Mixed With Polycarboxylic Acid Or Derivative And Polyhydroxy Reactant Or Polymer Therefrom Patents (Class 525/425)
  • Patent number: 5459230
    Abstract: The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt), lauric acid lactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt) and an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt), the melting point of the copolyamide being lower than 140.degree. C. and at least 10% by weight of lauric acid lactam and/or 11-aminoundecanoic acid being copolymerized.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: October 17, 1995
    Assignee: Elf Autochem Deutschland GmbH
    Inventors: Eduard de Jong, Karl-Heinz Hapelt
  • Patent number: 5457144
    Abstract: This invention provides hydrolytically labile polyamide compositions and articles containing an ester derived moiety in the polymer backbone which will degrade after exposure to water over long periods of time.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: October 10, 1995
    Assignee: Rohm and Haas Company
    Inventors: Norman L. Holy, Newman M. Bortnick
  • Patent number: 5455308
    Abstract: Thermosettable composition suitable for the production of endless objects without the use of continuous carrier material, whereby the composition comprises an epoxy resin or an unsaturated polyester and a high molecular weight thermoplastic polymer which has a weight-average molecular weight of at least 1,000,000 g/mol in an amount to make the composition spinnable, the amount ranging from at least 0.1% where the polymer has a molecular weight of 5,000,000 g/mol or more or less than 2% where the polymer has the weight-average molecular weight of 1,000,000 g/mol, the amount decreasing as the weight-average molecular weight increases.
    Type: Grant
    Filed: August 16, 1994
    Date of Patent: October 3, 1995
    Assignee: DSM N.V.
    Inventor: Cornelis W. M. Bastiaansen
  • Patent number: 5455311
    Abstract: The object of the present invention is the production of thermoplastically workable copolymers capable of being composted, characterized in that they consist of partially crystalline soft segments formed from aliphatic esters and also of amorphous hard segments and that the proportion of soft segments amounts to 70% to 95% by weight.
    Type: Grant
    Filed: August 8, 1994
    Date of Patent: October 3, 1995
    Assignee: Bayer AG
    Inventors: Ernst Grigat, Ralf Dujardin, Ralf Timmermann, Hans-Georg Rast
  • Patent number: 5455310
    Abstract: A thermoplastic composition which comprises a siloxane polycarbonate block copolymer wherein the polysiloxane segments of the copolymer are of the formula: ##STR1## where R.sup.1, R.sup.2, Y, D, A, X, A' and E are as defined herein, and high heat polycarbonates containing recurring or repeating polycarbonate units of the formula: ##STR2## wherein Z is --O--, --N(R.sup.3)-- or a mixture thereof and R.sup.3 is selected from hydrogen, hydrocarbyl and halogen-substituted hydrocarbyl.
    Type: Grant
    Filed: August 15, 1994
    Date of Patent: October 3, 1995
    Assignee: General Electric Company
    Inventors: James F. Hoover, Paul D. Sybert
  • Patent number: 5453463
    Abstract: Molding materials are composed ofA) from 5 to 95% by weight of polyaryl ethers,B) from 5 to 95% by weight of a mixture (B) ofB.sub.I) from 75 to 97% by weight of partly aromatic polyamides andB.sub.II) from 3 to 25% by weight of a rubber impact modifierand furthermoreC) from 0 to 40% by weight of additives and/or processing assistants.
    Type: Grant
    Filed: October 5, 1994
    Date of Patent: September 26, 1995
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Klaus Muehlbach
  • Patent number: 5451642
    Abstract: A thermoplastic resin composition containing a polyamide resin composition (C) consisting of a polyamide resin (A) and another thermoplastic resin (B) and at least one modifier (D) is excellent in coatability, mechanical properties, linear expansion coefficient and appearance, can be molded into an article which comprises the polyamide resin (C), wherein the ratio of the percent occupied area of the polyamide resin on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1.2, and/or the ratio of the percent concentration of the polyamide resin on the surface of the article determined on the basis of the nitrogen concentration on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1,2, which article is suited for electric and electronic parts and automobile parts such as a bumper, fender and wheel cover.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: September 19, 1995
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroomi Abe, Takeshi Fujii, Kiyoshi Mitsui, Hideo Shinonaga, Satoru Sogabe, Satoru Hosoda, Keitaro Kojima
  • Patent number: 5446109
    Abstract: A polyamide/aliphatic polyester block, copolymer (A) comprising a polyamide block and an aliphatic polyester block, (B) satisfying the expression T.sub.1 -T<100-C (in which T is the melting point (.degree.C.) of the above block copolymer, T.sub.1 is the melting point (.degree.C.) of a polyamide composed of the polyamide block and C is the content (wt. %) of the polyamide block), (C) exhibiting the extraction amount which satisfies the expression, when extracted in tetrahydrofuran, E<(100-C).times.0.4 (in which E is the extraction amount (wt. %) when the block copolymer is refluxed in tetrahydrofuran, and C is the content (wt. %) of the polyamide block) and (D) having an intrinsic viscosity, measured at 35.degree. C., in the range of from 0.5 to 5; a process for the production thereof; a fiber formed therefrom; and an intimate blend comprising a thermoplastic resin having no or poor compatibility with polyamide and the block copolymer.
    Type: Grant
    Filed: February 23, 1994
    Date of Patent: August 29, 1995
    Assignee: Teijin Limited
    Inventors: Shunichi Matsumura, Takashi Ito, Takanori Miyoshi
  • Patent number: 5439987
    Abstract: A thermoplastic molding composition having a high neat deflection temperature but a relatively low melt extrusion temperature is formed by blending a polyetherimide with about 35 to about 80 weight percent of a copolyester of terephthalic and/or isophthalic acid and a glycol component comprising ethylene glycol and up to about 60 mol percent of 1,4-cyclohexanedimethanol. The blend also has a high flexural modulus and can be used to form plastic articles that can be molded at moderate temperatures but retain flexural strength at elevated temperatures. Certain compositions of the invention are clear, single phase solid solutions.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: August 8, 1995
    Assignee: Eastman Chemical Company
    Inventors: Christopher E. Scott, Max F. Meyer, Kenneth E. Breeding, Jeffrey T. Owens
  • Patent number: 5438105
    Abstract: A polyamic acid composite comprising i) a polyamic acid having three dimensional network molecular structure obtained by a ring-opening polyaddition reaction of a tetracarboxylic acid dianhydride with an aromatic diamine and a tri- or tetramino compound and ii) (a) a high polymer component having a different molecular structure from the polyamic acid, which is dispersed in the three dimensional network molecular structure of the polyamic acid and of which molecular chains are interpenetrated with molecular chains of the polyamic acid or (b) a curable resin composition which is dispersed in the three dimensional network molecular structure of the polyamic acid and which is capable of forming a cured resin of which molecular chains are interpenetrated with molecular chains of the polyamic acid, and a polyimide composite obtained from the polyamic acid composite, and process for production thereof.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: August 1, 1995
    Assignee: Toho Rayon Co., Ltd.
    Inventor: Yasuhisa Nagata
  • Patent number: 5426148
    Abstract: A fast-curing sealant composition is made from generally liquid oligomers and has good tensile strength, one hundred percent modulus, Shore-A Hardness, and good insensitivity to water. One part of the sealant composition is generally a polyester or polyether oligomer having acetoacetate end groups or functionalities thereon, whereas the second part is also generally a polyester of polyether oligomer generally containing primary amine end groups or functions. The oligomers are generally of a low molecular weight, as from about 500 to about 10,000, and are modified by compounding with various additives such as carbon black, antioxidants, ultraviolet light inhibitors, and the like. Polyfunctional acetoacetate-terminated molecules having 3 or more functional end groups or polyfunctional primary amine-terminated molecules having 3 or more functional end groups serve to increase the crosslink density and modulus of the compositions. The sealant can be used as a coating or as a caulking type compound.
    Type: Grant
    Filed: April 28, 1994
    Date of Patent: June 20, 1995
    Assignee: Tremco, Inc.
    Inventor: Harold A. Tucker
  • Patent number: 5418281
    Abstract: Blends of poly(arylene sulfide)s, liquid crystalline polyesters and liquid crystalline poly(esteramide)s exhibit a lower melt viscosity than would be expected based on the melt viscosities of analogous blends of liquid crystalline polyesters and poly(arylene sulfide)s that have the same overall amount of liquid crystalline polymer. The viscosities are reduced over a wide range of compositions. Such blends are useful in the manufacture of electronic components, particularly connectors.
    Type: Grant
    Filed: August 17, 1994
    Date of Patent: May 23, 1995
    Assignee: Hoechst Celanese Corporation
    Inventors: Paul C. Yung, H. Clay Linstid, III
  • Patent number: 5418299
    Abstract: Blends can be formed which comprise a flexible coil polymer substrate, e.g., of a poly(alkylene terephthalate), and a thermotropic, essentially liquid crystalline oligomer which comprises aromatic units and at least one linear polyalkylene spacer. These blends can be used to form fibers or molded articles.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: May 23, 1995
    Assignee: Akzo Nobel N.V.
    Inventors: Ki-Soo Kim, Sophia Dashevsky, Jian-Lin Liu, Stanley W. Palmaka
  • Patent number: 5416171
    Abstract: The invention relates blending compositions comprising (a) a polyamide and (b) a block copolyetheramide with hard polyamide segments and soft polyether segments. The block copolyetheramide is defined by the formula:--[--CO--R.sup.1 --CO--(NHR.sup.2 CO).sub.m --O--(R.sup.3 --O--).sub.p --(CO--R.sup.2 --NH).sub.q --].sub.n --wherein R represents the alkylene group of an aliphatic diacid having between about 2 and about 18 carbon atoms; R.sup.2 represents an alkylene group having between about 3 and about 11 carbon atoms; R.sup.3 represents an alkylene group having between about 2 and about 4 carbon atoms; m and q independently range between about 2 and about 40; p ranges between about 10 and about 100; and n ranges between about 2 and about 50, said blending composition containing a polyether content ranging between about 1 and about 50%. The blocking copolyetheramides may be prepared by reacting a polyetherdiol, caprolactam and an aliphatic diacid in a two-stage method.
    Type: Grant
    Filed: August 11, 1994
    Date of Patent: May 16, 1995
    Assignee: Industrial Technology Research Institute
    Inventors: Lie-Zen Chung, De-Lun Kuo, Hong-Bing Tsai
  • Patent number: 5401812
    Abstract: A thermosetting polyimide composition is provided with a sufficient heat resistance and excellent mechanical and electrical characteristics in toughness, flexibility and so on and under severe environmental conditions, by adding to a polyfunctional unsaturated imide a thermosetting resin selected from the group consisting of polyetherimide, polyarylate and polyamideimide which are in a miscibility region with the polyfunctional unsaturated imide and have an excellent glass transition point and a number-average molecular weight of more than 10,000.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: March 28, 1995
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hiroshi Yamamoto, Taro Fukui
  • Patent number: 5393848
    Abstract: An improved liquid crystalline polymer blend is produced by mixing a preformed thermotropic liquid crystalline polymer in the melt phase with reactants needed to form a second liquid crystalline polymer under conditions sufficient to form the second liquid crystalline polymer. The resulting blends are anisotropic and have improved morphology and improved melt processability. The method is particularly useful when the second liquid crystalline polymer is biphasic or is difficult to synthesize or process in the melt.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: February 28, 1995
    Assignee: Hoechst Celanese Corp.
    Inventors: Larry F. Charbonneau, Balaram Gupta, H. Clay Linstid, Linda C. Sawyer, James P. Shepherd
  • Patent number: 5393849
    Abstract: A thermosetting composition comprising the combination of an unsaturated polyester resin and a polyamino compound having a plurality of secondary or primary amino moieties.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: February 28, 1995
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Ramji Srinivasan, Ted M. McVay, David A. Hutchings
  • Patent number: 5391572
    Abstract: Thermoplastic molding compositions are obtainable by mixingA) from 0.5 to 5% by weight of a thermoplastic polyester elastomer andB) from 0 to 50% by weight of fibrous or particulate fillers or mixtures thereof into a melt ofC) from 40 to 99.5% by weight of a polyamide prepolymer having a viscosity number of from 40 to 80 ml/g and subsequent postcondensation in solid phase.
    Type: Grant
    Filed: May 11, 1994
    Date of Patent: February 21, 1995
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz, Gunter Pipper
  • Patent number: 5387639
    Abstract: Blends of polyester-carbonates and/or polyarylate resins with polyetherimide resins are thermoplastically molded to obtain ductile, high distortion temperature articles. The polyester-carbonate resin or polyarylate resin is selected from a particular class prepared by polymerization of a dihydric phenol, and an ester precursor which is terephthalic acid, optionally with a proportion of isophthalic acid.
    Type: Grant
    Filed: October 23, 1992
    Date of Patent: February 7, 1995
    Assignee: General Electric Company
    Inventors: Paul D. Sybert, Raymond H. Glaser
  • Patent number: 5378769
    Abstract: A molding composition is provided which is effective as an agent for imparting compatibility in thermoplastic blends or as an adhesion-promoting layer in composite materials which comprises:A. a polyamideB. a polyester, andC. an oxazoline derivative.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: January 3, 1995
    Assignee: Huls Aktiengesellschaft
    Inventors: Joachim Mugge, Friedrich Sosna
  • Patent number: 5372879
    Abstract: The present invention provides a biaxially oriented polyester film made of a polyester containing 0.01 to 5% by weight of crosslinked polymer particles characterized by:(1) having a particle size distribution ratio (.gamma.) of 1.3 to 3.5,(2) having an average particle diameter of 0.1 to 2 .mu.m,(3) having a non-circularity of 3.4 or more, and(4) having a standard deviation of noncircularity, of at least 0.16.The polyester film of the present invention has a flat surface having a small number of large protuberances, excellent running property and excellent winding property, and can be produced economically. The film has excellent properties for use as a base for various magnetic recording media.
    Type: Grant
    Filed: February 18, 1994
    Date of Patent: December 13, 1994
    Assignee: Teijin Limited
    Inventors: Makoto Handa, Tomoyuki Kishino
  • Patent number: 5366663
    Abstract: Mixtures of liquid crystalline copolymers, polyether imides and compatibilizers and use thereof.Mixtures of at least one A) liquid crystalline copolymer, at least one B) polyether imide and at least one C) compatibilizer where the proportions of components A) and B) are each from 5 to 95 % by weight, based on the sum total of the two components, and the proportion of the compatibilizer C) is from 0.5 to 10 % by weight, based on the mixture of A) and B), have improved breaking strength and extension values.They are therefore highly suitable for producing molded articles or for use as matrix material for composites.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: November 22, 1994
    Assignee: Hoechst AG
    Inventors: Michael Romer, Andreas Schleicher
  • Patent number: 5366804
    Abstract: A composite fiber of at least two different polymers, one of which is water-insoluble and selected from the group consisting of polyester, polyamide and copolymers therefrom and the other is water-dissipatable, having a plurality of at least 19 segments of the water-insoluble polymer, uniformly distributed across the cross-section of the fiber and being surrounded by the water-dissipatable polymer, a process for the manufacture of such a fiber and a process for the manufacture of microfibers therefrom.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: November 22, 1994
    Assignee: BASF Corporation
    Inventor: Jeffrey S. Dugan
  • Patent number: 5346967
    Abstract: Thermoplastic resins of enhanced solvent resistance especially useful for packaging or automotive parts comprising blends of amorphous polyamides with a thermoplastic polyester resin, substantially free of a polyarylate have excellent physical properties and barrier resistance to oxygen and carbon dioxide. Preferred blends comprise polyesters prepared by reacting a dihydric alcohol with a dicarboxylic acid, and amorphous polyamides prepared from non-symmetric monomers comprising odd-number chain diamines and diacids, and meta aromatic diamines and diacids.
    Type: Grant
    Filed: January 25, 1993
    Date of Patent: September 13, 1994
    Assignee: General Electric Company
    Inventors: Donald C. Clagett, Daniel W. Fox, Louis M. Maresca
  • Patent number: 5344895
    Abstract: A polymer composition is disclosed which includes a polyamideimide polymer and a liquid crystalline polymer, wherein the amount of the liquid crystalline polymer is in an amount which significantly decreases the melt viscosity of the polyamideimide polymer while not significantly decreasing the mechanical properties of the polyamideimide polymer.
    Type: Grant
    Filed: April 1, 1993
    Date of Patent: September 6, 1994
    Assignee: University of Massachusetts Lowell
    Inventors: Xiaoyun Lai, Dafang Zhao, Francis Lai
  • Patent number: 5340885
    Abstract: Copolymers comprising amide units and ester units are prepared by melt phase interchange of diaryl esters of dicarboxylic acids and diamines with dihydric alcohols and diesters of aromatic dicarboxylic acids. The products are tough resins, useful per se as molding compounds, and to compatibilize and toughen other thermoplastic polymers.
    Type: Grant
    Filed: January 25, 1993
    Date of Patent: August 23, 1994
    Assignee: General Electric Company
    Inventors: Donald C. Clagett, Daniel W. Fox, Louis M. Maresca, Sheldon J. Shafer
  • Patent number: 5340884
    Abstract: This invention relates to a polyester/polyamide blend having an excellent gas barrier property and an improved flavor retaining property, and clarity. More particularly, the present invention relates to a polyethylene terephthalate/low molecular weight polyamide blend having an excellent gas barrier property, in which by reducing the concentration of acetaldehyde contained in the polyester, the storage property of a food or the like and the flavor-retaining property and fragrance retaining property are highly improved without producing haze.
    Type: Grant
    Filed: September 13, 1993
    Date of Patent: August 23, 1994
    Assignee: Eastman Kodak Company
    Inventors: David E. Mills, Steven L. Stafford
  • Patent number: 5332777
    Abstract: Unreinforced polyamide molding materials containA) from 60 to 100% by weight of a mixture consisting ofA.sub.1) from 97.5 to 99.85% by weight of one or more polyamides,A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide andA.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atomsand, based on the total weight of the polyamide molding material,B) from 0 to 40% by weight of a toughened polymer andC) from 0 to 10% by weight of conventional additives in effective amounts.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: July 26, 1994
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz
  • Patent number: 5331061
    Abstract: Thermoplastically processable elastomeric block copolyetheresteretheramides from recurring units of the formula ##STR1## in which ##STR2## represents a polyamide segment containing terminal carboxyl groups and having an average molar mass of 700 to 10 000, --O--E--O-- is a poly-(oxytetramethylene)-segment having an average molar mass of 600 to 3 500, --NH--F--NH-- represents a poly-(oxy-1,2-propylene)-segment containing terminal amino groups and having an average molar mass of 350 to 2 500, x and y are integers from 3 to 35 and indicate the number of the respective, randomly arranged, recurring units, the ratio x:y of components A and B varying between 5:1 and 1:5.The ether amides of the present invention can optionally be mixed with additives, fillers, modifiers, or other compatible polymers normally used in the processing of polyamides and which are suitable for the production of molded articles, for example by injection molding, coinjection, extrusion, blow molding, etc.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: July 19, 1994
    Assignee: EMS-Inventa AG
    Inventor: Hanns-Jorg Liedloff
  • Patent number: 5331053
    Abstract: Polymeric fibrids reinforce elastomers to yield well-blended products of high modulus and elongation.
    Type: Grant
    Filed: December 14, 1990
    Date of Patent: July 19, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Dexter L. Atkinson, Arnold Frances, Lee J. Hesler
  • Patent number: 5326830
    Abstract: The invention relates to a process for forming chain extended polymers and graft and block polymers and copolymers which comprises the steps of: (a) forming an intimate mixture of one or more polymers and one or more effective phosphorus (III) chain extension reagent compounds; wherein at least one of said effective chain extension reagents has bonded to the phosphorus (III) atom at least one group which is a nitrogen-containing heteroaromatic moiety that is bonded through a nitrogen of the heteroaromatic moiety to the phosphorus (III) atom by a single bond; and (b) heating said mixture for a time and at a temperature sufficient to form said extended chain polymer or copolymer. Further embodiments relate to polymers and copolymers prepared in accordance with the process of this invention as well as articles formed from these polymers and polymer compositions comprising the polymeric materials of this invention.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: July 5, 1994
    Assignee: AlliedSignal Inc.
    Inventor: Shaul M. Aharoni
  • Patent number: 5324795
    Abstract: The present invention relates to a polymer blend composition for melt molding which is a composition obtained by adding a thickener to a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer, characterized in that the melt viscosity of the composition determined at a molding temperature at a shear rate of 1000 sec.sup.-1 is the same or higher than the melt viscosity of said non-liquid crystal polymer determined under the same conditions.According to the present invention, a polymer blend for melt molding having improved properties, whereby problems observed in prior arts upon molding a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer (for example, insufficient alignment of the liquid crystal polymer and difficulties in extrusion, because of excessively low melt viscosity) can be solved, is obtained.
    Type: Grant
    Filed: May 12, 1993
    Date of Patent: June 28, 1994
    Assignee: Unitika Ltd.
    Inventor: Jun-ichi Suenaga
  • Patent number: 5321099
    Abstract: Blends of (1) a crystalline polyamide derived from 4,4'-diphenylmethane diisocyanate (MDI) and a dicarboxylic acid and (2) a segmented polyesteramide derived from (a) MDI, (b) a carboxylic acid-terminated polyester prepolymer, a carboxylic acid-terminated polyether prepolymer or a carboxylic acid-terminated polycarbonate prepolymer and (c) from 0 to 10 moles of a dicarboxylic acid per mole of prepolymer, exhibit increased tensile ductility and are useful in the manufacture of headlamp reflectors, electrical connectors, molded circuit boards and the like.
    Type: Grant
    Filed: January 2, 1992
    Date of Patent: June 14, 1994
    Assignee: The Dow Chemical Company
    Inventors: David J. Goldwasser, Augustin T. Chen
  • Patent number: 5321098
    Abstract: The invention relates to a composition mixture comprising (i) at least one ester-acid, ester-salt or mixtures thereof and (ii) at least one amidic-acid, amidic-salt or mixtures thereof a polymer fabrics treated with the same. The treated polymer fabrics have improved wicking/wetting characteristics. The treated polymer fabrics maintain these characteristics upon repeated exposure to aqueous fluids.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: June 14, 1994
    Assignee: The Lubrizol Corporation
    Inventor: Kasturi Lal
  • Patent number: 5321087
    Abstract: The present invention relates to a process for the preparation of a thermoplastic resin composite comprising conducting polycondensation of a monomer material in a solution of an organic solvent containing an organic solvent soluble polymer to form an aromatic condensation polymer which is insoluble in said organic solvent and a thermoplastic resin composite prepared by the process.
    Type: Grant
    Filed: July 22, 1992
    Date of Patent: June 14, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Naoya Ogata, Takehisa Nakanishi, Tadashi Asanuma
  • Patent number: 5319064
    Abstract: Thermotropic liquid crystalline poly(ester-amide) compositions are disclosed which comprise a bis(4-carbonyl phenylene) terephthalate unit and a unit derived from an N-substituted hydrocarbylenediamine (e.g., one derived from an N,N-dialkylalkylene).
    Type: Grant
    Filed: October 6, 1992
    Date of Patent: June 7, 1994
    Assignees: Univ. of Mass. at Amherst, Akzo N.V.
    Inventors: Thomas F. McCarthy, Robert W. Lenz, Simon W. Kantor, Ki-Soo Kim, Sophia Dashevsky
  • Patent number: 5317066
    Abstract: The polyester-grafted polyamide of the present invention comprises a polyamide as the backbone and a thermoplastic polyester as the graft and has a number-average molecular weight in terms of standard polymethyl methacrylate of 50,000 to 500,000 as determined by gel permeation chromatography using 1,1,1,3,3,3-hexafluoro-2-propanol. The polyester-grafted polyamide is useful as a modifier for polyesters and polyamides.
    Type: Grant
    Filed: March 23, 1993
    Date of Patent: May 31, 1994
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Kazushi Watanabe, Katsuhiko Sumida
  • Patent number: 5314987
    Abstract: Novel blends of (i) PET, PBT, CoPET, CoPBT or mixtures thereof with (ii) nylon, wherein component (i) is from a catalyst system based on antimony and germanium, or has virtually no residual cobalt and manganese are disclosed and claimed. These blends have superior barrier properties and clarity. The clarity thereof is further enhanced by adding cobalt octoate to the blend. Articles from such blends are also disclosed and claimed. Novel blends of nylon and cobalt octoate which exhibit superior barrier properties are also disclosed and claimed, as well as articles therefrom. And, multilayer structures and articles therefrom having a core layer of a blend of (i) PET, PBT, CoPET, CoPBT or mixtures thereof, and, (ii) nylon, and optionally (iii) cobalt octoate, are also disclosed and claimed.
    Type: Grant
    Filed: September 18, 1991
    Date of Patent: May 24, 1994
    Assignee: American National Can Company
    Inventors: Yong J. Kim, Ray Germonprez
  • Patent number: 5312866
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: May 14, 1992
    Date of Patent: May 17, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toshihiko Tsutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito
  • Patent number: 5306785
    Abstract: Compositions are provided which comprise a polyester resin which comprises the reaction product of at least one straight chain, branched, or cycloaliphatic C.sub.2 -C.sub.10 alkane diol or chemical equivalent thereof; and a cycloaliphatic diacid or chemical equivalent thereof; and a poly(ether ester) elastomer, a poly(etherimide ester) elastomer, a copolymer elastomer comprising (ether ester) monomers and (etherimide ester) monomers, a copolymer comprising ethylene and one or more comonomers copolymerizable therewith to provide a solid copolymer, or a combination of any of the foregoing. These compositions have excellent tensile properties.
    Type: Grant
    Filed: October 5, 1992
    Date of Patent: April 26, 1994
    Assignee: General Electric Company
    Inventors: Willem F. H. Borman, Nan-I Liu
  • Patent number: 5300576
    Abstract: The thermal properties, such as heat distortion temperature of biodegradable polymers, such as polylactic acid, polyglycolides, polybutyric acid and copolymers of butyric and valeric acid, may be increased by blending them with a polymer having Tg from 75.degree. C. to 200.degree. C. and a Hildebrand parameter (.sigma.) of not more than 3 MPA.sup.1/2 different from the biopolymer.
    Type: Grant
    Filed: October 3, 1991
    Date of Patent: April 5, 1994
    Assignee: Camelot Technologies, Inc.
    Inventors: Speros P. Nemphos, Gregory B. Kharas
  • Patent number: 5296558
    Abstract: A polymeric composition comprises:(i) an aromatic polyimide or an aromatic carboxylic ester polymer,(ii) a substantially wholly aliphatic polyamide, and(iii) a polyamide that contains both aromatic aliphatic moieties.It is found that the mechanical properties of blends of the aromatic polymers (i) and the polyamides (iii) can be significantly improved by the incorporation of a quantity of the aliphatic amides (ii), even though the miscibility of polymers, as observed by their glass transition temperatures may remain unchanged.
    Type: Grant
    Filed: August 5, 1993
    Date of Patent: March 22, 1994
    Assignee: Raychem Limited
    Inventors: Kathleen A. Hood, Stephen Day, Richard J. Penneck
  • Patent number: 5286811
    Abstract: A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: May 21, 1992
    Date of Patent: February 15, 1994
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5284903
    Abstract: The present invention teaches polyetherimide blends which are comprised of at least one polyetherimide resin and at least one polyester resin derived from a cyclohexanedimethanol and a carbocylic acid. These blends can be utilized in applications requiring improved impact strengths compared to unmodified polyetherimide compositions.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: February 8, 1994
    Assignee: General Electric Company
    Inventor: Michael G. Minnick
  • Patent number: 5283282
    Abstract: A polyamide composition comprising an aromatic ring-containing polyamide resin and a specific amount of an aliphatic polyester. The composition has improved molding properties, such as mold release characteristics, and exhibits excellent physical properties, such as stiffness, which will not be lowered upon contact with moisture. The polyamide composition may contain additional components which have been used to improve properties other than molding properties, such as Izod impact strength and hinge effect properties, so that the effects of the components are also exerted in the present composition without sacrificing the main effect aimed at by the present invention, i.e., excellent molding properties. Therefore, the polyamide composition of the present invention is useful as a molding material in various fields, e.g., automobile, electrical and electronic industries.
    Type: Grant
    Filed: December 10, 1991
    Date of Patent: February 1, 1994
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Tetsuo Hamada, Sadayuki Yakabe, Akira Ito
  • Patent number: 5281669
    Abstract: Intimate blends of macrocyclic oligomer compositions, such as cyclic polycarbonate or poly(alkylene dicarboxylate) oligomer mixtures, are blended with linear polymers, especially addition polymers. The blends flow easily and are frequently homogeneous. The macrocyclic oligomers therein may be polymerized to produce resin blends having advantageous properties.
    Type: Grant
    Filed: April 13, 1992
    Date of Patent: January 25, 1994
    Assignee: General Electric Company
    Inventors: Roger P. Kambour, Warren L. Nachlis, Eric J. Pearce, Jeffrey D. Carbeck
  • Patent number: 5280087
    Abstract: Disclosed is a novel two-step reaction method for preparing block copolyether-ester-amides. In the first step, caprolactam or other lactam is reacted with a polyether polyol in the presence of a catalyst to form an amino-terminated prepolymer with both a polyamide hard segment and a polyether soft segment. In the second step, the prepolymer is reacted with a dicarboxylic acid as a chain extender to form high molecular weight block copolyether-ester-amides.The block copolyether-ester-amides prepared by this method are transparent, easily moldable by conventional processing methods such as extrusion and injection molding, and exhibit excellent mechanical properties.
    Type: Grant
    Filed: January 22, 1993
    Date of Patent: January 18, 1994
    Assignee: Industrial Technology Research Institute
    Inventors: Lie-Zen Chung, De-Lun Kou, Wen-Bin Shiu, Fu-Le Lin
  • Patent number: 5275877
    Abstract: A shaped reinforced thermoplastic composite, such as composite laminate (10 or 10A), comprises a thermoplastic matrix polymer (22) and a plurality of fibers (20) of a liquid crystal polymer (LCP) which are formed in situ in the matrix polymer. This composite is formed by forming a prepreg as a plurality of individual sheets or layers (50), each of which comprises essentially unidirectionally oriented fibers (20) of said LCP in a thermoplastic polymer matrix (22). A lay-up is formed by cutting each individual sheet or layer into pieces so that the direction of fiber orientation in each such piece is either parallel to one pair of edges or at angles of 45.degree. to all of the edges. The lay-up is shaped under heat and pressure to form the composite.
    Type: Grant
    Filed: April 25, 1991
    Date of Patent: January 4, 1994
    Assignee: Edison Polymer Innovation Corporation
    Inventor: Avraam Isayev
  • Patent number: 5276107
    Abstract: A polymer composition for forming in-situ composite molded articles is provided. The polymer composition comprises a polyphenylene sulfide matrix resin, a thermotropic liquid crystal polymer, and a non-crystalline polymer. The polymer composition may be melt injected or melt extruded to form in-situ composite molded articles having improved mechanical properties.
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: January 4, 1994
    Assignee: Korea Institute of Science and Technology
    Inventors: Kwang U. Kim, Byoung C. Kim, Soon M. Hong
  • Patent number: 5268225
    Abstract: Composite laminates are prepared from thin sheets of thermotropic liquid crystal polymer blends. A preferred blend contains 2 thermotropic liquid crystal polymers, i.e., a first liquid crystal polymer in LCP-1, and a second liquid crystal polymer (LCP-2), the second liquid crystal polymer having a higher melting point than the first. The second liquid crystal polymer is molecularly oriented and is preferably at least partially in the form of microscopic fibers in a matrix of the first liquid crystal polymer. The two liquid crystal polymers are phase separated in the solid phase and have overlapping melt processing temperatures.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: December 7, 1993
    Assignee: The University of Akron
    Inventor: Avraam Isayev