Elemental Metal Or Metal Compound Other Than As Silicate Dnrm Patents (Class 523/457)
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Patent number: 11466119Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.Type: GrantFiled: March 5, 2018Date of Patent: October 11, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Kazumasa Fukuda, Yoshitaka Takezawa, Naoki Maruyama, Yuka Yoshida, Tomoko Higashiuchi
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Patent number: 11440990Abstract: An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.Type: GrantFiled: September 29, 2017Date of Patent: September 13, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Yuka Yoshida, Naoki Maruyama, Tomoko Higashiuchi, Kazumasa Fukuda, Keiichiro Nishimura, Yoshitaka Takezawa
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Patent number: 11359128Abstract: Cementing compositions including a di- or poly epoxide resin, and amine hardener, and a di- or polyfunctional alkylphosphonate ester fortifier and methods of using the cementing compositions such as in a subterranean zone penetrated by a well bore.Type: GrantFiled: February 21, 2014Date of Patent: June 14, 2022Assignee: HALLIBURTON ENERGY SERVICES, INC.Inventors: Gary P. Funkhouser, Paul Joseph Jones, Greg Robert Hundt
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Patent number: 11352562Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein ??1 is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.Type: GrantFiled: April 9, 2019Date of Patent: June 7, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Tomoko Higashiuchi, Naoki Maruyama, Kazumasa Fukuda, Yoshitaka Takezawa, Hideyuki Katagi, Yuki Nakamura
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Patent number: 11268008Abstract: Various embodiments disclosed relate to a curable composition and resin for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing in a subterranean formation a curable composition. The curable composition can include an epoxy silane monomer, a hardener, and carrier fluid. The curable composition can include an epoxy monomer, an amine silane hardener, and carrier fluid. The method can also include curing the curable composition to form an epoxy silane resin.Type: GrantFiled: August 16, 2019Date of Patent: March 8, 2022Assignee: Halliburton Energy Services, Inc.Inventor: Greg Robert Hundt
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Patent number: 11208525Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.Type: GrantFiled: May 1, 2019Date of Patent: December 28, 2021Assignee: Showa Denko Materials Co., Ltd.Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi
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Patent number: 11203686Abstract: A polymer wax powder having a self-repairing function and a preparation method thereof, wherein the polymer wax powder is prepared from the following components in parts by weight: 55-75 parts of a polyethylene wax, 1-20 parts of an allyl bisphenol A diglycidyl ether epoxy resin, 0.5-2 parts of a hydroxyalkylamide, 0.5-5 parts of a silane coupling agent, 5-25 parts of a carboxyl-terminated saturated polyester, and 0.5-5 parts of an accelerator. The preparation method thereof includes steps of mixing components, melt extruding, micronizing and cross-linking by electron irradiation. A composite polymer wax micropowder with an average particle size of 1 ?m-70 ?m could be prepared by the above method; such wax micropowder may be used as a self-repairing functional additive for a polyester type or epoxy polyester type powder coating, thereby improving the surface hardness and stain resistance of the powder coating, and imparting a self-repairing function to the coating material.Type: GrantFiled: September 7, 2018Date of Patent: December 21, 2021Assignee: NANJING TIANSHI NEW MATERIAL TECHNOLOGIES CO., LTDInventors: Haikuo Yu, Hua Ren, Tingting Gu, Xiangkang Meng
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Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same
Patent number: 11186674Abstract: Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound; 0.20?b/a?0.60; and??(i) 0.002?c/a?0.014;??(ii) wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).Type: GrantFiled: April 5, 2018Date of Patent: November 30, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Kentaro Sano, Taiki Kuroda, Ayumi Mori, Toshiya Kamae -
Patent number: 11111422Abstract: Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications.Type: GrantFiled: February 5, 2020Date of Patent: September 7, 2021Assignee: PRC-DeSoto International, Inc.Inventors: Renhe Lin, Weibin Cui
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Patent number: 11104832Abstract: Provided are a liquid epoxy resin sealing material capable of suppressing occurrence of fillet cracks generated when an underfill cured product is left under high temperature aerobic conditions, and a semiconductor device using the liquid epoxy resin sealing material. More specifically, provided are the liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by the following formula, wherein 0.5 to 10 parts by mass of (D) the antioxidant agent is contained based on a total of 100 parts by mass of (A) the epoxy resin and (B) the amine curing agent, and the semiconductor device using the liquid epoxy resin sealing material.Type: GrantFiled: February 6, 2018Date of Patent: August 31, 2021Assignee: NAMICS CORPORATIONInventors: Nozomu Sasage, Yohei Hosono
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Patent number: 11091629Abstract: The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at least one alkaline earth oxide.Type: GrantFiled: December 7, 2017Date of Patent: August 17, 2021Assignee: 3M Innovative Properties CompanyInventors: Sohaib Elgimiabi, Frank Neuroth
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Patent number: 10865300Abstract: An aqueous composition comprising: (1) an alkyl cellulose ether, and (2) an acrylic polymer comprising polymerized units of (i) 35 to 65 wt % C1-C4 alkyl acrylates; (ii) 30 to 60 wt % C3-C6 carboxylic acid monomers; and (iii) 2 to 10 wt % of monomers having an alkyl group having at least ten carbon atoms.Type: GrantFiled: August 22, 2016Date of Patent: December 15, 2020Assignees: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Saugata Nad, Ravi Rao, Ashish G. Muratkar, Robert Krasnansky
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Patent number: 10647849Abstract: The present invention provides an epoxy resin composition comprising at least the following component [A], component [B] and component [C], the epoxy resin composition being characterized in that: the mixture of component [A] and component [B] is a mixture that, when temperature is increased at 2° C./min, begins to thicken at temperature (T1) and completes thickening at temperature (T2), temperature (T1) being 80-110° C. and temperature (T1) and temperature (T2) satisfying the relationship of expression (1) 5° C.?(T2?T1)?20° C. expression (1); and the mixture of component [A] and component [C] is a mixture that, when temperature is increased at 2° C./min, begins to cure at temperature (T3), temperature (T1) and temperature (T3) satisfying the relationship of expression (2) 5° C.?(T3?T1)?80° C. expression (2). Component [A]: epoxy resin Component [B]: thickening particle Component [C]: curing agent.Type: GrantFiled: March 30, 2016Date of Patent: May 12, 2020Assignee: TOHO TENAX CO., LTD.Inventors: Toru Kaneko, Yuko Okano
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Patent number: 10597565Abstract: Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications.Type: GrantFiled: July 7, 2017Date of Patent: March 24, 2020Assignee: PRC-DeSoto International, Inc.Inventors: Renhe Lin, Weibin Cui
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Patent number: 10584228Abstract: Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.Type: GrantFiled: May 20, 2016Date of Patent: March 10, 2020Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Yoshitaka Takezawa, Shingo Tanaka, Fusao Hojo
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Patent number: 10280348Abstract: Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.Type: GrantFiled: January 31, 2017Date of Patent: May 7, 2019Assignee: PRC-DeSoto International, Inc.Inventor: Bruce Virnelson
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Patent number: 9913324Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.Type: GrantFiled: December 11, 2014Date of Patent: March 6, 2018Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki Mihara, Kunihiko Ishiguro, Toshimitsu Nakamura, Tetsuya Mieda
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Patent number: 9620257Abstract: Polymer compositions which are antistatic or have been made conductive and the production thereof.Type: GrantFiled: November 2, 2011Date of Patent: April 11, 2017Assignee: Evonik Degussa GmbHInventors: Kathrin Lehmann, Stefan Stadtmueller, Peter Schwab
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Patent number: 9376588Abstract: This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.Type: GrantFiled: April 24, 2012Date of Patent: June 28, 2016Assignee: Dow Global Technologies LLCInventors: Amy Song, Hongyu Chen
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Patent number: 9331151Abstract: The present disclosure regards a method for coupling a graphene layer to a substrate having at least one hydrophilic surface, the method comprising the steps of providing the substrate having at least one hydrophilic surface, depositing on the hydrophilic surface a layer of a solvent selected in the group constituted by acetone, ethyl lactate, isopropyl alcohol, methylethyl ketone and mixtures thereof and depositing on the solvent layer a graphene layer. It moreover regards an electronic device comprising the graphene/substrate structure obtained.Type: GrantFiled: June 30, 2015Date of Patent: May 3, 2016Assignee: STMicroelectronics S.r.l.Inventors: Sebastiano Ravesi, Corrado Accardi, Cristina Tringali, Noemi Graziana Sparta′, Stella Loverso, Filippo Giannazzo
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Patent number: 9051062Abstract: A method for making a fuselage section comprises the steps of assembling a support system. The support system comprises fiber reinforced composite material and includes at least three frames and six stringers. The support system is partially cured via a fast cure process such that the support system attains about eighty percent of its fully cured strength. A skin comprising uncured fiber reinforced composite material is globally positioned such that an inner surface of the skin corresponds to an outer surface of the support system. The skin and the support system are fully cured together. The support system is assembled on a bonding tool having a bonding surface corresponding to an inner surface of the skin.Type: GrantFiled: February 8, 2013Date of Patent: June 9, 2015Assignee: Textron Innovations, Inc.Inventors: Richard Boone, Benjamin De Putter
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Publication number: 20150141550Abstract: The present invention relates to a polyarylene sulfide resin composition having excellent impact resistance in which a polyarylene sulfide resin having a specific end group, an epoxy-containing olefin-based elastomer, and/or an organic or inorganic filler are included, and a preparation method thereof.Type: ApplicationFiled: June 5, 2013Publication date: May 21, 2015Applicant: SK CHEMICALS CO.,LTD.Inventors: Byoung Gook Kang, Il-Hoon Cha, Sung-Gi Kim, Se-Ho Lee
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Publication number: 20150140883Abstract: A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.Type: ApplicationFiled: January 28, 2015Publication date: May 21, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takabumi OOMORI, Keiichi HASEBE
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Publication number: 20150140337Abstract: According to one or more embodiments, a polymeric article includes a polymeric composition, which in turn includes a polymeric material in a first weight percent, a non-metallic fibrous material in a second weight percent, and a metallic fiber material in a third weight percent and being intermixed with the non-metallic fibrous material. The polymeric material may include at least one of epoxy, vinyl ester, and/or polyester. The fibrous material may include at least one of glass fiber and carbon fiber. The metallic fiber material may include at least one of steel and aluminum.Type: ApplicationFiled: November 19, 2013Publication date: May 21, 2015Applicant: Ford Global Technologies, LLCInventors: Rick H. Wykoff, Mohammed Omar Faruque, Fubang Wu, Yijung Chen, Matthew John Zaluzec
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Publication number: 20150137362Abstract: A curable composition including: an epoxy resin; and an amine curing component including: an aromatic amine curing agent; and a solubilizer including an aliphatic amine, a cycloaliphatic amine, a non-volatile primary alcohol, non-volatile solvent or a mixture thereof. An electronic assembly including: a substrate; an underfill including a cured product of the curable composition on the substrate; and a ball grid array on the underfill is also disclosed.Type: ApplicationFiled: November 19, 2013Publication date: May 21, 2015Inventors: Steven E. Lau, Steffanie S. Ung
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Publication number: 20150111044Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.Type: ApplicationFiled: December 23, 2014Publication date: April 23, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takaaki OGASHIWA, Hiroshi TAKAHASHI, Tetsuro MIYAHIRA, Yoshihiro KATO
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Patent number: 9005761Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.Type: GrantFiled: December 22, 2011Date of Patent: April 14, 2015Assignee: Elite Material Co., Ltd.Inventor: Yu-Te Lin
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Patent number: 9000071Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.Type: GrantFiled: April 29, 2013Date of Patent: April 7, 2015Assignee: LG Innotek Co., Ltd.Inventors: Jae Man Park, Hae Yeon Kim, SungBae Moon, Jeungook Park, SungJin Yun, JongHeum Yoon, Hyuk Soo Lee, Jaehun Jeong, In Hee Cho
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Publication number: 20150093499Abstract: An insulating material and its method of use of insulating material for rotating machines such as motors and generators. The insulating material includes a resin embedded with a filler that is not based only on a monomodal nanoparticle size particle distribution. Radiation erodes the material and is conductive to the formation of in situ protective layers on the body to be insulated.Type: ApplicationFiled: March 22, 2013Publication date: April 2, 2015Inventors: Peter Gröppel, Christian Meichsner
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Patent number: 8993654Abstract: The invention relates to a graft copolymer latex comprising the which comprises a graft copolymer ABC of at least one olefinically unsaturated monomer C and at least one modified alkyd resin A2B or modified oil A1B which modified alkyd resin A2B or modified oil A1B have chain-pendant olefinically unsaturated groups, to a process for its preparation, and the use thereof a binder in coating compositions.Type: GrantFiled: January 27, 2012Date of Patent: March 31, 2015Assignees: Allnex Belgium SA., Allnex Austria GmbHInventors: Keltoum Ouzineb, José Pierre, Johann Billiani, Gerhard Reidlinger, Philippe Deligny
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Patent number: 8987354Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.Type: GrantFiled: April 25, 2012Date of Patent: March 24, 2015Inventors: Jingxu Zhu, Hiran Perinpanayagam, Mohammad S. Mozumder, Hui Zhang, Wen Shi
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Publication number: 20150064444Abstract: Disclosed is a powder paint composition of and a method for preparing the same. More particularly, the present invention relates to a powder paint composition including a powder paint prepared by physically attaching metallic particles to a powder resin, which exhibits no separation or aggregation of metallic particles when coated and significantly improves metallic texture owing to orientation of the metallic particles, and a method for preparing the same.Type: ApplicationFiled: December 18, 2013Publication date: March 5, 2015Applicant: HYUNDAI MOTOR COMPANYInventor: Hwan Oh Kim
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Publication number: 20150065612Abstract: An electrical insulation body for a high-voltage rotary machine is provided. The electrical insulation body has a synthetic resin which is produced by reacting an epoxy with a hardener, and to which a filler component comprising particles is added, wherein the mass fraction of chlorine in the epoxy is less than 100 ppm.Type: ApplicationFiled: February 1, 2013Publication date: March 5, 2015Applicant: Siemens AktiengesellschaftInventors: Peter Groppel, Christian Meichsner, Friedhelm Pohlmann
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Publication number: 20150056756Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.Type: ApplicationFiled: April 5, 2013Publication date: February 26, 2015Inventors: Sathid Jitjongruck, Anongnat Somwangthanaroj
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Patent number: 8962712Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.Type: GrantFiled: June 14, 2012Date of Patent: February 24, 2015Assignee: Taiyo Holdings Co., Ltd.Inventors: Nobuhito Ito, Kazuyoshi Yoneda, Masao Arima
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Publication number: 20150044451Abstract: Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness.Type: ApplicationFiled: November 20, 2012Publication date: February 12, 2015Inventors: Masayoshi Kido, Yoshihide Sekito
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Patent number: 8952097Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.Type: GrantFiled: September 26, 2012Date of Patent: February 10, 2015Assignee: Sika Technology AGInventors: Jürgen Finter, Matthias Gössi
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Publication number: 20150034369Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.Type: ApplicationFiled: July 3, 2012Publication date: February 5, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Naoki Kashima, Keiichi Hasebe, Seiji Shika, Yoshinori Mabuchi, Yoshihiro Kato
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Patent number: 8946323Abstract: The present invention relates to an acidic aqueous particulate composition containing, in addition to iron(III) ions, fluoride ions and at least one water-insoluble, dispersed organic binder, a water-insoluble, dispersed oxide pigment with elevated resistance to agglomeration for the autophoretic deposition of organic-inorganic hybrid layers onto metal surfaces, the composition additionally containing at least one anionic wetting agent which comprises functional groups selected from sulfonates, phosphonates and/or carboxylates. The invention furthermore comprises the use of such a composition for the autodeposition of a film-forming organic-inorganic hybrid coating onto metal surfaces which are at least in part selected from surfaces, the main constituents of which are iron, zinc and/or aluminum.Type: GrantFiled: November 9, 2011Date of Patent: February 3, 2015Assignee: Henkel AG & Co. KGaAInventors: Ulrike Schmidt-Freytag, Ute Herrmann
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Publication number: 20150031798Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.Type: ApplicationFiled: August 18, 2014Publication date: January 29, 2015Inventors: Jens ROCKS, Walter Odermatt
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Patent number: 8940827Abstract: The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.Type: GrantFiled: September 30, 2009Date of Patent: January 27, 2015Assignee: Globe Composite Solutions, Ltd.Inventor: Xiujun Wang
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Publication number: 20150014032Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.Type: ApplicationFiled: January 24, 2013Publication date: January 15, 2015Inventors: Keiichi Hasebe, Seiji Shika, Naoki Kashima, Yoshinori Mabuchi
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Publication number: 20150004309Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include a powder coating composition comprising a polymeric binder and an application package. The application package includes at least one antistatic component and at least one post-blended component. Use of the application package reduces back ionization and faraday cage effects during electrostatic application. The described methods provide coatings with optimal surface smoothness and edge coverage.Type: ApplicationFiled: September 19, 2014Publication date: January 1, 2015Applicant: VALSPAR SOURCING, INC.Inventors: Thomas Reno, Robert Breitzman
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Patent number: 8921461Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.Type: GrantFiled: November 2, 2012Date of Patent: December 30, 2014Assignee: Sumitomo Bakelite Co., LtdInventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
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Publication number: 20140353004Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.Type: ApplicationFiled: May 5, 2014Publication date: December 4, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Chul Jung, Joon Seok Kang, Jang Bae Son, Sang Hyun Shin, Kwang Jik Lee, Hye Sook Shin
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Patent number: 8883883Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.Type: GrantFiled: May 28, 2010Date of Patent: November 11, 2014Assignee: Sumitomo Bakelite Co., Ltd.Inventor: Masahiro Wada
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Publication number: 20140318839Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.Type: ApplicationFiled: July 27, 2012Publication date: October 30, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Sung Bae Moon, Jae Man Park, Jong Heum Yoon, Hae Yeon Kim, In Hee Cho
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Publication number: 20140314959Abstract: The present invention relates to a method for the establishment of a crack resistant epoxy paint coat and paint compositions suitable for said method. The method is developed for use in ballast tanks e.g. a ballast tank of a vessel. The method involves the steps: (i) applying a paint composition comprising an epoxy-based binder system onto the surface thereby forming a curable paint film on the surface, and (ii) allowing the curable paint film to cure thereby forming the epoxy paint coat. The paint composition has a viscosity of at the most 140 KU, when ready to be applied. The paint composition comprises 35-80% by solids volume of the paint of an epoxy-based binder system having a ratio between the hydrogen equivalents and the epoxy equivalents in the range of 20:100 to 120:100. The paint composition furthermore comprises 0.5-30% by solids volume of the paint of one or more fibres. The fibres have an average length, of at the most 250 ?m.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Applicant: HEMPEL A/SInventors: Kim SCHEIBEL, Jørn KAHLE, Michael Stanley PEDERSEN, Lars Thorslund PEDERSEN
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Patent number: 8846790Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.Type: GrantFiled: July 26, 2011Date of Patent: September 30, 2014Assignee: Taiwan Union Technology CorporationInventors: Cheng Ping Liu, Tsung Hsien Lin, Hsien Te Chen, Chih Wei Liao
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Publication number: 20140272574Abstract: A binder composition for a rechargeable battery, including a binder polymer having a glass transition temperature (Tg) of 20° C. or less, and having a storage modulus (60° C.) of 50-150 MPa. The binder composition according to an embodiment can improve life characteristics of the rechargeable battery by efficiently controlling expansion of a negative electrode plate.Type: ApplicationFiled: January 7, 2014Publication date: September 18, 2014Applicant: SAMSUNG SDI CO., LTD.Inventors: Dongho Son, Kijun Kim, Junkyu Cha, Nari Seo