Polymer Derived From Ethylenic Reactants Only Derived From Reactant Containing A -cooh Group Patents (Class 525/119)
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Patent number: 11660844Abstract: A composite film includes a) a self-supporting layer of a polymer film (such as a polyester), b) an optional primer layer on the polymer film layer, wherein the primer layer includes a PVdX (X being halo), acrylic or vinyl resin; and c) a layer of heat seal composition on the primer layer, wherein the heat seal composition includes a polyolefin plastomer (POP) resin and a tackifier that constitutes at least 20 wt % of the heat seal composition. The composite film may be formed by applying a coating composition including the heat seal composition in a solvent to a primer layer on the polymer film or directly on the polymer film in absence of the optional primer layer, and then evaporating the solvent. The composite film may be heat-sealed to a surface of a container or a self-supporting film.Type: GrantFiled: September 26, 2018Date of Patent: May 30, 2023Assignee: DuPont Teijin Films U.S. Limited PartnershipInventors: Shengsheng Liu, Fenghua Deng, Julian Neal Robinson, Moira Tayler
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Patent number: 11628652Abstract: A composite film includes a) a self-supporting layer of a polymer film (such as a polyester), b) an optional primer layer on the polymer film layer, wherein the primer layer includes a PVdX (X being halo), acrylic or vinyl resin; and c) a layer of heat seal composition on the primer layer, wherein the heat seal composition includes a polyolefin plastomer (POP) resin and a tackifier that constitutes at least 20 wt % of the heat seal composition. The composite film may be formed by applying a coating composition including the heat seal composition in a solvent to a primer layer on the polymer film or directly on the polymer film in absence of the optional primer layer, and then evaporating the solvent. The composite film may be heat-sealed to a surface of a container or a self-supporting film.Type: GrantFiled: September 26, 2018Date of Patent: April 18, 2023Assignee: DuPont Teijin Films U.S. Limited PartnershipInventors: Shengsheng Liu, Fenghua Deng, Julian Neal Robinson, Moira Tayler
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Patent number: 11447610Abstract: Described herein are articles and methods of making articles, including a transparent composite film having a fiber filler embedded in a polymer network. The polymer network of the transparent composite film is a cured, cross-linked matrix including a first and second structure segment. The structure segments may contribute or impart improved properties in the transparent composite film. The select structure segments can provide increased modulus and reduced glass transition temperature thereby allowing for a desirable balance of flexibility and rigidity in the transparent composite film. The improved transparent composite film is suitable for many applications including use in display devices.Type: GrantFiled: April 26, 2018Date of Patent: September 20, 2022Assignee: Corning IncorporatedInventors: Jun Hou, Kevin Robert McCarthy
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Patent number: 9987785Abstract: Methods and apparatuses are disclosed for applying activatable melt flowable materials to substrates made from synthetic materials. The methods are concerned with formation of appropriate flowable materials, control over the manner in which the flowable materials are applied, treatment of the substrates prior to application of the flowable materials and the selection of the optimum combination of materials for the substrates and the flowable materials. The methods may be particularly suited for applying flowable materials to surfaces to produce components found in automotive, aerospace including trucks, busses and tractors and marine vehicles.Type: GrantFiled: April 26, 2013Date of Patent: June 5, 2018Assignee: Zephyros, Inc.Inventor: Francois Crouzet
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Patent number: 9718987Abstract: This invention relates to bio-based polyfunctional carboxylic acids reacted with vinyl ether compounds to form liquid vinyl-blocked bio-based polyfunctional carboxylic acids. These liquid vinyl-blocked bio-based polyfunctional carboxylic acids can be mixed with a polyfunctional vegetable oil-based epoxy resin to form a homogeneous curable coating composition. Upon curing at elevated temperature, thermoset coatings are formed which have excellent hardness, solvent resistance, adhesion, and flexibility. The invention also relates to the use of a curable coating composition comprising at least one polyfunctional vegetable oil-based epoxy resin and at least one vinyl-blocked bio-based polyfunctional carboxylic acid, which may be coated onto a substrate and cured thermally. Methods of making the vinyl-blocked bio-based polyfunctional carboxylic acids and curable coating compositions and substrates containing the same are also disclosed.Type: GrantFiled: May 20, 2016Date of Patent: August 1, 2017Assignee: NDSU RESEARCH FOUNDATIONInventors: Dean C. Webster, Erin Pavlacky, Curtiss Kovash, Jr.
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Patent number: 9684255Abstract: Provided is a coating agent having a polymerizable compound containing a hydroxyl group in the molecule, conductive inorganic particles whose surface is treated with a dispersing agent having a nitrogen atom in the molecule, and a solvent, in which when the interatomic distance between an oxygen atom of the hydroxyl group and the atom farthest away from the oxygen atom in the molecule of the polymerizable compound is represented by D1 and the interatomic distance between the nitrogen atom and the atom farthest away from the nitrogen atom in the molecule of the dispersing agent is represented by D2, D1 and D2 satisfy the relationship represented by the following formula (1). [(|D1?D2|)/D2]?0.Type: GrantFiled: May 22, 2015Date of Patent: June 20, 2017Assignee: Canon Kabushiki KaishaInventors: Noriaki Egawa, Eiichi Hamana
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Patent number: 9282639Abstract: An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 ?m or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.Type: GrantFiled: December 11, 2013Date of Patent: March 8, 2016Assignee: HITACHI METALS, LTD.Inventors: Daisuke Shanai, Takashi Aoyama, Kazuhiko Sasada, Hiroaki Komatsu
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Patent number: 9150721Abstract: The present invention generally relates to self healing polymer materials comprising thermoset and thermoplastic polymers. The present invention also relates to a method of manufacturing self healing polymer materials, methods of post-curing and healing the self healing polymer materials, composite materials comprising self healing polymer materials and methods of preparing the composite materials. In an attempt to develop improved structural materials, polymers and polymer materials have been identified that can be used in materials to act as self healing agents to repair structural damage occurring in the materials. The self healing polymer materials that have been identified are capable of being healed under post-curing or healing conditions.Type: GrantFiled: June 18, 2010Date of Patent: October 6, 2015Assignee: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATIONInventors: Stuart Bateman, Sam Meure, Dong Yang Wu, Scott Furman, Sarah Khor, Russell Varley
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Patent number: 8962773Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: October 30, 2013Date of Patent: February 24, 2015Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Publication number: 20140343228Abstract: A one-component epoxy composition containing a latent catalyst and with surprisingly long storage stability. The catalyst being a reaction product of at least one tertiary amine compound and at least one polymer having at least one carboxylic acid and/or anhydride group.Type: ApplicationFiled: November 10, 2011Publication date: November 20, 2014Inventors: Yanfei Liu, Ming Ming, Shaoguang Feng, Liqiang Fan, Andreas Lutz, Gary L. Jialanella
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Publication number: 20140323613Abstract: Multi-pack curable composition comprising: a first pack comprising a blend of (i) an epoxy resin, (ii) an unsaturated polyester or vinyl ester resin, and optionally (iii) a peroxyester, a second pack comprising an amine curing agent for the epoxy resin and at least one transition metal compound selected from iron, copper, and manganese compounds, and at least when the first pack does not contain a peroxyester, a third pack comprising a peroxide.Type: ApplicationFiled: November 29, 2012Publication date: October 30, 2014Inventors: Frederik Willem Karel Koers, Auke Gerardus Talma
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Patent number: 8829123Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: January 9, 2013Date of Patent: September 9, 2014Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Publication number: 20140228519Abstract: Provided are a carbon fiber-reinforced thermoplastic resin composition excellent in interfacial adhesion between carbon fiber and a thermoplastic resin and excellent in dynamic characteristics, and a molding material, a prepreg, and a method for producing the same. The carbon fiber-reinforced thermoplastic resin composition includes the following components (A) and (B), carbon fiber and a thermoplastic resin; component (A): (A1) a bifunctional or higher functional epoxy compound and/or (A2) an epoxy compound which has a monofunctional or higher epoxy group and has one or more taypes of functional groups selected from a hydroxyl group, an amide group, an imide group, a urethane group, a urea group, a sulfonyl group and a sulfo group; and component (B): 0.Type: ApplicationFiled: September 21, 2012Publication date: August 14, 2014Inventors: Yoshifumi Nakayama, Toshiya Kamae, Daigo Kobayashi, Makoto Endo
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Patent number: 8802777Abstract: Crosslinker/accelerator system for thermally crosslinking polyacrylates with functional groups that are adapted to react with epoxy groups in a crosslinking reaction, comprising at least one epoxy group-containing substance and at least one substance that accelerates the crosslinking reaction at a temperature below the melting temperature of the polyacrylate.Type: GrantFiled: March 18, 2008Date of Patent: August 12, 2014Assignee: tesa SEInventors: Stephan Zöllner, Kay Brandes, Sven Hansen, Esther Von Possel
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Patent number: 8791204Abstract: A process for the manufacture of a polymer dispersion from a mixture of a first polypropylene polymer having sufficient carboxylic acid and/or carboxylic acid anhydride groups equivalent to an acid value of from 2 to 50 mg KOH/g nv polymer and a second polymer having a molar excess of functional groups capable of reacting with the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene is provided. Also provided herein are polypropylene dispersions in organic carrier liquid prepared by such method, as well as coating compositions comprising the dispersion and articles coated with the coating composition.Type: GrantFiled: November 10, 2009Date of Patent: July 29, 2014Assignee: Akzo Nobel Coatings International B.V.Inventor: Riaz Ahmad Choudhery
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Patent number: 8716401Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.Type: GrantFiled: November 25, 2009Date of Patent: May 6, 2014Assignee: Lintec CorporationInventors: Yasunori Karasawa, Isao Ichikawa
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Patent number: 8674039Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.Type: GrantFiled: January 28, 2010Date of Patent: March 18, 2014Assignee: Wacker Chemie AGInventors: Michael Faatz, Reinhard Haerzschel
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Patent number: 8609767Abstract: Toughened thermosetting resins comprising thermosetting resins and rubber particles having an average particle size in the range of 20 to 500nm. The toughened resins are obtained by mixing a fully vulcanized powdery rubber having an average particle size in the range of 20 to 500nm with thermosetting resin prepolymers and then curing them. The toughened thermosetting resins comprise rubber phases having a small, uniform and stable particle size, which results in a very significant toughening effect, especially when crazes rapidly grow (as in a standard Izod impact test). The toughened thermosetting resins are excellent in impact resistance, strength, modulus and heat resistance, and when appropriately toughened, the thermosetting resins can be enhanced in terms of impact strength, glass transition temperature and heat distortion temperature.Type: GrantFiled: October 8, 2002Date of Patent: December 17, 2013Assignees: China Petroleum and Chemical Corporation, Sinopec Beijing Research Institute of Chemical IndustryInventors: Fan Huang, Jinliang Qiao, Yiqun Liu, Xiaohong Zhang, Jianming Gao, Zhihai Song
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Patent number: 8586683Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: March 8, 2013Date of Patent: November 19, 2013Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Patent number: 8563661Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: January 9, 2013Date of Patent: October 22, 2013Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Patent number: 8541516Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: February 15, 2012Date of Patent: September 24, 2013Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Patent number: 8461268Abstract: A golf ball material composed of (A) an oxygen-containing inorganic metal compound in the form of a particulate or a master batch capable of neutralizing at least some of the acid groups in an acid-containing polymer blend, (B) one or more polymer selected from among diene polymers, thermoplastic polymers and thermoset polymers, and (C) an acid-containing polymer is prepared by mixing component A in a blend of components B and C. The golf ball material has a good heat resistance, flowability and processability, and can be used to produce high-performance golf balls having durability, scuff resistance and optimal hardness without a loss of rebound.Type: GrantFiled: November 15, 2011Date of Patent: June 11, 2013Assignee: Bridgestone Sports Co., Ltd.Inventors: Yoshinori Egashira, Eiji Takehana
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Patent number: 8450419Abstract: The invention provides a golf ball material comprising components (A), (B) and (C): (A) a mixture of different masterbatches prepared by separately masterbatching two or more different metal ions (A1) or a masterbatch prepared by simultaneously masterbatching two or more different metal ions in itself (A2), (B) one or more polymer selected from the group consisting of diene polymers, thermoplastic polymers and thermoset polymers, and (C) one or more polymer having an acid content of from about 0.5 to about 30 wt % and selected from the group consisting of olefin-unsaturated carboxylic acid copolymers, olefin-unsaturated carboxylic acid-unsaturated carboxylic acid ester terpolymers, unsaturated carboxylic anhydride-containing polymers, unsaturated dicarboxylic acid-containing polymers and unsaturated dicarboxylic acid half ester-containing polymers. The invention also provides a method for preparing such a golf ball material, and a golf ball made of the material.Type: GrantFiled: August 24, 2010Date of Patent: May 28, 2013Assignee: Bridgestone Sports Co., Ltd.Inventors: Yoshinori Egashira, Eiji Takehana
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Patent number: 8436108Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: May 3, 2012Date of Patent: May 7, 2013Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Patent number: 8389630Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).Type: GrantFiled: December 27, 2006Date of Patent: March 5, 2013Assignee: Kaneka CorporationInventors: Hitoshi Tamai, Kohei Ogawa, Yoshiki Nakagawa
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Patent number: 8372916Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: May 3, 2012Date of Patent: February 12, 2013Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Patent number: 8318870Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.Type: GrantFiled: January 14, 2011Date of Patent: November 27, 2012Assignee: Sika Technology AGInventors: Markus Haufe, Andreas Kramer
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Patent number: 8304034Abstract: The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.Type: GrantFiled: December 31, 2007Date of Patent: November 6, 2012Assignee: Cheil Industries Inc.Inventors: Hyun-Moo Choi, O-Bum Kwon, Sun-Yul Lee
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Publication number: 20120211704Abstract: Flexible members for use in imaging devices comprise a polymerizable release agent.Type: ApplicationFiled: February 17, 2011Publication date: August 23, 2012Applicant: XEROX CORPORATIONInventors: Edward F. Grabowski, Yuhua Tong
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Publication number: 20120165432Abstract: The present invention generally relates to self healing polymer materials comprising thermoset and thermoplastic polymers. The present invention also relates to a method of manufacturing self healing polymer materials, methods of post-curing and healing the self healing polymer materials, composite materials comprising self healing polymer materials and methods of preparing the composite materials. In an attempt to develop improved structural materials, polymers and polymer materials have been identified that can be used in materials to act as self healing agents to repair structural damage occurring in the materials. The self healing polymer materials that have been identified are capable of being healed under post-curing or healing conditions.Type: ApplicationFiled: June 18, 2010Publication date: June 28, 2012Inventors: Stuart Bateman, Sam Meure, Dong Yang Wu, Scott Furman, Sarah Khor, Russell Varley
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Publication number: 20120156484Abstract: The present invention is directed to a bio-based composition comprising a polycondensate of a dimer of a fatty alcohol and a dimer of a fatty acid, and an epoxidized fatty acid ester as a cross-linking agent, wherein the polycondensate and the epoxidized fatty acid ester are capable of reacting with each other.Type: ApplicationFiled: June 2, 2010Publication date: June 21, 2012Applicants: NITTO DENKO CORPORATION, NITTO EUROPE N.V.Inventors: Richard Vendamme, Walter Alfons Eevers
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Patent number: 8202948Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1; and (C) a thermosetting or thermoplastic composition.Type: GrantFiled: November 4, 2010Date of Patent: June 19, 2012Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Publication number: 20120142807Abstract: Polymerizable compositions are provided that contain an epoxy compound and a polymerizable, ethylenically-unsaturated resin having an acid functional group where the epoxy compound is polymerized by cationic polymerization initiated by the acid functional group and the polymerizable, ethylenically-unsaturated resin is polymerized by free-radical polymerization. To that end, a two-part polymerizable composition is provided that has a first part containing the epoxy compound; and a second part containing the polymerizable, ethylenically-unsaturated resin having an acid functional group. The first part and/or the second part further contain a radical initiator effective to initiate either self-curing or light-curing by free-radical polymerization.Type: ApplicationFiled: June 11, 2010Publication date: June 7, 2012Applicant: PENTRON CLINICAL TECHNOLOGIES L.L.C.Inventors: Shuhua Jin, Weitao Jia
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Publication number: 20120123023Abstract: Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 ?m, a peak temperature of tan ? in the range of ?100 to 0° C., determined with dynamic viscoelasticity measurement, of ?40° C. or below, a peak height of tan ? in the range of ?100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more. This polymer has excellent dispersibility of primary particles in a resin, excellent storage stability of a resin composition obtained, and excellent insulating properties and reduction in elastic modulus of a molded article obtained.Type: ApplicationFiled: March 9, 2010Publication date: May 17, 2012Applicant: MITSUBISHI RAYON CO., LTD.Inventors: Tsuneki Wakita, Toshihiro Kasai
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Patent number: 8143357Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: GrantFiled: November 4, 2010Date of Patent: March 27, 2012Assignee: Dow Global Technologies LLCInventor: Joseph Gan
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Patent number: 8106115Abstract: A golf ball material composed of (A) an oxygen-containing inorganic metal compound in the form of a particulate or a master batch capable of neutralizing at least some of the acid groups in an acid-containing polymer blend, (B) one or more polymer selected from among diene polymers, thermoplastic polymers and thermoset polymers, and (C) an acid-containing polymer is prepared by mixing component A in a blend of components B and C. The golf ball material has a good heat resistance, flowability and processability, and can be used to produce high-performance golf balls having durability, scuff resistance and optimal hardness without a loss of rebound.Type: GrantFiled: February 20, 2009Date of Patent: January 31, 2012Assignee: Bridgestone Sports Co., Ltd.Inventors: Yoshinori Egashira, Eiji Takehana
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Publication number: 20120016084Abstract: A production of a water-absorbent resin by which a particle diameter of the water-absorbent resin can be controlled simply and conveniently, and a content of fine powder can be decreased, without necessity of change of raw materials or expensive facility investment is to be provided. The method is a continuous production method of a polyacrylic acid (salt)-based water-absorbent resin, comprising a polymerization step of an aqueous solution containing acrylic acid (salt), a drying step of the resultant hydrogel-like polymer, a pulverization step of the dried substance, a classification step of the pulverized substance, and optionally a surface cross-linking step of the classified substance, wherein (a) the drying step and the pulverization step are connected via a storage step and a transportation step; and (b) a time of holding the dried substance from a time of completing the drying step to a time of starting the pulverization step is set at 3 minutes or longer.Type: ApplicationFiled: March 31, 2010Publication date: January 19, 2012Applicant: Nippon Shokubai Co., Ltd,Inventors: Yorimichi Dairoku, Toshihiro Takaai, Shinichi Fujino, Satoshi Matsumoto
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Patent number: 8093334Abstract: A dispersion of polymer microparticles in organic liquid, the polymer comprising the reaction product of i) from 2 to 40 parts by weight of a first polymer being polypropylene polymer having sufficient carboxylic acid and/or carboxylic acid anhydride groups equivalent to an acid value of from 2 to 50 mg KOH/g nv polymer and ii) from 60 to 98 parts by weight of a second polymer having a molar excess of functional groups capable of reacting with the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene polymer and wherein the organic liquid is chosen to be a good solvent for the second polymer and a poor solvent for the polypropylene polymer.Type: GrantFiled: April 30, 2008Date of Patent: January 10, 2012Assignee: Akzo Nobel Coatings International B.V.Inventors: Riaz Ahmad Choudhery, David George James
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Publication number: 20110294954Abstract: Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.Type: ApplicationFiled: February 4, 2010Publication date: December 1, 2011Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Kaori Fukutani, Toshihiro Kasai
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Patent number: 8030401Abstract: The present invention is directed to photoinitiated cationic epoxy compositions including: (a) at least one substantially saturated epoxy material comprising at least two glycidyl ether groups; (b) about 0.1 to about 20 weight percent on a basis of total weight of the composition of at least one polymer comprising at least one vinyl chloride segment and at least one vinyl acetate segment; and (c) at least one cationic photoinitiator; and bonded substrates and methods of bonding including the same.Type: GrantFiled: August 3, 2006Date of Patent: October 4, 2011Assignee: Henkel CorporationInventors: Philip T. Klemarczyk, Anthony F. Jacobine
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Publication number: 20110130518Abstract: Epoxy reactive liquid modifiers include acrylate functionalized compounds, acrylamide functionalized compounds, oxalic amide functionalized compounds, actoacetoxy functionalized urethanes and acetoacetoxy functionalized polyalkenes. The reactive liquid modifiers are incorporated into epoxy resin compositions comprising a curable epoxy resin, an amine curing agent, and the reactive liquid modifier, wherein the reactive liquid modifier is polymerized to form at least one of an interpenetrating polymer network and a semi-interpenetrating polymer network with the curable epoxy resin.Type: ApplicationFiled: July 22, 2009Publication date: June 2, 2011Inventors: Ilya Gorodisher, Alphonsus V. Pocius, Babu N. Gaddam, Richard G. Hansen
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Patent number: 7951879Abstract: Embodiments relate to viscosifiers that are terminated polymers that have functional terminal groups. The polymers being pre-extended by polyepoxides and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions and considerably reduce or even exclude the formation of high-molecular addition products so that the products obtained have low viscosity and good storage stability.Type: GrantFiled: December 21, 2007Date of Patent: May 31, 2011Assignee: Sika Technology AGInventors: Andreas Kramer, Jan Olaf Schulenburg, Jürgen Finter
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Publication number: 20110114972Abstract: An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency.Type: ApplicationFiled: July 22, 2009Publication date: May 19, 2011Inventors: Atsushi Sato, Hiroyuki Hirakawa
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Patent number: 7932322Abstract: The invention relates to viscosifiers, especially terminated polymers that have functional terminal groups, said polymers being pre-extended by polyamines, polymercaptans, (poly)aminoalcohols, (poly)mercaptoalcohols or (poly)aminomercaptans and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. They are also charaterized in that the formation of high-molecular addition products is considerably reduced or even excluded so that products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.Type: GrantFiled: December 21, 2007Date of Patent: April 26, 2011Assignee: Sika Technology AGInventors: Andreas Kramer, Jan Olaf Schulenburg, Jürgen Finter, Norman Blank
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Patent number: 7915344Abstract: Viscosifiers, especially terminated polymers that have functional terminal groups, the polymers being pre-extended by polyols and being reacted to give polymers that are terminated by other functional groups, are produced. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. The formation of high-molecular addition products is considerably reduced or even excluded so that the products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.Type: GrantFiled: December 21, 2007Date of Patent: March 29, 2011Assignee: Sika Technology AGInventors: Andreas Kramer, Jan Olaf Schulenburg
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Publication number: 20110049426Abstract: Use of a resin system for making a composite material in a liquid moulding process. The resin system comprises an epoxy component and at least one curing agent, and at least 35 wt. % of the epoxy component is one or more naphthalene based epoxy resin. There is also provided a cured composite material, and a method of making the cured composite material in a liquid moulding process which comprises placing fibre reinforcement and the resin system in a mould and curing. The resin system and the methods of making a cured composite material are particularly applicable to liquid moulding processed such as resin trans moulding (RTM), vacuum assisted resin transfer moulding (VARTM), Seeman composite resin infusion moulding (SCRIMP), resin infusion under flexible tooling (RIFT), and liquid resin infusion (LRI).Type: ApplicationFiled: May 14, 2009Publication date: March 3, 2011Applicant: Hexcel Composites, Ltd.Inventors: Neal Patel, Steve Mortimer
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Publication number: 20110039108Abstract: A heat-curable adhesive composition comprising an epoxy-resin, a toughening agent, a curing agent and an acetoacetoxy-functionalized compound wherein the composition can be cured to form structural adhesives of high impact strength.Type: ApplicationFiled: January 18, 2008Publication date: February 17, 2011Inventors: Siegfried R. Goeb, Dirk hasenberg, Christian Kloninger, Dirk Kolowrot, Steffen Traser
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PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS, POLARIZERS AND LIQUID CRYSTAL DISPLAYS COMPRISING THE SAME
Publication number: 20110032455Abstract: The invention relates to pressure-sensitive adhesive compositions which comprise (A) base resin, (B) the first multifunctional compound and (C) the second multifunctional compound that can react with the first multifunctional compound and realizes an interpenetrating network structure in the cured state, and relates to polarizers and liquid crystal displays comprising the same. The invention shows excellent durability under high temperature and/or high humidity condition and good properties such as machinability, removability and workability. The invention can provide the adhesive compositions efficiently suppressing light leakage generated in the liquid crystal displays. In particular, the adhesive compositions of the invention prevent light leakage even when being used in large display devices of 20 inches or more.Type: ApplicationFiled: January 7, 2009Publication date: February 10, 2011Applicant: LG CHEM, LTD.Inventors: No Ma Kim, In Ho Hwang, Jeong Min Ha -
Patent number: 7872077Abstract: Grafted polymers which are the reaction products of: (a) (Meth)acrylic acid and (b) Non-symmetric maleates according to general formula (I), in which R1 stands for a linear or branched alk(en)yl radical having 1 to 22 carbon atoms and 0 or 1 double bond, while n and m independently represent integers between 0 and 200, on condition that the sum (n+m) is different from 0 are disclosed. Methods of making and using the grafted polymers are also disclosed.Type: GrantFiled: January 15, 2008Date of Patent: January 18, 2011Assignee: Cognis IP Management GmbHInventors: Stephanie Merlet, Florence Andrioletti, William LaMarca, Benoit Abribat
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Publication number: 20110001251Abstract: Disclosed is an adhesive composition, comprising, as essential components, a thermosetting resin component A and a high-molecular component B which are evenly compatible and miscible with each other at a temperature of 5 to 40° C. without being separated from each other, and a curing agent component C, wherein after the adhesive composition comes into contact with an adherend and after the thermosetting resin component A is cured, the thermosetting resin component A is separated, in the adhesive composition, into particulate structures wherein the concentration of the thermosetting resin component A is larger than that in the surrounding of the particulate structures, and further the particulate structures are formed in a larger amount near a surface of the composition which contacts the adherend than inside the adhesive composition. The adhesive composition can be used in thin-film bonding.Type: ApplicationFiled: July 3, 2008Publication date: January 6, 2011Inventors: Yutaka Gou, Kazuhiro Miyauchi, Takashi Inoue, Atsushi Takahara, Hiroshi Jinnai