Heavy Metal Patents (Class 523/459)
  • Patent number: 9056438
    Abstract: A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C—Z1—CH2CH2CH2—Z2—CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: June 16, 2015
    Assignee: 3M Innovative Properties Company
    Inventor: Eric G. Larson
  • Publication number: 20140312536
    Abstract: Provided is an epoxy resin composition including a nano-sized radioactive radiation shielding material which has superior shielding effects for against radiation, and to a method for preparing same. In particular, the method for preparing the epoxy resin composition for neutron shielding, includes the steps of: a step of mixing a boron compound powder for absorbing neutrons, optionally a high density metal powder for shielding from against gamma rays and a flame retardant powder, respectively separately or in combination, with an amine-based curing agent to obtain a mixture of a curing agent and a powder; an ultrasonic wave treating step of applying ultrasonic waves to the mixture to coat the surface of the powder with the amine-based curing agent and to disperse the powder in the curing agent; and a dispersing step of mixing and dispersing the amine-based curing agent, that was dispersed and includes the powder treated with ultrasonic waves, in an epoxy resin.
    Type: Application
    Filed: May 11, 2012
    Publication date: October 23, 2014
    Applicant: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Jae-Woo Kim, Ji-Heon Jun, Yeon-Joo Bae
  • Publication number: 20140272574
    Abstract: A binder composition for a rechargeable battery, including a binder polymer having a glass transition temperature (Tg) of 20° C. or less, and having a storage modulus (60° C.) of 50-150 MPa. The binder composition according to an embodiment can improve life characteristics of the rechargeable battery by efficiently controlling expansion of a negative electrode plate.
    Type: Application
    Filed: January 7, 2014
    Publication date: September 18, 2014
    Applicant: SAMSUNG SDI CO., LTD.
    Inventors: Dongho Son, Kijun Kim, Junkyu Cha, Nari Seo
  • Publication number: 20140203771
    Abstract: An electronic package is provided, which includes: a substrate, a charging module and a coil module disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the charging module and the coil module. The coil module has a plurality of coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils. Further, the adhesive compound comprises a metal oxide. Compared with the conventional ferrite, the adhesive compound is flexible and not easy to crack or break during transportation or assembly, thereby greatly improving the charging efficiency of the electronic package.
    Type: Application
    Filed: August 6, 2013
    Publication date: July 24, 2014
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Tsung-Hsien Hsu, Hsin-Lung Chung, Te-Fang Chu, Chia-Yang Chen, Kwok-Yan Lam
  • Publication number: 20140199539
    Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
    Type: Application
    Filed: January 27, 2014
    Publication date: July 17, 2014
    Applicants: KOYO ENGINEERING CO., LTD., MEISEI INDUSTRIAL COMPANY LIMITED
    Inventors: Hirotaka YAMASHIRO, Yasuhisa MAEDA, Shuichi SAITOH, Katsuhisa KASHIWAZAKI
  • Publication number: 20140187679
    Abstract: This invention relates to a resin composition with good workability, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and an inorganic filler having a nanocone shape, and to an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jik Lee, Joon Ho Bae, Hyun Chul Jung
  • Publication number: 20140187676
    Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.
    Type: Application
    Filed: March 17, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Lee, Boum Seock Kim, Eun Tae Park, Se Hoon Jeong
  • Publication number: 20140177194
    Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.
    Type: Application
    Filed: December 26, 2012
    Publication date: June 26, 2014
    Inventors: Hitesh Arora, Mihir A. Oka, Chandra M. Jha
  • Patent number: 8697237
    Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: April 15, 2014
    Assignee: Panasonic Corporation
    Inventors: Hirohisa Hino, Taro Fukui, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi
  • Patent number: 8680179
    Abstract: The invention provides a composite composition comprising a cationically polymerizable organic resin, a cationic photoinitiator, a hydrolysate and/or condensate of at least one hydrolysable silane compound and inorganic nanoparticles. The composite composition is suitable for the preparation of patterned moulded articles or substrates having a patterned coating, in particular by photolithography. Micropatterns obtained show improved properties, such as a high shape stability and an excellent elastic modulus.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: March 25, 2014
    Assignees: Leibniz-Institut fuer Neue Materialien gemeinnuetzige GmbH, Canon Kabushiki Kaisha
    Inventors: Etsuko Hino, Mitsutoshi Noguchi, Norio Ohkuma, Yoshikazu Saito, Carsten Becker-Willinger, Pamela Kalmes, Michael Veith
  • Publication number: 20140063427
    Abstract: There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter.
    Type: Application
    Filed: November 21, 2012
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Kyu LEE, Seong Hyun Yoo, Hyun Jun Lee, Jin Seok Moon, Keun Yong Lee
  • Patent number: 8575238
    Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodephenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at last one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to- a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: November 5, 2013
    Assignee: Raytheon Company
    Inventors: Thomas K. Dougherty, Christopher T. Snively, Steven E. Lau, William J. Wolfgong, Cindy W. Ma, Stephen L. Schrader
  • Publication number: 20130203897
    Abstract: Electrical insulation system with improved electrical breakdown strength, including a hardened polymer component having incorporated therein a filler material and a nano-scale sized filler material. The hardened polymer component is selected from epoxy resin compositions, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclo-pentadiene. The filler material has an average particle size within the range of 1 ?m-500 ?m, and is present in a quantity within the range of 40%-65% by weight, calculated to the total weight of the insulation system. The nano-scale sized filler material is a pretreated nano-scale sized filler material, having been produced by a sol-gel process. The nano-scale sized filler material is present within the electrical insulation system in an amount of about 1%-20% by weight, calculated to the weight of the filler material present in the electrical insulation system.
    Type: Application
    Filed: August 3, 2012
    Publication date: August 8, 2013
    Applicant: ABB RESEARCH LTD
    Inventors: Xavier KORNMANN, Lars E. Schmidt, Andrej Krivda, Felix Greuter, Martin Carlen
  • Patent number: 8465666
    Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: June 18, 2013
    Assignee: Panasonic Corporation
    Inventors: Toshiyuki Asahi, Yukihiro Shimasaki, Koji Shimoyama
  • Publication number: 20130072597
    Abstract: The invention relates to non aqueous curing agents for water dispersed epoxy resins. The curing agent composition offers a binder pot life of several hours, and in the presence of a metal, such as zinc, nearly no hydrogen generation is observed. The present curing composition can be mixed with a metal powder to provide a storage stable paste. The curing agent composition and/or paste is fully compatible with an epoxy water based resin. After low shear blending, the epoxy curing agent and metal system is storage stable for several hours working pot life that provides for cured coatings having good performance.
    Type: Application
    Filed: March 4, 2011
    Publication date: March 21, 2013
    Applicant: MOMENTIVE SPECIALTY CHEMICALS INC.
    Inventors: Jim Elmore, Pascale Claeys-Bouuaert, Françoise Heine
  • Publication number: 20120316266
    Abstract: There is provided a colloidal particle of an oxide of at least one metal selected from the group consisting of Ti, Fe, Zr, Sn, Ta, Nb, Y, Mo, W, Pb, In, Bi, and Sr, which is capable of being dispersed in a hydrophobic organic solvent, and a hydrophilic organic solvent dispersed sol thereof or a sol thereof dispersed in a hydrophobic organic solvent having a solubility of water of 0.05 to 12% by mass, and further, a fine powder of a metal oxide colloidal particle capable of being redispersed in various organic solvents. A silane treated modified metal oxide colloidal particle on the surface of which an amine compound and 1 to 4 silyl group(s) per 1 nm2 of the surface area are bonded, and which is produced by coating a metal oxide colloidal particle as a core with a complex oxide colloidal particle.
    Type: Application
    Filed: January 19, 2011
    Publication date: December 13, 2012
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Yoshinari Koyama, Motoko Asada, Tomoki Furukawa, Natsumi Tsuihiji
  • Publication number: 20120288700
    Abstract: A coating for a substrate is a cured coating composition which includes binder and particles, wherein the particles are inorganic, organic or organo-metallic; have diameters between about 1 and 500 nm; may be treated with a surface modifer; and wherein the cured coating composition is in direct or indirect contact with the substrate.
    Type: Application
    Filed: November 10, 2010
    Publication date: November 15, 2012
    Inventors: Robert McMullin, Fred Lewchik, Terry Lester
  • Publication number: 20120263966
    Abstract: A resin composition for a pre-coated steel sheet having excellent welding properties, corrosion resistance and workability, a method of producing a pre-coated steel sheet using the same, and a pre-coated steel sheet are provided. More particularly, a metal resin composition for coating a film is provided. The composition includes a subject resin, a curing agent, and at least one kind of metal powder selected from the group consisting of Ni, Co, Mn, Fe, Ti, Cu, Al, Zn, Sn and Fe2P powder, and has an average short-axis diameter (?) satisfying the condition t/3???3t (where t is a thickness of a dried coating film formed by coating a resin metal composition for coating the coating film). Therefore, the steel sheet to which the metal resin composition is coated has excellent welding properties, corrosion resistance and workability.
    Type: Application
    Filed: December 7, 2010
    Publication date: October 18, 2012
    Applicant: POSCO
    Inventors: Jin Ho Jung, Je Hoon Baek, Jong Gi Oh, Yong Gyun Jung
  • Publication number: 20120207986
    Abstract: A structural reinforcement material is provided that includes a base material selected from thermosets, low viscosity thermoplastics with short transition phases and low viscosities, low melting point metallic alloys, and combinations thereof. At STP, the structural reinforcement material is a solid or a formable dough or a mixture thereof. When heated to an activation temperature, the structural reinforcement material becomes flowable into a cavity. Following cooling, the structural reinforcement material is a solid or a thermoset with a strength sufficient to reinforce the cavity. A structural reinforcement insert comprising the structural reinforcement material is also provided, as is a reinforced cavity of an automobile and a method of reinforcing a cavity.
    Type: Application
    Filed: April 3, 2012
    Publication date: August 16, 2012
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Vincent BELPAIRE, Dominique MELLANO, Norman BLANK, Juergen FINTER
  • Publication number: 20120153532
    Abstract: A plastic molding material contains at least one filler and a polymer resin, selected from the group made up of cyanate ester resins, epoxy novolac resins, multifunctional epoxy resins, bismaleimide resins and their mixtures. The proportion of filler in the plastic molding material is in the range of 65 to 92 wt. %, with reference to the overall mass of the plastic molding material.
    Type: Application
    Filed: April 6, 2010
    Publication date: June 21, 2012
    Inventors: Irene Jennrich, Andre Zimmermann, Frieder Sundermeier
  • Publication number: 20120077040
    Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.
    Type: Application
    Filed: December 7, 2011
    Publication date: March 29, 2012
    Applicant: Korea Electrotechnology Research Institute
    Inventors: Hyo-yul PARK, Myeong-sang Ahn, Dong-jun Kang, Dae-young Jung
  • Publication number: 20110263754
    Abstract: A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed.
    Type: Application
    Filed: January 6, 2009
    Publication date: October 27, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Mark B. Wilson, Michael J. Mullins, Perrin Shao Ping Ren, Frank Y. Gong, Ludovic Valette
  • Publication number: 20110257299
    Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.
    Type: Application
    Filed: January 6, 2009
    Publication date: October 20, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Tomoyuki Aoyama, Frank Y. Gong, Bernd Hoevel, Michael J. Mullins, Perrin Shao Ping Ren, Joey W. Storer, Hung-Jue Sue, Ludovic Valette, Anteneh Z. Worku, Raymond J. Thibault
  • Publication number: 20110224330
    Abstract: Fiber reinforced composites fabricated using a low-temperature, solution-based growth of nanowires such as ZnO nanowires on the surface of the reinforcing fibers such as carbon fibers and functionalized aramid fibers. The composites with nanowire interphase may have an enhanced fiber/matrix interface strength and a comparable in-plane strength, as compared to similar composites without such nanowire interphase.
    Type: Application
    Filed: June 26, 2009
    Publication date: September 15, 2011
    Inventors: Henry A. Sodano, Gregory John Ehlert
  • Publication number: 20110224329
    Abstract: A method comprising (a) mixing a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, into a dispersant to provide a dispersion; and (b) adding the dispersion to a varnish, is disclosed.
    Type: Application
    Filed: January 6, 2009
    Publication date: September 15, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Frank Y. Gong, Michael J. Mullins, Raymond J. Thibault, Wayne Yi
  • Publication number: 20110218273
    Abstract: A process comprising: contacting a) an epoxy resin; b) a compound selected from the group consisting of a phenol-containing compound, an isocyanate-containing compound, and mixtures thereof and c) a stabilizer comprising a metal-containing compound, said metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof; in the presence of a catalyst in an advancement reaction zone under advancement reaction conditions to produce an advancement reaction product is disclosed.
    Type: Application
    Filed: December 15, 2009
    Publication date: September 8, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Raymond J. Thibault, Michael J. Mullins
  • Patent number: 7981977
    Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: July 19, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Kazuyoshi Tendou, Satoru Tsuchida, Shinsuke Hagiwara
  • Patent number: 7892647
    Abstract: The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents that selectively absorb infrared radiation. In various embodiments of the present invention, an interlayer includes lanthanum hexaboride, which effectively absorbs infrared radiation at about 1,000 nanometers, and an epoxy, which stabilizes the lanthanum hexaboride agent.
    Type: Grant
    Filed: December 14, 2005
    Date of Patent: February 22, 2011
    Assignee: Solutia Incorporated
    Inventors: William Keith Fisher, Bruce Edward Wade, Paul Daniel Garrett
  • Patent number: 7888411
    Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: February 15, 2011
    Assignee: Creative Electron, Inc.
    Inventors: Matthew Wrosch, Miguel Albert Capote, Janet Fox, legal representative, Alan Grieve
  • Publication number: 20110009521
    Abstract: The invention provides an epoxy nanocomposite material for dental therapy, which can be applied to direct or indirect clinical restoration, dental core-post system, and dental brace etc. The epoxy nanocomposite filling material provided by the invention can be polymerized with various curing agents to form the polymer with low shrinkage.
    Type: Application
    Filed: February 5, 2010
    Publication date: January 13, 2011
    Applicant: National Taiwan University
    Inventors: Wei-Fang Su, Sheng-Hao Hsu, Yun-Yuan Tai, Min-Huey Chen
  • Publication number: 20100297422
    Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating composition comprising a substantially non-zinc containing primer and a topcoat. The primer includes an epoxy resin having an epoxy equivalent weight of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a hydroxyl equivalent weight of about 200 to about 500, and a filler material. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 520 to about 930, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a carboxyl functional polyester with an acid number of about 45 to about 75 mg KOH/g, a foaming agent and a reinforcing fiber.
    Type: Application
    Filed: January 23, 2009
    Publication date: November 25, 2010
    Applicant: Akzo Nobel Coatings International B.V.
    Inventor: Chad Lucas
  • Patent number: 7811668
    Abstract: Epoxy resins comprising deagglomerated barium sulphate with an average particle size of less than 0.5 ?M feature increased flexural impact strength and breaking extension. Epoxy resins of this kind can be used as, for example, composite material or binders in watercraft construction, in wind turbines, in pipes, for containers or in aircraft construction, in particular in composite materials comprising glass fibre or carbon fibre.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: October 12, 2010
    Assignee: Solvay Infra Bad Hoenningen GmbH
    Inventors: Rainer Stahl, Won Jai Park, Ferdinand Hardinghaus, Christopher David Glende, Karl Koehler
  • Publication number: 20100255312
    Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.
    Type: Application
    Filed: November 17, 2009
    Publication date: October 7, 2010
    Inventors: Thomas K. Dougherty, Christopher T. Snively, Steven E. Lau, William J. Wolfgong, Cindy W. Ma, Stephen L. Schrader
  • Patent number: 7772333
    Abstract: Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a film-forming resin includes reacting various polymers to incorporate a pendent group comprising a —Si(OR)3 group. Film-forming resins can be used in methods of producing coating compositions. Coating compositions can be used to coat a substrate, such as a metal substrate, by electrodeposition. Applied coatings containing the film-forming resins can be cured to form crosslinked films on substrates.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: August 10, 2010
    Assignee: BASF Coatings GmbH
    Inventors: Sergio Gonzalez, Timothy S. December
  • Patent number: 7759436
    Abstract: Film-forming materials include nonionic metal coordinating structures. Nonionic metal coordinating structures can coordinate metals, such as metal catalysts and metal substrates. Example film-forming materials can be the product of a poly-functional epoxide and a nucleophilic ligand having a nonionic metal coordinating structure, or the product of a poly-functional alcohol and an electrophilic ligand having a nonionic metal coordinating structure.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 20, 2010
    Assignee: BASF Coatings GmbH
    Inventors: Timothy S. December, Sergio Gonzalez, Günther Ott, Karl-Heinz Grosse-Brinkhaus
  • Patent number: 7632545
    Abstract: In one embodiment, a radiation shielding composition comprises lead oxide or lead composite material of predetermined particle size, and an adhesive, wherein the composition comprises free flow property.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: December 15, 2009
    Assignee: General Electric Company
    Inventors: Cariappa Achappa Baduvamanda, Bhaskar Raj
  • Patent number: 7625477
    Abstract: This invention provides an electrodeposition paint comprising particles of at least one metallic compound selected from bismuth hydroxide, zirconium compound and tungsten compound, said particles of the metallic compound having an average particle diameter of 1-1,000 nm. The electrodeposition paint forms coating film excelling in corrosion resistance, finished appearance, paint stability and so on.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: December 1, 2009
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Masahide Kawaraya, Toshimitsu Muramatsu, Yuji Hirose
  • Patent number: 7622516
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: November 24, 2009
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Patent number: 7579392
    Abstract: The invention is a formulation that contains: (1) a low-viscosity epoxy resin; (2) a phenolic chain extender whose concentration is less that 0.6 equivalents phenolic hydroxyl group per equivalent of the low-viscosity epoxy resin; (3) a catalyst that promotes self-curing reactions between epoxy groups; (4) an inhibitor that inhibits the activity of the catalyst under “B-staging” conditions; (5) less than 25 weight percent of a volatile organic solvent; and (6) optionally, a multifunctional cross-linking agent. The formulation contains low levels of volatile organic solvent, and can be used to make electrical laminates. It builds molecular weight controllably in B-staging, so that dripping is avoided but the prepreg can be easily laminated.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: August 25, 2009
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, Alan R. Goodson
  • Publication number: 20090018239
    Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
    Type: Application
    Filed: July 21, 2008
    Publication date: January 15, 2009
    Applicant: Henkel Corporation
    Inventors: John G. Woods, Yuhshi Luh, Bruce C.B. Chan, Philip T. Klemarczyk, Andrew D. Messana
  • Patent number: 7462394
    Abstract: The present invention is directed to a passivating material suitable for passivating a metal surface. The passivating material comprises a polymer which comprises (a) at least one nitro group, and/or pyridine group, and/or phenolic hydroxyl group; and (b) at least one group selected from a phosphorous-containing group and/or a carboxylic acid group, wherein the at least one phosphorous-containing group is selected from a phosphate, a phosphite, or a non-nitrogen substituted phosphonate.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: December 9, 2008
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Cathy A. Taylor, Daniel Rardon, Paul Lamers, Kaliappa G. Ragunathan, Shanti Swarup, Michael Hart
  • Patent number: 7348370
    Abstract: A corrosion resistant epoxy primer comprises a epoxy resin, a curing agent, and a non-chromate containing corrosion-inhibiting pigment.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: March 25, 2008
    Assignee: United Technologies Corporation
    Inventor: Promila P. Bhaatia
  • Publication number: 20070299165
    Abstract: An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone and a phenyl group, a curing agent, and a filler.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventors: Deborah Ann Haitko, Slawomir Rubinsztajn
  • Patent number: 7255925
    Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: August 14, 2007
    Assignee: LG Chem, Ltd.
    Inventors: Hyuk-Sung Chung, Bong-Jin Jeon, Hyun-Cheol Kim, Eun-Hae Koo
  • Patent number: 7179853
    Abstract: Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. A resin dispersion of a cationic electrodeposition includes an aqueous dispersion prepared by the following processes. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for neutralization, a reaction product of manganese phosphate and an acid diluted in an deionized water to 10%, and a cationic surfactant.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: February 20, 2007
    Assignee: DPI Co., Ltd.
    Inventors: Hoon Chung, Seung-Jae Baek, Jong-Myung Hong, Ki-Myong Song
  • Patent number: 7157507
    Abstract: A photocurable silver composition is provided which comprises an ultraviolet light curable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake composition comprises at least 20% of the weight of the silver powder. The disclosed compositions may be used to produce silver-containing coatings on a variety of different substrates. Related methods are provided.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: January 2, 2007
    Assignee: Allied PhotoChemical, Inc.
    Inventor: Roy C. Krohn
  • Patent number: 7125917
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: October 24, 2006
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Patent number: 7095125
    Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: August 22, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Patent number: 7008981
    Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: March 7, 2006
    Assignee: Industrial Technology Reserarch Institute
    Inventors: Shur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yi-Kai Chang, Jinn-Shing King
  • Patent number: 6994891
    Abstract: An epoxy composition for application to the surface of a marine vessel. The epoxy composition comprises an epoxy resin and an iron particulate combined with one or more materials, preferably dry materials, which are piped into a feeder and then into a mixer. The dry materials are selected from a group of one or more additives comprising a ceramic material, an amorphous fumed silica such as Cab-O-Sil®, a silicone and a color pigment. The combined mixture is then submitted to a polarizing process so that the iron particulate is magnetized to create a polarized, electromagnetic field. A second mixture comprising an epoxy hardener, a ceramic material and an amorphous fumed silica is produced for ultimately combining with the epoxy resin mixture at the point of application to the marine vessel.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: February 7, 2006
    Inventor: Murray Ginsberg