Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.

Abstract: Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.

Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodephenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at last one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to- a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

Abstract: A structural reinforcement material is provided that includes a base material selected from thermosets, low viscosity thermoplastics with short transition phases and low viscosities, low melting point metallic alloys, and combinations thereof. At STP, the structural reinforcement material is a solid or a formable dough or a mixture thereof. When heated to an activation temperature, the structural reinforcement material becomes flowable into a cavity. Following cooling, the structural reinforcement material is a solid or a thermoset with a strength sufficient to reinforce the cavity. A structural reinforcement insert comprising the structural reinforcement material is also provided, as is a reinforced cavity of an automobile and a method of reinforcing a cavity.

Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

Abstract: As a paint composition of cationic electrodeposition and a method preparing thereof, the paint composition of cationic electrodeposition comprises about 42 to about 47 percent by weight of a cationic electrodeposition resin composition, about 6 to about 13 percent by weight of a pigment paste composition, and about 40 to about 48 percent by weight of ion exchange water. An electronic part film coated by utilizing the paint composition of cationic electrodeposition on alloy such as an iron, an aluminum, etc. does not include a lead and a tin. In addition, when assembling electronic parts, an error rate is minimized by inhibiting frictional static electricity through anti-static capacity, and the probability of a fire is dirninished by inhibiting static electricity.

Abstract: This invention provides an electrodeposition paint comprising particles of at least one metallic compound selected from bismuth hydroxide, zirconium compound and tungsten compound, said particles of the metallic compound having an average particle diameter of 1-1,000 nm. The electrodeposition paint forms coating film excelling in corrosion resistance, finished appearance, paint stability and so on.

Abstract: As a paint composition of cationic electrodeposition and a method preparing thereof, the paint composition of cationic electrodeposition comprises about 42 to about 47 percent by weight of a cationic electrodeposition resin composition, about 6 to about 13 percent by weight of a pigment paste composition, and about 40 to about 48 percent by weight of ion exchange water. An electronic part film coated by utilizing the paint composition of cationic electrodeposition on alloy such as an iron, an aluminum, etc. does not include a lead and a tin. In addition, when assembling electronic parts, an error rate is minimized by inhibiting frictional static electricity through anti-static capacity, and the probability of a fire is diminished by inhibiting static electricity.

Abstract: Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. A resin dispersion of a cationic electrodeposition includes an aqueous dispersion prepared by the following processes. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for neutralization, a reaction product of manganese phosphate and an acid diluted in an deionized water to 10%, and a cationic surfactant.

Abstract: The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl phenol and/or a carboxylic acid, a xylene-formaldehyde resin, and an amino group-containing compound.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.

Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

Abstract: This invention provides, at a low cost, a low-pollution type cationic electro-coating bath composition which contains neither lead nor chromium, and which comprises cationic electrodeposition paint and, contained therein, a bismuth oxide paste, the amount of the bismuth oxide paste being within a range of 0.1 to 0.3% by weight as metal bismuth on the basis of total solid content of said cationic electro-coating bath composition, and the bismuth oxide paste being prepared by dispersing bismuth oxide (B) in an organic acid-neutralized aqueous dispersion of diethanol amine-added alicyclic epoxy resin (A).

Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.

Abstract: Polymerizable composition that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radiopacifying fillers in an amount sufficient to render the polymerizable composition radiopaque. Components (a), (b), and (c) are selected such that the polymerizable composition polymerizes to form a polymerized composition having a Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of the cationically active functional group are a reaction temperature of 25° C.

Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

Abstract: A plastic lens having a primer layer made from a polyurethane resin obtained through a reaction between a polyester polyol containing isophthalic acid as a main component and a polyisocyanate. A plastic lens having excellent resistance to scratch and impact resistance can be obtained by further forming a hard-coat layer and an anti-reflection layer on the primer layer.

Abstract: A thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixing of an epoxy resin, a cross-linking agent and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper and an organic solvent.

Abstract: Polymerizable compositions that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radiopacifying fillers in an amount sufficient to render the polymerizable composition radiopaque. Components (a), (b), and (c) are selected such that the polymerizable composition polymerizes to form a polymerized composition having a Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of the cationically active functional group at a reaction temperature of 25° C.

Abstract: High-melting polyamide resin compositions having improved mechanical properties, and molded articles for electrical and electronic components made using the same. The high-melting polyamide resin compositions comprise an aromatic polyamide having a melting point of 280° C. to 340° C. and glycidyl isocyanurate, a novolak-epoxy, or mixtures thereof.

Abstract: In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide; the inorganic filler being mixed in an amount of from 70% by volume to 85% by volume based on the total weight of the encapsulant composition, and the hydrous bismuth nitrate oxide being mixed in an amount of from 2.5 parts by weight to 20 parts by weight based on 100 parts by weight of the epoxy resin, and ii) an electronic device having an encapsulating member comprising a cured product of this encapsulant composition.

Abstract: An adhesive composition, which is useful as an adhesive for FPC protective film and is particularly superior in dimensional stability and adhesion is described herein. The adhesive composition comprises a resin component containing an phenoxy resin, an epoxy resin and a curing agent, characterized in that said resin component further contains a polyester polyol and an inorganic colloid dispersed in said resin component.

Abstract: The present invention pertains to novel durable, tough, transparent, luminescent overlay compositions, useful for highlighting and/or illuminating and preserving surfaces and markings thereupon, such as roadways/highways, pedestrian passageways, airport runways, traffic control surface markings on travelways such as those listed above, traffic control devices/signs, structures, and articles. The clear compositions contain a moisture sensitive luminescent substance (for example, a phosphorescent substance having increased brightness and longer lasting afterglow) and an epoxy resin which imparts moisture stability to the luminescent substance, and durability and longer life to the underlying markings, surface area, structure or article.

Abstract: The invention pertains to a method for producing preparations containing bismuth salts, wherein bismuth oxide is reacted in a specific way with lactic acid and the resulting mixture of bismuthyl lactate and bismuth lactate is dispersed in a binder. These preparations are used as catalytic components in electrophoretic paints to be applied by cathodic deposition. Dipping paints of this kind have excellent application and film properties. This obviates the need to use lead and tin compounds as catalysts.

Abstract: The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives. Furthermore the dual curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives can be used in the optical industry, in optoelectronics and microelectronics, for example for the adhesion of complicated optical components in the combination glass/glass, glass/metal. Advantageous is the small shrinkage during polymerization and the good mechanical properties in combination with the possibility of step-wise or one-step polymerization.

Abstract: The present invention relates to novel compositions useful, for example, in marking road surfaces. The compositions contain a moisture sensitive luminescent substance (for example a phosphorescent substance having increased brightness and longer lasting afterglow) and an epoxy resin or a polyurethane resin which is water miscible or soluble, and which impart moisture stability to the luminescent substance. The luminescent substance-resin mixtures may be mixed with water-based highway paints. As a result, these novel compositions impart an extended road surface life, and are environmentally friendly because they do not contaminate the surrounding environment with organic hydrocarbon products via vaporization or runoffs. In addition these compositions may be used both indoors and outdoors for nighttime marking and in other marking applications.

Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metalic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys, and polytetrafluoroethylene as a lubricant to aid metal stamping operations, and a soluble colorant.

Abstract: This invention relates to aqueous epoxy resin-containing compositions useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin; (B) a non-ionic emulsifier, (C) chromium trioxide, (D) a conductive pigment, (E) water, and, optionally, polytetrafluorethylene as a lubricant. The compositions may also contain phosphoric acid or an alkylphosphoric acid. These compositions are useful in coil coating operations to improve the electrocoatability of a metal substrate, in particular, steel, galvanized or aluminized substrates. The basecoated metal can then be conventionally coated or electro coated with weldable or non-weldable primer coatings and may be followed by the application of decorative topcoats.

Abstract: A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.

Abstract: A vibration-isolating composite material consists essentially of powder of an inorganic elastic material and a synthetic polymer mixed thereto. The inorganic elastic material is at least one material selected from the group consisting of NdP.sub.5 O.sub.4, BiVO.sub.3, Gd.sub.2 (MoO.sub.4).sub.3, GdNbO.sub.4 and KH.sub.2 PO.sub.4 and the synthetic polymer is at least one material selected from the group consisting of thermoplastic resins, thermosetting resins and rubber materials.

Abstract: A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: Disclosed is a polyalkylene terephthalate type flame retardant resin composition comprising:(A) 100 parts by weight of a polyalkylene terephthalate resin,(B) 30 to 250 parts by weight of a filler,(C) 5 to 50 parts by weight of an organic halogen compound having a glycidyl group, and(D) 5 to 50 parts by weight of sodium antimonate,wherein heat resistance is improved and change in molding stability is small even when it is exposed to high temperatures during molding.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony peroxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulate the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1):Bi.sub.x O.sub.y (OH).sub.p (Y.sup.-a).sub.q (NO.sub.3).sub.r.nH.sub.2 O (1)wherein Y.sup.-a represents a residue of an oxyacid other than nitrate; a represents the ionic valence, absolute value, of the residue of the oxyacid; and x, y, p, q, r and n each represents a value satisfying the following:1.ltoreq.x 1.ltoreq.y O.ltoreq.n0.08 x.ltoreq.p.ltoreq.0.92 x0.02 x.ltoreq.aq.ltoreq.0.92 x0.ltoreq.r.ltoreq.0.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: Process for enhancing the electrostatic chargeability of powder coatings or powders, and the use thereof for surface coating solid objects.Process for enhancing the electrostatic chargeability of powder coatings or powders intended for the surface-coating of solid objects, by homogeneously incorporating at least one salt-like, cationic compound of the formula (1) ##STR1## in which R.sub.1, R.sub.2, R.sub.3 and R.sub.4, independently of one another, denote hydrogen atoms, straight-chain or branched alkyl groups having 1 to 30 carbon atoms, mononuclear or polynuclear cycloaliphatic radicals having 5 to 12 carbon atoms, oxethyl groups of the general formula --(CH.sub.2 --CH.sub.2 --O).sub.n --R in which n denotes a number from 1 to 10 and R denotes a hydrogen atom, a (C.sub.1 -C.sub.

Abstract: Disclosed is a thermosetting resin composition comprising (a) a preliminary reaction product between a polyamino compound and an unsaturated bismaleimide compound, (b) an epoxy group-containing vinyl compound, (b') a vinyl group-free aliphatic or aromatic halogenated epoxy compound, (c) an epoxy curing agent and (d) a radical polymerization initiator as indispensable components. This composition is characterized in that the vinyl group-free aliphatic or aromatic halogenated epoxy compound as the component (b') is incorporated. This unsaturated bismaleimide type thermosetting resin composition is excellent in not only heat resistance and strength but also flame retardancy and light weight characteristic.

Abstract: An electrically conductive coating composition is useful for a primer or a surfacer paint for a plastic article, in particular one having a small polarity on the surface, and comprises (A) a polyurethane, (B) a spiro-ortho-ester resin of the ring-opening expansive property, (C) a cellulose derivative, (D) a hydroxy-containing surfactant and (E) an electrically conductive material.

Abstract: Disclosed is a polyester molding composition containing a reinforcing material and a halogenated flame retardant, the polyester containing repeat units from terephthalic acid and 1,4-cyclohexane-dimethanol, the composition further comprising an additive system which enhances the flame retardancy thereof without detrimental loss of mechanical properties, said composition characterized as having a heat deflection temperature of greater than 250.degree. C., a tensile strength of greater than 16,000 psi, a flexural strength of greater than 21,500 psi and a notched Izod impact strength of greater than 1.5.

Abstract: A flame retardant, curing adhesive film having improved OSU heat release properties is provided. The film contains decabromophenylene oxide and antimony trioxide as a flame retardant agent.