Abstract: Thermoplastic molding materials containA) from 50 to 99% by weight, based on the total weight of the molding material, of a toughened polymer,B) from 1 to 20% by weight, based on the total weight of the molding material, of a blend ofB.sub.1) a copolymer comprising polymerized units which are derived from a polymerizable carboxylic acid or derivatives thereof andB.sub.2) a polyamide,C) from 0 to 40% by weight of a fibrous or particulate filler or of a mixture thereof andD) from 0 to 20% by weight of conventional additives and processing assistants.

Abstract: A method for binding ceramic materials in aqueous media is disclose. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: Dynamic balancing compositions are described which include an epoxy resin component and a curing component. The curing component contains at least one of a polyamide agent or polyamine agent. The balancing compositions drastically reduce the time required for balancing because, immediately after their application, they can be rotated and balanced in the uncured state. The balancing compositions also have an increased pot life and can be colored with pigment to approximate the color of copper windings.

Abstract: Conventional hot-melt adhesive compositions for the coating of textile sheet structures exhibit problems in respect of resistance to washing and cleaning. The presence of an epoxide in hot-melt adhesive composition enables the production of cleaning-resistant laminated materials having a particularly high level of wash resistance.

Abstract: A thermoplastic resin composition comprising a thermoplastic resin (A) and a thermoplastic polymer (B) having a glass transition temperature within the range of from -20.degree. C. to 70.degree. C. which are melt-blended in a proportion (A)/(B) of from 95/5 to 20/80 in weight ratio. The composition, upon application of an external stress in a temperature region of from a temperature about the glass transition temperature of the thermoplastic polymer (B) to the melting point thereof, is transformable to any shape that conforms to that stress, and is capable of becoming fixed to the transformed shape in a temperature region lower than the glass transition temperature.The composition can be used to provide a temperature-dependent shape-transformable/fixable product formed of the above composition.

Abstract: The invention relates to a Bismaleimide-Triazine resin (BT resin ) and production method thereof and in particular, a series of novel BT resin prepared by reacting a novel bismaleimide with various aromatic cyanate esters. By combining said novel bismaleimide monomer with various proportions of cyanate esters having different structures, BT resins having various processing temperature conditions can be formulated, which, after polymerizing and crosslinking, can provide materials with various thermal stability, dielectric constants, and mechanical properties for various applications.

Abstract: Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

Abstract: The invention relates to a phosphorus-modified epoxy resin having an epoxide value of from 0.05 to 0.6 mol/100 g comprising structural units derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) phosphorus-containing dicarboxylic acids or phosphorus-containing carboxylic anhydrides,to a process for their preparation and to their use.

Abstract: An epoxy-modified polyamide resin obtained by reacting a diisocyanate(A) with at least one member selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid anhydride (B) in a nitrogen-containing aprotic solvent to form a polyamide resin intermediate and reacting this polyamide resin intermediate with an epoxy resin (C) in the nitrogen-containing aprotic solvent. This epoxy-modified polyamide resin has a high molecular weight and can provide a film with excellent heat resistance and flexibility, and its composition can be used as a coating material, adhesive or such in the form as it is.

Abstract: The present invention relates to a polyether polymer having structural units represented by general formula (1), wherein R.sup.1 and R.sup.2 mean individually an alkyl group of 1-20 carbon atoms, which may have at least one hydroxyl group, and Y denotes an alkylene group of 1-10 carbon atoms, which may have a hydroxyl group, a preparation process thereof, and a moisturizer, a cosmetic composition and a detergent composition comprising this polymer. The cosmetic composition and detergent composition are excellent in moisture retention, keep up the moisturizing effect over a long period of time and give users a pleasant feeling.

Abstract: Disclosed are thermoplastic resin compositions having improved heat resistance, e.g., IR soldering and HDT; increased ductility and flowability; and reduced flash. In particular, the thermoplastic resin compositions have at least one high heat amorphous resin, at least one polysulfide; and, optionally, at least one reinforcing filler and/or at least one polyolefin and/or at least one polyolefin compound and/or at least one polyepoxy compound. The high heat amorphous resin is preferably a polyetherimide and the polyolefin is preferably a high crystalline polyethylene. The compositions of the invention are particularly well suited for preparing no flash high heat electrical connectors.

Abstract: A fire-retardant compound including bromine indicated by general formula (1), wherein the end group X and Y are comprised by A or B shown in formula (2), and the said fire-retardant compound is a mixture of the composition including 15 to 30% of X=Y=A, the composition including 40 to 60% of X=A and Y=B and the composition including 20 to 35% of X=Y=B, and degree of polymerization n is indicated by an integral number from 0 to 30, and a flame-retarded thermoplastic resin including said fire-retardant compound.

Abstract: The invention relates to a process for increasing the molecular weight of polycondensates, which comprises heating a polycondensate in the temperature range below the melting point and above the glass transition temperature in the solid phase of the polymer with additionof at least one sterically hindered hydroxyphenylalkylphosphonic ester or monoester.

Abstract: A composition that is useful in the preparation of radiation curable coatings is provided. The composition comprises the reaction product of an epoxy component comprised of a diepoxide and an acid component comprised of an ethylenically unsaturated carboxylic acid or reactive derivative thereof, reacted in the presence of a polyamide based on a polymerized fatty acid. The polyamide preferably has a number average molecular weight of less than about 10,000 g/mole. Also provided is a polymerizable composition comprised of the reaction product and a reactive diluent. A method of coating a substrate is also provided which comprises applying to a substrate a composition comprised of the reaction product and exposing said composition to radiation to cure said composition.

Abstract: The invention relates to flame-resistant epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprise a phosphorus-containing compound of the formula I or II ##STR1## in which R is a linear or branched alkyl, cycloalkyl, aryl or alkylaryl group having 1 to 18 carbon atoms or is hydrogen, and R' is a linear or branched alkylene, cycloalkylene, arylene or alkylarylene group having 1 to 18 carbon atoms, to a process for their preparation and to their use.

Abstract: An antistatic composition containing a crosslinked thermosetting resin formed by reacting, in the presence of a water-soluble solvent, (a) a polyaminoamide having unreacted primary and secondary amine groups and (b) a polychlorohydrin derivative.

Abstract: Modified epoxy resins are obtained by reaction of an epoxy resin with up to one mol equivalent per epoxy group of an alkyl or alkenyl substituted, hydroxy substituted aromatic acid, especially by reaction of a bisphenol A epoxy resin with an alkylated salicylic acid. Also are described a process for the production of such modified resins, curable compositions comprising the modified epoxy resin and products provided with the cured composition, especially in coating applications and civil engineering applications.

Abstract: An increase in the molecular weight of a polyamide or recycled polyamide, essentially without crosslinking, can be achieved by blending said polyamide with a polyfunctional epoxy resin and a sterically hindered hydroxyphenylalkylphosphonic acid ester or half-ester and heating the blend to above the melting point (or the glass transition temperature) of the polyamide, in the absence of a catalyst of the type used in the polymerization of polyamides.

Abstract: A binder composition for thermosetting powder paints comprising (i) a polymer that is capable of reacting with epoxy groups and (ii) a crosslinker that contains epoxy groups, wherein the crosslinker comprises at least one C.sub.5 to C.sub.26 linear or branched aliphatic chain with the proviso that epoxy groups are carried on at least one aliphatic chain. In order to function as a crosslinker the amount of oxirane-oxygen originating from the crosslinker in the binder composition is higher than 0.1 meq/gram. The crosslinker is, for example, an epoxydized oil, a modified epoxydized oil or an epoxydized alkyd resin. A powder paint comprising the binder composition can contain a suitable catalyst and, optionally, an additional curing agent.

Abstract: Disclosed is a microcapsule-type curing agent comprising (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable to the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.

Abstract: The invention relates to water-dispersible binders for cationic electrocoating finishes, which binders are reaction products of(A) low molecular weight epoxide resins containing aromatic groups and having an epoxide equivalent weight of below 375,(B) aliphatic and/or alicyclic polyfunctional alcohols and/or carboxylic acids having a molecular weight of below 350,(C) if appropriate up to 60% by weight, relative to the total binder, of polyfunctional alcohols, carboxylic acids and/or SH compounds having a molecular weight of 500-5,000 and(D) primary, secondary and/or tertiary amines and/or salts thereof or a sulfide/acid mixture or a phosphine/acid mixture, the reaction product of A and B containing 10-45% of aromatic groups, calculated as the phenylene group. By means of the binders, a higher layer thickness is obtained in electrocoating.

Abstract: A method for the preparation of a diaminobisimide compound of the formula (I) substantially free of oligomers: ##STR1## wherein Ar.sup.1 is an optionally substituted aromatic residue which provides for good conjugation between the nitrogen containing groups; andAr is an optionally substituted aromatic residue characterized in that at least two molar proportions of an aromatic diamine of the formula (II)H.sub.2 N--Ar.sup.1 --NH.sub.2 (II)wherein Ar.sup.1 is as defined above,are heated with one molar proportion of an aromatic tetracarboxylic acid of the formula (III) or the corresponding dianhydride,(HOOC).sub.2 Ar(COOH).sub.2 (III)wherein Ar is as defined above,optionally in the presence of a polar solvent and optionally including 0.1 to 2 molar proportions of a tertiary amine.The compounds of formula (I) are useful curing agents in epoxy resin formulations.

Abstract: An amine hardener composition for curing epoxy resin based coatings and related products comprising (A) from 5 to 75% of a diamine which possesses a vapor pressure less than about 133 Pascals at 20.degree. C., contains both a primary and a tertiary amine and corresponds to either of the structures: ##STR1## where R.sub.1 and R.sub.2 are independently C.sub.1 -C.sub.8 alkyl; X is --CH.sub.2 --CH.sub.2 --, --CH.sub.2 --CH.sub.2 --CH.sub.2 --, or --CH.sub.2 --O--CH.sub.2 --; and n is 2-6, (B) from 5 to 95% of a polyamide, amidoamine, Mannich base or cycloaliphatic amine curing agent; and (C) from 0 to 50% of other active hydrogen containing dismines or polyamines. Coatings based on the composition can be formulated at up to 100% solids, and have an excellent combination of pot life and dry speed.

Abstract: This invention relates to heat-resistant film adhesives for use in fabrication of printed circuit boards formulated from polyimides with silicone units and epoxy resins and, if necessary, epoxy resin curing agents. It is possible to introduce functional groups reactive with epoxy resins into the polyimide structure. The films are used by inserting them between adherends and pressing at 1 to 1,000 kg/cm.sup.2 and 20.degree. to 250.degree. C. and they show excellent heat resistance, heat resistance at soldering temperature after moisture absorption and processibility when contact-bonded at 250.degree. C. or less.

Abstract: The present invention provides a curable epoxy resin composition, which includes an epoxy resin; from 10 to 60 percent by weight of the epoxy resin of an amine curing agent; from 0.1 to 5 percent by weight of the epoxy resin of an imidazole accelerator; and from 0.01 to 5 percent by mole of the epoxy resin of chromium acetylacetonate (Cr(acac).sub.3). The resultant cured epoxy resin prepared from the epoxy resin composition of the present invention demonstrates improved fracture toughness. Also, the interlaminar fracture energy of the resultant graphite/epoxy laminate prepared from the cured epoxy resin of the present invention is greater than that of the conventional graphite/epoxy laminate.

Abstract: A copolymer composition comprising the hard segment of a polyimide, the soft segment of an oligomeric aliphatic polyester, and a diepoxide for crosslinking and esterification. The diepoxide polyimide copolymer membranes have exhibited high selectivity and flux for separation of an aromatic/saturate mixture. These membranes have shown much better stability in soaking with an aromatic/saturate feed than the copolymer membranes without a diepoxide.

Abstract: An adhesive composition which is a mixture of: (A) between about 30 and about 99 wt% of a first urethane adhesive component which is formed from a polyether polyol having a weight average molecular weight of between about 400 and about 10,000, the polyether polyol being end-capped with an isocyanate and having an isocyanate functionality between about 2.0 and about 3.0; (B) between about 1 and about 70 wt% of a second urethane adhesive component formed from a polyester diol or polyester diol mixture having hydroxyl functionalities of at least about 2, the polyester diol or polyester diol mixture being end-capped with an isocyanate and has a isocyanate functionality of between about 2 and about 2.3; and (C) between about 1 and about 70 wt% of unreacted isocyanate having an isocyanate functionality of between about 2 and about 3.

Abstract: A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Abstract: The present invention describes an aliphatic polyoxaamide polymer and blends thereof that may be used to produce surgical devices such as sutures, sutures with attached needles, molded devices, and the like. The aliphatic polyoxaamide of the present invention have a first divalent repeating unit of formula I:[X--C(O)--C(R.sub.1) (R.sub.2)--O--(R.sub.3)--O--C(R.sub.1) (R.sub.2)--C(O)--] Iand a second repeating unit selected from the group of formulas consisting of:[--Y--R.sub.17 --].sub.T, I[--O--R.sub.5 --C(O)--].sub.B, and III([--O--R.sub.9 --C(O)].sub.P --O--) XIand combinations thereof, wherein X and Y are selected from the group consisting of --O-- and --N(R)--, provided both X and Y are not both --O-- and may be blended with a second polymer that is preferably biocompatable.

Abstract: A composition containing 100 parts by weight of a soluble polyimidosiloxane obtained by polymerization and imidation of an aromatic tetracarboxylic acid component and a component comprising a diaminopolysiloxane, an aromatic diamine with a hydroxyl group and optionally another aromatic diamine, 1 to 50 parts by weight of an epoxy resin, and optionally, also 2 to 150 parts by weight of an inorganic filler such as mica, silica or barium sulfate, and an organic solvent. The composition is homogeneously soluble in organic solvents, and when formed into a protective film on a flexible wiring board it has high heat resistance, flexing resistance, adhesion and chemical resistance (against soldering flux and tin plating solutions).

Abstract: An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

Abstract: A mouldable reinforced polyamide composition comprising;(a) a polyamide consisting essentially of between about 0.5 and about 99.5 mol. % of aliphatic diamines having 4-12 carbon atoms and a complementary amount of 2-methyl-pentamethylene diamine copolymerized with aliphatic dicarboxylic acids having 6-12 carbon atoms; and(b) a filler in an amount of 0.5 to 200 parts by weight per 100 parts by weight of said polyamide. The polyamide has an RV greater than about 20. Related polyamides, especially in which the acid is 1,12-dodecanedioic acid, are also disclosed. The polyamides may be used in a wide variety of end-uses, including moulding, and exhibit excellent gloss compared with nylon 6,6.

Abstract: Non-delaminating resinous compositions are prepared by blending at least one polyetherimide, at least one liquid crystalline polyester in an amount to provide lower melt viscosity, and a compatibilizing amount of at least one polyepoxy compound. The compositions may also contain a minor proportion of at least one non-liquid crystalline polyester such as poly(ethylene terephthalate) or poly(ethylene 2,6-naphthalenedicarboxylate).

Abstract: A composition of matter and a process for the preparation thereof is disclosed for a fibrous composite (e.g., synthetic wood). The fibrous composite contains 50 to 95% by weight carpet and 5 to 50% by weight of a structural adhesive. Structural adhesives effective in this application would include phenol-formaldehyde resins, either of the resole or novalac type, phenol-formaldehyde resins that have at least one other co-monomer present, e.g., bis-phenol A, resorcinol, and other substituted phenols, urea-formaldehyde resins, melamine urea formaldehyde resins, tannin-phenol-formaldehyde resins, diisocyanate resin, epoxy resins, crosslinkable polyvinyl acetate, proteins, e.g., soy flour, blood and polyester resins.

Abstract: A linear block copolymer comprising units of an alkylene oxide, linked to units of peptide via a linking group comprising a --CH.sub.2 CHOHCH.sub.2 N(R)-- moiety, is useful as an imaging agent, drug, prodrug or as a delivery system for imaging agents, drugs or prodrugs.

Abstract: Hot melt adhesive compositions containing amine and acid terminated polyamide resins, optionally curable when combined with epoxy resins, wherein the amine component of the polyamide resin contains (i) 1,2-diaminopropane, (ii) a piperazine-containing diamine, and optionally, (iii) polyetherdiamines; the polyamide resins may be acid or amine terminated, and are characterized by having an acid plus amine number of up to 40, preferably up to 30, and more preferably up to 20; the adhesive compositions are useful in a number of applications and have good strength while exhibiting flexibility and low tackiness.

Abstract: The invention relates to polyamide molding compounds with increased viscosity, high thermal stability and favorable mechanical properties, to a process for their production and to their use.

Abstract: Disclosed is a microcapsule curing agent including (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin. The microcapsule curing agent is formed as a particle-like material in which component (A) is coated with a layer whose main constituent is component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule curing agent, a thermosetting resin composition and a prepreg which exhibit good storage stability at room temperature and are excellent in thermal resistance for cured products made therefrom can be obtained. A fiber reinforced composite material obtained using the thermosetting resin composition is excellent in curing uniformity and thermal resistance.

Abstract: An epoxy resin composition is disclosed that contains compounds that contain at least two 1,2-epoxide groups. The epoxide group-containing compounds are reaction products of compounds (A1) that contain at least two 1,2-epoxide groups per molecule, compounds (A2) that are polyoxyalkylenemonoamines that have a molecular weight of from 130 to 900 and, if desired, polyoxyalkylenemonoamines (A3) that have a molecular weight of from 900 to 5000 and/or polycarboxylic acids (A4). The resin composition additionally contains at least one hardener (B) and, if desired, customary additives (C).

Abstract: A liquid epoxy resin composition is disclosed which comprises a liquid epoxy resin, an amine curing agent, an inorganic filler such as calcined talc, and an organic rheology additive such as modified castor oil. The epoxy resin composition having not greater than 0.4 of an R-value defined by the following equation:R=.eta..sub.10 /Scwherein .eta..sub.10 is a viscosity in Pa.s of the composition at a rate of shear of 10 sec.sup.-1 and Sc represents a Casson yielding point shows excellent adaptability to a high speed dispenser.

Abstract: A thermosetting resin composition which comprises (A) a resin in which at least one compound having a graft-reactive group such as a carboxyl group, a primary amino group or a secondary amino group and a carboxylic anhydride group has been grafted on a polycarbodiimide and (B) an epoxy compound. The said thermosetting resin composition retains heat resistance, electrically insulating properties and mechanical properties characteristic of polycarbodiimide, is excellent in solubility in various solvents and storage stability in the form of a solution and can be easily cured under mild conditions, and can produce a cured product excellent in humidity resistance, transparency, chemical stability and adhesiveness to various substrates.

Abstract: A composition which is the reaction product of (i) a material having the structure ##STR1## where R.sub.1 is an organic radical having 6 to 25 carbon atoms; R.sub.2 is alkylene having 1 to 4 carbon atoms; R.sub.3 and R.sub.4 are independently alkyl having 1 to 4 carbon atoms and n is 2-4 and (ii) an acidic hydrogen-containing compound. The compositions are useful as catalyst in induction curable adhesive compositions.

Abstract: An epoxy resin composition is disclosed that contains compounds that contain at least two 1,2-epoxide groups. The epoxide group-containing compounds are reaction products of compounds (A1) that contain at least two 1,2-epoxide groups per molecule, compounds (A2) that are polyoxyalkylenemonoamines that have a molecular weight of from 130 to 900 and, if desired, polyoxyalkylenemonoamines (A3) that have a molecular weight of from 900 to 5000 and/or polycarboxylic acids (A4). The resin composition additionally contains at least one hardener (B) and, if desired, customary additives (C).

Abstract: A new copolymer composition comprising the hard segment of a polyimide, the soft segment of an oligomeric aliphatic polyester, and a diepoxide for crosslinking and esterification. The new diepoxide polyimide copolymer membranes have exhibited high selectivity and flux for separation of an aromatic/saturate mixture. These new membranes have shown much better stability in soaking with an aromatic/saturate feed than the copolymer membranes without a diepoxide.

Abstract: This invention is a two-part induction-curable epoxy adhesive comprising a first part of a polyfunctional epoxy such as a sorbitol polyglycidyl ether, and a diepoxy compound such as a diepoxy bisphenol-A wherein a portion of the diepoxy compound may preferably comprise a glycol-based epoxy having an epoxy equivalent weight of at least about 250. The second part of the adhesive is a curing agent which preferably maybe a mixture of nitrogen-based compounds di(aminoalkyl)ether of diethylene glycol, and a toughening agent. The invention also comprises a method of adjoining two substrates by applying the adhesive composition of the invention and curing as well as the article resulting from this method.

Abstract: A thermosetting powder coating composition resistant to overspray incompatibility defects that comprises solid particulates of a uniform mixture of (a) a polyester resin having an average of two or more carboxyl groups, (b) a first crosslinker that is reactive toward the carboxyl groups of the polyester resin, (c) from 1% to 20% of a reactive acrylic copolymer having a weight average molecular weight of from 10,000 to 40,000, and (d) a second crosslinker that is reactive toward the reactive functionality of the acrylic copolymer is described.

Abstract: A resin composition for aqueous coating, comprising, as the main components, a resin having hydroxyl group(s) and cationic group(s) and a certain novolac-substituted phenol type epoxy resin. This composition has excellent bath stability and low-temperature curability and is useful in cationic electrocoatings, in particular.

Abstract: Radiation-curable acrylates are prepared by a process in which, in a 1st stage, a hydroxy compound is reacted with acrylic acid or methacrylic acid and, in or before a 2nd stage, the reaction product of the 1st stage is then reacted with an epoxy compound and compounds having one or more primary or secondary amino groups are added in the 2nd stage and the reaction in the 2nd stage is continued, after the addition of these compounds, until the acid number of the reaction mixture has decreased by at least 3 mg KOH/g of reaction mixture from the time of the addition of these compounds.

Abstract: A polymide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

Abstract: Water vapor permeable films of polymeric material of thermoplastic elastomer type based on polyetheresteramide, and preferably on polyether block amides and articles comprising a film of this kind and capable, in particular, of coming into contact with the human body.