Abstract: A thermoplastic resin composition is provided which contains polyetherimide resin, poly(arylene sulfide) resin, an epoxy compound and, optionally, glass fibers. The composition exhibits enhanced physical properties, specifically enhanced ductility and flash resistance. The composition is useful for making molded articles exhibiting desired physical properties.

Abstract: A thermosetting powder coating composition resistant to overspray incompatibility defects that comprises solid particulates of a uniform mixture of (a) a polyester resin having an average of two or more carboxyl groups, (b) a first crosslinker that is reactive toward the carboxyl groups of the polyester resin, (c) from 1% to 20% of a reactive acrylic copolymer having a weight average molecular weight of from 10,000 to 40,000, and (d) a second crosslinker that is reactive toward the reactive functionality of the acrylic copolymer is described.

Abstract: Thermoplastic polyblend compositions, well suited for the production of mechanically strong and chemical-resistant shaped articles having a wide variety of chemical engineering and other applications, e.g., for the production of electrical cable for high-frequency electrical transmissions, comprise (i) a fluoropolymer, (ii) an aromatic polyester and (iii) a copolymeric compatibilizing agent therefor, the compatibilizing copolymer (iii) comprising the copolymerizate of ethylene, a glycidyl acrylate, an acrylic comonomer and, optionally, a peroxy comonomer.

Abstract: Internal polymeric surfaces of medical devices are provided that have enhanced biocompatibility properties. The internal polymeric surface presents an anti-thrombogenic, fibrinolytic or thrombolytic interface with body fluids such as blood flowing through medical device tubing during implantation for medical procedures. The biocompatibility enhancing agent is secured to the polymeric substrate by a spacer molecule which is covalently bound to the internal polymeric surface which had been subjected to radiofrequency plasma treatment with a low pressure plasma medium of water vapor, oxygen or combination of water vapor and oxygen gas.

Abstract: A molding material useful in the fabrication of an electrical or electronic part comprises a modified phenolic resin (A), an epoxy resin (B) and a curing agent (C), said modified phenolic resin prepared by heating heavy oil or pitch and a formaldehyde in a molar ratio of formaldehyde: (oil or pitch) of from 1-15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol: (oil or pitch) of from 0.5-5:1 to form a modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon and (ii) an extraction with an aromatic hydrocarbon solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.

Abstract: A polyurethane adhesive composition prepared by incorporating phosphorus oxy acid or a derivative thereof, an amine compound and an epoxy resin into an organic polyisocyanate and an organic polyol.The polyurethane adhesive composition is employed in the manufacture of composite films by lamination of various plastic films, metal foils and so forth. The composition is excellent in adhesive properties, acid resistance and hot water resistance.

Abstract: A process for producing a modified polyaminoamide with markedly increased reactivity as an epoxy resin curing agent is disclosed. The process comprises introducing amino groups and mercapto groups into a polyaminoamide by using an aziridine compound and a thiirane compound. The modified polyaminoamide is capable of curing an epoxy resin at a low temperature and at a high rate to provide a cured epoxy resin excellent in anticorrosion and chemical resistance.

Abstract: An aqueous resin dispersion which comprises as the chief component acrylic-modified epoxy-polyamine resin composed of a bisphenolic epoxy resin containing at least two epoxy groups per molecule; and, as bound to at least a part of said epoxy groups, an acrylic resin having on the average at least one functional group which is capable of reacting with said epoxy group, per molecule, the molecular weight distribution of said acrylic resin as expressed by its weight average molecular weight (Mw)/number average molecular weight (Mn) being within a range of 1 to 1.2, and an active hydrogen-containing amino compound. Said aqueous resin dispersion may further optionally contain non-ionic, film-forming resin. Such dispersions are useful for cationic electrodeposition paint which can form a coating excelling in weatherability and corrosion resistance.

Abstract: A cured resin product has a strain energy release rate (GIC) of at least 400 J/m.sup.2, a flexural modulus of at least 300 Kg/mm.sup.2, and a glass transition temperature (Tg) of at least 120.degree. C. The cured resin composition comprises a thermoset resin component (A), optionally including a curing agent (B), and a thermoplastics resin component (C), the thermoplastics resin and thermoset resin components (C) and (A) being present at least partly in respective phases (1) and (2) each being elongate in at least one direction and each preferably having a three dimensionally continuous structure. Phase (1) may contain a silicon containing compound providing a concentration therein of elemental silicon higher than that in any other phase, and/or the cured resin product may additionally include regions where one of the phases (1) and (2) essentially surrounds the other.

Abstract: An aqueous resin dispersion which comprises as the chief component acrylic-modified epoxy-polyamine resin composed of a bisphenolic epoxy resin containing at least two epoxy groups per molecule; and, as bound to at least a part of said epoxy groups, an acrylic resin having on the average at least one functional group which is capable of reacting with said epoxy group, per molecule, the molecular weight distribution of said acrylic resin as expressed by its weight average molecular weight (Mw)/number average molecular weight (Mn) being within a range of 1 to 1.2, and an active hydrogen-containing amino compound. Said aqueous resin dispersion may further optionally contain non-ionic, film-forming resin. Such dispersions are useful for cationic electrodeposition paint which can form a coating excelling in weatherability and corrosion resistance.

Abstract: A thermosettable resin composition is prepared by admixing a liquid mixture of thermosettable resins such as a polyepoxide and amorphous thermoplastic polymer particles such as a polyetherimide to form a homogeneous cured resin composition. The particles have an average diameter of from 0.5-50 micrometers, a surface area of at least 1.0 m.sup.2 /g, a dissolution temperature of at least 50.degree. C., and are essentially insoluble in the thermosettable resin at temperatures of up to 15.degree. C. below the dissolution temperature but are completely dissolved at a temperature of at least 20.degree. C. below the cure temperature of the resin.

Abstract: Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.

Abstract: Encapsulant compositions which provide both dry heat and humid heat stability comprise:(a) a first liquid epoxy resin comprising either:(1) the diglycidyl ether of polyoxypropylene glycol; or(2) the diglycidyl ester of linoleic dimer acid;(b) a second liquid epoxy resin comprising the diglycidyl ether of 1,4-butanediol, present in the amount of about 12 to 55 parts by weight of said composition; and(c) a stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a flexibilized polyamine and a flexibilized polyamide.

Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cycloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Abstract: Thermosettable composition suitable for the production of endless objects without the use of continuous carrier material, whereby the composition comprises an epoxy resin or an unsaturated polyester and a high molecular weight thermoplastic polymer which has a weight-average molecular weight of at least 1,000,000 g/mol in an amount to make the composition spinnable, the amount ranging from at least 0.1% where the polymer has a molecular weight of 5,000,000 g/mol or more or less than 2% where the polymer has the weight-average molecular weight of 1,000,000 g/mol, the amount decreasing as the weight-average molecular weight increases.

Abstract: Thermoplastic polyblend compositions, well suited for the production of mechanically strong and chemical-resistant shaped articles having a wide variety of chemical engineering and other applications, e.g., for the production of electrical cable for high-frequency electrical transmissions, comprise (i) a fluoropolymer, (ii) an aromatic polyester and (iii) a copolymeric compatibilizing agent therefor, the compatibilizing copolymer (iii) comprising the copolymerizate of ethylene, a glycidyl acrylate, an acrylic comonomer and, optionally, a peroxy comonomer.

Abstract: A thermo-curable resin composition which contains (a) an aromatic polyamide oligomer having polymerizable unsaturated group(s) at both terminals or within side chain(s), (b) a maleimide compound and (c) an epoxy resin; and a copper foil laminate which comprises impregnating said composition into substrates, followed by bonding by co-pressing copper foils is provided. The copper-clad laminate of the present invention has excellent adhesiveness to copper foil, heat resistance and electrical properties.

Abstract: A fusible interlining has a textile substrate employed with a single adhesive layer and is intended to be bonded to drapery. The adhesive layer includes a first phase in the form of thermoplastic powder of dense granules whose primary function is to ensure the adhesion of the fusible interlining to the drapery at the time of bonding. A second phase of the adhesive layer is a crosslinkable system including a crosslinkable resin and a hardener in the form of a homogeneous matrix whose main function is to coat the granules of the thermoplastic powder of the bonding system.

Abstract: A flame retardant capable of imparting a polyamide-containing resin with excellent flame retardancy without deteriorating the impact strength of the polyamide-containing resin even when it is incorporated in a small amount, and a flame-retardant polyamide-containing resin composition containing the above flame retardant and having practically sufficient impact strength. The flame retardant comprises 100 parts by weight of magnesium hydroxide, 2 to 750 parts by weight of red phosphorus and 0.2 to 250 parts by weight of an epoxy resin, and the flame-retardant polyamide-containing resin composition comprises 100 parts by weight of a polyamide-containing resin, 2 to 50 parts by weight of magnesium hydroxide, 1 to 15 parts by weight of red phosphorus and 0.1 to 5 parts by weight of an epoxy resin.

Abstract: An epoxy resin-impregnated prepreg useful for the production of a copper foil-laminated board of a chip-on-board having a high heat resistance, high dimension stability and high silver migration-preventing property, comprises an aromatic polyamide fiber base material having 3.0% by weight or less of an equilibrium moisture content, 80 ppm or less of an extracted chlorine content and 50 ppm or less of an extracted sodium content, and an epoxy resin composition comprising an epoxy resin and a curing agent, containing 5 ppm or less of sodium and 600 ppm or less of chlorine and impregnated in the base material, said aromatic polyamide fibers having been produced by a wet spin-drawing process having a draw-washing procedure in which undrawn aromatic polyamide filaments are drawn at a draw ratio of 1.05 to 1.5, while forwarding the filaments through a hot water bath having a path length of 1 to 50 m and while flowing hot water at 30.degree. C. to 100.degree. C.

Abstract: The action of thermoplastic polymers to whose polymer backbone aliphatic or cycloaliphatic groups are bonded via a group --O--, --O--CO--, --CO--OR.sup.22 --OCO-- or --CO--O--, said aliphatic or cycloaliphatic groups being substituted by Cl, Br and/or iodine in the .alpha.--, .beta.--, .gamma.-- or .omega.-position, on an unsubstituted or substituted tetrathio-, tetraseleno- or tetratelluro-naphthalene or -tetracene contained in this polymer gives electrically conducting compositions by the formation of charge transfer complexes. These compositions are suitable for the production of antistatic or electrically conducting mouldings, sheets, filaments, fibres, coatings and composites.

Abstract: A thermoset adhesive composition comprising a thermoplastic, substantially amine terminated piperazine-containing and/or polyetherdiamine-containing polyamide resin, and further comprising an epoxy resin.

Abstract: The polymeric pigment dispersants of this invention are polyester/acrylic comb polymers which are the reaction product of 20-85% of a carboxylic functional polyester copolymer, 10-50% of an oxirane substituted acrylic copolymer, and 2 to 20% of an imide compound. These materials disperse a wide variety of pigments and are useful in solvent borne coatings where they can provide improved efficiency of pigment use, lower paint viscosity, and reduced emission of volatile organic solvent.

Abstract: An amine reacted acrylated epoxy resin blend that is particularly suitable for impregnating a fiber material and at least initial curing by exposure to ionizing radiation. These epoxy resins are basically produced by combining epoxy resins, including esterified epoxy resins, with stoichiometric quantities of aliphatic or cyclo aliphatic polyamines. The resins can be used to impregnate fibers which are exposed to ionizing radiation such as an electron beam or ultraviolet light and immediately formed into a structure, such as by filament winding. A short exposure to the ionizing radiation produces a stress-free, self supporting structure that can be fully cured through simple heating without elaborate tooling, vacuum bagging, autoclaves or the like.

Abstract: Polymeric surfaces of medical devices or components of medical devices are provided that have enhanced biocompatibility properties. The polymeric surface presents an anti-thrombogenic, fibrinolytic or thrombolytic interface with body fluids such as blood during implant ation or medical procedures. The biocompatibility enhancing agent is secured to the polymeric substrate by a spacer molecule which is covalently bound to the polymeric substrate which had been subjected to radiofrequency plasma treatment with a water vapor medium.

Abstract: Thermoplastic powder coating compositions including a polyamide and/or polyetheresteramide constituent and an epoxy/sulfonamide resin constituent are well adapted for coating a wide variety of metal substrates, e.g., by electrostatic spraying, without the requirement for first treating such substrates with an adhesion primer.

Abstract: An improved liquid matrix system for producing fibre-reinforced plastic components is disclosed. The system comprises (i) a liquid diglycidyl ether of a halogenated bisphenol or a mixture of liquid polyglycidyl ether bisphenols at least one of which being a polyglycidyl ether halogenated bisphenol; and (ii) a curing agent that is a sterically hindered aromatic diamine containing two primary amino groups attached to the carbon atoms in the aromatic nucleus, said carbon atoms not adjacent to each other, and at least one C.sub.1 to C.sub.6 linear or branched alkyl or thioalkyl substituent; the improvement comprising adding to said system a curing accelerator composition containing a mixture of a boron halide and an imidazole unsubstituted or substituted with at least one C.sub.1 to C.sub.6 linear or branched alkyl or C.sub.6 to C.sub.10 aryl.

Abstract: An epoxy ester resin which results from reacting (a) an epoxy resin, (b) a dimerized fatty acid and (c) a monocarboxylic acid. The epoxy ester resins are useful in coating compositions.

Abstract: Novel polymers which are suitable as binders are obtainable by reacting(A) a base resin which has an average molecular weight M.sub.w of from 200 to 5,000 and contains on average from 1 to 3 epoxy or isocyanato groups as the reactive groups per moleculewith(B) a mixture of(B1) 5 to 50% by weight of polyisobutylene which is terminated with primary amino groups and has an average molecular weight M.sub.w of from 500 to 5,000 and(B2) 5-95% by weight of an amidoamine which carries primary amino groups and is obtainable by condensation of diprimary diamines of 2 to 20 carbon atoms with aliphatic C.sub.2 -C.sub.44 -dicarboxylic acids,the amounts being such that from 1 to 5 equivalents of primary amino groups of (B) are present per equivalent of reactive groups of (A).

Abstract: A hot-melt adhesive composition is prepared from (1) a thermoplastic amine-terminated piperazine containing polyamide resin derived from (a) a polymerized fatty acid, (b) an aliphatic polyamine, and (c) a piperazine-containing polyamine without primary amine groups and/or a polyetherdiamine, optionally with (d) a linear dicarboxylic acid and/or a monocarboxylic acid; and (2) an epoxy resin; wherein the epoxy:amine ratio is greater than about 1:1 to less than about 10:1.

Abstract: A thermal resistance resin dust obtained by a process which comprisesa step of preparing a composition comprising(I) an aromatic hydrocarbon-formaldehyde resin-modified novolak type epoxy resin and(II) a cyanate ester resin composition comprising (a) polyfunctional cyanate esters, prepolymers of said cyanate ester, or prepolymers of said cyanate ester and an amine; or (a) in combination with (b) a monofunctional or polyfunctional maleimide, a prepolymer of said maleimide or a prepolymer of said maleimide and an amine, andoptionally (III) an inorganic filler with cleavage property,a step of curing the composition at a final curing temperature of not less than 200.degree. C. anda step of grinding the cured product, is disclosed.

Abstract: The present process for producing aromatic polyamide fibers for reinforcement of rubbers lies in that, in the first step, the fibers are dipped in an epoxy treating solution containing aromatic glycidylamines having 2 or more epoxy groups in one molecule and aromatic amines at a specific ratio and dried and cured, and thereafter, in the second step, the fibers are dipped in a treating solution for the second step containing resorcin formaldehyde resins and rubber latices and dried and cured. More preferably, specific chlorophenol compounds are added to the treating solution for the second step.The aromatic polyamide fibers obtained by the process of the present invention provide rubber products excellent in water resistance when they are used for reinforcement of rubbers, and the products have high adhesive strength in initial adhesion and besides, small decrease in adhesive strength even if they are dipped in water for a long time.

Abstract: An epoxy-terminated polyamide having the following structure: ##STR1## where each of R.sub.1, R.sub.2, and R.sub.3 is a divalent organic group, and each of n and m is a natural number, and an adhesive containing the above epoxy-terminated polyamide, an epoxy resin and a curing agent. The epoxy-terminate polyamide is well compatible with epoxy resins and an adhesive containing the same is excellent in adhesiveness and thermal resistance.

Abstract: The resin composition comprises, as essential components, (A) an epoxy resin, (B) a thermoplastic resin and (C) particles of a diaminodiphenylsulfone compound whose cross linking reactivity with the epoxy resin is prevented until the resin composition is subjected to molding or curing by a resin coating which is formed (i) by forming or adhering resin particles onto the surface of the diaminodiphenylsulfone particles or (ii) by forming a resin film on the diaminodiphenylsulfone particles, the coating resin used for forming the resin coating is not compatible with components included in the resin composition at the temperature up to the curing temperature of the resin composition.

Abstract: Epoxy resin compositions having improved storage stability before curing and improved thermal and mechanical performance after curing comprise a mixture of a polyepoxide and a curing agent that is reactive with the polyepoxide. The epoxy resin composition is characterized by a glass transition temperature of less than 20.degree. C., measured under standard conditions, after subjecting the epoxy resin composition to a specified thermal cycle. The preferred curing agents are aromatic diamines, for example, 3,7-diaminodibenzothiophene-5,5-dioxide; 3,7-diaminophenothiazine sulfone, 3,7-diamino-N-methylphenothiazine sulfone; 2,7-diamino-9-fluorenone and 2,4,6,8-tetramethyl-3,7-diaminothioxanthene sulfone.

Abstract: Epoxy interpenetrating polymer networks having chemical bonds between the interpenetrating networks are prepared from a first and a second polymer network, at least one of which contains an EPRXE resin; a resin having two epoxide functionalities represented by E and a reactive pendant nonepoxide functionality X. The two resin networks are sequentially crosslinked followed by activation of the pendant functionality of the EPRXE resin to form internetwork chemical bonds between the two resin networks affording an epoxy resin with both increased strength and toughness. The invention is also directed to the process of making interpenetrating polymer networks.

Abstract: An epoxy resin composition for forming prepregs is disclosed which includes an epoxy resin having at least two epoxy groups, a latent curing agent for the epoxy resin in an amount of 0.5-3.0 equivalents per equivalent of the epoxy groups of the epoxy resin, and a reactive, viscosity-increasing agent in an amount of 0.2-3.0 parts by weight per 100 parts by weight of the epoxy resin. The epoxy resin composition has an initial viscosity n.sub.I(50) at 50.degree. C. of 1,000-200,000 cP and an initial viscosity n.sub.I(23) at 23.degree. C. of at least 10,000 cP.

Abstract: A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane, a polyimide such as a bismaleimide, an epoxy resin and a curing agent for the epoxy resin can be thermally cured to a tough polymer blend having a high glass transition temperature.

Abstract: The present invention relates to a polycondensation and/or addition product containing carboxyl groups and amino groups. This can be obtained by reactinga) polycarboxylic acids or anhydrides thereof, if appropriate together with monocarboxylic acids,b) polyols, if appropriate together with monools, and, if appropriatec) further modifying components, and, if appropriate,d) a component which is capable of reacting with the reaction product from a), b) and, if appropriate, c), with the proviso that the final product contains tertiary amino groups which originate from components a) and/or b) and/or d), and the reaction product from a), b), if appropriate c) and if appropriate d) has an acid number from 5 to 200, preferably 10 to 130, and an amine number from 3 to 150, preferably 10 to 100.

Abstract: A flame-retardant thermoplastic resin composition is disclosed, comprising (A) a thermoplastic resin and (B-1) a halogenated epoxy resin whose epoxy groups are blocked by a long chain aliphatic carboxylic acid or (B-2) a mixture prepared by melt mixing (b1) a halogenated epoxy resin or (b2) a halogenated epoxy resin whose epoxy groups are blocked with (b3) a long chain aliphatic carboxylic acid. The composition has easy release from mold and satisfactory thermal stability during molding.

Abstract: Disclosed is a curable resin composition comprising (a) 100 parts by weight of a siloxane-amide block copolymer of formula (1): ##STR1## where R.sup.1 is a substituted or unsubstituted divalent hydrocarbon group; R.sup.2 may be the same or different and each is a substituted or unsubstituted monovalent hydrocarbon group; R.sup.3 is substituted or unsubstituted divalent aromatic hydrocarbon group; and m and an each are a number of 1 or more; (b) from 1 to 100 parts by weight of a crosslinking agent containing 2 or more epoxy groups in the molecule, and (c) up to 15 parts by weight of a curable catalyst. The composition can be cured at room temperature and in the absence of moisture in a closed system to give a cured product having high oil resistance and mechanical strength.

Abstract: The present invention relates to a polymer blend composition for melt molding which is a composition obtained by adding a thickener to a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer, characterized in that the melt viscosity of the composition determined at a molding temperature at a shear rate of 1000 sec.sup.-1 is the same or higher than the melt viscosity of said non-liquid crystal polymer determined under the same conditions.According to the present invention, a polymer blend for melt molding having improved properties, whereby problems observed in prior arts upon molding a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer (for example, insufficient alignment of the liquid crystal polymer and difficulties in extrusion, because of excessively low melt viscosity) can be solved, is obtained.

Abstract: Curable compositions which are precursors for cured or partially cured light stabilized epoxy resins which are the product of the reaction of some or all of the epoxy groups of an epoxy resin with an N-(2,2,6,6-tetraalkyl-4-piperidinyl)amic acid hydrazide as well as the cured or partially cured reaction products thereof together with processes for their use and articles of manufacture produced thereby are disclosed.

Abstract: An improvement is proposed in the curing method of an epoxy resin by the admixture of a polyamide as a crosslinking curing agent, in which the curing agent as well as the epoxy resin composition with admixture of the curing agent has an outstandingly low viscosity as compared with the use of a conventional polyamide to facilitate handling. The improvement can be obtained by using, as the polyamide, a condensation reaction product between (A) an alkylene polyamine having 4 to 20 carbon atoms in a molecule and (B) a dimeric acid mixture containing at least 50% by weight of a non-cyclic dimeric acid or an alkyl ester thereof represented by the general formula ##STR1## in which each R is, independently from the other, a hydrogen atom or a C.sub.1-4 alkyl group obtained by the dimerization reaction of oleic acid or an alkyl ester thereof. When flexibility or bendability is desired of the cured epoxy resin, the condensation reaction is performed, in addition to the reactants (A) and (B), with admixture of a C.sub.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: The subject invention relates to a toughened epoxy matrix formulation useful as a prepreg for fiber reinforcements comprising at least two epoxy components, an amine hardener and about 10%-25% of a micropulverized polyimide thermoplastic having a molecular weight of from about 20,000 to about 100,000 and Tg of at least about 220.degree. C. The invention further relates to a process for preparing a toughened epoxy matrix formulation comprising:a. preheating a blend of at least two epoxy compounds to a temperature of about 130.degree. F. to about 140.degree. F.;b. blending into the epoxy blend from step (a) a micropulverized polyimide thermoplastic;c. mixing the blend of epoxy and thermoplastic at a temperature of about 110.degree. F. to about 130.degree. F.; andd. adding to the blend of epoxy and thermoplastic an amine hardener and mixing at about 110.degree. F. to about 130.degree. F. until a low mix viscosity is obtained.

Abstract: An improved thermoset adhesive composition comprising a thermoplastic, substantially amine-terminated polyamide resin, an epoxy resin, and a diluent, and methods for the preparation thereof.

Abstract: This invention relates to two-component curable hot-melt compositions comprising thermoplastic polyamide resins that are substantially free of piperazine-containing polyamines. In one preferred embodiment the polyamide resins are the reaction product of an acid component with an amine component, wherein the amine component consists essentially of about (i) 20 to 100 equivalent percent of one or more acyclic diamines selected from the group consisting of 2-methyl-1,5-pentanediamine, 1,3-pentanediamine, 1,3-propanediamine, 1,5-pentanediamine, 1,7-heptanediamine, 1,9-nonanediamine, methyl-1,9-nonanediamine, 1,2-propanediamine, and 2-methyl-1,2-diaminopropane, and (ii) about 0 to 80 equivalent percent of one or more polyamines selected from the group consisting of cyclic and acyclic polyamines other than those amines of (i). The compositions possess excellent heat resistance, flexibility, elasticity and resistance to solvents, including organic solvents and water.

Abstract: The invention relates to a thermosetting reactive resin mixture ofa) at least one organic compound, which possesses at least two epoxide groups,b) at least one carbamate compound of the formulae I, II, III or IV, such as can be quoted from the claim petitions,c) at least one basic catalyst,and with or withoutd) other processing aids and/or additives.The thermosetting reactive resin mixture according to the present invention are used for chemically resistant coatings, as cross-linked, no longer soluble and infusible moulded articles, for the production of cathodically precipitable electrophoretic enamels, and for the production of coating powders and automobile paints.

Abstract: Thermoplastic resin compositions comprising polyarylate and polyamide resins as main components, polyethylene terephthalate and an epoxy resin of the following formula [1] in a predetermined amount are provided. ##STR1##The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.