Abstract: A water-soluble thermosetting resin giving high wet-strength of paper and excellent preservation stability which comprises 20% by weight or less of components having a molecular weight of 10,000 or less; and a water-soluble thermosetting resin giving high wet-strength of paper in which, in a reverse mutation test carried out for the resin as the object to be tested using histidine-requiring Salmonella typhimurium TA1535 strain, the number of reversant colonies generated is less than twice the number of reversant colonies in the solvent control, treated only the solvent as a reference liquid are provided; and a process for producing an aqueous cationic thermosetting resin solution giving excellent preservation stability of the solution which comprises a step of reacting polyamidepolyamine and epihalohydrin, and a step wherein the solution obtained by reacting polyamidepolyamine and epihalohydrin is held at a temperature of about 30 to about 70° C. for a period, while adjusting the pH to about 2 to about 3.

Abstract: A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones and at least one epoxy resin modified by at least one aromatic polyamine. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition.

Abstract: The present invention relates to a highly branched polyamide oligomer of the general formula (I) as hereinabove defined, to the process for preparing and branched oligomers and to different uses thereof. As well known to the man skilled in the art, the implementations and efficacy of the different polyamide oligomers may vary, depending on their structure and valency (reactive groups composition). Polyamide oligomers may be used, for example, as epoxy hardeners in the preparation of thermosetting compositions, as thermoplastic hot melt adhesives, as adhesion promoters and many other suitable applications. The highly branched oligomers disclosed have been shown to be highly efficient, for example, as epoxy hardeners, inter alia, in the formation of glue, lacquer, enamel or sealant mixtures.

Abstract: A water-dispersible curing agent for epoxy resins is prepared by the reaction of (a) an epoxy-functional compound obtained from the reaction of at least one epoxy resin and an amidoamine derived from the reaction of an acid-terminated polyalkylene glycol and a diamine in an active amine hydrogen:epoxy groups ratio of from 1:15 to 1:350, (b) at least one polyamine in an active amine hydrogen:epoxy groups ratio of from 2:1 to 30:1 which yields an amine-terminated product having an amine equivalent weight of at least 50, and, optionally, (c) a monoepoxy in a remaining active amine hydrogen:epoxy groups ratio of from 5:1 to 20:1.

Abstract: An epoxy resin composition containing a) an epoxy resin and b) a liquid amine terminated polyamide curing agent prepared by condensing an aminoalkylpiperazine and a dicarboxylic acid. The epoxy resin composition typically requires less than 35% of solvent to produce a sprayable viscosity. The cured epoxy composition has good flexibility. A hydroxy-functional flexibilized resin is also produced by reacting (a) an epoxy resin, (b) a liquid aminoalkylpiperazine-based amine terminated polyamide and (c) a hydroxy-functional amine.

Abstract: A glycidylester of the general formula I in which R1 and R4 are the same or different C1-C6 alkyl or C6-C10 cycloalkyl groups, and R2 and R3 are the same or different and are H or C1-C6 alkyl or C6-C10 cycloalkyl groups. The glycidylester is used in a thermosetting resin composition, comprising also a curing compound and preferably an advanced resin product. The thermosetting resin composition can be applied for outdoor durable coatings, having excellent resistance against acid rain.

Abstract: A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones and at least one epoxy resin modified by at least one aromatic polyamine. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: Stable aqueous emulsions of epoxy resins are provided using an epoxy-functional surfactant prepared by reacting an amidoamine having the formula: wherein R1 is an alkyl, aryl, or arylalkyl group or mixtures thereof having 1 to 15 carbon atoms, R2 is aliphatic, cycloaliphatic, or aromatic group having 2 to 18 carbon atoms optionally containing non-reactive oxygen or at most all average of 4 secondary and/or tertiary nitrogen atoms per structure in the backbone, X and Y are independently a hydrogen, methyl or ethyl group with the provision that if X is methyl or ethyl, Y is hydrogen or if Y is methyl or ethyl, X is hydrogen, and n+m+o is a real number from 40 to 400, and n+o is a real number in an amount effective to provide resin emulsification, and the ratio of (I) to (II) by weight.

Abstract: The combination of powder coatings usable in a coating method comprising mixing two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogeneous hue. A powder coating composition comprising two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogeneous hue. A coating method comprising the steps of (a) applying to a substrate two or more powder coatings, of which each color is different; (b) heating to fuse with each other each of the two or more powder coatings applied in step (a); and (c) curing the resulting fused product in step (b), to give a coating film having a homogeneous hue.

Abstract: An adhesive for applying to a creping surface in the process for dry creping tissue paper is disclosed. The adhesive comprises cationic starch and optionally a polyvinyl alcohol and a water-soluble, thermosetting, cationic polyamide-epihalohydrin resin. The adhesive provides high adhesion and doctorability for dry creping.

Abstract: Heatset lithographic printing ink compositions having improved rub-resistant properties containing a resin cross-linked with a polyepoxide compound and solubilized with an aliphatic alcohol.

Abstract: Proposed is a process for sealing the seams of a water vapour permeable lining comprising a laminate of a textile material and a waterproof, but water vapour permeable film in which sections of said laminate with the textile sides facing one another are bonded together along the contours of the material to be lined, after which the lining is dipped in a solution of a hydrophilic polymer in an organic solvent which acts as a swelling agent for the waterproof film of the laminate, followed by evaporation of the solvent. The water vapour permeable film in the laminate preferably is made of a hydrophilic copolyetherester or copolyetheramide, while the hydrophilic polymer soluble in an organic solvent preferably is a copolyetherester.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin.

Abstract: There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.

Abstract: An antistatic composition containing a crosslinked thermosetting resin formed by reacting, in the presence of a water-soluble solvent, (a) a polyaminoamide having unreacted primary and secondary amine groups and (b) a polychlorohydrin derivative.

Abstract: The present invention relates to a process for the preparation of a foamed article having a foam density of less than 180 kg/m3 and an average cell diameter of less than 1.5 mm comprising the extrusion of a molten semi-crystalline thermoplastic resin composition in the presence of a foaming agent, with the semi-crystalline thermoplastic resin composition comprising a polymeric epoxide containing at least two epoxide groups being a copolymer of a monomer mixture comprising at least one C10 to C18-olefin and at least one ethylenically unsaturated compound comprising an epoxide group. The process results in the preparation of foamed articles having a regular and homogeneous structure. Another advantage of the present invention is that it is not necessary anymore to add a compound of Group Ia, IIa, or IIIa of the Periodic Table, such as LiCl, to the extrusion process.

Abstract: There is provided a curing agent composition, a method for making a curing agent composition, two component curable epoxy resin compositions, methods of their manufacture, and the different cured products thereof. The curing agent comprises the reaction product of a a) phenolic acid substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom; b) a polyepoxide compound; c) a polyamine compound having at least two primary amine groups; and d) a monoglycidyl capping agent. The curing agents contain secondary amine groups, yet are reactive enough to cure epoxy resins without the necessity for external catalysts/accelerators, at a wide range of curing temperatures and are immediately compatible with a standard diglycidyl ether of Bisphenol-A epoxy resins.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: There is provided a surfactant composition, a stable, self emulsifiable water borne curing agent composition, and methods for the manufacture of each, and two component water borne curable epoxy resin compositions. The surfactant composition comprises the reaction product of an a) a phenolic acid substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom; b) a polyepoxide compound; c) a polyamine compound having at least two primary amine groups; d) a reactive surfactant; and optionally e) a monoglycidyl, monocarboxylic acid, or monoisocyanate capping agent; wherein the reactive surfactant comprises an epoxide, a carboxylic acid or anhydrides thereof, or an isocyanate functional moeity, and a hydrophilic moiety comprising a polyoxyalkylene monool or polyol residue.

Abstract: The present invention is directed to a thermoplastic resin composition comprising one or more polyetherimide resins; one or more polyester resins; at least one epoxy compound having one or more epoxy functional groups per molecule in an amount effective to improve at least one of impact resistance, hydrolytic resistance, and tab-bending performance of a molded specimen of the composition; and optionally, at least one catalyst in an amount effective to improve at least one of impact resistance, hydrolytic resistance, and tab-bending performance of a molded specimen of the composition as compared to the same composition not containing the catalyst. It was unexpectedly found that the compositions exhibited enhanced heat, impact, hydrolytic resistance, and/or enhanced tab-bending performance over other compositions known in the art. In a preferred embodiment, the epoxy compound contains 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and the catalyst contains sodium stearate.

Abstract: An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.

Abstract: The present invention provides a coupled polymer, which is prepared by reacting a living alkali metal-terminated polymer with a particular coupling agent. The coupling agent has the formula ##STR1## where R1, R3 are independently selected from the group consisting of aliphatic alkyl and alkenyl, and hydrogen, and R.sub.2 is alkylene, alkenylene, divalent cycloalkylene, divalent arenyl, or a C.sub.1-17 divalent hydrocarbyl containing ether or ketone group. By means of the particular coupling agent, the coupling efficiency is relatively high, and no harmful materials will be generated to corrode the pipes. The coupled polymer obtained has a coupling number of less than 3, and good rubbery physical properties, transparency, and wear resistance.

Abstract: The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fabrics, rubbers, engineered materials, and concrete, said flexible industrial adhesive composition comprising:(a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule;(b) a liquid amine terminated polyamide prepared by reacting at least one C.sub.18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1;(c) one or more optional polyamine(s); and(d) one or more optional filler(s);wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%.

Abstract: An aqueous epoxy resin system suitable for coatings comprises (a) water, (b) at least one epoxy resin and (c) a curing agent prepared by (i) reacting at least one polyamine having at least 3 active amine hydrogen atoms per molecule and at least one epoxy resin in an epoxy equivalent to to polyamine mole ratio of from 0.9:1 to 1:10 to obtain an amine-terminated intermediate; (ii) reacting the amine-terminated intermediate with from 0.5 to 25 weight percent, based on the amine-terminated intermediate, of an acid-terminated polyalkylene glycol to yield an amine-terminated curing agent. The amine-terminated intermediate can be capped with a monoepoxide in an amine hydrogen to epoxy groups ratio of from about 1.5:1 to 30:1 prior to reaction with the acid-terminated polyalkylene glycol, or the amine-terminated curing agent following step (ii) can be capped with a monoepoxide in an amine hydrogen atoms to epoxy groups ratio of from about 2:1 to 30:1.

Abstract: A water-compatible curing agent for epoxy resins is prepared by (a) reacting at least one polyamine having at least 3 active amine hydrogen atoms per molecule and at least one epoxy resin in an epoxy equivalent to polyamine mole ratio of from 0.9:1 to 1:10 to obtain an amine-terminated intermediate; (b) reacting the amine-terminated intermediate with from 0.5 to 25 weight percent, based on the amine-terminated intermediate, of an acid-terminated polyalkylene glycol to yield an amine-terminated curing agent. The amine-terminated intermediate can be capped with a monoepoxide in an amine hydrogen atoms to epoxy groups ratio of from about 1.5:1 to 30:1 prior to reaction with the acid-terminated polyalkylene glycol, or the amine-terminated curing agent produced following step (b) can be capped with a monoepoxide.

Abstract: An epoxy resin composition containing a) an epoxy resin and b) a liquid amine terminated polyamine curing agent prepared by condensing an aminoalkylpiperazine and a dicarboxylic acid. The epoxy resin composition typically requires less than 35% of solvent to produce a sprayable viscosity. A hydroxy-functional flexibilized resin is also produced by reacting (a) an epoxy resin, (b) a liquid aminoalkylpiperazine-based amine terminated polyamine and (c) a hydroxy-functional amine.

Abstract: This invention relates to a hybrid nonisocyanate polyurethane network polymer formed by cross-linking at least one cyclocarbonate oligomer and at least one amine oligomer. The cyclocarbonate oligomer contains a plurality of terminal cyclocarbonate groups. At least one cyclocarbonate oligomer further comprises from about 4% to about 12% by weight of terminal epoxy groups. Because at least one cyclocarbonate oligomer contains both cyclocarbonate and epoxy reactive groups, the network formed therefrom is referred to as a hybrid nonisocyanate polyurethane network. The cyclocarbonate oligomer or oligomers have an average functionality towards primary amines of from about 2.0 to about 5.44. The amine oligomer comprises at least one primary amine-terminated oligomer terminated with primary amine groups and has an average functionality towards cyclocarbonate groups of from about 3.0 to about 3.8. The amine oligomer is present in an amount from about 0.93 to about 0.

Abstract: Process for preparing a thermosetting coating composition comprising;(a) mixing(i) a cleavable carbonyl polymer having an activated carbonyl group adjacent to oxygen or nitrogen, in the backbone, and having a molecular weight greater than 5,000(ii) a multifunctional compound having a molecular weight less than 5,000 having a functional group capable of reacting with the cleavable carbonyl polymer to cleave the polymer at the carbonyl group and bond with the cleaved polymer, the compound having a crosslinking group;(b) reacting the mixture in an extruder, at 50 to 350.degree. C. for 15 to 600 seconds, to cleave the polymer, and react the cleaved polymer with the functional group on the multifunctional compound(c) quenching the reaction mixture cooling prior to equilibrium reaction, to produce a functionalized cleaved polymer having crosslinking groups derived from the multifunctional compound and capable of crosslinking by heat reaction outside the extruder.

Abstract: A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound.

Abstract: Novel powder coating compositions containing reactive hyperbranched polymers are disclosed and claimed. Preferred embodiments include powder coating compositions formed from hyperbranched polyesters having terminal hydroxy, carboxy, epoxy, and isocyanate groups. Preferred hyperbranched polyesters are formed from .alpha.,.alpha.-bis-(hydroxymethyl)-propionic acid, which act either as crosslinkers, adhesion promotors, or flow and leveling agents.

Abstract: The present invention relates to cured compositions useful as adhesives and sealants formed by dispersing an amine-terminated polyamide curative into a base to form a composite and activating the composite forming the cured composition. Bases described include epoxies, polysulfides and cyanoacrylates. Curing mechanisms include heat and pressure activation. The amine-terminated polyamide curative has a ratio of equivalents of amine to acid groups of from about 1.05:1.00 equivalents NH.sub.X :COOH to no greater than about 1.95:1.00 when x is 1 or 2.

Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble cross-linked polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a polyvinyl formal resin.

Abstract: A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: Compositions of amine terminated polyamide resins useful for curing epoxy resins are disclosed comprising combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines having an N--H functionality of 2 or 3 per mole selected from the group consisting of piperazine, or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. Coating compositions comprising these polyamide resins are also disclosed.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70% by weight of an inorganic filler, at least one of the epoxy resin and the curing agent has such a molecular weight distribution as to provide an average dispersity Mw/Mn of less than 1.6, a two-nucleus compound content of less than 8% by weight and a seven- and more-nucleus compound content of less than 32% by weight. When the composition is cured at 180.degree. C. for 90 seconds into a primary product having Tg1 and the primary product postcured at 180.degree. C. for 5 hours into a secondary product having Tg2, the relationship: (Tg2-Tg1)/Tg2<0.1 is satisfied. The composition is fast-curing and effectively moldable and cures into a reliable product without a need for postcure.

Abstract: Claimed is a copolyether amide having a melting point in the range of 180.degree. to 260.degree. C., incorporating at least 10 wt. % and not more than 30 wt. % of ethylene oxide groups, and composed of 30 to 60 wt. % of polyamide segments and 70 to 40 wt. % of segments derived from a (cyclo)aliphatic or aromatic dicarboxylic acid or a dimeric fatty acid and a polyoxyalkylene diamine derived from a polyoxyalkylene group having a molecular weight of 600 to 6000 and an atomic ratio of carbon to oxygen of 2.0 to 4.3. Also claimed is a non-porous, waterproof film having a water vapor permeability of at least 1000 g/m.sup.2 day determined at 30.degree. C. and 50% RH in accordance with ASTM E96-66 which is based on a the use of these films in rainwear, shoes, tents, chairs, as mattress covers and underslating, for medical purpose garments, and for the manufacture of dressings.

Abstract: The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprises a phosphorus-containing compound of the formula I or II ##STR1## in which R1 and R2 are identical or different and are a straight-chain or branched alkyl radical of 1 to 8 carbon atoms, a cyclohexyl, cyclopentyl or aryl radical or an alkyl- or alkoxy-substituted alkyl radical of 1 to 18 carbon atoms, it also being possible for R1 and R2, together with the P atom, to form a ring, and m and n are 0 or 1, to a process for their preparation and to their use.

Abstract: Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.

Abstract: Two-component curable adhesive for blocking automotive wiring bundles, the respective components preferably amine-terminated polyamide Part A, and acrylate, anhydride or epoxy Part B, being contained in separate sheets which are inter-leaved with one another. The concentration of the reactive components in the sheets is chosen to cause the adhesive to flow on initial heating and then to cure to resist further flow at elevated temperatures in service. Apparatus, kits and method for blocking cables or wire bundles using the adhesive are also claimed.

Abstract: Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.

Abstract: There is provided a curing agent composition for epoxy resins and two component curable epoxy resin compositions. The curing agent is made by reacting at least a b) substituted aryl amidopolyamine with a c) monoglycidyl capping agent, where the substituted aryl amidopolyamine is made by reacting at least:bi) a phenolic compound substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom, andbii) an aliphatic polyamine compound having at least two primary amine groups.The curing agent is storage stable for at least 6 months. There is also provided a two component epoxy resin composition, which advantageously can be made in the absence of external catalysts/accelerators, and can cure within 24 hours at the low temperature of 4.4.degree. C. The two component epoxy resin composition also exhibits excellent compatibility between the curing agent and the epoxy resin, thus reducing or eliminating the need for an induction time.

Abstract: Modified epoxy resins are obtained by reaction of an epoxy resin with up to one mol equivalent per epoxy group of an alkyl or alkenyl substituted, hydroxy substituted aromatic acid, especially by reaction of a bisphenol A based epoxy resin with an alkylated salicylic acid. Also are described a process for the production of such modified resins, curable compositions comprising the modified epoxy resin and products provided with the cured composition, especially in coating applications and civil engineering applications.

Abstract: Disclosed is a blend capable of forming a semi-interpenetrating network when cured of (A) a solution of about 30 to about 50 wt % solids in an organic solvent of a fully imidized polyimidesiloxane and (B) about 5 to about 30 pbw per 100 pbw of the polyimidesiloxane of an epoxy resin which comprises a cycloaliphatic epoxy and an epoxy curing agent. The polyimidesiloxane is the reaction product of an aromatic dianhydride and diamine. The diamine is about 5 to about 80 mole % non-siloxane containing aromatic diamine and the remainder a siloxane diamine, where the siloxane diamine is about 40 to about 80 wt % of the weight of the polyimidesiloxane. The blend is used to bond metal parts to ceramic packages.

Abstract: A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300.degree. C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.

Abstract: This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.