Abstract: The invention relates to a resin composition comprising epoxy resin, a cross linking agent for the epoxy resin in the form of a carboxylic anhydride, and at least one allyl network forming compound. According to the invention, the anhydride-functional compound is a copolymer of an ethylenically unsaturated anhydride and a vinyl compound. Notably suitable are styrene-maleic anhydride copolymers known as SMA Type 1. Surprisingly, it was found that the presence of at least 2 wt.% of triallyl cyanurate (TAC) results in an increase in Tg, such that even with simple difunctional epoxy compounds resins can be obtained which have a glass transition temperature of 130.degree. C. and higher. It was further found that the processing as prepreg of epoxy resins cross-linked using anhydride-vinyl copolymers will be greatly enhanced by the presence of at least 10 % of allyl.

Abstract: A coating composition for metal containers, a method of coating a metal container, and a metal article useful as a food or beverage container are disclosed. The coating composition for metal container interiors and exteriors comprises: (a) a low molecular weight polyfunctional epoxy novolac resin; (b) a phenolic resin; (c) a solution grade vinyl chloride copolymer, a high molecular weight epoxy resin or a mixture thereof; (d) about 60% to about 90% by weight of nonvolatile material of a vinyl chloride dispersion resin; and a nonaqueous carrier. The coating composition is stored as a single unit system from manufacture until use without an unacceptable increase in viscosity.

Abstract: There is provided a process for making a gel-containing additive concentrate by mixing a reactive polymer such as SAN and a substantially immiscible carrier polymer such as polycarbonate or polystyrene and reactively extruding the reactive polymer and carrier polymer in the presence of a multi-functional crosslinking agent and catalyst

Abstract: Rigid-rod and segmented rigid-rod polymers, methods for preparing the polymers and useful articles incorporating the polymers are provided. The polymers incorporate rigid-rod backbones with pendant solubilizing groups attached thereto for rendering the polymers soluble.

Abstract: A reinforced elastic body is disclosed, which comprises a chlorosulfonated polyolefin reinforced with polyester fibers having an adhesive containing an isocyanate compound and/or an epoxy compound and an adhesive composed of a mixture of a resorcin-formaldehyde resin and a 2,3-dichlorobutadiene-containing polymer. Also, a production process of the reinforced elastic body is disclosed, which comprises vulcanizing-adhering polyester fibers treated with an adhesive containing an isocyanate compound and/or an epoxy compound and then treated with an adhesive composed of a mixture of a resorcin-formaldehyde resin and a 2,3-dichlorobutadiene-containing polymer to a chlorosulfonated olefin compounded material.

Abstract: A stretched resin film having as a base material a resin composition composed of the following components (A), (B), (C) and (D):(A) a thermoplastic polyester resin100 parts by weight;(B) a modified olefin based resin obtained by graft polymerizing 0.01 to 20 parts by weight of an .alpha.,.beta.-unsaturated carboxylate based monomer having a hydroxyl group and 0.01 to 50 parts by weight of an aromatic vinyl compound onto 100 parts by weight of an olefin based resin3 to 100 parts by weight;(C) a polyethylene resin having a molecular weight of 1,000 to 10,0001 to 10 parts by weight; and(D) a bisphenol epoxy resin1 to 10 parts by weight.

Abstract: A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.

Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

Abstract: A curable coating composition is described comprising two components that are reactive with one another upon curing to form urethane linkages. The urethane-forming components are an active hydrogen groups-containing component and a polyisocyanate, or a carbamate groups-containing component and a carbamate group-reactive component. The composition further comprises a third component that includes one or more epoxide groups. Coatings prepared with this coating composition can be cured and coated with additional coating(s), providing good intercoat adhesion to the subsequent coating.

Abstract: Improved compositions are provided which comprise a poly(phenylene ether) resin, a poly(arylene sulfide) resin, a polyester resin, and a compatibilizer compound. The compositions can further comprise functionalizing agents, impact modifiers, flame retardants, and reinforcing fillers to provide compositions that exhibit improved tensile strength and elongation characteristics. Articles molded from these compositions are useful in the electrical connector industry.

Abstract: A thermoplastic resin composition containing (A) a liquid crystalline polyester and a reaction product of (B) a thermoplastic polymer having a crosslinkable functional group and (C) a crosslinking agent, in which a volume ratio of the polyester (A) to the polymer (B) is from 20:80 to 50:50 and the polyester (A) forms a continuous phase, and a method for producing the same. This composition is cheap and has good properties of the liquid crystalline polyester even in a composition range in which a ratio of the liquid crystalline polyester is small.

Abstract: A process for making reduced gloss thermoplastic resin compositions is provided. The process involves compounding a nitrile polymer with an electrophilic reagent to form a polymeric gel compound, blending the polymeric gel compound with a first thermoplastic resin and a weight ratio of between 5:1 and 0.5:1 to make a concentrate comprising gels dispersed in the first thermoplastic resin, and admixing the concentrate with a second thermoplastic resin produced the desired composition, wherein the concentrate is used at a level of from 2 to 60 percent by weight based on the total weight of the composition. The process provides improved product consistency, and consistently yields a product exhibiting reduced gloss and high levels of impact strength with a uniformly dispersed concentration of polymeric gels therein. The compositions are useful in making molded articles exhibiting consistent reduced gloss and high impact strengths.

Abstract: Gels useful as low gloss additives for blends of addition polymers, such as ABS resins, with polycarbonates are prepared by a melt blending operation in which a polyepoxide such as 3,4-epoxycyclohexyl 3,4-epoxycyclohexanecarboxylate is blended with at least one addition polymer such as a styrene-acrylonitrile copolymer, and concurrently with at least one aromatic polycarbonate in at least two increments. The first increment comprises about 20-60% of total polycarbonate and the second increment is subsequently introduced.

Abstract: A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.

Abstract: The thermoplastic elastomer compositions contain a continuous phase or matrix of an engineering thermoplastic such as ester polymer and a discontinuous phase of an acrylic rubber which is cured substantially by using epoxidized oils. The cured composition which can be dynamically vulcanized has good physical properties such as tensile strength, elongation, and high temperature resistance.

Abstract: A water-based coating composition that does not use an organic solvent is formed by dispersing a resin composition into an aqueous medium. The water-based coating composition has excellent stability over time. The coating film obtained from the composition has excellent retort resistance, adhesion to metals, processability and chemical resistance; and it can be cured at relatively low temperatures.

Abstract: Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

Abstract: Film-forming reactive systems for the surface-to-surface bonding and/or coating of substrates, more particularly for heat-sealable coatings are provided. The system is based on an aqueous dispersion of at least two epoxy-curable resins (I) and an epoxy compound as the curing component (II). The epoxy-curable resins are a polyurethane polymer containing epoxy-reactive functional groups present as the curable resin (Ia) and an aqueous dispersion of an acrylate and/or methacrylate homopolymer or copolymer containing carboxyl and/or methylol groups present as an additional curable resin (Ib). Also provided is a method for the production of laminates which employs the reactive system to bond substrates.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.

Abstract: An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.

Abstract: A resin composition for aqueous coating, comprising as main components(A) a resin having hydroxyl groups and cationic groups, and(B) a compound having, in the molecule, at least two glycidyl groups each in a glycidylamino group represented by the following formula ##STR1## (R is a group selected from a hydrogen atom and a glycidyl group) directly bonding to carbon atoms of the aromatic ring. This composition is excellent in storage stability, low-temperature curability, etc. and is useful in cationic electrocoatings, in particular.

Abstract: An adhesive composition containing a chlorinated ethylene/vinyl acetate copolymer and at least one of a phenolic resin and an aromatic nitroso compound as an adhesion-promoting additive. The chlorinated ethylene/vinyl acetate copolymer can be prepared without the utilization of environmentally hazardous chlorinated solvents and provides for adhesive compositions which exhibit excellent adhesion and resistance to adverse environmental conditions.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: A composition useful as an aqueous anionic electrodepositable coating comprises a film-former of from about 67-95% by weight of a phosphated polyepoxide resin, from about 5-33% by weight of a carboxyl group-containing vinyl addition resin, and up to about 40% by weight of the film-former of a crosslinking agent.

Abstract: Curable compositions which are precursors for cured or partially cured light stabilized epoxy resins which are the product of the reaction of some or all of the epoxy groups of an epoxy resin with an N-(2,2,6,6-tetraalkyl-4-piperidinyl)amic acid hydrazide as well as the cured or partially cured reaction products thereof together with processes for their use and articles of manufacture produced thereby are disclosed.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.

Abstract: Thermoplastic elastomer compositions comprise a blend of polyester resin and a covalently-crosslinked acrylate rubber. Such compositions can be prepared by dynamic vulcanization of the rubber in admixture with the polyester and can exhibit high temperature dimensional stability and low oil swell.

Abstract: This invention relates to a blend comprising a polyester, polycarbonate and an amine functinalized elastomer and optionally an effective amount of an effective graft coupling agent.

Abstract: The new compound N,N,N'N'-tetraglycidyl-3,3'-diethyl-4,4'-diaminodiphenylmethane and curable resin compositions containing it.

Abstract: Compositions containing A) a copolymer based on at least one 1,3-diene and at least one polar, ethylenically unsaturated comonomer and B) a phenol-terminated polyurethane, polyurea or polyurea-urethane of the formula I ##STR1## in which m is 1 or 2, n is 2 to 6, R.sup.1 is the n-valent radical of an elastomeric prepolymer which is soluble or dispersible in epoxide resins, X and Y independently of one another are --O-- or --NR.sup.3 --, it being necessary for one of these groups to be --NR.sup.3 --, R.sup.2 is an m+1-valent radical of a polyphenol or aminophenol after the removal of the phenolic hydroxy group(s) or the amino group or both the amino group and the phenolic hydroxyl group, respectively, and R.sup.3 is hydrogen, C.sub.1 -C.sub.6 alkyl or phenyl, are described.Compounds containing the components A) and B) as well as an epoxide resin C) are also described.The cured products are distinguished by a high peel strength and high resistance to crack propagation.

Abstract: A polyol resin substantially free of epoxy groups is useful as a coating material and is prepared by(i) reacting a bisphenol epoxy resin with a compound having one active hydrogen per molecule and optionally a bisphenol to form a polyol resin having secondary hydroxyl groups, and(ii) esterifying part of the secondary hydroxyl groups with a lactone or a monocarboxylic acid (ester) to form a polyol resin with graft-polymerized polyester moieties.

Abstract: An elastomer-modified phenolic composition is provided which is an reaction product of a phenolic compound and about 5 to about 35 weight percent, based on the total weight of the elastomer-modified phenolic compound, of a functionalized elastomer. Further, there is provided a composition comprising an epoxy resin and a curing agent for the epoxy resin comprising the elastomer-modified phenolic composition. The use of the elastomer-modified phenolic curing agent permits the preparation of low-viscosity powder coating formulations for impact-resistant coatings.

Abstract: Disclosed are a resin composition (D) for coating obtained by reacting (A) an epoxy resin, (B) a butadiene-acrylonitrile copolymer having carboxyl groups or amino groups at both terminals of the molecule and (C) a bifunctional mononuclear phenolic compound, and an electrodeposition coating composition comprising the resin composition (D). The coating compositions have high adhesiveness to metal substrates and may form a high corrosion-resistance coat film having good flexibility, chipping-resistance and low temperature properties. The coating compositions are favorably used in car industrial field.

Abstract: Thermosetting powder coating compositions and their method of application to substrates primed with an electrodeposited coating are disclosed. The powder coating composition comprises a solid particulated mixture of a polyepoxide and an elastomer-modified phenolic compound which is a reaction product of an epoxy resin, a functionalized elastomer and a phenolic compound. The use of the elastomer-modified phenolic composition permits the preparation of low viscosity, stable powder coating formulations for chip-resistant coatings.

Abstract: A vulcanizable rubber composition is disclosed that includes (a) a rubber component selected from natural rubber, synthetic rubber or combinations thereof; (b) a methylene donor; and (c) a methylene acceptor which is the addition product of (1) at least one of the compounds including a dihydric phenol, a polyhydric phenol, a dihydric phenolic resin or a polyhydric phenolic resin, and (2) at least one of the compounds including a mono oxirane compound, an alkylene carbonate having from about 2 to 18 carbon atoms, or a poly oxirane compound. The addition product of this invention is a hydroxylalkyl aryl ether having from about 25 to 85 percent of the hydroxyl groups of the di- or polyhydric phenol or the dior polyhydric phenolic resin unreacted. A reinforced rubber article is also provided.

Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

Abstract: Hardenable mixtures comprising(a) an epoxide resin,(b) a latent epoxide resin hardener which starts to react only at a temperature of at least 80.degree. C. (measured by DSC at a heating rate of 10.degree. C./minute),(c) an amine having at least one amine hydrogen and(d) a thiol having at least one SH group, either the amine (c) having at least two hydrogen atoms bound to one or more nitrogen atoms or the thiol (d) having at least two SH groups, and the difference between the reaction maxima in the DSC diagram at a heating rate of 10.degree. C./minutes being at least 30.degree. C., are suitable for the production of crosslinked products, especially for the production of flexible prepregs having a non-critical B stage and a very good storability.

Abstract: A protective paint coating containing a polymeric binder having both hydrophobic and hydrophilic moieties in the polymeric structure comprises an acrylic-graft terpolymer. The terpolymer comprises aliphatic-modified glycidyl acrylate and epoxy resin coreacted with diphenol to form the terpolymer. Ethylenically unsaturated monomers, including carboxyl monomers, are in-situ copolymerized in the presence of the terpolymer to produce the acrylic-graft terpolymer. The aliphatic-modified glycidyl acrylate component of the terpolymer comprise the reaction product of a glycidyl acrylate and an aliphatic ethylenic monomer having a chain of 2 to 20 carbon atoms. The aliphatic chain and the carboxyl functionality provide the self-contained wetting agent properties to the polymeric binder structure.

Abstract: The present invention relates to a rubber stock containing 0.1 to 10.0 phr of a polyhydric phenoxy resin. The polyhydric phenoxy resins may be used as a replacement for resorcinol and function as a methylene acceptor. The rubber stocks of the present invention exhibit improved tensile strength at break without the inherent fuming problems associated with resorcinol containing rubber stocks. These beneficial properties are obtained while maintaining high low strain stiffness and cord adhesion associated with resorcinol containing stocks.

Abstract: This application describes a water dispersible polymeric vehicle comprising epoxy polymers having about 5 to 50 weight percent mesogens or a cross-linkable blend of an amine salt of a mesogenic carboxylic acid, cross-linker resin and an epoxy polymer, the mesogenic acid providing about 5 to 50 weight percent mesogenic groups to the blend.

Abstract: The present invention provides a resin which is a mixture of a) the product of a diol and one or more diepoxides and b) an A-B-A block copolymer wherein A represents blocks of an epoxy/diol copolymer which is the reaction product of a diol and a diepoxide, and B represents blocks of an epoxy-capped, carboxyl-terminated polybutadiene or polybutadiene/acrylonitrile copolymer.Amine resins, produced by reaction of this resin with an amine are useful as the principal resin in electrocoating formulations which produce deposited films having excellent corrosion resistance and improved impact and chip resistance.

Abstract: A novel thermoplastic composition having improved paint adhesion strength comprising,A) from about 5 to 95 weight % of a6t least one polyphenylene ether.B) from about 95 to 5 weight % of at least one polyamide,C) paint adhesion improving amount of at least one paint adhesion improver selected from the class consisting of(1) homopolymers or copolymers of unsaturated nitrile compounds and(2) homopolymers or copolymers of alkyl (meth)acrylate, excluding an ethylene alkylacrylate copolymer having about 50 weight % or higher of ethylene,D) from about 0.01 to 30 parts by weight of at least one compatibilizer, based on 100 by weight of the total of the polyphenylene either and polyamide.

Abstract: A resin composition, comprisng a glycidyl ether of a hydrogenated conjugated diene polymer, an epoxy resin, and a reaction product of a phenolic compound with formaldehyde, having improved flexibility and thermal stability and useful for sealing a semiconductor device, whereby thermal stress can be effectively reduced.

Abstract: A protective paint coating containing a polymeric binder having both hydrophobic and hydrophilic moieties in the polymeric structure comprises an acrylic-graft terpolymer. The terpolymer comprises aliphatic-modified glycidyl acrylate and epoxy resin coreacted with diphenol to form the terpolymer. Ethylenically unsaturated monomers, including carboxyl monomers, are in-situ copolymerized in the presence of the terpolymer to produce the acrylic-graft terpolymer. The aliphatic-modified glycidyl acrylate component of the terpolymer comprise the reaction product of a glycidyl acrylate and a branched aliphatic ethylenic monomer having a branched chain of 2 to 20 carbon atoms. The branched aliphatic chain and the carboxyl functionality provide the self-contained wetting agent properties to the polymeric binder structure.

Abstract: A cationically electrodepositable resin composition containing as main component primary hydroxyl group-containing cationic resin obtained by reacting epoxy resin (A) having at least three epoxy group-containing functional groups represented by the following structural formula (I) ##STR1## with primary or secondary amine compound (B) containing primary hydroxyl group and optionally, further phenol compound (C) having at least one phenolic hydroxyl group in one molecule, as well as a cationically electrodepositable paint composition containing as main components said cationic resin and curing agent.

Abstract: Curable compositions containingA) an epoxy resin having on average more than one epoxy group per molecule,B) a carboxylic anhydride curing agent for component A) andC) about 5 to 40% by weight, relative to the amount of the components A), B) and C), of a liquid mixture of C1) a polyalkylene glycol based on polypropylene glycol or polybutylene glycol having two to about six hydroxyl, carboxyl, carboxylic anhydride or glycidyl end groups and of C2) an elastomeric copolymer based on butadiene, a polar, ethylenically unsaturated comonomer and, if appropriate, further ethylenically unsaturated comonomers having carboxylic acid, hydroxyl, mercapto or glycidyl ether end groups are described. Components C1) and C2) can also occur together in a segmented copolymer.

Abstract: A cationic electrodeposition coating resin composition composed mainly of(A) a resin containing a primary hydroxyl group and a cationic group, and(B) an epoxy resin which is a copolymer comprising recurring units represented by formula (I) ##STR1## and recurring units represented by formula (II) ##STR2## wherein R denotes a C.sub.3 -C.sub.35 alkyl group, the proportion of the recurring units of formula being 1 to 75% by weight.