Boron Dnrm Patents (Class 523/445)
  • Patent number: 9859189
    Abstract: A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100° C. to 175° C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: January 2, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji, Motomi Kurokawa, Kazuya Hirasawa
  • Patent number: 9835611
    Abstract: It is an object to provide a stress history measurement method and a stress sensor by which the stress history of an object being measured can be measured easily with high accuracy over a wide stress measurement range. In the stress history measurement method, the stress history to which the object being measured has been subjected is measured on the basis of the ratio of twinned calcite particles after the object to be measured has been subjected to an external force, the object having a stress sensor embedded therein and capable of being deformed elastically when being subjected to the external force, the sensor including a number of calcite particles. The stress sensor is configured such that a number of calcite particles are hardened by a resin with adjacent particles kept in contact with each other.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: December 5, 2017
    Assignee: JAPAN AGENCY FOR MARINE-EARTH SCIENCE AND TECHNOLOGY
    Inventors: Arito Sakaguchi, Hide Sakaguchi
  • Patent number: 9812618
    Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: November 7, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jaehun Jeong, Sung Bae Moon, Sang In Yoon, Mi Jin Lee, Yuwon Lee
  • Patent number: 9139687
    Abstract: An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: September 22, 2015
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takayoshi Hirai, Tetsurou Imura, Makoto Takahashi
  • Patent number: 9029438
    Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: May 12, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Takashi Nishimura, Kenji Mimura, Motoki Masaki, Seiki Hiramatsu, Xiaohong Yin
  • Patent number: 9018282
    Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventor: Yoke Ai Gan
  • Publication number: 20150069877
    Abstract: Disclosed is a resin composition for electric insulation which contains an epoxy resin; a hardening agent; and fine particles, in which the fine particles form a plurality of threadlike agglomerates and the agglomerates have a dendritic structure when the epoxy resin, the hardening agent, and the fine particles are mixed and hardened, a base material of the fine particle is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, and hydrophilic groups and hydrophobic groups are present together on a surface of the base material. Thus improvement of the electric characteristics and the mechanical characteristics of the insulation material and suppression of viscosity of the resin composition are made compatible.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 12, 2015
    Inventors: Takuya OTOWA, Hiroshi MORITA, Atsushi OHTAKE, Kinya KOBAYASHI, Keiji SUZUKI
  • Publication number: 20150065609
    Abstract: Compositions comprising a polymer-containing matrix and a filler comprising a cage compound selected from borane cage compounds, carborane cage compounds, metal complexes thereof, residues thereof, mixtures thereof, and/or agglomerations thereof, where the cage compound is not covalently bound to the matrix polymer. Methods of making and applications for using such compositions are also disclosed.
    Type: Application
    Filed: November 7, 2014
    Publication date: March 5, 2015
    Inventors: Daniel E. Bowen, III, Eric A. Eastwood
  • Publication number: 20150037575
    Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
    Type: Application
    Filed: February 21, 2013
    Publication date: February 5, 2015
    Applicant: SHOWA DENKO K.K.
    Inventors: Yoichiro Sakaguchi, Kentarou Takahashi, Keisuke Mameda
  • Publication number: 20150031798
    Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.
    Type: Application
    Filed: August 18, 2014
    Publication date: January 29, 2015
    Inventors: Jens ROCKS, Walter Odermatt
  • Patent number: 8940827
    Abstract: The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: January 27, 2015
    Assignee: Globe Composite Solutions, Ltd.
    Inventor: Xiujun Wang
  • Publication number: 20150025176
    Abstract: A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 22, 2015
    Inventors: Glenn G. Eagle, Andreas Lutz, Gary L. Jialanella
  • Publication number: 20140370266
    Abstract: The present invention concerns a sizing composition for glass fibres comprising the following components: (a) A silane based coupling agent which is not an aminosilane; (b) A film former; (c) A borate; (d) A lubricant Characterized in that, at least 75 wt. % of the silane coupling agent present in the composition is dialkoxylated. It also concerns a glass fibre sized with the reaction product of said sizing composition, as well as a polymeric composite reinforced with such glass fibres.
    Type: Application
    Filed: June 25, 2012
    Publication date: December 18, 2014
    Inventors: Nadia Masson, Luc Peters, Willy Piret
  • Patent number: 8911140
    Abstract: A method for preparing an insulating varnish. The method includes: providing equivalence of an epoxy resin solution having a concentration exceeding 99 wt. % and acetone solution having a concentration of 40 wt. %, adding silane coupling agent-modified hexagonal boron nitride (BN) having a particle size of between 200 and 250 nm to the acetone solution and stirring; mixing the epoxy resin solution and the acetone solution and stirring, and dispersing the resulting mixture; adding to the mixture, low molecular weight polyamide resins as a curing agent, and stirring to uniformly disperse the curing agent; adding n-butane as a lubricant to the mixture and stirring, cooling the mixture to room temperature, adding di-n-butyl phthalate as a diluent to the mixture and stirring; and allowing the mixture to stand in a vacuum drier to remove bubbles to yield the insulating varnish, which is free of bubbles.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: December 16, 2014
    Assignee: Tianjin Jing Wei Electric Wire Co., Ltd.
    Inventors: Boxue Du, Shulin Dong
  • Publication number: 20140353004
    Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.
    Type: Application
    Filed: May 5, 2014
    Publication date: December 4, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Chul Jung, Joon Seok Kang, Jang Bae Son, Sang Hyun Shin, Kwang Jik Lee, Hye Sook Shin
  • Publication number: 20140349120
    Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 27, 2014
    Applicant: Shengyi Technology Co., Ltd.
    Inventor: Xianping Zeng
  • Publication number: 20140342161
    Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 20, 2014
    Applicant: Shengyi Technology Co. Ltd.
    Inventor: Xianping Zeng
  • Publication number: 20140312536
    Abstract: Provided is an epoxy resin composition including a nano-sized radioactive radiation shielding material which has superior shielding effects for against radiation, and to a method for preparing same. In particular, the method for preparing the epoxy resin composition for neutron shielding, includes the steps of: a step of mixing a boron compound powder for absorbing neutrons, optionally a high density metal powder for shielding from against gamma rays and a flame retardant powder, respectively separately or in combination, with an amine-based curing agent to obtain a mixture of a curing agent and a powder; an ultrasonic wave treating step of applying ultrasonic waves to the mixture to coat the surface of the powder with the amine-based curing agent and to disperse the powder in the curing agent; and a dispersing step of mixing and dispersing the amine-based curing agent, that was dispersed and includes the powder treated with ultrasonic waves, in an epoxy resin.
    Type: Application
    Filed: May 11, 2012
    Publication date: October 23, 2014
    Applicant: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Jae-Woo Kim, Ji-Heon Jun, Yeon-Joo Bae
  • Publication number: 20140275345
    Abstract: The present invention provides a dual-cure composition containing multifunctional polyols, uretidiones, peroxide curable monomers containing unsaturation and crosslinking agents. The dual-cure composition may be used to form a high modulus material useful as the matrix in a prepreg material and in composites. The present invention also relates to methods for the production of the dual-cure composition, prepreg materials comprising the dual-cure composition and a fibrous support, and composites made from the prepreg material.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Charles Todd Williams, Joseph Pierce, David Zielinski
  • Patent number: 8784980
    Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: July 22, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Pui-Yan Lin, Govindasamy Paramasivam Rajendran, George Elias Zahr
  • Publication number: 20140187676
    Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.
    Type: Application
    Filed: March 17, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Lee, Boum Seock Kim, Eun Tae Park, Se Hoon Jeong
  • Patent number: 8759422
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo
  • Publication number: 20140162072
    Abstract: A thermosetting resin composition contains a liquid epoxy resin, a solid epoxy resin having a softening point of 125° C. or lower, an aromatic diamine compound including benzoate group and a main chain including polymethylene group, a solvent soluble polyimide resin having Tg of 200° C. or higher and a weight average molecular weight Mw of 50000 or smaller, and a phenoxy resin having Tg of 130° C. or higher. A total of amounts of the solvent soluble polyamide resin and the phenoxy resin is 15 weight parts or more and 150 weight parts or less, provided that 100 weight parts are assigned to a total of amounts of the liquid epoxy resin, the solid epoxy resin and the aromatic diamine compound.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 12, 2014
    Applicant: TAMURA CORPORATION
    Inventors: Tetsuaki SUZUKI, Yusuke TANAHASHI, Nobuaki ISHIZAKA
  • Patent number: 8748541
    Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: June 10, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenichi Mori, Syouichi Itoh
  • Patent number: 8709587
    Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: April 29, 2014
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventor: Kuniharu Umeno
  • Publication number: 20140107257
    Abstract: A flame retardant composition is produced by mixing a flammable organic material with an inorganic phosphorus-inorganic phosphoric oxyacid compound or its salts. The inorganic phosphorus-inorganic phosphoric oxyacid compounds are produced by reacting an inorganic phosphorus compound having a valence of 3-4 with an inorganic phosphorus oxyacid with a valence of 5. Carbonization auxiliaries, metal-containing compound having a carbonization acceleration effect, a comb-like polymer and a filler may be added with the flame retardant composition.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 17, 2014
    Inventor: David H. Blount
  • Publication number: 20140079924
    Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 20, 2014
    Applicant: Samsung Electro-Mechanisc Co., Ltd.
    Inventors: Jin Seok MOON, Hyun Jun Lee, Jeong Kyu Lee, Seong Hyun Yoo, Keun Yong Lee
  • Patent number: 8637593
    Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: January 28, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hayato Kotani, Naoyuki Urasaki, Makoto Mizutani
  • Patent number: 8617930
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Publication number: 20130337269
    Abstract: A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.
    Type: Application
    Filed: March 5, 2012
    Publication date: December 19, 2013
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hajime Ohtsuka, Daisuke Ueyama, Masanobu Sogame
  • Patent number: 8585272
    Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: November 19, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hayato Kotani, Naoyuki Urasaki, Makoto Mizutani
  • Patent number: 8545977
    Abstract: Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (?m) to 100 micron (?m) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)].
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: October 1, 2013
    Assignee: ABB Research Ltd.
    Inventors: Stephen Clifford, Faustine Soyeux, Andrej Krivda, Vincent Tilliette, Nikolaus Zant, Bandeep Singh, Felix Greuter, Leopold Ritzer
  • Patent number: 8541516
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20130157061
    Abstract: There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.
    Type: Application
    Filed: May 31, 2012
    Publication date: June 20, 2013
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masanobu Sogame, Daisuke Ueyama, Hajime Ohtsuka
  • Publication number: 20130143981
    Abstract: To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc.
    Type: Application
    Filed: August 26, 2010
    Publication date: June 6, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Kenji Miyata, Toshitaka Yamagata
  • Publication number: 20130109786
    Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture. The present invention provides a green, environmentally friendly epoxy resin composition with high reliability and low warpage properties that can satisfy the requirement of lead-free high temperature reflux process.
    Type: Application
    Filed: December 18, 2012
    Publication date: May 2, 2013
    Applicant: Henkel (China) Investment Company Ltd.
    Inventor: Henkel (China) Investment Company Ltd.
  • Publication number: 20130065987
    Abstract: A thermal conductive sheet has a peeling adhesive force with respect to a copper foil of 2 N/10 mm or more, a thermal conductivity in a thickness direction (TC1) of 4 W/m·K or more, a thermal conductivity in a direction perpendicular to the thickness direction (TC2) of 20 W/m·K or more, and a ratio (TC2/TC1) of the thermal conductivity in a direction perpendicular to the thickness direction (TC2) with respect to the thermal conductivity in the thickness direction (TC1) of 3 or more.
    Type: Application
    Filed: September 12, 2012
    Publication date: March 14, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Saori Fukuzaki, Keisuke Hirano, Seiji Izutani
  • Patent number: 8362115
    Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: January 29, 2013
    Assignee: Henkel (China) Investment Company Ltd.
    Inventors: Guangchao Xie, Xingming Cheng
  • Patent number: 8362116
    Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: January 29, 2013
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming Jen Tzou, June Che Lu, Yi Cheng Lin
  • Publication number: 20130012621
    Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
    Type: Application
    Filed: December 28, 2010
    Publication date: January 10, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kei Yamamoto, Takashi Nishimura, Kenji Mimura, Motoki Masaki, Seiki Hiramatsu, Xiaohong Yin
  • Publication number: 20120329912
    Abstract: A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO2, about 10 wt % to about 20 wt % Al2O3, about 20 wt % to about 30 wt % B2O3 and about 1 wt % to about 5 wt % oxides of IA/IIA metals. The fused filler can be used in a resin composition for preparing prepregs and printed circuit boards.
    Type: Application
    Filed: September 8, 2011
    Publication date: December 27, 2012
    Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Cheng-Ping LIU, Jiun-Jie HUANG, Hsien-Te CHEN, Chih-Wei LIAO
  • Publication number: 20120318131
    Abstract: There is provided a polymer ceramic composite which includes one or more particulate ceramics and a mixture of polymers. There is further provided methods of manufacture and application of the polymer ceramic composition. The composition finds use as a mouldable armour strike face, particularly in personal protective equipment and in vehicle or aircraft armour.
    Type: Application
    Filed: August 4, 2010
    Publication date: December 20, 2012
    Applicant: VCAMM LIMITED
    Inventor: Mark Forrest
  • Patent number: 8288466
    Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided. The surface modified hexagonal boron nitride particles comprise surface-bonded substituted phenyl radicals.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: October 16, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventors: Pui-Yan Lin, Govindasamy Paramasivam Rajendran, George Elias Zahr
  • Patent number: 8277936
    Abstract: The present invention relates to a hexagonal boron nitride platelet particle having a layer of a ferromagnetic metal between the layers of hexagonal boron nitride thereof, and a process for preparing the composition thereof. The present invention further relates to polymeric composites formed therefrom. The present invention describes improvements in thermal conductivity of said composites when subject to an orienting magnetic field.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: October 2, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventor: Salah Boussaad
  • Publication number: 20120202922
    Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.
    Type: Application
    Filed: April 12, 2012
    Publication date: August 9, 2012
    Applicant: Henkel AG & Co. KGaA
    Inventor: Yoke Ai Gan
  • Publication number: 20120188730
    Abstract: An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.
    Type: Application
    Filed: September 13, 2010
    Publication date: July 26, 2012
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Kenji Miyata, Toshitaka Yamagata
  • Patent number: 8217099
    Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: July 10, 2012
    Assignees: ITEQ (Dongguan) Corporation, ITEQ Corporation
    Inventors: Yufang He, Lijun Su
  • Publication number: 20120153532
    Abstract: A plastic molding material contains at least one filler and a polymer resin, selected from the group made up of cyanate ester resins, epoxy novolac resins, multifunctional epoxy resins, bismaleimide resins and their mixtures. The proportion of filler in the plastic molding material is in the range of 65 to 92 wt. %, with reference to the overall mass of the plastic molding material.
    Type: Application
    Filed: April 6, 2010
    Publication date: June 21, 2012
    Inventors: Irene Jennrich, Andre Zimmermann, Frieder Sundermeier
  • Publication number: 20120077904
    Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.
    Type: Application
    Filed: September 30, 2011
    Publication date: March 29, 2012
    Inventors: Guangchao XIE, Xingming CHENG
  • Publication number: 20120064788
    Abstract: The present invention relates to fiber glass strands, yarns, fabrics, composites, prepregs, laminates, fiber-metal laminates, and other products incorporating glass fibers formed from glass compositions. The glass fibers, in some embodiments, are incorporated into composites that can be used in reinforcement applications. Glass fibers formed from some embodiments of the glass compositions can have certain desirable properties that can include, for example, desirable electrical properties (e.g. low Dk) or desirable mechanical properties (e.g., specific strength).
    Type: Application
    Filed: September 14, 2011
    Publication date: March 15, 2012
    Inventors: James Carl Peters, Juan Camilo Serrano, Hong Li, Cheryl A. Richards, Steven Joel Parks