Abstract: An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.

Abstract: A resin composition for a cationically electrodepositable paint comprising(A) a resin having hydroxyl groups and cationic groups,(B) an epoxy resin having at least 2 epoxy functional groups each of which comprises an epoxy group directly bound to an alicyclic ring and/or bridged alicyclic ring on average per molecule, and(C) a finely divided gelled polymer as principal components, wherein said finely divided gelled polymer is obtained by emulsion polymerizing(C-1) a polymerizable monomer containing at least two radically polymerizable unsaturated groups in the molecule, and(C-2) a radically polymerizable unsaturated monomer other than the one mentioned in (C-1), abovein the presence of a reactive emulsifier containing an allyl group in the molecule.

Abstract: Compositions containing A) a copolymer based on at least one 1,3-diene and at least one polar, ethylenically unsaturated comonomer and B) a phenol-terminated polyurethane, polyurea or polyurea-urethane of the formula I ##STR1## in which m is 1 or 2, n is 2 to 6, R.sup.1 is the n-valent radical of an elastomeric prepolymer which is soluble or dispersible in epoxide resins, X and Y independently of one another are --O-- or --NR.sup.3 --, it being necessary for one of these groups to be --NR.sup.3 --, R.sup.2 is an m+1-valent radical of a polyphenol or aminophenol after the removal of the phenolic hydroxy group(s) or the amino group or both the amino group and the phenolic hydroxyl group, respectively, and R.sup.3 is hydrogen, C.sub.1 -C.sub.6 alkyl or phenyl, are described.Compounds containing the components A) and B) as well as an epoxide resin C) are also described.The cured products are distinguished by a high peel strength and high resistance to crack propagation.

Abstract: Cationic advanced resins are obtained by (I) reacting a composition comprising (A) an advanced epoxy resin composition comprising the product resulting from reacting a composition comprising (1) an aromatic hydroxyl-containing product resulting from reacting a composition comprising (a) at least one diglycidyl ether of (i) an oxyalkylated aromatic diol, or ii) at least one compound having two hydroxyl groups per molecule in which the hydroxyl groups are attached to an aliphatic or cycloaliphatic carbon atom and which compound is free of aromatic rings; or (iii) a combination of (i) and (ii); and (iv) optionally a diglycidyl ether compound different from (i) and (ii); and (b) at least one compound containing two aromatic hydroxyl groups per molecule; (2) at least one diglycidyl ether of a compound containing two aromatic groups per molecule; (3) optionally, one or more compounds containing two aromatic hydroxyl groups per molecule; and (4) optionally, a monofunctional capping agent; with (B) a nucleophilic com

Abstract: A thermosettable resin composition having a viscosity that decreases during processing temperatures and increases as the temperature is raised to curing temperatures is provided The composition comprises thermosettable resins and thermoplastic particles that are insoluble in the thermosettable resins at processing temperatures but soluble in the thermosettable resins at curing temperatures. Prepregs prepared from the thermosettable resin composition are also provided.

Abstract: A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.

Abstract: A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.

Abstract: This invention relates to thermosetting compositions for the production of epoxide networks of very high impact strength, to a process for their preparation and to their use as polymer materials, coating compounds, adhesives and materials for electrical insulation.

Abstract: Blow moldable copolyetherimide ester compositions are provided. The copolyetherimide ester compositions contain respective amounts of copolyetherimide ester resin and salts of aliphatic polycarboxylic acid. Preferably amounts of multifunctional epoxide are also incorporated into the compositions for further increasing the melt strength thereof. The compositions exhibit suitable melt strength for blow molding thereof.

Abstract: Matrix resin formulations comprising cyanate esters of phenol adducts of dicyclopentadiene, epoxy resins and particular thermoplastics, provide fiber reinforced composites with excellent toughness and hot/wet properties.

Abstract: Blow moldable copolyetherimide ester compositions are provided. The copolyetherimide ester compositions contain respective amounts of copolyetherimide ester resin and salts of aliphatic polycarboxylic acid. Preferably amounts of multifunctional epoxide are also incorporated into the compositions for further increasing the melt strength thereof. The compositions exhibit suitable melt strength for blow molding thereof.

Abstract: A polyimidosiloxane material useful for forming, on a flexible substrate material, a flexible protective coating layer with a high heat resistance, electrical insulating property and curl-resistance, comprises a polymerization-imidization product of an aromatic tetracarboxylic acid component comprising, as a principal ingredient, 2,3,3',4'-biphenyltetracarboxylic dianhydride with a diamine component comprising, as a principal ingredient, a diaminopolysiloxane compound of the formula (I) ##STR1## wherein R.sub.1 is a divalent hydrocarbon residue, R.sub.2 is an C.sub.1-3 alkyl or phenyl group, n is an integer of 3 to 30, and is preferably used, optionally together with an epoxy resin, in the form of a solution or dispersion in an organic solvent to coat a flexible substrate material, for example, a flexible circuit element, therewith.

Abstract: A thermoplastic molding material based onA) from 2 to 97.5% w/w of a homopolymer or copolymer of polyoxymethyleneB) from 2 to 97.5% w/w of a polyamideC) from 0.5 to 25% w/w of a polycondensate of 2,2-di(4-hydroxyphenyl)propane and epichlorohydrinD) from 0 to 60% w/w of an impact modifier, andE) from 0 to 60% w/w of fibrous or particulate fillers or mixtures thereof.

Abstract: Internal polymeric surfaces of medical devices are provided that have enhanced biocompatibility properties. The internal polymeric surface presents an anti-thrombogenic, fibrinolytic or thrombolytic interface with body fluids such as blood flowing through medical device tubing during implantation for medical procedures. The biocompatibility enhancing agent is secured to the polymeric substrate by a spacer molecule which is covalently bound to the internal polymeric surface which had been subjected to radiofrequency plasma treatment with a low pressure plasma medium of water vapor, oxygen or combination of water vapor and oxygen gas.

Abstract: The incorporation of 2 to 25 .mu.m particles of a limited class of polyimides having appreciable nonaromatic character into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45 Ksi after a 1500 in-lb/in impact.

Abstract: The invention is an epoxy resin adhesive composition. The composition comprises:A. An epoxy resin component; andB. A curative component comprising:a curing amount of a polyamine curing agent and 2 to 30 phr. of an adhesion enhancer of comprising a partially hindered polyetherpolyamine.The fast curing adhesive offers high lap shear strength and relatively high peel strength.

Abstract: Epoxy-containing compounds are prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of a compound containing an average of more than one aromatic hydroxyl group per molecule with an alkylene oxide wherein the ratio of moles of epihalohydrin to hydroxyl groups is at least about 1.2:1. When these epoxy containing compounds are formulated into coatings, the resultant products have improved chemical resistance to acids.

Abstract: Epoxy resins containing epoxidized polybutenes and a process for preparing them are disclosed. The cured epoxy resin containing epoxidized polybutene is useful as a coating or a composite and demonstrates improved flexibility and ductility and improved chemical and water resistance with no loss in heat deflection temperature.

Abstract: This invention relates to mixtures of short fibers of varying lengths, diameters and aspect ratios composed of an anisotropic polymer, to compositions containing said fibers and one or more thermoplastic or thermoset resins, and to a process for forming said mixtures.

Abstract: A composition useful as an electrodepositable coating comprises a curing agent and an advanced epoxy resin prepared by advancing a diglycidyl ether of a dihydric phenol with an aromatic hydroxyl-containing reaction product of a diglycidyl ether of an oxyalkylated dihydric phenol and/or a diglycidyl ether of a (cyclo) aliphatic diol, optionally with a dihydric phenol and/or a monofunctional capping agent, combined with a diglycidyl ether of a dihydric phenol.

Abstract: A method of imparting hydrophobic or abhesive properties to a substrate. A composition including a compound selected from the group consisting of(a) a compound of the formulaR.sub.1 R.sub.2 C.dbd.CR.sub.3 R.sub.4and an oligomer of polymer thereof;(b) a compound of the formula--(CR.sub.1 R.sub.2 --CR.sub.3 R.sub.4).sub.n --(c) a compound of the formula ##STR1## and an oligomer or polymer thereof wherein R.sub.1, R.sub.2 and R.sub.3 are independently CH.sub.3 or C.sub.2 H.sub.5 ; R.sub.4 is H, CH.sub.3 or C.sub.2 H.sub.5 ; A and B are independently H, CH.sub.3, C.sub.2 H.sub.5 or --(CR.sub.1 R.sub.2 --CR.sub.3 R.sub.4).sub.n --; and n is an integer between 1 and 20,000,000 is applied to the surface of the substrate. When the composition cures, the substrate possesses superior water-proof and release properties.

Abstract: A polyurethane adhesive composition containing an oxy acid of phosphorus or a derivative thereof, a carboxylic acid or an anhydride thereof, a silane coupling agent and an epoxy resin can serve as an adhesive for manufacturing food packaging materials, for instance, giving bonds having very good bond strength, heat resistance and hot water resistance between a metal foil and a plastic film.

Abstract: The invention relates to compositions containing A) a liquid copolymer based on butadiene and at least one polar, ethylenically unsaturated comonomer, and B) a polyether prepolymer capped with hydroxyarylcarboxylic or hydroxyaralkylcarboxylic acids, or a capped polyester, polythioester or polyamide containing polyether segments. The phenolic hydroxyl group in component B) can also be etherified with epichlorohydrin and this product can be converted to a episulfide, if desired, or the phenolic hydroxyl group can be reacted with cyanogen halide to form a cyanate group.The stock compositions can be used in combination with epoxy resins to manufacture structural adhesives or sealing compounds.

Abstract: Bismaleimide resin systems containing low viscosity epoxy resins and a swellable or soluble thermoplastic when utilized to impregnate intermediate modulus carbon fiber are capable of preparing quasiisotropic composites, which, when cured, exhibit compression strengths after impact of greater than 47-50 ksi after an impact of 1500 in-lb/in.

Abstract: An article coated with a cationically electrodepositable paint composition comprises (A) a resin having hydroxyl and cationic groups, (B) an epoxy resin having at least 2 epoxy groups, each directly bound to an alicyclic ring, and (C) lead hydroxide and/or lead maleate as curing catalyst(s).

Abstract: Disclosed is a curable epoxy resin composition which is effectively cured at ambient temperature and when cured has excellent adhesive strength and good water resistance. The epoxy resin composition comprises:(a) an epoxy resin having at least two epoxy groups in one molecule,(b) a monofunctional (meth)acrylate represented by ##STR1## wherein R.sub.1 represents a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, R.sub.2 and R.sub.3 respectively represent a hydrogen atom or a methyl group, and n is an integer of 1 to 4, and(c) An amine curing agent selected from the group consisting of an aromatic polyamine, a modified aromatic polyamine, a polyamideamine and a mixture thereof. The present invention also provides an adhesive composition prepared from the above mentioned curable epoxy resin composition.

Abstract: A polycondensation and/or addition product containing carboxyl groups and tertiary amino groups, coating agents based on the latter, and the use thereof.The present invention relates to a polycondensation and/or addition product containing carboxyl groups and amino groups. This can be obtained by reactinga) polycarboxylic acids or anhydrides thereof, if appropriate together with monocarboxylic acids,b) polyols, if appropriate together with monools, and, if appropriatec) further modifying components, and, if appropriate,d) a component which is capable of reacting with the reaction product from a), b) and, if appropriate, c), with the proviso that the final product contains tertiary amino groups which originate from components a) and/or b) and/or d), and the reaction product from a), b), if appropriate c) and if appropriate d) and an acid number from 5 to 200, preferably 10 to 130, and an amine number from 3 to 150, preferably 10 to 300.

Abstract: This invention relates in general to the formation of fibers having a controlled molecular orientation prepared from rod-like extended chain aromatic-heterocyclic ordered polymers, and containing a binder in the micro-infrastructure. Such fibers have high tensile strength, modulus, and environmental resistance characteristics.

Abstract: Epoxy resin formulations having improved storage stability comprising epoxys selected from the group consisting of polyglcidyl ethers of polycyclic bridged hydroxy-substituted polyaromatic compounds and N,N,N',N'-tetraglycidyl-bis(4-amino-3-ethylphenyl) methane with from about 6 to about 150 pbw, per hundred parts by weight of the epoxy resin components, of a solid aromatic diamine hardener insoluble in said composition at room temperature in an amount effective to cure said epoxy resin.

Abstract: A thermosetting resin composition useful for heat-resistant adhesive agents and cured shaped articles, comprising (A) a terminal imide oligomer having hydroxyl groups prepared, in an organic medium, from a biphenyltetracarboxylic acid ingredient, an aromatic diamine ingredient and a modifying monoamine ingredient having at least one hydroxy group, and exhibiting a logarithmic viscosity number of 0.01 to 1 at 30.degree. C., and (B) an organic compound having at least two epoxy groups, the imide oligomer optionally being in the state of a partial reaction product of the above-mentioned ingredients.

Abstract: Miscible blends of (1) a thermoplastic methylol polyester having backbone repeating units containing pendent hydroxyl and methylol moieties and divalent organic moieties such as 1,3-phenylene, 1,4-phenylene, 2,6-naphthalene, biphenylene and isopropylidene diphenylene, and (2) a linear, saturated polyester or copolyester of aromatic dicarboxylic acids, such as poly(ethylene-co-1,4-cyclohexanedimethylene terephthalate) (PETG) and poly(ethylene terephthalate) (PET), have improved clarity and exhibit enhanced barrier to oxygen relative to PET and PETG.

Abstract: Polymeric surfaces of medical devices or components of medical devices are provided that have enhanced biocompatibility properties. The polymeric surface presents an anti-thrombogenic, fibrinolytic or thrombolytic interface with body fluids such as blood during implantation or medical procedures. The biocompatibility enhancing agent is secured to the polymeric substrate by a spacer molecule which is covalently bound to the polymeric substrate which had been subjected to radiofrequency plasma treatment with a water vapor medium.

Abstract: Thermoplastic resin compositions comprising polyarylate and polyamide resins as main components, and an epoxy resin of the following formula [1] in a predetermined amount are provided. ##STR1## The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.

Abstract: Curable epoxy-amine coatings comprised of pigmented mixtures of reactive amine-functional curing agents and epoxy resins are substantially improved by being rendered thixotropic or pseudoplastic by the inclusion of at least about 0.05% by weight of a thixotropic additive selected from monocarboxylic organic acid, dicarboxylic organic acid, tricarboxylic organic acid, fatty acid or polymerized fatty acid.

Abstract: An adhesive composition comprising(A) An epoxide resin component,(B) A hardener component, and incorporated in either or both/or (A) and (B) a thermoplastic polymer, mixtures thereof and application of said mixtures to substrate surfaces to adhere said surfaces together are described.

Abstract: A polyurethane adhesive composition containing an oxy acid of phosphorus or a derivative thereof, a carboxylic acid or an anhydride thereof and an epoxy resin can serve as an adhesive for manufacturing food packaging materials, for instance, giving bonds having very good bond strength, heat resistance and hot water resistance between a metal foil and a plastic film.

Abstract: A cationically electrodepositable paint composition comprises (A) a resin having hydroxyl groups and cationic groups, (B) an epoxy resin having at least two epoxy groups, each directly bound to a (bridged) alicyclic ring, and (C) lead hydroxide and/or lead maleate as curing catalyst(s).

Abstract: Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular.These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.

Abstract: Novel polyamide copolymers having skeletons of a specific structure are disclosed. The polyamide copolymers have excellent resistance to hydrolysis, low temperature characteristics (low temperature softness), heat aging resistance and mechanical properties as compared to conventional polyamide copolymers. The polyamide copolymers also show excellent efficiencies in fabrication properties and transparency. In particular, the polyamide copolymers having a branched structure in the molecule thereof provide good results.

Abstract: A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.

Abstract: A fiber reinforced resin matrix composite material repair system is provided, which critically employs a resin comprising a catalyst of the formula I: ##STR1## with a multifunctional epoxy resin, the resin system being sealed in a water-proofed environment prior to being coated onto a fiber reinforcement. The coated fiber reinforcement is applied over the damaged area, the damaged portion having been removed, and the surrounding surface smoothed. An adhesive is applied to the remaining surface, prior to application of the patch. The resulting patch, which may further include thermoplastic toughening agents and an enhancer, can be directly cured at temperatures below 212.degree. F. to give physical properties similar to the original material.

Abstract: An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epoxy resins is an unmodified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The other epoxy resin is an urethane-modified or glycol-modified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The polyamide powder has an average particle size of 150 .mu.m or less and a melting of at least 170.degree. C. and is present in an amount 1-50 parts by weight per 100 parts by weight of liquid epoxy resin admixture.

Abstract: A polymaleimide/epoxy blend is cured with cyanamide to provide interlocked one-phase networks with superior thermal properties.

Abstract: The present invention discloses a curable coating composition characterized in that the composition comprises as a vehicle component a nitrogen-containing resin modified with an epoxy resin and obtained by subjecting to a condensation reaction a polybasic acid compound and an amine compound having at least two active hydrogen atoms in the molecule on the average which atoms are reactive with the carboxyl group of the polybasic acid compound, without or along with a polyhydric alcohol and/or a fatty acid, and modifying the resulting nitrogen-containing resin with the epoxy resin.

Abstract: Hybrid curable compositions comprising components curable by condensation and components curable by the free radical initiated polymerization. The components curable by condensation reaction comprise amino resins and co-reactants, the condensation reaction being optionally catalyzed by acid catalysts. The components curable by free radical initiated polymerization comprise acryloyl compounds.

Abstract: Thermoplastic resin compositions comprising polyarylate and polyamide resins as main components, polyethylene terephthalate and an epoxy resin of the following formula [1] in a predetermined amount are provided. ##STR1##The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.

Abstract: Polyaminoamides of formula: ##STR1## in which A.sub.1 represents a divalent radical of structure: ##STR2## in which a and b=0 or 1 ##STR3## in which c and d=0 or 1 ##STR4## B.sub.1 represents: 1) in the proportions of 60 to 100% (in moles), the radical ##STR5## in which x.sub.2 =2 and n.sub.1 =1 or 2, or alternatively, x.sub.1 =3 and n.sub.1 =1 and e=0 or 12) in the proportions of 0 to 40% (in moles), the radical (II) above in which x.sub.1 =2 and n.sub.1 =0 or the radical ##STR6## 3) in the proportions of 0 to 20% (in moles), the radical--NH--(CH.sub.2).sub.6 --NH--;in radicals A.sub.1 and B.sub.1, Y represents a residue of an ultraviolet radiation-absorbing molecule, anda+b+c+d+e.gtoreq.1, it being understood that when a, b, c, d or e are zero, the nitrogen atom is then bound to a hydrogen atom;the ratio ##EQU1## is between 0.05 and 0.5; A.sub.2 represents a bivalent radical which has one of the following structures: ##STR7## B.sub.

Abstract: The invention relates to lacquers based on a substance mixture of epoxide compounds and possibly polyesters as well as salts of primary (cyclo)aliphatic C.sub.4-18 -diamines with benzene polycarboxylic acid as hardeners as well as the usual additives and a procedure for the production of flat lacquer coatings.

Abstract: Epoxy compositions having improved toughness and flexibility comprising a polyepoxide of the formula ##STR1## wherein each X is H, allyl or glycidyl, Y is allyl or glycidyl and R is an alkyl of 1 to 4 carbons with there being at least two epoxy groups on the ring modified with a carboxy terminated polymer.

Abstract: An intermediate for a composite material is disclosed. The intermediate is obtained by impregnating an epoxy resin composition containing a specific additive into a carbon fiber. The composite material obtained from the intermediate has improved mechanical properties.