Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: The invention relates to a self-hardening material for layerwise construction of three-dimensional components, whereby the material comprises at least one particulate material and a separately applied bonding agent for bonding the particulate material, and has a setting time which is at least several times as long as the application time of a particulate layer.

Abstract: This invention is a low-voiding adhesive film prepared from a composition. The composition comprises a toughening polymer, a curable resin, a curing agent for the curable resin, a void reduction compound, and a curing agent for the void reduction compound. The void reduction compound has at least two Si—O moieties contiguous with each other and at least one reactive functionality. Additional embodiments of this invention are described, including a process for producing the low-voiding die attach film, a method for reducing voids in a semiconductor package using the film of this invention, and a semiconductor package assembled with the film of this invention.

Abstract: Vinyl chloride polymer compositions, optionally plasticized, containing a hydrophilic polymer (e.g., a hydrophilic polyurethane or hydrophilic vinyl polymer) are described for use as coatings and films with increased moisture vapor transmission and/or static dissipative properties. Films from this material are useful as fluid barriers that allow diffusion of moisture vapors. Similar modifications can be made to acrylate and urethane polymers.

Abstract: The retardation film of the present invention contains at least one of an epoxy resin cured product and an epoxy (meth)acrylate resin cured product. In the retardation film of the present invention, in-plane birefringence index thereof at a wavelength of 590 nm is preferably 0.001 or more and a birefringence index in a thickness direction thereof at a wavelength of 590 nm is preferably 0.001 or more.

Abstract: The invention provides a golf ball material comprising components (A), (B) and (C): (A) a mixture of different masterbatches prepared by separately masterbatching two or more different metal ions (A1) or a masterbatch prepared by simultaneously masterbatching two or more different metal ions in itself (A2), (B) one or more polymer selected from the group consisting of diene polymers, thermoplastic polymers and thermoset polymers, and (C) one or more polymer having an acid content of from about 0.5 to about 30 wt % and selected from the group consisting of olefin-unsaturated carboxylic acid copolymers, olefin-unsaturated carboxylic acid-unsaturated carboxylic acid ester terpolymers, unsaturated carboxylic anhydride-containing polymers, unsaturated dicarboxylic acid-containing polymers and unsaturated dicarboxylic acid half ester-containing polymers. The invention also provides a method for preparing such a golf ball material, and a golf ball made of the material.

Abstract: The present invention provides a particulate water absorbing agent for absorbent cores which is excellent in powder conveying property, and achieves sufficient absorption performances for use in absorbent cores in particulate water absorbing agents including a water absorbing resin as a principal component, and which further is suitable for practical applications. In the present invention, characteristics that had not been known conventionally at all, i.e., “permeability potential under pressure (PPUP)” and “frictional charge being a positive charge” of the particulate water absorbing agent are regulated at a time, and furthermore, regulation of the “moisture content of 2 to 10% by weight” is perfected. Also, the particulate water absorbing agent including (A) a water-swelling crosslinked polymer having a constitutional unit derived from an unsaturated monomer containing an acid group and/or a salt thereof; and (B) water fulfills certain requirements.

Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.

Abstract: Provided herein are one-solution type thermosetting resin compositions that may be useful to form protective films for color filters used in liquid crystal displays or image sensors. According to some embodiments, the resin compositions may include a self-curable copolymer and an epoxy compound. The protective films may exhibit desirable flatness, adhesiveness, transmittance, heat resistance and chemical resistance. Also provided are methods of forming a film on a substrate, and substrates having a film formed thereon. In addition, provided herein are color filters including a film formed from a composition according to an embodiment of the invention, and liquid crystal displays and image sensors including such color filters.

Abstract: Crosslinker/accelerator system for thermally crosslinking polyacrylates with functional groups that are adapted to react with epoxy groups in a crosslinking reaction, comprising at least one epoxy group-containing substance and at least one substance that accelerates the crosslinking reaction at a temperature below the melting temperature of the polyacrylate.

Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.

Abstract: The invention provides a golf ball material which includes, in mixture: (A) a metal-containing chelating agent (A1) or a mixture (A2) composed of a metal-containing chelating agent and an oxygen-containing inorganic metal compound; (B) one or more polymers selected from the group consisting of diene polymers, thermoplastic polymers and thermoset polymers; and (C) one or more acid-containing polymers having an acid content of from 0.5 to 30 wt % and selected from the group consisting of olefin-unsaturated carboxylic acid copolymers, olefin-unsaturated carboxylic acid-unsaturated carboxylic acid ester terpolymers, unsaturated carboxylic acid anhydride-containing polymers, unsaturated dicarboxylic acid-containing polymers and unsaturated dicarboxylic acid half ester-containing polymers. The invention also provides a method for preparing such a golf ball material, and a golf ball made with the material.

Abstract: Resin systems comprising a crosslinkable resin, a reactive diluent, and a plurality of reactive, surface-modified nanoparticles; and gel coats including such resin systems are described. Articles having such compositions attached to a surface of a substrate, e.g., a fibrous reinforced substrate, are also described.

Abstract: A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.

Abstract: There is provided an adhesive film for a semiconductor, comprising a thermoplastic resin (A), an epoxy resin (B) and a curing agent (C), wherein a minimum melt viscosity of said adhesive film for a semiconductor is 0.1 Pa·s to 500 Pa·s both inclusive in a temperature range of 50° C. to 180° C. both inclusive at a temperature-rise rate of 10° C./min from room temperature and a content of volatile component is 5.0% or less.

Abstract: The present invention relates to (A) a water dispersion for ink-jet printing including particles of a waster-insoluble crosslinked polymer which contain a colorant, and a water-insoluble organic compound, wherein the water-insoluble crosslinked polymer is (1) a polymer produced by crosslinking a water-insoluble polymer with a crosslinking agent; (2) a polymer produced by crosslinking 100 parts by weight of the water-insoluble polymer with 0.5 to 9.5 parts by weight of the crosslinking agent; or (3) a polymer having a weight-average segment molecular weight of from 1,400 to 20,000 as calculated from [(weigh-average molecular weight of the water-insoluble polymer)/(number of molar equivalents of the crosslinking agent to be reacted with 1 mol of the water-insoluble polymer+1)]; (B) an ink for ink-jet printing containing the above water dispersion which is excellent in gloss and storage stability; and (C) particles of the water-insoluble crosslinked polymer.

Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.

Abstract: The invention discloses specific polyester resins which are obtained by the technique of reacting polyesterpolyol oligomer of specific monomeric composition further with polyvalent carboxylic acid (anhydride) and the like; thermosetting water-borne coating compositions using the polyester resins, and coating film-forming methods using the thermosetting water-borne coating compositions.

Abstract: A resin composition for an optical material, which is excellent in heat resistance and transparency and is soluble in an aqueous alkali solution, a resin film for an optical material made of the resin composition, and an optical waveguide using the same are provided. The resin composition for an optical material includes: (A) an alkali-soluble (meth)acrylate polymer containing a maleimide skeleton in a main chain; (B) a polymerizable compound; and (C) a polymerization initiator. The resin film for an optical material is made of the resin composition for an optical material. The optical waveguide has a core part and/or a clad layer formed using the resin composition for an optical material or the resin film for an optical material.

Abstract: A dampening material is presented with a carboxy-terminated butadiene nitrile (CTBN) as a dampening element. The glass transition temperature of the CTBN is generally at room temperature. The material is a two-component system with micro-scale phase segregation. The CTBN is reacted into an epoxy resin at a high temperature and cooled to allow the epoxy to react with a curing agent. A phase segregation occurs between the epoxy and the CTBN as the epoxy gels/cures. The extent of phase separation in the reaction is controlled by cross-linking and gelling. The rubbery component of CTBN phase segregates and forms discrete, spherical domains. Because the glass transition temperature of the rubbery domains is in the operational temperature range of interest, the composite is capable of absorbing acoustic energy. A high modulus allows a larger amount of acoustic energy to enter the composite where it is absorbed by the rubbery CTBN component.

Abstract: The present invention provides hardenable coating compositions, comprising: a first compound selected from the group consisting of polyacids, polyanhydrides, salts thereof and mixtures thereof, and a second compound having two or more active hydrogen groups. When used as a roll coating composition, the first compound preferably has a low average molecular weight and an acid number greater than about 100. The hardenable coating composition preferably has an extended open time and can be rapidly cured to a substantially tack-free state in less than about one minute at 200° C. Coated articles and methods of coating are also provided.

Abstract: A composition curable by polymerization, as well as a process of applying the composition and metal substrates coated therewith, the composition comprising: a) at least one metal compound which reacts before and/or during the curing of the composition by polymerization, with at least one of components b), c) or, if present, d), so that the metal is bound in the cured composition, the metal being selected from silicon, titanium, zirconium, manganese, zinc, vanadium, molybdenum and tungsten; b) at least one monomer or oligomer which contains at least one carboxyl or ester group and at least one olefinic double bond and which has no polyether chain of at least five ethylene oxide and/or propylene oxide units; c) at least one compound which contains both a polyether chain of at least five ethylene oxide and/or propylene oxide units and at least one carboxyl or ester group having at least one polymerizable double bond; and optionally d) at least one initiator for free radical and/or cationic polymerization and/or

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: In one aspect, the invention provides a water-based release coating composition comprising a mixture of: A. from 0.1 to about 5 wt % of a fluoro(meth)acrylate (co)polymer or a fluorochemical urethane compound containing at least one fluorinated group having the formula —CF2)nCF3, wherein n is an integer from 1 to 3; B. from about 5 to about 99.9 wt % of a copolymer comprising the reaction product of a. from about 40 to about 70 wt % of an alkyl (meth)acrylate, wherein the alkyl group contains from 16 to 22 carbon atoms, b. from about 3 to about 20 wt % of (meth)acrylic acid, c. from about 20 to about 40 wt % acrylonitrile, and d. from 0 to about 15 wt % of vinyl monomer, other than acrylonitrile, wherein the sum of a. through d. equals 100%; and C. from 0 to about 94.9 wt % of an extender polymer, wherein the sum of A., B., and C. is 100% and wt % is based on the total amount of solids in the composition.

Abstract: Resins for powder coatings which are thermally and radiation curable containing both olefinically unsaturated groups and at least one other reactive group in the same molecules selected from epoxide groups and acid groups, a method for their preparation, and the use thereof in powder coating compositions.

Abstract: A water absorbing agent comprising a crosslinked polymer including a water-soluble vinyl monomer (a1) and/or a vinyl monomer (a2) that is formed into the water-soluble vinyl monomer (a1) by hydrolysis, and a crosslinking agent (b) as an essential constituting unit, wherein the following formulae (1) and (2) are satisfied; a process for its production, and absorbers and absorbent articles made by the water absorbing agent. (Y)??1.14(X)+69.5 ??(1) (X)=((x1)2+4×(x2)2)1/2 ??(2) wherein (x1) denotes a water-retention amount (g/g) of the water absorbing agent after being soaked in a physiological saline for one hour; (x2) denotes an absorption amount (g/g) of the water absorbing agent after being soaked in a physiological saline under loading of 0.9 psi for one hour; and (Y) denotes a liquid permeation speed (ml/min) of a physiological saline after the water absorbing agent is soaked in a physiological saline under loading of 0.3 psi for one hour.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.

Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.

Abstract: There is provided: a production process for a water-absorbing agent having stable properties in a short time; and a water-absorbing agent. The production process comprises the step of blending an acid-group-containing water-absorbent resin powder with a noncrosslinkable water-soluble inorganic base and/or an irreducible alkaline-metal-salt pH buffer and further with a dehydratable crosslinking agent reactable with the acid group, thereby subjecting the resin powder to crosslinking treatment, or comprises the step of blending an acid-group-containing water-absorbent resin powder with the above base and/or pH buffer and further with a crosslinking agent reactable with the acid group, thereby subjecting the resin powder to crosslinking treatment, wherein the resin powder has a weight-average particle diameter of 300 to 600 ?m wherein the ratio of fine powders having particle diameters of not larger than 150 ?m in the resin powder is not more than 10 weight %.

Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living-radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition-having an epoxy group at a main chain terminus thereof.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification.

Abstract: The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal.

Abstract: Pre-formed polymer particles are chemically modified by free radical-initiated surface graft modification. The resulting resin is specifically adapted to provide enhanced chromatographic performance throughout chromatographic separations.

Abstract: An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small voids and unusually high Young's modulus.

Abstract: A two-part acrylic structural adhesive comprises a first package containing from about 10 to about 90 percent by weight of at least one ethylenic unsaturated methacrylic ester selected from the group consisting of 1) an alkyl mono-, di- or tetra-substituted cyclohexyl methacrylate, wherein the substitutions occur in either the 3, 4, and/or 5 ring positions, and 2) a linear or branched C4–C10 alkyl methacrylate; from about 10 to about 80 percent by weight of a toughener, and an adhesion promoter; and a second package containing a bonding activator, and, optionally, an epoxy resin.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

Abstract: A substantially non-gelled polymeric composition is disclosed and comprises the reaction product of an A polymer which is an addition polymer having 3.5 or more reactive functional groups per polymer chain and a B polymer having about 2 to about 3 functional groups per polymer chain that are co-reactive with the reactive functional groups of the A polymer. Also disclosed is a process for preparing such polymeric compositions, powder coatings and 100% solids ink resins prepared with such polymeric compositions, and a method for deglossing a powder coating using such polymeric compositions.

Abstract: An activatable (e.g., heat expandable) material and articles incorporating the same is disclosed. The material includes an epoxy resin; an epoxy/elastomer hybrid or reaction product; a blowing agent; a curing agent; and optionally, a filler. In preferred embodiments, the material includes aramid fiber, nanoclay or both.

Abstract: An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of ?10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

Abstract: The invention relates to an adhesive based on highly saturated, carboxylated nitrile-butadiene rubber (HXNBR), to its use, to processes for its preparation, to its use for the bonding of substrates and to products manufactured therewith.

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.

Abstract: A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprises a) from about 10-90% by weight, relative to a) plus b), of carboxylic acid-functional acrylic resin(s); b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s); c) a catalyst in an amount sufficient to cure the composition at a temperature of about 300° F. or below for about 30 minutes or less; and d) optionally, a flexiblizing agent.

Abstract: A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.

Abstract: A coating compound comprising a binder/crosslinking agent system that comprises 20 wt. % to 80 wt. % of one or more carboxyl-functional components A) and 80 wt. % to 20 wt. % of one or more epoxy-functional (meth)acrylic copolymers B).

Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

Abstract: In a production process for a water-absorbent resin, comprising the steps of: blending a liquid material and a water-absorbent resin; and heating the resultant mixture in order to produce a modified water-absorbent resin, the present invention is to provide: a method for uniformly and efficiently treating a water-absorbent resin favorably in view of industry, and as a result, a good-balanced water-absorbent resin having various excellent properties, such absorption capacity without a load, absorption capacity under a load, and single-layer absorption capacity under a load in contact with an aqueous liquid. The production process comprises the step of spray-blending a water-absorbent resin (A) and a liquid material (B) with a blending apparatus equipped with a spray nozzle (C), wherein the liquid material (B) is sprayed from the spray nozzle (C) and its spray pattern is a circular and hollow cone shape or a double-convex-lens and elliptic cone shape.

Abstract: Superabsorbent polymers having a slow rate of absorption, and a process for their preparation. The superabsorbent polymer has a slow rate of absorption, is crosslinked with a covalent crosslinking agent and the metal of a polyvalent metal coordination compound, has the metal of the coordination compound distributed essentially homogeneously throughout the polymer, and has an Absorption Rate Index of at least about 5 minutes.

Abstract: A process for preparing a heat curable powder coating composition comprises exposing a powder comprising a carboxyl-functional polymer and a polyepoxy compound to an amine selected from the group consisting of organic amines and ammonia under mild conditions, particularly temperatures of between −30° C. and 50° C.