Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.

Abstract: The present invention relates to fiber glass strands, yarns, fabrics, composites, prepregs, laminates, fiber-metal laminates, and other products incorporating glass fibers formed from glass compositions. The glass fibers, in some embodiments, are incorporated into composites that can be used in reinforcement applications. Glass fibers formed from some embodiments of the glass compositions can have certain desirable properties that can include, for example, desirable electrical properties (e.g. low Dk) or desirable mechanical properties (e.g., specific strength).

Abstract: Disclosed is a curable system comprising at least two compositions (A) and (B), a method for the manufacturing of a cured product as well as cured products obtainable by the method.

Abstract: The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: The invention relates to a heat curable composition for fire-resistant or intumescent composite parts, which is free of any halogen additive or halogen structure in the components thereof, and which comprises: a) 100 parts by weight of a dry resin, including a1) an unsaturated polyester having an acid index lower than 10 and/or a2) a vinyl ester; b) 40 to 200 parts by weight of a reactive thinner among ethylenically unsaturated monomers; c) 20 to 110 parts by weight of a thermal expansion agent selected from melamine and derivatives thereof, guanidine, glycine, urea, triisiocynurates, and azodicarbinamide; d) 0 to 250 parts by weight of aluminium trihydrate; e) 10 to 80 parts by weight of a carbonisation precursor agent selected from multifunctional polyols; f) 50 to 200 parts by weight of a compound selected from a phosphorus derivative and/or a boric acid derivative; g) optionally at least one metal oxide; h) optionally other additives and fillers; i) optionally reinforcements containing natural or syntheti

Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.

Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: A thermosetting epoxy composition contains a modified silicon dioxide and is suitable for use in preparing an epoxy laminate having a low coefficient of thermal expansion and good drilling workability, which modified silicon dioxide contains no crystal water, has low expansibility, and contains 40% to 80% by weight of silicon dioxide and 60% to 20% by weight of an inorganic additive, and the modified silicon dioxide is obtained by a high-temperature (above 1000° C.) sintering process followed by a crushing process.

Abstract: There is provided a neutron shielding material which has heat resistance and has ensured neutron shielding performance even in a high-temperature environment during storage of a spent nuclear fuel for high burnup. A neutron shielding material having improved heat resistance and ensured neutron shielding performance due to the absence of an amine curing agent is provided by a neutron shielding material composition comprising a polymerization initiator, a polymerization component, a density increasing agent and a boron compound. As the polymerization component of the present invention, an epoxy component and an oxetane component are particularly preferably used.

Abstract: The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group II element in the long periodic table.

Abstract: The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materials 30 and a host resin matrix 32. The HTC materials 30 form a continuous organic-inorganic composite with the host resin matrix 32 via surface functional groups that are grafted to the HTC materials 30 and form covalent linkages with the host resin matrix 32. Phonons 34 tend to pass along the HTC materials 30 as they travel through the host resin matrix 32, and phonons 36 pass to the next HTC material if the distance between these materials is less than n.

Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

Abstract: A polysaccharide-based solid material including, in its mass, at least one active agent having bactericidal, fungal, insecticidal and/or flame-retardant properties, and at least one complexing agent and/or at least one polymeric matrix having a complexing agent. The active agent includes at least one compound selected from the group including boron, silica, aluminum, phosphorus, iodine, derivatives thereof, aluminosilicate derivatives, and mixtures thereof. The solid material is characterized by an improved stability and by reduced environmental impact, and makes it possible to prepare materials based on wood particles and woods having a particular resistance against environmental attacks such as moisture.

Abstract: This invention is a barrier composition comprising a resin or resin/filler system that is capable of being cured at low temperature while still maintaining superior barrier performance. This composition comprises (a) an aromatic compound having meta-substituted epoxy functionalities; (b) a multifunctional aliphatic amine; (c) optionally, one or more fillers; (d) optionally one or more adhesion promoters; (c) optionally, a phenolic cure accelerator.

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.

Abstract: The present invention provides a polybutylene terephthalate resin composition which has an excellent vibration welding performance, an excellent resistance to heat shock, and is useful for a case, housing and the like of electric/electronic parts. Specifically, it provides a polybutylene terephthalate resin composition for vibration welding comprising (A) 100 parts by weight of a polybutylene terephthalate resin; (B) 20 to 100 parts by weight of a modified polyester copolymer containing 5 to 30% by mole of a comonomer; (C) 5 to 30 parts by weight of an elastomer selected from an acrylic-based copolymer having a glycidyl group and/or an ?-olefin.?,?-unsaturated carboxylic acid (ester).?,?-unsaturated carboxylic acid glycidylester-based ternary polymer; and (D) 60 to 150 parts by weight of a glass fiber.

Abstract: The present invention includes polymer films that comprise lanthanum hexaboride and an epoxy agent. The lanthanum hexaboride and epoxy agent can be incorporated into or onto a polymer film in any suitable manner. The addition of an epoxy agent surprisingly provides a stabilization effect to the lanthanum hexaboride, which allows for the production of polymer films that advantageously absorb infrared radiation and resist environmental degradation. Polymer films thus produced have a significant number of applications, for example, but not limited to, display devices, protective coverings, and glazing film applications.

Abstract: The invention is a formulation that contains: (1) a low-viscosity epoxy resin; (2) a phenolic chain extender whose concentration is less that 0.6 equivalents phenolic hydroxyl group per equivalent of the low-viscosity epoxy resin; (3) a catalyst that promotes self-curing reactions between epoxy groups; (4) an inhibitor that inhibits the activity of the catalyst under “B-staging” conditions; (5) less than 25 weight percent of a volatile organic solvent; and (6) optionally, a multifunctional cross-linking agent. The formulation contains low levels of volatile organic solvent, and can be used to make electrical laminates. It builds molecular weight controllably in B-staging, so that dripping is avoided but the prepreg can be easily laminated.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: The invention relates to (1) a curable epoxy resin composition comprising (A) a non-gel type amine-modified epoxy resin which is obtained by reacting an epoxy resin with a polyamine and (B) at least one of boric acid and boric ester, (2) a powder form of the curable epoxy resin composition and a process for its production, and (3) a process for production of heat-resistant laminated sheets by using the curable epoxy resin composition. The invention provides (1) a curable epoxy resin composition capable of giving a cured article having a high glass transition temperature and excellent mechanical properties, (2) a powder form of curable epoxy resin composition having a high glass transition temperature, excellent mechanical properties and excellent storage stability and a process for its production, and (3) heat-resistant laminated sheets made by using the curable epoxy resin compositions and having excellent heat resistance and mechanical properties.

Abstract: A boron nitride composition having its surface treated with a coating layer comprising at least an organosilicon compound. In one embodiment, the boron nitride powder surface is first treated by either a calcination process, or by coating with at least an inorganic compound for the surface to have a plurality of reactive sites containing at least a functional group that is reactive to at least one functional group of the organosilicon compound.

Abstract: The present invention provides a curable cathodic corrosion protection powder coating, which comprises a thermosetting resin, a zinc borate compound, a curing agent in an amount effective to cure the coating. Further, the present invention also provides a method of cathode corrosion protection which includes the steps of subjecting the substrate to a mechanical treatment, applying to said treated steel surface, the cathodic protective coating, and polarizing the coated material as a cathode.

Abstract: The present invention provides a curable alkanolamine containing epoxy powder coating composition comprising at least one epoxy resin, at least one alkanolamine, a curing agent in an amount effective to cure the coating and optionally at least one zinc borate compound. Further, the present invention provides a method of cathode corrosion protection which includes the steps of subjecting a metal substrate to a mechanical treatment, applying the curable alkanolamine containing epoxy powder coating composition to the surface of the metal substrate, and polarizing the coated material as a cathode. The present invention also relates to a process for making and applying the alkanolamine containing epoxy powder coating compositions of the present invention.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 ?m or less. The epoxy resin composition contains a large amount of the aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property due to the direction of application.

Abstract: The present invention provides a curable cathodic corrosion protection powder coating, which comprises a thermosetting resin, a zinc borate compound, a curing agent in an amount effective to cure the coating. Further, the present invention also provides a method of cathode corrosion protection which includes the steps of subjecting the substrate to a mechanical treatment, applying to said treated steel surface, the cathodic protective coating, and polarizing the coated material as a cathode.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: Polymer compositions comprising polyester, boron component, and epoxy component. Articles made from these compositions, particularly articles requiring excellent hydrolysis resistance properties.

Abstract: Polymer compositions comprising polyester, boron component, and epoxy component. Articles made from these compositions, particularly articles requiring excellent hydrolysis resistance properties.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak ?-alkoxy ester linkages which provide for the reworkable aspect of the invention.

Abstract: Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly such as a wafer-level underfilled microelectronic package.

Abstract: The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts made from a low softening point materials with an anti-friction and anti-wear hard coating composition. The coating composition comprises a mixture of (i) solid lubricants comprising boron nitride, graphite and molybdenum disulfide, (ii) a thermoset resin system, (iii) catalyst for curing the resin system and (iv) a solvent system comprising highly volatile solvents. The coating composition is applied to the part and cured to form a coating on the part.

Abstract: A high-polymer neutron shielding material which scarcely reduces the hydrogen number density when exposed to a high temperature of 150 to 200° C. for a long time period A heat-setting type epoxy resin is employed. The base resin is selected from various epoxy resins such as bisphenol A type epoxy resin. The hardener is selected from alicyclic polyamine, polyamide amine, aromatic polyamine, acid anhydride, and so on. These materials are mixed and hardened at a temperature higher than the room temperature. To give a flame resistance to the hardened resin, a fire retardant such as magnesium hydroxide is added to the mixture. To improve the neutron shielding performance of the hardened resin, a neutron absorbing material is added to the mixture. Further, to increase the moderating performance, hydrogenated bisphenol A epoxy resin is used as the base resin or metal hydride or hydrogen absorbing alloy is added.

Abstract: A battery operated hand-held dispenser which operates efficiently at lower power levels than prior art devices. The dispenser as included therein has spray, foam or stream, dispensing capabilities coupled with pump mechanisms, vent mechanisms and positive closures.