Mixed With Polycarboxylic Acid Or Derivative And Polyhydroxy Reactant Or Polymer Therefrom Patents (Class 525/425)
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Patent number: 5459230Abstract: The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt), lauric acid lactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt) and an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt), the melting point of the copolyamide being lower than 140.degree. C. and at least 10% by weight of lauric acid lactam and/or 11-aminoundecanoic acid being copolymerized.Type: GrantFiled: May 27, 1994Date of Patent: October 17, 1995Assignee: Elf Autochem Deutschland GmbHInventors: Eduard de Jong, Karl-Heinz Hapelt
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Patent number: 5457144Abstract: This invention provides hydrolytically labile polyamide compositions and articles containing an ester derived moiety in the polymer backbone which will degrade after exposure to water over long periods of time.Type: GrantFiled: February 2, 1994Date of Patent: October 10, 1995Assignee: Rohm and Haas CompanyInventors: Norman L. Holy, Newman M. Bortnick
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Patent number: 5455308Abstract: Thermosettable composition suitable for the production of endless objects without the use of continuous carrier material, whereby the composition comprises an epoxy resin or an unsaturated polyester and a high molecular weight thermoplastic polymer which has a weight-average molecular weight of at least 1,000,000 g/mol in an amount to make the composition spinnable, the amount ranging from at least 0.1% where the polymer has a molecular weight of 5,000,000 g/mol or more or less than 2% where the polymer has the weight-average molecular weight of 1,000,000 g/mol, the amount decreasing as the weight-average molecular weight increases.Type: GrantFiled: August 16, 1994Date of Patent: October 3, 1995Assignee: DSM N.V.Inventor: Cornelis W. M. Bastiaansen
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Patent number: 5455311Abstract: The object of the present invention is the production of thermoplastically workable copolymers capable of being composted, characterized in that they consist of partially crystalline soft segments formed from aliphatic esters and also of amorphous hard segments and that the proportion of soft segments amounts to 70% to 95% by weight.Type: GrantFiled: August 8, 1994Date of Patent: October 3, 1995Assignee: Bayer AGInventors: Ernst Grigat, Ralf Dujardin, Ralf Timmermann, Hans-Georg Rast
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Patent number: 5455310Abstract: A thermoplastic composition which comprises a siloxane polycarbonate block copolymer wherein the polysiloxane segments of the copolymer are of the formula: ##STR1## where R.sup.1, R.sup.2, Y, D, A, X, A' and E are as defined herein, and high heat polycarbonates containing recurring or repeating polycarbonate units of the formula: ##STR2## wherein Z is --O--, --N(R.sup.3)-- or a mixture thereof and R.sup.3 is selected from hydrogen, hydrocarbyl and halogen-substituted hydrocarbyl.Type: GrantFiled: August 15, 1994Date of Patent: October 3, 1995Assignee: General Electric CompanyInventors: James F. Hoover, Paul D. Sybert
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Patent number: 5453463Abstract: Molding materials are composed ofA) from 5 to 95% by weight of polyaryl ethers,B) from 5 to 95% by weight of a mixture (B) ofB.sub.I) from 75 to 97% by weight of partly aromatic polyamides andB.sub.II) from 3 to 25% by weight of a rubber impact modifierand furthermoreC) from 0 to 40% by weight of additives and/or processing assistants.Type: GrantFiled: October 5, 1994Date of Patent: September 26, 1995Assignee: BASF AktiengesellschaftInventors: Martin Weber, Klaus Muehlbach
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Patent number: 5451642Abstract: A thermoplastic resin composition containing a polyamide resin composition (C) consisting of a polyamide resin (A) and another thermoplastic resin (B) and at least one modifier (D) is excellent in coatability, mechanical properties, linear expansion coefficient and appearance, can be molded into an article which comprises the polyamide resin (C), wherein the ratio of the percent occupied area of the polyamide resin on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1.2, and/or the ratio of the percent concentration of the polyamide resin on the surface of the article determined on the basis of the nitrogen concentration on the surface of the article to the weight percentage of the polyamide in the polyamide resin composition (C) is not less than 1,2, which article is suited for electric and electronic parts and automobile parts such as a bumper, fender and wheel cover.Type: GrantFiled: December 23, 1994Date of Patent: September 19, 1995Assignee: Sumitomo Chemical Company, LimitedInventors: Hiroomi Abe, Takeshi Fujii, Kiyoshi Mitsui, Hideo Shinonaga, Satoru Sogabe, Satoru Hosoda, Keitaro Kojima
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Patent number: 5446109Abstract: A polyamide/aliphatic polyester block, copolymer (A) comprising a polyamide block and an aliphatic polyester block, (B) satisfying the expression T.sub.1 -T<100-C (in which T is the melting point (.degree.C.) of the above block copolymer, T.sub.1 is the melting point (.degree.C.) of a polyamide composed of the polyamide block and C is the content (wt. %) of the polyamide block), (C) exhibiting the extraction amount which satisfies the expression, when extracted in tetrahydrofuran, E<(100-C).times.0.4 (in which E is the extraction amount (wt. %) when the block copolymer is refluxed in tetrahydrofuran, and C is the content (wt. %) of the polyamide block) and (D) having an intrinsic viscosity, measured at 35.degree. C., in the range of from 0.5 to 5; a process for the production thereof; a fiber formed therefrom; and an intimate blend comprising a thermoplastic resin having no or poor compatibility with polyamide and the block copolymer.Type: GrantFiled: February 23, 1994Date of Patent: August 29, 1995Assignee: Teijin LimitedInventors: Shunichi Matsumura, Takashi Ito, Takanori Miyoshi
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Patent number: 5439987Abstract: A thermoplastic molding composition having a high neat deflection temperature but a relatively low melt extrusion temperature is formed by blending a polyetherimide with about 35 to about 80 weight percent of a copolyester of terephthalic and/or isophthalic acid and a glycol component comprising ethylene glycol and up to about 60 mol percent of 1,4-cyclohexanedimethanol. The blend also has a high flexural modulus and can be used to form plastic articles that can be molded at moderate temperatures but retain flexural strength at elevated temperatures. Certain compositions of the invention are clear, single phase solid solutions.Type: GrantFiled: May 31, 1994Date of Patent: August 8, 1995Assignee: Eastman Chemical CompanyInventors: Christopher E. Scott, Max F. Meyer, Kenneth E. Breeding, Jeffrey T. Owens
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Patent number: 5438105Abstract: A polyamic acid composite comprising i) a polyamic acid having three dimensional network molecular structure obtained by a ring-opening polyaddition reaction of a tetracarboxylic acid dianhydride with an aromatic diamine and a tri- or tetramino compound and ii) (a) a high polymer component having a different molecular structure from the polyamic acid, which is dispersed in the three dimensional network molecular structure of the polyamic acid and of which molecular chains are interpenetrated with molecular chains of the polyamic acid or (b) a curable resin composition which is dispersed in the three dimensional network molecular structure of the polyamic acid and which is capable of forming a cured resin of which molecular chains are interpenetrated with molecular chains of the polyamic acid, and a polyimide composite obtained from the polyamic acid composite, and process for production thereof.Type: GrantFiled: February 28, 1994Date of Patent: August 1, 1995Assignee: Toho Rayon Co., Ltd.Inventor: Yasuhisa Nagata
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Patent number: 5426148Abstract: A fast-curing sealant composition is made from generally liquid oligomers and has good tensile strength, one hundred percent modulus, Shore-A Hardness, and good insensitivity to water. One part of the sealant composition is generally a polyester or polyether oligomer having acetoacetate end groups or functionalities thereon, whereas the second part is also generally a polyester of polyether oligomer generally containing primary amine end groups or functions. The oligomers are generally of a low molecular weight, as from about 500 to about 10,000, and are modified by compounding with various additives such as carbon black, antioxidants, ultraviolet light inhibitors, and the like. Polyfunctional acetoacetate-terminated molecules having 3 or more functional end groups or polyfunctional primary amine-terminated molecules having 3 or more functional end groups serve to increase the crosslink density and modulus of the compositions. The sealant can be used as a coating or as a caulking type compound.Type: GrantFiled: April 28, 1994Date of Patent: June 20, 1995Assignee: Tremco, Inc.Inventor: Harold A. Tucker
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Patent number: 5418281Abstract: Blends of poly(arylene sulfide)s, liquid crystalline polyesters and liquid crystalline poly(esteramide)s exhibit a lower melt viscosity than would be expected based on the melt viscosities of analogous blends of liquid crystalline polyesters and poly(arylene sulfide)s that have the same overall amount of liquid crystalline polymer. The viscosities are reduced over a wide range of compositions. Such blends are useful in the manufacture of electronic components, particularly connectors.Type: GrantFiled: August 17, 1994Date of Patent: May 23, 1995Assignee: Hoechst Celanese CorporationInventors: Paul C. Yung, H. Clay Linstid, III
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Patent number: 5418299Abstract: Blends can be formed which comprise a flexible coil polymer substrate, e.g., of a poly(alkylene terephthalate), and a thermotropic, essentially liquid crystalline oligomer which comprises aromatic units and at least one linear polyalkylene spacer. These blends can be used to form fibers or molded articles.Type: GrantFiled: November 23, 1993Date of Patent: May 23, 1995Assignee: Akzo Nobel N.V.Inventors: Ki-Soo Kim, Sophia Dashevsky, Jian-Lin Liu, Stanley W. Palmaka
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Patent number: 5416171Abstract: The invention relates blending compositions comprising (a) a polyamide and (b) a block copolyetheramide with hard polyamide segments and soft polyether segments. The block copolyetheramide is defined by the formula:--[--CO--R.sup.1 --CO--(NHR.sup.2 CO).sub.m --O--(R.sup.3 --O--).sub.p --(CO--R.sup.2 --NH).sub.q --].sub.n --wherein R represents the alkylene group of an aliphatic diacid having between about 2 and about 18 carbon atoms; R.sup.2 represents an alkylene group having between about 3 and about 11 carbon atoms; R.sup.3 represents an alkylene group having between about 2 and about 4 carbon atoms; m and q independently range between about 2 and about 40; p ranges between about 10 and about 100; and n ranges between about 2 and about 50, said blending composition containing a polyether content ranging between about 1 and about 50%. The blocking copolyetheramides may be prepared by reacting a polyetherdiol, caprolactam and an aliphatic diacid in a two-stage method.Type: GrantFiled: August 11, 1994Date of Patent: May 16, 1995Assignee: Industrial Technology Research InstituteInventors: Lie-Zen Chung, De-Lun Kuo, Hong-Bing Tsai
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Patent number: 5401812Abstract: A thermosetting polyimide composition is provided with a sufficient heat resistance and excellent mechanical and electrical characteristics in toughness, flexibility and so on and under severe environmental conditions, by adding to a polyfunctional unsaturated imide a thermosetting resin selected from the group consisting of polyetherimide, polyarylate and polyamideimide which are in a miscibility region with the polyfunctional unsaturated imide and have an excellent glass transition point and a number-average molecular weight of more than 10,000.Type: GrantFiled: December 21, 1992Date of Patent: March 28, 1995Assignee: Matsushita Electric Works, Ltd.Inventors: Hiroshi Yamamoto, Taro Fukui
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Patent number: 5393848Abstract: An improved liquid crystalline polymer blend is produced by mixing a preformed thermotropic liquid crystalline polymer in the melt phase with reactants needed to form a second liquid crystalline polymer under conditions sufficient to form the second liquid crystalline polymer. The resulting blends are anisotropic and have improved morphology and improved melt processability. The method is particularly useful when the second liquid crystalline polymer is biphasic or is difficult to synthesize or process in the melt.Type: GrantFiled: February 12, 1993Date of Patent: February 28, 1995Assignee: Hoechst Celanese Corp.Inventors: Larry F. Charbonneau, Balaram Gupta, H. Clay Linstid, Linda C. Sawyer, James P. Shepherd
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Patent number: 5393849Abstract: A thermosetting composition comprising the combination of an unsaturated polyester resin and a polyamino compound having a plurality of secondary or primary amino moieties.Type: GrantFiled: October 19, 1993Date of Patent: February 28, 1995Assignee: Georgia-Pacific Resins, Inc.Inventors: Ramji Srinivasan, Ted M. McVay, David A. Hutchings
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Patent number: 5391572Abstract: Thermoplastic molding compositions are obtainable by mixingA) from 0.5 to 5% by weight of a thermoplastic polyester elastomer andB) from 0 to 50% by weight of fibrous or particulate fillers or mixtures thereof into a melt ofC) from 40 to 99.5% by weight of a polyamide prepolymer having a viscosity number of from 40 to 80 ml/g and subsequent postcondensation in solid phase.Type: GrantFiled: May 11, 1994Date of Patent: February 21, 1995Assignee: BASF AktiengesellschaftInventors: Walter Goetz, Walter Betz, Gunter Pipper
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Patent number: 5387639Abstract: Blends of polyester-carbonates and/or polyarylate resins with polyetherimide resins are thermoplastically molded to obtain ductile, high distortion temperature articles. The polyester-carbonate resin or polyarylate resin is selected from a particular class prepared by polymerization of a dihydric phenol, and an ester precursor which is terephthalic acid, optionally with a proportion of isophthalic acid.Type: GrantFiled: October 23, 1992Date of Patent: February 7, 1995Assignee: General Electric CompanyInventors: Paul D. Sybert, Raymond H. Glaser
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Patent number: 5378769Abstract: A molding composition is provided which is effective as an agent for imparting compatibility in thermoplastic blends or as an adhesion-promoting layer in composite materials which comprises:A. a polyamideB. a polyester, andC. an oxazoline derivative.Type: GrantFiled: August 12, 1992Date of Patent: January 3, 1995Assignee: Huls AktiengesellschaftInventors: Joachim Mugge, Friedrich Sosna
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Patent number: 5372879Abstract: The present invention provides a biaxially oriented polyester film made of a polyester containing 0.01 to 5% by weight of crosslinked polymer particles characterized by:(1) having a particle size distribution ratio (.gamma.) of 1.3 to 3.5,(2) having an average particle diameter of 0.1 to 2 .mu.m,(3) having a non-circularity of 3.4 or more, and(4) having a standard deviation of noncircularity, of at least 0.16.The polyester film of the present invention has a flat surface having a small number of large protuberances, excellent running property and excellent winding property, and can be produced economically. The film has excellent properties for use as a base for various magnetic recording media.Type: GrantFiled: February 18, 1994Date of Patent: December 13, 1994Assignee: Teijin LimitedInventors: Makoto Handa, Tomoyuki Kishino
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Patent number: 5366663Abstract: Mixtures of liquid crystalline copolymers, polyether imides and compatibilizers and use thereof.Mixtures of at least one A) liquid crystalline copolymer, at least one B) polyether imide and at least one C) compatibilizer where the proportions of components A) and B) are each from 5 to 95 % by weight, based on the sum total of the two components, and the proportion of the compatibilizer C) is from 0.5 to 10 % by weight, based on the mixture of A) and B), have improved breaking strength and extension values.They are therefore highly suitable for producing molded articles or for use as matrix material for composites.Type: GrantFiled: November 25, 1992Date of Patent: November 22, 1994Assignee: Hoechst AGInventors: Michael Romer, Andreas Schleicher
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Patent number: 5366804Abstract: A composite fiber of at least two different polymers, one of which is water-insoluble and selected from the group consisting of polyester, polyamide and copolymers therefrom and the other is water-dissipatable, having a plurality of at least 19 segments of the water-insoluble polymer, uniformly distributed across the cross-section of the fiber and being surrounded by the water-dissipatable polymer, a process for the manufacture of such a fiber and a process for the manufacture of microfibers therefrom.Type: GrantFiled: March 31, 1993Date of Patent: November 22, 1994Assignee: BASF CorporationInventor: Jeffrey S. Dugan
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Patent number: 5346967Abstract: Thermoplastic resins of enhanced solvent resistance especially useful for packaging or automotive parts comprising blends of amorphous polyamides with a thermoplastic polyester resin, substantially free of a polyarylate have excellent physical properties and barrier resistance to oxygen and carbon dioxide. Preferred blends comprise polyesters prepared by reacting a dihydric alcohol with a dicarboxylic acid, and amorphous polyamides prepared from non-symmetric monomers comprising odd-number chain diamines and diacids, and meta aromatic diamines and diacids.Type: GrantFiled: January 25, 1993Date of Patent: September 13, 1994Assignee: General Electric CompanyInventors: Donald C. Clagett, Daniel W. Fox, Louis M. Maresca
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Patent number: 5344895Abstract: A polymer composition is disclosed which includes a polyamideimide polymer and a liquid crystalline polymer, wherein the amount of the liquid crystalline polymer is in an amount which significantly decreases the melt viscosity of the polyamideimide polymer while not significantly decreasing the mechanical properties of the polyamideimide polymer.Type: GrantFiled: April 1, 1993Date of Patent: September 6, 1994Assignee: University of Massachusetts LowellInventors: Xiaoyun Lai, Dafang Zhao, Francis Lai
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Patent number: 5340885Abstract: Copolymers comprising amide units and ester units are prepared by melt phase interchange of diaryl esters of dicarboxylic acids and diamines with dihydric alcohols and diesters of aromatic dicarboxylic acids. The products are tough resins, useful per se as molding compounds, and to compatibilize and toughen other thermoplastic polymers.Type: GrantFiled: January 25, 1993Date of Patent: August 23, 1994Assignee: General Electric CompanyInventors: Donald C. Clagett, Daniel W. Fox, Louis M. Maresca, Sheldon J. Shafer
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Patent number: 5340884Abstract: This invention relates to a polyester/polyamide blend having an excellent gas barrier property and an improved flavor retaining property, and clarity. More particularly, the present invention relates to a polyethylene terephthalate/low molecular weight polyamide blend having an excellent gas barrier property, in which by reducing the concentration of acetaldehyde contained in the polyester, the storage property of a food or the like and the flavor-retaining property and fragrance retaining property are highly improved without producing haze.Type: GrantFiled: September 13, 1993Date of Patent: August 23, 1994Assignee: Eastman Kodak CompanyInventors: David E. Mills, Steven L. Stafford
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Patent number: 5332777Abstract: Unreinforced polyamide molding materials containA) from 60 to 100% by weight of a mixture consisting ofA.sub.1) from 97.5 to 99.85% by weight of one or more polyamides,A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide andA.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atomsand, based on the total weight of the polyamide molding material,B) from 0 to 40% by weight of a toughened polymer andC) from 0 to 10% by weight of conventional additives in effective amounts.Type: GrantFiled: September 25, 1992Date of Patent: July 26, 1994Assignee: BASF AktiengesellschaftInventors: Walter Goetz, Walter Betz
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Patent number: 5331061Abstract: Thermoplastically processable elastomeric block copolyetheresteretheramides from recurring units of the formula ##STR1## in which ##STR2## represents a polyamide segment containing terminal carboxyl groups and having an average molar mass of 700 to 10 000, --O--E--O-- is a poly-(oxytetramethylene)-segment having an average molar mass of 600 to 3 500, --NH--F--NH-- represents a poly-(oxy-1,2-propylene)-segment containing terminal amino groups and having an average molar mass of 350 to 2 500, x and y are integers from 3 to 35 and indicate the number of the respective, randomly arranged, recurring units, the ratio x:y of components A and B varying between 5:1 and 1:5.The ether amides of the present invention can optionally be mixed with additives, fillers, modifiers, or other compatible polymers normally used in the processing of polyamides and which are suitable for the production of molded articles, for example by injection molding, coinjection, extrusion, blow molding, etc.Type: GrantFiled: December 9, 1992Date of Patent: July 19, 1994Assignee: EMS-Inventa AGInventor: Hanns-Jorg Liedloff
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Patent number: 5331053Abstract: Polymeric fibrids reinforce elastomers to yield well-blended products of high modulus and elongation.Type: GrantFiled: December 14, 1990Date of Patent: July 19, 1994Assignee: E. I. Du Pont de Nemours and CompanyInventors: Dexter L. Atkinson, Arnold Frances, Lee J. Hesler
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Patent number: 5326830Abstract: The invention relates to a process for forming chain extended polymers and graft and block polymers and copolymers which comprises the steps of: (a) forming an intimate mixture of one or more polymers and one or more effective phosphorus (III) chain extension reagent compounds; wherein at least one of said effective chain extension reagents has bonded to the phosphorus (III) atom at least one group which is a nitrogen-containing heteroaromatic moiety that is bonded through a nitrogen of the heteroaromatic moiety to the phosphorus (III) atom by a single bond; and (b) heating said mixture for a time and at a temperature sufficient to form said extended chain polymer or copolymer. Further embodiments relate to polymers and copolymers prepared in accordance with the process of this invention as well as articles formed from these polymers and polymer compositions comprising the polymeric materials of this invention.Type: GrantFiled: November 12, 1993Date of Patent: July 5, 1994Assignee: AlliedSignal Inc.Inventor: Shaul M. Aharoni
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Patent number: 5324795Abstract: The present invention relates to a polymer blend composition for melt molding which is a composition obtained by adding a thickener to a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer, characterized in that the melt viscosity of the composition determined at a molding temperature at a shear rate of 1000 sec.sup.-1 is the same or higher than the melt viscosity of said non-liquid crystal polymer determined under the same conditions.According to the present invention, a polymer blend for melt molding having improved properties, whereby problems observed in prior arts upon molding a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer (for example, insufficient alignment of the liquid crystal polymer and difficulties in extrusion, because of excessively low melt viscosity) can be solved, is obtained.Type: GrantFiled: May 12, 1993Date of Patent: June 28, 1994Assignee: Unitika Ltd.Inventor: Jun-ichi Suenaga
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Patent number: 5321099Abstract: Blends of (1) a crystalline polyamide derived from 4,4'-diphenylmethane diisocyanate (MDI) and a dicarboxylic acid and (2) a segmented polyesteramide derived from (a) MDI, (b) a carboxylic acid-terminated polyester prepolymer, a carboxylic acid-terminated polyether prepolymer or a carboxylic acid-terminated polycarbonate prepolymer and (c) from 0 to 10 moles of a dicarboxylic acid per mole of prepolymer, exhibit increased tensile ductility and are useful in the manufacture of headlamp reflectors, electrical connectors, molded circuit boards and the like.Type: GrantFiled: January 2, 1992Date of Patent: June 14, 1994Assignee: The Dow Chemical CompanyInventors: David J. Goldwasser, Augustin T. Chen
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Patent number: 5321098Abstract: The invention relates to a composition mixture comprising (i) at least one ester-acid, ester-salt or mixtures thereof and (ii) at least one amidic-acid, amidic-salt or mixtures thereof a polymer fabrics treated with the same. The treated polymer fabrics have improved wicking/wetting characteristics. The treated polymer fabrics maintain these characteristics upon repeated exposure to aqueous fluids.Type: GrantFiled: October 4, 1991Date of Patent: June 14, 1994Assignee: The Lubrizol CorporationInventor: Kasturi Lal
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Patent number: 5321087Abstract: The present invention relates to a process for the preparation of a thermoplastic resin composite comprising conducting polycondensation of a monomer material in a solution of an organic solvent containing an organic solvent soluble polymer to form an aromatic condensation polymer which is insoluble in said organic solvent and a thermoplastic resin composite prepared by the process.Type: GrantFiled: July 22, 1992Date of Patent: June 14, 1994Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Naoya Ogata, Takehisa Nakanishi, Tadashi Asanuma
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Patent number: 5319064Abstract: Thermotropic liquid crystalline poly(ester-amide) compositions are disclosed which comprise a bis(4-carbonyl phenylene) terephthalate unit and a unit derived from an N-substituted hydrocarbylenediamine (e.g., one derived from an N,N-dialkylalkylene).Type: GrantFiled: October 6, 1992Date of Patent: June 7, 1994Assignees: Univ. of Mass. at Amherst, Akzo N.V.Inventors: Thomas F. McCarthy, Robert W. Lenz, Simon W. Kantor, Ki-Soo Kim, Sophia Dashevsky
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Patent number: 5317066Abstract: The polyester-grafted polyamide of the present invention comprises a polyamide as the backbone and a thermoplastic polyester as the graft and has a number-average molecular weight in terms of standard polymethyl methacrylate of 50,000 to 500,000 as determined by gel permeation chromatography using 1,1,1,3,3,3-hexafluoro-2-propanol. The polyester-grafted polyamide is useful as a modifier for polyesters and polyamides.Type: GrantFiled: March 23, 1993Date of Patent: May 31, 1994Assignee: Daicel Chemical Industries, Ltd.Inventors: Kazushi Watanabe, Katsuhiko Sumida
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Patent number: 5314987Abstract: Novel blends of (i) PET, PBT, CoPET, CoPBT or mixtures thereof with (ii) nylon, wherein component (i) is from a catalyst system based on antimony and germanium, or has virtually no residual cobalt and manganese are disclosed and claimed. These blends have superior barrier properties and clarity. The clarity thereof is further enhanced by adding cobalt octoate to the blend. Articles from such blends are also disclosed and claimed. Novel blends of nylon and cobalt octoate which exhibit superior barrier properties are also disclosed and claimed, as well as articles therefrom. And, multilayer structures and articles therefrom having a core layer of a blend of (i) PET, PBT, CoPET, CoPBT or mixtures thereof, and, (ii) nylon, and optionally (iii) cobalt octoate, are also disclosed and claimed.Type: GrantFiled: September 18, 1991Date of Patent: May 24, 1994Assignee: American National Can CompanyInventors: Yong J. Kim, Ray Germonprez
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Patent number: 5312866Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.Type: GrantFiled: May 14, 1992Date of Patent: May 17, 1994Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Toshihiko Tsutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito
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Patent number: 5306785Abstract: Compositions are provided which comprise a polyester resin which comprises the reaction product of at least one straight chain, branched, or cycloaliphatic C.sub.2 -C.sub.10 alkane diol or chemical equivalent thereof; and a cycloaliphatic diacid or chemical equivalent thereof; and a poly(ether ester) elastomer, a poly(etherimide ester) elastomer, a copolymer elastomer comprising (ether ester) monomers and (etherimide ester) monomers, a copolymer comprising ethylene and one or more comonomers copolymerizable therewith to provide a solid copolymer, or a combination of any of the foregoing. These compositions have excellent tensile properties.Type: GrantFiled: October 5, 1992Date of Patent: April 26, 1994Assignee: General Electric CompanyInventors: Willem F. H. Borman, Nan-I Liu
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Patent number: 5300576Abstract: The thermal properties, such as heat distortion temperature of biodegradable polymers, such as polylactic acid, polyglycolides, polybutyric acid and copolymers of butyric and valeric acid, may be increased by blending them with a polymer having Tg from 75.degree. C. to 200.degree. C. and a Hildebrand parameter (.sigma.) of not more than 3 MPA.sup.1/2 different from the biopolymer.Type: GrantFiled: October 3, 1991Date of Patent: April 5, 1994Assignee: Camelot Technologies, Inc.Inventors: Speros P. Nemphos, Gregory B. Kharas
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Patent number: 5296558Abstract: A polymeric composition comprises:(i) an aromatic polyimide or an aromatic carboxylic ester polymer,(ii) a substantially wholly aliphatic polyamide, and(iii) a polyamide that contains both aromatic aliphatic moieties.It is found that the mechanical properties of blends of the aromatic polymers (i) and the polyamides (iii) can be significantly improved by the incorporation of a quantity of the aliphatic amides (ii), even though the miscibility of polymers, as observed by their glass transition temperatures may remain unchanged.Type: GrantFiled: August 5, 1993Date of Patent: March 22, 1994Assignee: Raychem LimitedInventors: Kathleen A. Hood, Stephen Day, Richard J. Penneck
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Patent number: 5286811Abstract: A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.Blends, prepregs, and composites can be prepared from the oligomers.Type: GrantFiled: May 21, 1992Date of Patent: February 15, 1994Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5284903Abstract: The present invention teaches polyetherimide blends which are comprised of at least one polyetherimide resin and at least one polyester resin derived from a cyclohexanedimethanol and a carbocylic acid. These blends can be utilized in applications requiring improved impact strengths compared to unmodified polyetherimide compositions.Type: GrantFiled: December 23, 1992Date of Patent: February 8, 1994Assignee: General Electric CompanyInventor: Michael G. Minnick
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Patent number: 5283282Abstract: A polyamide composition comprising an aromatic ring-containing polyamide resin and a specific amount of an aliphatic polyester. The composition has improved molding properties, such as mold release characteristics, and exhibits excellent physical properties, such as stiffness, which will not be lowered upon contact with moisture. The polyamide composition may contain additional components which have been used to improve properties other than molding properties, such as Izod impact strength and hinge effect properties, so that the effects of the components are also exerted in the present composition without sacrificing the main effect aimed at by the present invention, i.e., excellent molding properties. Therefore, the polyamide composition of the present invention is useful as a molding material in various fields, e.g., automobile, electrical and electronic industries.Type: GrantFiled: December 10, 1991Date of Patent: February 1, 1994Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Tetsuo Hamada, Sadayuki Yakabe, Akira Ito
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Patent number: 5281669Abstract: Intimate blends of macrocyclic oligomer compositions, such as cyclic polycarbonate or poly(alkylene dicarboxylate) oligomer mixtures, are blended with linear polymers, especially addition polymers. The blends flow easily and are frequently homogeneous. The macrocyclic oligomers therein may be polymerized to produce resin blends having advantageous properties.Type: GrantFiled: April 13, 1992Date of Patent: January 25, 1994Assignee: General Electric CompanyInventors: Roger P. Kambour, Warren L. Nachlis, Eric J. Pearce, Jeffrey D. Carbeck
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Patent number: 5280087Abstract: Disclosed is a novel two-step reaction method for preparing block copolyether-ester-amides. In the first step, caprolactam or other lactam is reacted with a polyether polyol in the presence of a catalyst to form an amino-terminated prepolymer with both a polyamide hard segment and a polyether soft segment. In the second step, the prepolymer is reacted with a dicarboxylic acid as a chain extender to form high molecular weight block copolyether-ester-amides.The block copolyether-ester-amides prepared by this method are transparent, easily moldable by conventional processing methods such as extrusion and injection molding, and exhibit excellent mechanical properties.Type: GrantFiled: January 22, 1993Date of Patent: January 18, 1994Assignee: Industrial Technology Research InstituteInventors: Lie-Zen Chung, De-Lun Kou, Wen-Bin Shiu, Fu-Le Lin
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Patent number: 5275877Abstract: A shaped reinforced thermoplastic composite, such as composite laminate (10 or 10A), comprises a thermoplastic matrix polymer (22) and a plurality of fibers (20) of a liquid crystal polymer (LCP) which are formed in situ in the matrix polymer. This composite is formed by forming a prepreg as a plurality of individual sheets or layers (50), each of which comprises essentially unidirectionally oriented fibers (20) of said LCP in a thermoplastic polymer matrix (22). A lay-up is formed by cutting each individual sheet or layer into pieces so that the direction of fiber orientation in each such piece is either parallel to one pair of edges or at angles of 45.degree. to all of the edges. The lay-up is shaped under heat and pressure to form the composite.Type: GrantFiled: April 25, 1991Date of Patent: January 4, 1994Assignee: Edison Polymer Innovation CorporationInventor: Avraam Isayev
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Patent number: 5276107Abstract: A polymer composition for forming in-situ composite molded articles is provided. The polymer composition comprises a polyphenylene sulfide matrix resin, a thermotropic liquid crystal polymer, and a non-crystalline polymer. The polymer composition may be melt injected or melt extruded to form in-situ composite molded articles having improved mechanical properties.Type: GrantFiled: June 1, 1992Date of Patent: January 4, 1994Assignee: Korea Institute of Science and TechnologyInventors: Kwang U. Kim, Byoung C. Kim, Soon M. Hong
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Patent number: 5268225Abstract: Composite laminates are prepared from thin sheets of thermotropic liquid crystal polymer blends. A preferred blend contains 2 thermotropic liquid crystal polymers, i.e., a first liquid crystal polymer in LCP-1, and a second liquid crystal polymer (LCP-2), the second liquid crystal polymer having a higher melting point than the first. The second liquid crystal polymer is molecularly oriented and is preferably at least partially in the form of microscopic fibers in a matrix of the first liquid crystal polymer. The two liquid crystal polymers are phase separated in the solid phase and have overlapping melt processing temperatures.Type: GrantFiled: December 2, 1991Date of Patent: December 7, 1993Assignee: The University of AkronInventor: Avraam Isayev