Abstract: Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardener and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.

Abstract: New and improved heat curable compositions are disclosed comprising epoxidic resin(s) and aromatic ether-sulfone polyamines, alone or in combination with other diamine curing agents and/or curing catalysts alone, or in further combination with reinforcements, e.g., graphite fibers and, optionally modified with second resins. The cured neat resins and fiber resin matrix compositions exhibit high toughness, compression strength and short beam shear strength under dry, wet and hot/wet conditions.

Abstract: A conformal coating protects electrical components used in a high voltage high vacuum evironment from flashovers caused by patch charging. The coating comprises a semiconductor powder, preferably elemental boron, having a low atomic number and uniformly dispersed throughout an organic binder such an an epoxy. The coating's surface resistivity is made to be high enough so that the coating acts as an electrical insulator. On the other hand, the coating's surface resistivity is sufficiently low that any patch charge is siphoned off to the nearest conductor. The surface resistivity is regulated by the proportion of semiconductor present. The coating's secondary electron emission coefficient is 1 or just under 1. The coating has the properties of adhesion, stability, elasticity, provision of mechanical support, and resistance to solvents and heat. An example is given in which the epoxy comprises resin, fine particles of elemental boron, and a polyamide hardener.

Abstract: Described herein are compositions which contain a specific group of oligomeric diamine hardeners and epoxy compounds which when combined with structural fibers produce composites which have improved tensile properties, high compressive strengths, and improved impact resistance. These compositions also exhibit low moisture absorption.

Abstract: A coating composition for application to a substrate for curing thereon to form an ablative coating. The composition comprises a reactive mixture of epoxy and polysulfide resins, an amine curing agent, refractory fibers and inorganic materials serving as a source of one or more Lewis acids and being capable of forming a glassy reaction product when exposed to heat. When applied to a substrate, the solvent-free composition cures to a tightly adhering, flexible coating capable of providing thermal protection in a very high-temperature, erosive environment.

Abstract: Curable thermosetting resin compositions comprising an epoxy resin having at least two 1,2-epoxy groups per molecule, an aromatic diamine hardener, and as a cure accelerator an aromatic trihydroxy compound are disclosed. The aromatic trihydroxy compound, such as for example, phloroglucinol, n-propyl gallate, or pyrogallol, improves the cure speed of the epoxy/aromatic diamine resin system, while at the same time producing cured compositions having excellent mechanical and thermal properties. The disclosed compositions find particular application in the preparation of composites by, e.g., filament winding procedures.

Abstract: Cured polyfunctional epoxy resins including tris(hydroxyphenyl)methane triglycidyl ether are toughened by addition of polybrominated polymeric additives having an EE below 1500 to the pre-cure composition. Carboxy-terminated butadiene-acrylonitrile rubber is optionally present in the pre-cure mixture as such or as a pre-formed copolymer with other reactants. Reinforced composites, particularly carbon-reinforced composites, of these resins are disclosed and shown to have improved toughness.

Abstract: Described herein is a composition comprising a select group of substituted diamine hardeners and an expoxy resin containing two or more 1,2-epoxide groups per molecule. These compositions exhibit reduced moisture absorption, and controlled reactivity which comprises the processing characteristics of the composition.

Abstract: Described herein is a composition which contains bis(2,3-epoxycyclopentyl) ether, a specific group of hardeners and a specific group of thermoplastics. When cured, these compositions have improved tensile properties as compared to similar compositions which do not contain thermoplastics.

Abstract: Cured polyfunctional epoxy resins including tris(hydroxyphenyl)methane triglycidyl ether are toughened by addition of polybrominated polymeric additives having an EE below 1500 to the pre-cure composition. Carboxy-terminated butadiene-acrylonitrile rubber is optionally present in the precure mixture as such or as a pre-formed copolymer with other reactants. Reinforced composites, particularly carbon-reinforced composites, of these resins are disclosed and shown to have improved toughness.

Abstract: A soft vinyl chloride resin composition having a light weight and a superior abrasion resistance and lusterless surface is provided, which composition is obtained by blending 100 parts by weight of a vinyl chloride copolymer consisting of 99.0 to 99.95% by weight of vinyl chloride and 1.0 to 0.05% by weight of a polyethylene glycol diacrylate or a polyethylene glycol dimethacrylate both having 4 to 50 polymerization units of ethylene glycol, mainly with (a) 5 to 100 parts by weight of a filler having a specific gravity of 0.7 or less and a compressive strength of 70 Kg/cm.sup.2 or higher and (b) 30 to 150 parts by weight of a plasticizer.

Abstract: A novel diepoxide curing agent is revealed. The curing agent comprises a mixture of an imidazole compound and a selected polyoxyalkylenepolyamine.This curative produces an epoxy resin of low viscosity with a prolonged pot life. They find particular usefulness in filament winding and pultrusion processes where they are used to fabricate articles of considerable strength.

Abstract: This invention relates to an improved coating composition for application to aluminum cell cathodes, wherein said composition comprises a Refractory Hard Material, and a thermosetting resinous binder system.The resinous binder system is characterized by a char yield greater than 25 percent, while the coating composition exhibits expansion characteristics such as to adhere to a cathode block at temperatures up to and including those normally encountered in the operation of an aluminum cell. The ablation rate of the carbon system utilized is essentially equal to the combined wear and dissolution rate of the Refractory Hard Material in an aluminum cell environment.

Abstract: The tensile properties and compressive strength of composites comprising epoxy resins and structural fibers are improved by the inclusion of a novel class of polynuclear aromatic diamine hardners exemplified by 4,4'-bis-(4-aminophenoxy) diphenyl sulfone and its analogs.

Abstract: A novel composition is described comprising an admixture of an unsaturated polyimide prepolymer essentially free of terminal amine groups and an epoxy resin having a homopolymerization temperature that is greater than the temperature at which the polyimide polymerizes. These compositions maintain the superior glass transition temperatures and moisture resistance of the polyimide while picking up the desirable handling properties of the epoxy. These compositions have excellent high temperature and moisture resistant properties and excellent storage stability. For instance, carbon composites made with these materials have exhibited 60% shear property retention at 450.degree. F. after being boiled in water for one week. Also described are prepregs comprising the novel composition, methods for curing the novel composition to obtain the superior properties, and articles of manufacture comprising the novel composition.

Abstract: The invention relates to a filled, resin composition and a method for the manufacture therefor. The composition is a matrix of an epoxy resin, a carbonate-containing filler, particularly calcium-magnesium carbonate or calcium carbonate, an anhydride hardener and an adhesive at 0.1 to 3.0 percent by weight, relative to the weight of the filler. The adhesive is a multibasic organic acid, an organic hydroxy acid such as malic acid or an amino acid. In the process, the adhesive can first be added to the hardener or to the filler containing resin before hardener is added.

Abstract: In a non-asbestos friction material comprising ferrous metal particle and/or ferrous metal fiber, organic dust, inorganic substance, lubricant, metal powder, fibrous reinforcing material and thermosetting resin, the friction material being characterized in containing 0.01-5.0 wt. % of at least one material selected from the group consisting of boric acid, borate, phosphoric acid and phosphate as an anticorrosive component. Further, in the non-asbestos friction material containing rubber, organic friction dust, inorganic powder, lubricant, non-ferrous metal powder and/or non-ferrous fiber, fibrous reinforcing material, thermosetting resin and other friction material, the friction material characterized in containing at least one material selected from the group consisting of boric acid, borate, phosphate acid and phosphate as an anti-corrosive component and containing no ferrous component.

Abstract: A jet printing ink composition comprises 2 to 60 wt.% of a binder precursor of an alkoxysilane having the formula R.sub.4-n Si(OH).sub.n (n=0 to 2; and R represents a C.sub.1 -C.sub.4 alkoxy group, methoxyethoxy, ethoxyethoxy or phenoxy group) or an oligomer thereof; and 25 to 95 wt.% of a solvent for said alkoxysilane or oligomer thereof; 0.001 to 5 wt.% of a solvent soluble acid; and 0.1 to 8 wt.% of a solvent soluble dyestuff, if necessary, further comprises up to 2 wt.% of a solvent soluble inert silicone oil for inhibiting blotting and up to 3 wt.% of an electroconductive agent.