high water proof and a hardened layer with high strength. There is provided an actinic energy radiation hardenable composition containing an epoxy compound represented by the following formula (1).

Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin; (B) an amine curing agent; (C) a nitrogen compound selected from the group consisting of organic acids salts of tertiary amines, amino acids, imino acids, and monoamine compounds having an alcoholic hydroxyl group in an amount of from 0.1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

Abstract: A thermosetting resin composition contains, as essential components, (A) an epoxy resin having at least two epoxy groups in its molecule, (B) a thermoplastic polyhydroxy polyether resin having a fluorene skeleton, (C) an epoxy curing agent, and (D) a filler. A dry film is obtained by forming a thin film of the thermosetting resin composition on a supporting base film, and a prepreg is obtained by coating and/or impregnating a sheet-like fibrous base material with the thermosetting resin composition. Since they exhibit excellent adhesiveness to a substrate or a conductor and a cured film of the thermosetting resin composition has a relatively low thermal expansion coefficient and a high glass transition point and exhibits high resistance to heat and the capability of being roughened by a roughening treatment, they are useful as a resin insulating layer of a multilayer printed circuit board.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols, epoxy-phosphorus acid reaction products, and an aqueous dispersion comprising the reaction product of trimellitic anhydride and a polyol, wherein the molar ratio of trimellitic anhydride to the polyol in the reaction product ranges from 1:2 to 1:4, and wherein the reaction product is further reacted with an anhydride to form another reaction product are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: The invention relates to a thermoset plastic material, comprising a three-dimensional matrix containing sulphur atoms and at least one anti-plasticizing additive which is unreactive toward said matrix.

Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.

Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler

Abstract: The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

Abstract: Epoxysilanes are provided which contain at least one epoxy group, at least one hydrolyzable silyl group and one or more linkages containing a carbonyl group bonded to heteroatoms selected from the group consisting of oxygen, sulfur and nitrogen with at least one such heteroatom being nitrogen, there being no such linkage in which both an epoxy group and hydrolyzable silyl group are directly or indirectly bonded to the same nitrogen heteroatom in the linkage.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.

Abstract: A toner fuser member has a substrate, on which is formed a toner release surface layer from a composition that includes: about 95 wt. % to about 99.9 wt. % of a cross-linked, glycidyl end-capped bisphenolic polymer having the formula where R1 and R2 are each independently H or an alkyl group containing 1 to about 4 carbon atoms, and R3 and R4 are each independently H, F, or an alkyl group containing 1 to about 4 carbon atoms, Z is a carbonyl cross-linking group, and x is an integer from 1 to about 10; and about 0.01 wt. % to about 5 wt. % of a perfluoroalkylsubstituted glycidyl-reactive compound having the formula where R5 is H or F, Q is OH or SiR6R7R8, R6, R7, and R8 being independently selected from the group consisting of Cl, OH, an alkyl group containing 1 to about 4 carbon atoms, an alkoxy group containing 1 to about 4 carbon atoms, an acyloxy group containing 2 to about 4 carbon atoms, and an amino group containing 0 to about 4 carbon atoms; and n is an integer from 1 to about 15.

Abstract: The present invention relates to homogeneous alumoxane-LCT-epoxy polymers and methods for making the same. The homogeneous alumoxane-LCT-epoxy polymers comprise alumoxane-containing sub-structures evenly dispersed and essentially completely co-reacted with the LCT-epoxy sub-structures. The alumoxane sub-structures are organically bonded to the LCT-epoxy sub-structures. This produces homogeneous alumoxane-LCT-epoxy polymers that are substantially free of particle wetting and micro-void formation, with improved thermal conductivity properties without compromising on other desired structural integrities.

Abstract: Bulk-modified potting composition based on a curable epoxy resin or on a mixture of these resins, where the resin or the mixture is composed of an epoxy resin, a hardener, where appropriate an accelerator, and also other additives, such as fillers, flexibilizers, and colorants, which potting composition (a) comprises a three-dimensionally crosslinked polysiloxane in disperse form and with a particle size in the range from 0.02 ?m to 50 ?m, which, where appropriate, has reactive groups which can react chemically with the epoxy resin and/or the hardener, (b) a selected linear or branched siloxane compound which has reactive groups which can react chemically with the epoxy resin and/or the hardener, and also, where appropriate, (c) a low-molecular-weight oligomeric siloxane compound, the use of the potting composition as an engineering material or as an insulating material, and the moldings and insulation produced therefrom.

Abstract: A toner fuser member contains a substrate on which is disposed a toner release surface layer formed from a composition that includes a silsesquioxane and a curable epoxy resin. On curing, the composition forms an interpenetrating polymer network of the silsesquioxane and cured epoxy resin.

Abstract: A weldable coating composition is disclosed. The composition comprises a binder in which is dispersed a conductive pigment and a source of silicon. Enhanced corrosion protection is offered, without sacrificing weldability of the coating layer. The composition is applied to and cured on a metal substrate.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H: a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulfone, b) as component B, from 0 to 20% by weight of at least one functionalized polyaryl ether sulfone, c) as component C, from 5 to 94.8% by weight of at least one polyamide, d) as component D, from 0.1 to 10% by weight of at least one epoxy resin, e) as component E, from 0.1 to 60% by weight of fibrous or particulate fillers or a mixture of these, f) as component F, from 0 to 40% by weight of impact-modifying rubbers which have functional groups, g) as component G, from 0 to 40% by weight of other conventional additives and processing aids, h) as component H, from 100 ppm to 0.5% by weight, based on the amounts of components A to G, of copper bromide and/or copper iodide.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film. A layer: a heat-resistant resin layer with a thickness of from 2 to 250 ?m which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, and B layer: a roughenable cured resin layer with a thickness of from 5 to 20 ?m which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.

Abstract: The present invention relates to homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials and methods for making the same. The homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials comprise HTC-oligomer sub-structures evenly dispersed and essentially completely co-reacted with the LCT-epoxy sub-structures, where the HTC-oligomer sub-structures are organically bonded to the LCT-epoxy sub-structures. This produces homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials that are substantially free of particle wetting and micro-void formation, with improved thermal conductivity properties without compromising on other desired structural integrities.

Abstract: The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, wherein the epoxy resin (A) contains a phosphorus atom, and wherein 5 to 50 parts by weight of the phenoxy resin (C) and 0.05 to 10 parts by weight of the curing accelerator (D) are mixed with 100 parts by weight in total of the epoxy resin (A) and the phenolic curing agent (B).

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip, and an encapsulant comprising a composition of the invention. A method of encapsulating a solid state device is also provided.