With Phenolic Reactant Or Polymer Thereof And Is Free Of 1,2-epoxy Groups Patents (Class 525/109)
  • Patent number: 10787560
    Abstract: Novel method for production of epoxy terminated butadiene and butadiene acrylonitrile copolymer tougheners synthesized through the use of hydroxyl terminated polybutadiene and hydroxyl terminated butadiene acrylonitrile copolymers as starting materials. The epoxy terminated butadiene and butadiene acrylonitrile copolymers synthesized by the novel method have unexpectedly lower viscosity, contain no free epoxy and provide good improvements in T-peel resistance over traditional tougheners produced using traditional methods. Adhesives, composites and coatings utilizing the tougheners of the inventive method are within the scope of the invention.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: September 29, 2020
    Assignee: Emerald Specialty Polymers, LLC
    Inventors: Jeremy Pasatta, Yu Chen
  • Patent number: 10480670
    Abstract: In order to provide a fluid control valve less likely to cause contamination, and a fluid control apparatus using the fluid control valve, at least any one of a valve seat member and a valve body member is one including a base body made of metal; and a resin layer that covers the surface of the base body to form a valve seat surface or a seating surface, in which the resin layer is directly chemically bonded to the base body.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: November 19, 2019
    Assignee: HORIBA STEC, Co., Ltd.
    Inventors: Shigeyuki Hayashi, Kazuya Shakudo
  • Patent number: 10422959
    Abstract: The present invention provides a method for fabricating a metallic micro/nanostructure at an optical fiber end-facet by the glue-and-strip method, wherein, firstly a metallic micro/nanostructure is fabricated on a substrate which has a relatively low binding force with it, then an optical fiber end-facet is applied with an adhesive, or a surface of the metallic micro/nanostructure is applied with the adhesive, after that, the optical fiber end-facet and the metallic micro/nanostructure are glued at a predetermined angle, and finally, the adhesive is cured and the optical fiber end-facet and the metallic micro/nanostructure are stripped off the substrate to complete the fabrication. The present invention is based on the idea in the glue-and-strip method that a noble metal is stripped off a weakly bound substrate, and thus demonstrates a new method which enables fabricating a metallic micro/nanostructure at an optical fiber end-facet with high quality, and the process of which is simple, fast, and low cost.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: September 24, 2019
    Assignee: XU YUAN BIOTECHNOLOGY COMPANY
    Inventor: Tian Yang
  • Patent number: 10239056
    Abstract: A micro flow channel chip having high shape accuracy is provided. A micro flow channel chip includes a base material 12 having a groove 121 formed on one surface; and a resin film 14 joined to the surface of the base material 12 so as to cover the groove 121 of the base material 12, in which the resin film 14 contains a (meth)acrylic resin (A), and the (meth)acrylic resin (A) contains a structural unit (A1) represented by Formula (1). (In Formula (1), R1 and R2 each independently represent a hydrogen atom, a methyl group, an ethyl group, or a propyl group; and R3 represents an alkyl group having 3 to 6 carbon atoms).
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: March 26, 2019
    Assignee: SUMITOMO BAKELITE COMPANY LIMITED
    Inventor: Hirohito Taniguchi
  • Patent number: 10227425
    Abstract: Vulcanizates with desirable properties can be obtained from compounds incorporating polymers that include hydroxyl group-containing aryl functionalities. The functionalities can be incorporated by using any or all of appropriate initiators, monomers and optional terminating compounds. Such polymers exhibit excellent interactivity with both conventional and non-conventional fillers.
    Type: Grant
    Filed: October 26, 2014
    Date of Patent: March 12, 2019
    Assignee: Bridgestone Corporation
    Inventors: Yuan-Yong Yan, Zengquan Qin, Xiao-Dong Pan, Dennis R. Brumbaugh
  • Patent number: 10196513
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: February 5, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Tomoya Yamazawa, Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe
  • Patent number: 10155838
    Abstract: A new polyurethane (PU) adhesive composition having unique properties in automotive related applications such as composite bonding.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: December 18, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Andreas Lutz, Daniel Schneider, Stefan Schmatloch, Ilona Caderas
  • Patent number: 10125276
    Abstract: Coating compositions that have resistance to sulfur staining along with corrosion resistance are disclosed. The coating compositions comprise a blend of: (a) one or more carboxylic acid group-containing polymers, (b) a dispersion of zinc oxide in a polysilicone resin. The coating compositions are typically applied to the internal surface of a steel can.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: November 13, 2018
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Christopher Most, Robert McVay
  • Patent number: 9683161
    Abstract: A self-adaptive cement formulation includes cement, water and thermoplastic block-polymer particles. The set cement demonstrates self-healing properties when exposed to methane, and is particularly suited for well-cementing applications. After placement and curing, the self healing properties help maintain zonal isolation should bonding be disrupted between the set cement and the formation or a casing string, should cracks or defects appear in the set-cement matrix, or both.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: June 20, 2017
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Sylvaine Le Roy-Delage, Laure Martin-Al-Khatib
  • Patent number: 9523059
    Abstract: In a sliding member, a sliding surface of a substrate of fluorine rubber on which another member slides is covered with a coating that is formed of an epoxy resin having a scratch hardness (Pencil Method) after curing of F to 2H and in which fluorine resin powder is dispersed.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: December 20, 2016
    Assignee: JTEKT CORPORATION
    Inventors: Takeshi Kunishima, Takashi Amoh, Keisuke Miyamoto, Masako Jimbo
  • Patent number: 9433501
    Abstract: An inflatable implant is disclosed. The inflatable implant comprises at least one inflation channel for forming an inflatable structure of the inflatable implant; and an inflation media disposed within the at least one inflation channel, wherein the inflation media comprises a mixture of an epoxy resin and a hardener, the mixture is configured to gel at about 37° C in less than about 2.5 hours after mixing to form a gelled mixture.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: September 6, 2016
    Assignee: DIRECT FLOW MEDICAL, INC.
    Inventors: Aruna Perera, Trevor Greenan, Larry Rogers
  • Patent number: 9315629
    Abstract: A heat-curable composition comprises 30-70 mass % of a compound represented by formula (1) and 70-30 mass % of a compound represented by formula (2). In formulae (1) and (2), R1, R2, R3 and R4 are the same as or different from one another, and are independently selected from the group consisting of —H, —CH3, —C(CH3)3 and a group represented by formula (i) for each of compound molecules. In formula (i), Y is selected from the group consisting of —O—, —CH2— and —C(CH3)2—. The heat-curable composition containing the benzoxazine compound has excellent solubility in solvents, heat resistance and flame retardancy, and therefore can be used for providing a cured product of the composition or a varnish.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: April 19, 2016
    Assignee: JFE CHEMICAL CORPORATION
    Inventors: Hiroaki Nakao, Kazuya Takemura
  • Patent number: 8969503
    Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: March 3, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Fabio Aguirre Vargas, Raymond J. Thibault, John Beckerdite
  • Patent number: 8962773
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 24, 2015
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20150050780
    Abstract: The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50° C., (B2) a thermosetting component having a softening point of between 50° C. and 100° C. and (C) a phenol resin having a softening point of no higher than 100° C., the composition containing 11 to 22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening point of below 50° C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50° C. and 100° C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100° C., based on 100 mass % of the resin composition.
    Type: Application
    Filed: March 5, 2013
    Publication date: February 19, 2015
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Tetsurou Iwakura
  • Patent number: 8946343
    Abstract: An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle?Heating value after 1 cycle)/Heating value upon 0 cycle]×100.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: February 3, 2015
    Assignee: Cheil Industries, Inc.
    Inventors: Baek Soung Park, Ki Tae Song, In Hwan Kim
  • Patent number: 8921461
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: December 30, 2014
    Assignee: Sumitomo Bakelite Co., Ltd
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: 8901207
    Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: December 2, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda, Ryohei Masui
  • Patent number: 8859672
    Abstract: A poly(arylene ether)-poly(hydroxy ether) block copolymer includes at least one poly(hydroxy ether) block and at least one poly(arylene ether) block, and the mole ratio of poly(hydroxy ether) blocks to poly(arylene ether) blocks is 0.95:1 to about 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be prepared by reacting a telechelic poly(arylene ether) having terminal hydroxyl groups with a telechelic poly(hydroxy ether) epoxy resin having terminal epoxy groups, wherein the mole ratio of the telechelic poly(hydroxy ether) to the telechelic poly(arylene ether) is 0.95:1 to 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be shaped into an article by extrusion, thermoforming, or molding, and is a compatibilizing agent for non-polar and polar polymers.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: October 14, 2014
    Assignee: Sabic Global Technologies B.V.
    Inventor: Edward Norman Peters
  • Patent number: 8829123
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: September 9, 2014
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20140228483
    Abstract: A thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) a liquid oligomeric butadiene homopolymer; and (4) a curing agent including one or more alkylphenol novolac resins or alkyphenol co-novolac resins, and one or more poly(2,6-dimethyl-1,4-phenylene oxides), which resin composition may be used to prepare composites, prepregs, or laminates.
    Type: Application
    Filed: February 13, 2013
    Publication date: August 14, 2014
    Applicant: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Publication number: 20140228519
    Abstract: Provided are a carbon fiber-reinforced thermoplastic resin composition excellent in interfacial adhesion between carbon fiber and a thermoplastic resin and excellent in dynamic characteristics, and a molding material, a prepreg, and a method for producing the same. The carbon fiber-reinforced thermoplastic resin composition includes the following components (A) and (B), carbon fiber and a thermoplastic resin; component (A): (A1) a bifunctional or higher functional epoxy compound and/or (A2) an epoxy compound which has a monofunctional or higher epoxy group and has one or more taypes of functional groups selected from a hydroxyl group, an amide group, an imide group, a urethane group, a urea group, a sulfonyl group and a sulfo group; and component (B): 0.
    Type: Application
    Filed: September 21, 2012
    Publication date: August 14, 2014
    Inventors: Yoshifumi Nakayama, Toshiya Kamae, Daigo Kobayashi, Makoto Endo
  • Patent number: 8802776
    Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: August 12, 2014
    Assignee: Dexerials Corporation
    Inventors: Taichi Koyama, Hironobu Moriyama, Takashi Matsumura, Takayuki Saito
  • Patent number: 8742018
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: June 3, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George Jacob, Marty J. Null
  • Patent number: 8716401
    Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: May 6, 2014
    Assignee: Lintec Corporation
    Inventors: Yasunori Karasawa, Isao Ichikawa
  • Patent number: 8697803
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: April 15, 2014
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: 8653202
    Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: February 18, 2014
    Assignee: TORAY Industries, Inc.
    Inventors: Koichi Fujimaru, Toshihisa Nonaka
  • Publication number: 20130316155
    Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: November 16, 2012
    Publication date: November 28, 2013
    Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
    Inventors: CHANG-YUAN LI, LI-MING CHOU, LI-CHIH YU, TSE-AN LEE
  • Patent number: 8586683
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: November 19, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8586699
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: November 19, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joesph Gan
  • Patent number: 8563661
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 22, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8541516
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20130230727
    Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 5, 2013
    Applicant: ISOLA USA CORP.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Patent number: 8519067
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: August 27, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yosinori Nishitani
  • Publication number: 20130206333
    Abstract: A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.
    Type: Application
    Filed: July 26, 2011
    Publication date: August 15, 2013
    Applicant: ZEPHYROS, INC.
    Inventor: Michael Czaplicki
  • Patent number: 8507594
    Abstract: Disclosed herein is a flame retardant thermoplastic resin composition including a polycarbonate resin, a branched acrylic copolymer, and a flame retardant. The flame retardant thermoplastic resin composition can have good compatibility as well as good flame retardancy, scratch resistance, colorability and appearance without requiring the addition of a compatibilizer.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: August 13, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Kee Hae Kwon, Il Jin Kim
  • Patent number: 8470936
    Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: June 25, 2013
    Assignee: Namics Corporation
    Inventors: Pawel Czubarow, Osamu Suzuki, Toshiyuki Sato, Kazuyoshi Yamada, Kaori Matsumura
  • Publication number: 20130137218
    Abstract: The present invention provides an under-fill material with which a semiconductor device having a high connection reliability can be provided while securing a usable material by reducing a difference in thermal-responsive behavior between a semiconductor element and an adherend, and a method for producing a semiconductor device using the under-fill material. In the under-fill material of the present invention, a storage elastic modulus E? [MPa] and a thermal expansion coefficient ? [ppm/K] after carrying out a heat-curing treatment at 175° C. for an hour satisfy the following formula (1) at 25° C.
    Type: Application
    Filed: November 27, 2012
    Publication date: May 30, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: NITTO DENKO CORPORATION
  • Patent number: 8445590
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: May 21, 2013
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Patent number: 8440771
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: May 14, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8436108
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: May 7, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20130095639
    Abstract: The present invention relates to a film for back surface of flip-chip semiconductor, which is to be formed on a back surface of a semiconductor element flip-chip connected onto an adherend, wherein an amount of shrinkage of the film for back surface of flip-chip semiconductor due to thermal curing is 2% by volume or more and not more than 30% by volume relative to a total volume of the film for back surface of flip-chip semiconductor before the thermal curing. According to the film for back surface of flip-chip semiconductor according to the present invention, since it is formed on the back surface of a semiconductor element having been flip-chip connected onto an adherend, it fulfills a function to protect the semiconductor element.
    Type: Application
    Filed: April 18, 2011
    Publication date: April 18, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga
  • Publication number: 20130090431
    Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
    Type: Application
    Filed: June 27, 2011
    Publication date: April 11, 2013
    Inventors: Ming Ming, Shaoguang Feng, Yan Fei Liu, Andreas Lutz, Robert D. Froese, Glenn G. Eagle, Gary L. Jialanella, Eric E. Cole, Michael R. Golden
  • Publication number: 20130041088
    Abstract: An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle?Heating value after 1 cycle)/Heating value upon 0 cycle]×100.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 14, 2013
    Inventors: Baek Soung PARK, Ki Tae SONG, In Hwan KIM
  • Patent number: 8372916
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: February 12, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8324326
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: December 4, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: 8314181
    Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: November 20, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Ye-Gang Lin, Donghai Sun, David Xiangping Zou
  • Patent number: 8313836
    Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: November 20, 2012
    Assignee: Isola USA Corp.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Patent number: 8293839
    Abstract: Disclosed herein is a polycarbonate-polysiloxane copolymer resin composition comprising: (A) about 100 parts by weight of a thermoplastic polycarbonate resin; and (B) about 0.1 to about 30 parts by weight of an organo-siloxane polymer having an epoxy group. The polycarbonate-polysiloxane copolymer resin composition has high impact strength at low temperature and high mechanical strength.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: October 23, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Bo Young Kim, Jong Cheol Lim, Tae Gon Kang
  • Publication number: 20120264870
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Application
    Filed: April 9, 2012
    Publication date: October 18, 2012
    Inventor: Charles David Shirrell