Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: Erosion resistant coating compositions comprising a poly(Bisphenol A-co-epichlorohydrin) glycidyl end-capped component, an active hydrogen compound, a linear siloxane and a silsesquioxane. Protective coatings formed from such a composition impart particle-erosion resistance to parts having such a coating disposed on some portion of their surface.

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: A rocket motor insulation including an elastomer-based polymer is improved in its processability by the addition of silica particles treated with a hydrophobic coating. The insulation also preferably includes a metallic coagent cross-linker, which when used in combination with the hydrophobic silica particles increases the tear strength and the elasticity of the insulation, while at the same time not adversely affecting the bonding characteristics of the insulation.

Abstract: An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of elasticity of the cured first insulating adhesive layer, and electrically conductive particles which are dispersed in at least either the first insulating adhesive layer or the second insulating adhesive layer.

Abstract: A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 200 parts by weight of a conductive particulate material. The conductive resin composition forms a defect-free conductive coating on a substrate after mixing a one part epoxy resin composition under vacuum at a temperature insufficient to induce thermal cure. Adding a liquid epoxy resin to the one part epoxy resin composition to form a mixture combining 40 to 200 parts by weight of conductive particulate with the mixture and dispersing the combined conductive particulate and the mixture under vacuum until a homogeneous conductive resin paste results where the dispersing time for the combined conductive particulate and the mixture under vacuum is greater than or equal to the period of time of vacuum mixing the liquid one part epoxy composition.

Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.

Abstract: A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99% by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg.

Abstract: A group of sealants are described which utilize a by-product of paint booth spray operations. Processed paint booth overspray particles are combined with various resins, curing agents to form the sealant compositions.

Abstract: A group of sealants are described which utilize a by-product of paint booth spray operations. Processed paint booth overspray particles are combined with various resins, curing agents to form the sealant compositions.

Abstract: A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.

Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

Abstract: This invention relates to an article comprising a bio-supportive media which bio-degrades at a preferred rate, comprising at least one bio-limiting agent and at least one nutritional source on a substrate. The media may be characterized as a polymer, composite, or amalgam of commonly used materials. The invention relates to altering the physical/chemical composition of the media such that biodegradation can occur at a specific, usually accelerated, preferred rate. Further, the biodegradation rate may be managed and balanced concurrently with the ability to provide for the exposure of integral component(s) which are bio-active. This relationship essentially provides for a managed release or managed availability of agent(s) which creates a new set of ecological conditions.

Abstract: The compositions described include micronized zinc oxide UV blocking agents with at least one organic UV protective compound. Premix compositions are provided for imparting improved UV resistance to paints, coatings, finishes and plastic articles comprising both micronized inorganic zinc oxide and organic UV protective compounds suitable for easy later inclusion into paint, coating, finish and plastic articles formulations.

Abstract: The invention is a curable resin composition comprising A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent; and D) a copper salt or complex of copper with an alcohol, aldehyde or ketone; and E) an inhibitor comprising alkylated phenolic compound or polyhydroxy aromatic compound. In another aspect it is a resin system comprising I) a resin composition comprising: A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent comprising a polar or aromatic ring containing compound; D) a copper salt or a copper complex with an alcohol, ketone or aldehyde; and E) an inhibitor comprising alkylated phenolic compound or a polyhydroxy aromatic hydrocarbon and I) a catalyst system which comprises E) an additional amount of an inhibitor; F) optionally an aliphatic amine, an aromatic amine, or a heterocyclic amine; G) a peroxide or persulphate initiator; and H) a transition metal accelerator.

Abstract: A thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixing of an epoxy resin, a cross-linking agent and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper and an organic solvent.

Abstract: The present invention relates to a semiconductor encapsulating resin composition which is safe and superior in moisture resistance, flame retardance and moldability, and to a highly reliable semiconductor device which is fabricated by encapsulating a semiconductor element with such a semiconductor encapsulating resin composition. The resin composition according to the present invention comprises a thermosetting resin, a hardening agent and a compound metal hydroxide of polyhedral crystal form represented by the following general formula (1): m(MaOb).n(QdOe).cH2O  (1) [wherein M and Q are different metal elements; Q is a metal element which belongs to a group selected from IVa, Va, VIa, VIIa, VIII, Ib and IIb groups in the periodic table; m, n, a, b, c, d and e, which may be the same or different, each represents a positive number].

Abstract: An apparatus separates a substantially metallic portion from a substantially non-metallic portion or constituent components of at least one electrical product, comprising a plurality of crushing machines, such as a first crushing machine and a second crushing machine and a separating machine. The first crushing machine crushes the at least one electrical product to create at least one crushed electrical product. The first crushing machine has a first screen affixed thereto to regulate a first flow of the at least one first crushed electrical product from the first crushing machine. The second crushing machine crushes the at least one first crushed electrical product to create at least one second crushed electrical product. The second crushing machine has a second screen affixed thereto to regulate a second flow of the at least one second crushed electrical product from the second crushing machine.

Abstract: A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, a polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Abstract: A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by weight of a metallic filler having an average particle size of 0.5 to 20 &mgr;m. The paste has a viscosity of not higher than 20,000 poise at 25° C. and a volatile content of not more than 1.0% when heated in a filling step. The paste exhibits such shrink-resistance properties that when a first cured resin obtained by heating in a filling step is re-heated and cooled in a solder reflow step to obtain a second cured resin, the shrinkage percentage of the first cured resin to the second cured resin in the longitudinal direction of the through-hole is not greater than 0.1%.

Abstract: The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.

Abstract: Provided is a black sealant for liquid crystal cell comprising (a) an epoxy resin, (b) a novolac resin, (c) a curing accelerator and (d) a titanium-type black pigment. The use of the black sealant for liquid crystal cell of the present invention can provide a liquid crystal cell which prevents light leakage of the liquid crystal cell from the sealed portion, which has a high electrical insulation property and which is excellent in an adhesion strength and a humidity resistance.

Abstract: The present invention provides a thermosetting epoxy resin composition which copes with both storage stability and curing properties at a low temperature. A thermosetting epoxy resin composition of the present invention comprises (A) an epoxy resin, and (B) a fine powder-treated curing agent which comprises a curing agent in the solid state at room temperature, and particle surfaces of which are adhered with a fine powder having a center particle size of 2 .mu.m or less in a weight ratio of said solid curing agent to said fine powder in the range between 1:0.001 to 1:0.7, for hiding active sites on the surface of the curing agent. This composition is useful as an adhesive, a sealant, a coating material, a paint, a potting material, and a molding material.

Abstract: An indicator for complete polymerization and cure of base-catalyzed epoxy thermoset resin systems is disclosed. In particular, the present invention makes use of an diazo dye having amino groups which forms a salt or complex with hardeners used in various epoxy resin systems. Upon full polymerization and consumption of the hardener, a chromophoric shift of the dye can be observed.

Abstract: A weldable heat curable liquid coating composition for steel is provided that exhibits improved mar resistance without impairing the weldability characteristics of the coating. To this end, the composition contains a conductive welding aid of iron dust. The weldable coating when applied to steel and cured thereon to a dry film allows for spot welding of the coated steel without requiring special welding equipment and techniques.

Abstract: A two-component system for forming a sealing composition for bonding to unsanded, polymer-coated fiberglass surfaces. The system includes a resin component containing a major amount of epoxy resin, glycidoxy silane (0-2.5 wt. %) and hydrophilic-modified polyolefin fiber (0.5-10 wt. %), and a curing agent component having a major amount of amine curing agent and which may also contain amino silane (0-5 wt. %). The resin component may also contain alpha-phase alumina (20-80 wt. %), ceramic fiber (2-25 wt. %), and mica (2-20 wt. %). In another formulation, the resin component contains glycidoxy silane (0-2.5 wt. %), hydrophilic-modified polyolefin fiber (0.5-10 wt. %), ceramic fiber (2-25 wt. %), anti-foam material (0.2-1.0 wt. %), and epoxy novolac resin to 100 wt. %. The curing agent component contains amino silane (0-5 wt. %) and amine curing agent to 100 wt. %.

Abstract: The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising(A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule,(B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature,(C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: ##STR1## wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder,wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10.mu. to 50.mu. and thicknesses ranging from 1.mu. to 5.mu.

Abstract: The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives. Furthermore the dual curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives can be used in the optical industry, in optoelectronics and microelectronics, for example for the adhesion of complicated optical components in the combination glass/glass, glass/metal. Advantageous is the small shrinkage during polymerization and the good mechanical properties in combination with the possibility of step-wise or one-step polymerization.

Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metalic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys, and polytetrafluoroethylene as a lubricant to aid metal stamping operations, and a soluble colorant.

Abstract: An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt % and the inorganic filler (C) contains 0.1-50 wt % of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.

Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Abstract: A low gloss coating composition having a 60.degree. gloss of less than about 60 which contains:a) a glycidyl group-containing acrylic copolymer;b) an aromatic polyester; andc) an isocyanurate curing agent having the formula: ##STR1## wherein R.sub.1 -R.sub.3 are independently selected from the group consisting of divalent alkylene groups of 1 to 18 carbon atoms and divalent groups of 3 to 21 carbon atoms and containing an ester linkage, and R.sub.4 -R.sub.6 are independently selected from the group consisting of H, organic salt groups, alkyl groups of 1 to 20 carbon atoms and C(O)R.sub.7 wherein R.sub.7 is an alkyl group of 1 to 22 carbon atoms.

Abstract: There is disclosed a conductive adhesive comprising(A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof;(B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and(C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.

Abstract: A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability.(III) A metal hydroxide represented by the following general formula (1):n(M.sub.a O.sub.b).cH.sub.2 O (1)wherein M represents a metallic element; a, b and c each represents a positive number; and n represents a positive number of 1 or more, with the proviso that when M.sub.a O.sub.b is repeated, the plurality of M's may be the same or different and that a and b may be the same or different; and(IV) a metal oxide represented by the following general formula (2):n'(Q.sub.d O.sub.

Abstract: This invention relates to aqueous epoxy resin-containing compositions useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin; (B) a non-ionic emulsifier, (C) chromium trioxide, (D) a conductive pigment, (E) water, and, optionally, polytetrafluorethylene as a lubricant. The compositions may also contain phosphoric acid or an alkylphosphoric acid. These compositions are useful in coil coating operations to improve the electrocoatability of a metal substrate, in particular, steel, galvanized or aluminized substrates. The basecoated metal can then be conventionally coated or electro coated with weldable or non-weldable primer coatings and may be followed by the application of decorative topcoats.

Abstract: A multi-component waterborne corrosion resistant coating composition used as an organic zinc rich primer for protecting metal substrate from corrosion. The composition includes zinc dust, a crosslinking component and a polymeric component produced from a low Tg polymer and an amine functional curing agent. These components of the composition are stored separately and then mixed prior to applying the coat of the composition over metal substrate.The coating composition of the present invention has longer pot life than conventional waterborne corrosion resistant coating composition.

Abstract: A blend of (A) an acrylic, polyester or epoxy resin having at least two alkenyl or alkynyl groups in a molecule, (B) an organic silicon compound having at least two hydrogen atoms each directly attached to a silicon atom in a molecule, and (C) a hydrosilylaion catalyst is blended with (D) an organic iron or aluminum compound to form a hydrosilylative composition. Component (D) scavenges a catalyst poison, permitting components (A) and (B) to undergo hydrosilylation reaction with the aid of catalyst (C).

Abstract: A stable coating composition for use in protecting metallic substrates from corrosion, comprising in weight percent, based on the total weight of the composition: from about 7% to 35% of alkyl silicate as a film forming substance; from about 35% to 55% of zinc powder; from about 5% to 25% of zinc flakes; from about 0.2 to 5% of at least one amorphous silica; and up to about 30% particulate ferrophosphate; wherein the alkyl silicate comprises, in weight percent, based on the weight of the alkyl silicate: from about 5% to 20% of tetraethyl orthosilicate.

Abstract: A coating composition for use in protecting metallic substrates from corrosion, comprising in weight percent, based on the total weight of the composition: from about 7% to 35% of film-forming substance; from about 35% to 55% of zinc powder; from about 5% to 25% of zinc flakes; from about 1% to 5% at least one kind of amorphous silica; and up to about 30% particulate ferrophosphate.

Abstract: Disclosed are curable compositions based on a combination of polyphenylene oxide, monomeric epoxy resin, a compatibilizing metal salt of tin, and suitable curing agents. The monomeric epoxy resin comprises a polyepoxide composition comprising at least one bisphenol polyglycidyl ether having an average of at most one aliphatic hydroxy group per molecule. The composition may be used in the preparation of laminates useful as printed circuit boards.

Abstract: An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.

Abstract: An abrasive material in a shaped form usable for grinding, abrading or cutting various articles, which has high abrasion performance and high mechanical strength and is characterized in comprising alumina fibers of 3 to 100 .mu.m in diameter and not more than 10% in coefficient of variation of diameter bonded with a resin.

Abstract: A coating composition for the protection of metallic substrates against environmental attack comprising, in weight percent, from about 10% to about 30% of at least one film-forming polymer such as epoxy resins having an epoxide value of about 250 to about 2500, vinyl chloride resins copolymerized with polyisocyanates, polyurethane resins, and polyester resins; from about 40% to about 55% particulate metallic zinc; from about 4.75% to about 7% zinc-coated hollow glass-like microspheres having diameters ranging from about 2.5 to about 60 microns, the volumetric ratio of the metallic zinc to the microspheres ranging from about 0.8:1 to 1.2:1; from about 1.5 to about 3% of at least one particle size grade of pyrogenic amorphous silica having an average particle size ranging from about 0.007 to about 0.04 micron; and not more than 30% solvents compatible with the film-forming polymer.

Abstract: A composition for forming the keys of a keyboard musical instrument consists predominantly of a synthetic resin. The addition of ceramic whiskers in cluster form significantly improves the workability, sweat absorption and texture of the composition.

Abstract: A coating composition and method of use thereof for coating metal substrates, especially galvanically active metals, containing a resinous organic polymer, a corrosion inhibiting leachable pigment and an ion reactive pigment generally in the form of metallic spheroid particles. Coated materials have improved corrosion resistance.

Abstract: A coating composition for the protection of substrates against environmental attack comprising, in weight percent based on the solvent-free weight of the composition, from about 8% to about 35% of at least one film forming polymer; from 0 to about 60% of a corrosion inhibiting agent such as metal chromates, metal phosphates, metal molybdates, particulate metallic zinc and/or particulate metallic aluminum; from 3% to about 6% of mixture of pyrogenic amorphous silicas of different particle sizes having average particle sizes ranging from about 0.007 to about 0.04 micron; from about 15% to about 55% of at least one crystalline silica having an oil absorption value of less than 20 measured by ASTM Standard Test D281-84; and 0 to 35% based on the total weight of the composition, of at least one solvent compatible with the polymer.

Abstract: An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1):Bi.sub.x O.sub.y (OH).sub.p (Y.sup.-a).sub.q (NO.sub.3).sub.r.nH.sub.2 O (1)wherein Y.sup.-a represents a residue of an oxyacid other than nitrate; a represents the ionic valence, absolute value, of the residue of the oxyacid; and x, y, p, q, r and n each represents a value satisfying the following:1.ltoreq.x 1.ltoreq.y O.ltoreq.n0.08 x.ltoreq.p.ltoreq.0.92 x0.02 x.ltoreq.aq.ltoreq.0.92 x0.ltoreq.r.ltoreq.0.

Abstract: Coating compositions which do not contain metal powders and which contain, as coloring component, 0.001 to 30% by weight of at least one organic pigment and/or of a polymer-soluble dye and/or of a pearlescent pigment and 0.001 to 30% by weight of molybdenum disulfide, based on the coating produced therewith, are suitable, for example, for coloring surfaces, especially metal surfaces.

Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.

Abstract: A corrosive resistant coating composition with improved weldability characteristics which is applied to a metal substrate as a wet film and then heated to dry and initiate curing to provide a protective coating tenaciously bonded to the substrate. The composition has corrosion inhibiting finely divided aluminum or stainless steel, a weldability agent of finely divided nickel, a primary bonding resin, and a vehicle of solvents. Preferably, the composition also has a secondary organic resin and thixotropic, metal suspension and hydroscopic agents.