Mixed With Additional Polycarboxylic Acid And A Polyamine; Amino Carboxylic Acid Or Derivative; Polyamine Salt Of A Polycarboxylic Acid; Lactam; Or Polymer Derived Therefrom Patents (Class 525/432)
  • Patent number: 5330834
    Abstract: A fiber having a reduced dye rate compared to nylon 6 formed from a block copolymer of 2-30 wt % nylon 6,6 and 70-98 wt % nylon 6 which fiber has a stain resist applied thereto.
    Type: Grant
    Filed: May 12, 1992
    Date of Patent: July 19, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: William T. Windley
  • Patent number: 5331063
    Abstract: This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide having the following repeating unit. ##STR1## wherein Z=C or SO.sub.2. Provided is an improved high temperature matrix resin which is capable of performing in the 200.degree. to 300.degree. C. range. This resin has significantly improved toughness and microcracking resistance, excellent processability, mechanical performance and moisture and solvent resistances.
    Type: Grant
    Filed: October 27, 1992
    Date of Patent: July 19, 1994
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Ruth H. Pater, Norman J. Johnston
  • Patent number: 5326830
    Abstract: The invention relates to a process for forming chain extended polymers and graft and block polymers and copolymers which comprises the steps of: (a) forming an intimate mixture of one or more polymers and one or more effective phosphorus (III) chain extension reagent compounds; wherein at least one of said effective chain extension reagents has bonded to the phosphorus (III) atom at least one group which is a nitrogen-containing heteroaromatic moiety that is bonded through a nitrogen of the heteroaromatic moiety to the phosphorus (III) atom by a single bond; and (b) heating said mixture for a time and at a temperature sufficient to form said extended chain polymer or copolymer. Further embodiments relate to polymers and copolymers prepared in accordance with the process of this invention as well as articles formed from these polymers and polymer compositions comprising the polymeric materials of this invention.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: July 5, 1994
    Assignee: AlliedSignal Inc.
    Inventor: Shaul M. Aharoni
  • Patent number: 5326613
    Abstract: The monolayered, biaxially stretch-oriented and heat-set tubular packaging casing, in particular synthetic sausage casing, is crystal-clear and exhibits high resilience. It is essentially composed of a polymer mixture comprising polyamide-6 and an aromatic copolyamide comprising units of hexamethylene diamine, terephthalic acid and isophthalic acid.
    Type: Grant
    Filed: October 23, 1992
    Date of Patent: July 5, 1994
    Assignee: Hoechst Aktiengesellschaft
    Inventor: Karl Stenger
  • Patent number: 5322905
    Abstract: Blends of copolyetherimide ester resin and amorphous or crystalline nylon provide thermoplastic elastomers having improved thermal aging performance. Optionally, various stabilizers, fillers and rubber modifiers can be added to the thermoplastic elastomer blend to further stabilize the blends to heat, oxidation and UV light.
    Type: Grant
    Filed: February 27, 1991
    Date of Patent: June 21, 1994
    Assignee: General Electric Company
    Inventor: Stephen R. Angeli
  • Patent number: 5321087
    Abstract: The present invention relates to a process for the preparation of a thermoplastic resin composite comprising conducting polycondensation of a monomer material in a solution of an organic solvent containing an organic solvent soluble polymer to form an aromatic condensation polymer which is insoluble in said organic solvent and a thermoplastic resin composite prepared by the process.
    Type: Grant
    Filed: July 22, 1992
    Date of Patent: June 14, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Naoya Ogata, Takehisa Nakanishi, Tadashi Asanuma
  • Patent number: 5321099
    Abstract: Blends of (1) a crystalline polyamide derived from 4,4'-diphenylmethane diisocyanate (MDI) and a dicarboxylic acid and (2) a segmented polyesteramide derived from (a) MDI, (b) a carboxylic acid-terminated polyester prepolymer, a carboxylic acid-terminated polyether prepolymer or a carboxylic acid-terminated polycarbonate prepolymer and (c) from 0 to 10 moles of a dicarboxylic acid per mole of prepolymer, exhibit increased tensile ductility and are useful in the manufacture of headlamp reflectors, electrical connectors, molded circuit boards and the like.
    Type: Grant
    Filed: January 2, 1992
    Date of Patent: June 14, 1994
    Assignee: The Dow Chemical Company
    Inventors: David J. Goldwasser, Augustin T. Chen
  • Patent number: 5319064
    Abstract: Thermotropic liquid crystalline poly(ester-amide) compositions are disclosed which comprise a bis(4-carbonyl phenylene) terephthalate unit and a unit derived from an N-substituted hydrocarbylenediamine (e.g., one derived from an N,N-dialkylalkylene).
    Type: Grant
    Filed: October 6, 1992
    Date of Patent: June 7, 1994
    Assignees: Univ. of Mass. at Amherst, Akzo N.V.
    Inventors: Thomas F. McCarthy, Robert W. Lenz, Simon W. Kantor, Ki-Soo Kim, Sophia Dashevsky
  • Patent number: 5312875
    Abstract: A polymer mixture reinforced by an in situ, melt-polymerized microphase whereby the rigidity of the base material is increased, a process for manufacturing same, and use thereof for providing reinforced compositions and articles in which the polymer mixture is prepared by polymerizing a component B in a melt of a component A composed of at least one thermoplastic polymer. Component B is composed of at least one compound having the structure ##STR1## The reaction of component B in a melt of component A results in linear, branched or cross-linked, high or low molecular weight polymers constituting a microphase. Preferably, the microphases have the form of microfibers. In the structure of component B, X is NH.sub.2, NHR.sup.3, OH or an N-substituted, Y-activated lactam of the ##STR2## type which is activated with an electrophilic substituent Y, where Y is CO, SO.sub.2, or R.sup.5 P=O; R.sup.1, R.sup.2 and R.sup.
    Type: Grant
    Filed: August 20, 1993
    Date of Patent: May 17, 1994
    Assignee: Rehau AG+Co.
    Inventors: Rolf Mulhaupt, Joachim Rosch, Siegfried Hopperdietzel, Ekkehard Weinberg, Herbert Klein
  • Patent number: 5306784
    Abstract: A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing the monomer precursors of Thermid.RTM. AL-600 (a thermoset) and NR-150B2 (a thermoplastic) and allowing the monomers to react randomly upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene end-capped polyimides which were previously inherently brittle and difficult to process.
    Type: Grant
    Filed: January 31, 1992
    Date of Patent: April 26, 1994
    Assignee: The United States of America as represented by the administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5300620
    Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: April 5, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma
  • Patent number: 5296558
    Abstract: A polymeric composition comprises:(i) an aromatic polyimide or an aromatic carboxylic ester polymer,(ii) a substantially wholly aliphatic polyamide, and(iii) a polyamide that contains both aromatic aliphatic moieties.It is found that the mechanical properties of blends of the aromatic polymers (i) and the polyamides (iii) can be significantly improved by the incorporation of a quantity of the aliphatic amides (ii), even though the miscibility of polymers, as observed by their glass transition temperatures may remain unchanged.
    Type: Grant
    Filed: August 5, 1993
    Date of Patent: March 22, 1994
    Assignee: Raychem Limited
    Inventors: Kathleen A. Hood, Stephen Day, Richard J. Penneck
  • Patent number: 5290850
    Abstract: An improved process for melt spinning a pigmented hexamethylene adipamide fiber from a melt blend of a polymer and a colored pigment wherein the polymer is a random interpolyamide or a block polymer having two different difunctional recurring amide-forming moieties other than those which form hexamethylene adipamide is disclosed along with pigmented hexamethylene adipamide polymer fibers having tenacities greater than 7.5 or even 8 grams per denier.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: March 1, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Ketan G. Shridharani, Peter R. Witt, Perry H. C. Lin, Sundar M. Rao
  • Patent number: 5290884
    Abstract: A novel miscible blend of component polymers comprised of from about 5 weight percent to about 95 weight percent of a polybenzimidazole and from about 95 weight percent to about 5 weight percent of an aromatic polyamide, aromatic polyamide-hydrazide or aromatic polyamide containing heterocyclic linkages. Miscibility of the component polymers of the blend is indicated by infrared, X-Ray and Differential Scanning Calorimetry analyses and scanning electron photomicrographs. In a film or molded article of a blend mostly comprised of a polybenzimidazole, it is preferred that the aromatic polyamide, aromatic polyamide-hydrazide or aromatic polyamide containing heterocyclic linkages be present in the blend in an amount sufficient to result in a blend with improved tensile properties compared to the polybenzimidazole and that is more thermally processable than the polybenzimidazole.
    Type: Grant
    Filed: March 27, 1991
    Date of Patent: March 1, 1994
    Assignee: Hoechst Celanese Corp.
    Inventors: Gordon W. Calundann, Friedrich Herold, Edward C. Chenevey, Tai-Shung Chung
  • Patent number: 5288842
    Abstract: A method of producing a multiphase polymer is disclosed whereby the phases have the same chemical structure but have different morphological states and thus different properties. This is achieved by forming a mixture of precursors of the polymer, at least one of the precursors having a reaction rate higher than the other precursor or precursors in the mixture. The precursor having the highest reaction rate is then converted to obtain a composite of a polymer and the precursors that are not polymerized. This mixture might also be formed by mixing a soluble polymer with its precursor.
    Type: Grant
    Filed: January 30, 1991
    Date of Patent: February 22, 1994
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Rodney T. Hodgson, David A. Lewis, Ravi Saraf
  • Patent number: 5286811
    Abstract: A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: May 21, 1992
    Date of Patent: February 15, 1994
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5286838
    Abstract: Thermotropic liquid crystalline copolyamides comprise: (a) a thermoplastic, aliphatic polyamide, such as nylon-6,6; and (b) a mesogen comprising an amide-linked aromatic group segment which is not completely para-linked (namely, is substantially ortho- or meta-linked or a mixture of ortho- and meta-linked) by an amide linkage to an alkylene amide group contained in the mesogen.
    Type: Grant
    Filed: November 12, 1992
    Date of Patent: February 15, 1994
    Assignee: Akzo N.V.
    Inventors: Jan G. Nel, Gert Boven
  • Patent number: 5284936
    Abstract: Substantially water-insoluble, crosslinked polypeptides containing 15 to 85 mole % of amino acid residues such as glutamic acid, aspartic acid, phosphoserine, phosphohomoserine, phosphotyrosine, phosphothreonine, phosphoasparagine, or phosphoglutamine, and 15 to 85 mole % of amino acid residues such as lysine, arginine, asparagine, glutamine, serine or tyrosine, in which the degree of crosslinking is sufficient to result in a substantially water-insoluble polypeptide with the ability to absorb a 1 wt. % aqueous NaCl solution in an amount of at least 20 times the weight of the polypeptide, are useful as superabsorbents in devices such as diapers, etc. Mild alkaline hydrolysis of the crosslinked polypeptides increases their superabsorbency by two to three fold.
    Type: Grant
    Filed: April 17, 1992
    Date of Patent: February 8, 1994
    Assignee: University of South Alabama
    Inventors: Julie Donachy, C. Steven Sikes
  • Patent number: 5281671
    Abstract: An abrasion-resistant rubber composition comprises as rubber components (A) 30-95 wt. % of an end-modified butadiene polymer and (B) 70-5 wt. % of a diene rubber other than the end-modified butadiene polymer (A). The end-modified butadiene polymer (A) is obtained by reacting at least one compound to active terminals of a starting butadiene polymer having a trans 1,4 bond content of 70-95 wt. %. The at least one compound is selected from N-substituted aminoketones, N-substituted thioaminoketones, N-substituted amino-aldehydes, N-substituted thioaminoaldehydes and compounds containing in the molecules thereof an atomic group represented by the following formula: ##STR1## in which M stands for an oxygen or sulfur atom.
    Type: Grant
    Filed: December 12, 1990
    Date of Patent: January 25, 1994
    Assignees: Nippon Zeon Co., Ltd., The Yokohama Rubber Co., Ltd.
    Inventors: Fumitoshi Suzuki, Yoshihiro Chino, Shuichi Akita
  • Patent number: 5273823
    Abstract: Granular compositions which comprise a block copolymer containing blocks of polybenzazole polymer and blocks of thermoplastic polymer can be compression molded to provide a molded article having physical properties superior to molded articles made from the thermoplastic polymer alone.
    Type: Grant
    Filed: July 2, 1990
    Date of Patent: December 28, 1993
    Assignee: The Dow Chemical Company
    Inventors: Wen-Fang Hwang, Otto C. Raspor, William J. Harris, Thuan P. Dixit
  • Patent number: 5270401
    Abstract: Disclosed is a plastics composition comprising a thermoplastic blend comprising: (1) 5-95 wt % of a polyamide (PA) and 95-5 wt % of a polyester (PE) incorporating 1-50 wt % of an aliphatic dimer fatty acid, (2) 0.01-30 parts by weight of a compound having at least one ethylenically unsaturated group or propylene group and further having a carboxylic, acid anhydride, acid amide, imido, carboxylic ester, amino or hydroxyl group per 100 parts by weight based on the combined weight of PA and PE, (3) 0-90 parts by weight of a polyester not modified with dimer fatty acid per 100 parts by weight based on the combined weight of PA and PE. Preferably the polyester (PE) is a polyethylene terephthalate or polybutylene terephthalate modified with di-oleic acid. The blends have a greatly improved elongation at break and are readily spinnable.
    Type: Grant
    Filed: October 11, 1991
    Date of Patent: December 14, 1993
    Assignee: DSM N.V.
    Inventors: Chi K. Sham, Wilhelmus T. M. Jansen, Martin A. Doherty
  • Patent number: 5268219
    Abstract: A polyamide resin composition obtained by melting and kneading(A) a first polyamide containing not less than 90 mol %, based on the total recurring units, of a m-xylylene adipamide unit of the formula, ##STR1## and (B) a second polyamide showing a semicrystallization time of not more than 30 seconds in a constant-temperature crystallization at 160.degree. C. and having a solubility parameter in the range of 13.+-.1.5;(C) under the conditions where the following relationship is satisfied,(0.025C-2.2).ltoreq.log R.ltoreq.(0.025C-0.5)wherein C is a proportion (wt. %) of the first polyamide based on the total weight of the first and second polyamides, and R is a ratio of the melt viscosity of the first polyamide to the melt viscosity of the second polyamide at a temperature higher by 20.degree. C. than the melting point of that one of the first and second polyamides which has a higher melting point than the other, provided that C is in the range of 20 to 95 (wt. %);and a film produced therefrom.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: December 7, 1993
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masahiro Harada, Takeo Hayashi, Hiroyuki Mishima, Hisashi Shimazaki
  • Patent number: 5268519
    Abstract: Polyetherimide oligomers having crosslinking end cap moieties which provide improved solvent-resistance to cured composites are generally represented by the formula: ##STR1## wherein X=--O-- or --S--; ##STR2## n=1 or 2; ##STR3## E=allyl or methallyl; R=a trivalent C.sub.(6-13) aromatic organic radical;R.sub.1 =any of lower alkyl, lower alkoxy, aryl, or substituted aryl;R'=a divalent C.sub.(6-30) aromatic organic radical;j=0, 1, or 2; andG=--CH.sub.2 --, --O--, --S--, or --SO.sub.2 --Blends generally comprise substantially equimolar amounts of the oligomers and a comparable, compatible, noncrosslinking, etherimide polymer of substantially the same backbone. The crosslinkable oligomers are made by reacting substituted phthalic anhydrides with hydroxyaryl amines and suitable crosslinking end cap reactants, or by self-condensation of phthalimide salts followed by capping the polymers.
    Type: Grant
    Filed: September 25, 1990
    Date of Patent: December 7, 1993
    Assignee: The Boeing Company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Patent number: 5266658
    Abstract: Preblends with improved interfacial adhesion, capable of later melt blending, can be formed by heating, above their glass transition temperatures but below their melting temperatures, a flexible coil polymer, to serve as the matrix, and a lesser amount of a block copolymer of a thermotropic liquid crystal polymer and a flexible coil polymer.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: November 30, 1993
    Assignee: Akzo nv
    Inventors: Sophia Dashevsky, Ki-Soo Kim, Stanley W. Palmaka
  • Patent number: 5266656
    Abstract: Molding materials are composed ofA) from 40 to 100% by weight, based on the total weight of the molding material, of a polyamide mixture based ona.sub.1) from 5 to 30% by weight, based on the total weight of the polyamide mixture, of at least one homo- or copolyamide that contains olefinic double bonds and comprises.alpha.) from 40 to 100 mol %, based on homo- or copolyamide, of at least one monomer that contains at least one olefinic double bond (monomers .alpha.) from the group of the.alpha..sub.1) olefinically unsaturated lactams,.alpha..sub.2) olefinically unsaturated aminocarboxylic acids,.alpha..sub.3) olefinically unsaturated dicarboxylic acids,.alpha..sub.4) olefinically unsaturated diamines, and.beta.) from 0 to 60 mol %, based on homo- or copolyamide, of at least one monomer that contains no olefinic double bonds (monomers .beta.) from the group of the.beta..sub.1) lactams.beta..sub.2) aminocarboxylic acids,.beta..sub.3) dicarboxylic acids,.beta..sub.4) diamines, anda.sub.
    Type: Grant
    Filed: March 3, 1993
    Date of Patent: November 30, 1993
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Brigitte Gareiss, Andreas Deckers, Petra Baierweck
  • Patent number: 5266655
    Abstract: Single-phase and amorphous polymer blends, well adapted for the production of resilient shaped articles, e.g., by molding, include (i) and amorphous semiaromatic polyamide homo- or copolymer, e.g., prepared from 2-methyl-1,5-pentamethylenediamine or mixture thereof with 2-ethyl-1,4-tetramethylenediamine and isophthalic acid or mixture thereof with terephthalic acid, and (ii) a minor amount, up to 40% by weight, of a semicrystalline nylon 66 or nylon 6 polyamide.
    Type: Grant
    Filed: September 3, 1992
    Date of Patent: November 30, 1993
    Assignee: Rhone-Poulenc Chimie
    Inventors: Jean-Pierre Prevost, Daniel Roberjot
  • Patent number: 5264544
    Abstract: Amorphous polyamide compositions are provided which are transparent and have improved glass transition and thermal decomposition temperatures. The polyamide compositions of the present invention can be prepared as the polymeric condensation product of a diamine component comprising neopentyldiamine, and a diacid component comprising an aromatic dicarboxylic acid.
    Type: Grant
    Filed: July 15, 1992
    Date of Patent: November 23, 1993
    Assignee: Amoco Corporation
    Inventors: Edward E. Paschke, Wassily Poppe, David P. Sinclair
  • Patent number: 5264282
    Abstract: The process for making a polyamide filament having thermal and mechanical properties close to those of nylon 66 but without spherulites includes concentrating an aqueous solution of adipic acid-hexamethylenediamine salt containing from 1 to 10% by weight of .epsilon.-caprolactam and from 1 to 15% by weight of PA 6.HHT to form a condensed mixture; polycondensing the condensed mixture to form a polycondensed mass; and melt-spinning the polycondensed mass to form the polyamide filament. The process parameters are controlled to produce a polyamide filament consisting essentially of at least 80% by weight nylon 66 monomer, 1 to 10% by weight nylon 6 monomer and 1 to 15% by weight PA 6.HHT.
    Type: Grant
    Filed: April 7, 1992
    Date of Patent: November 23, 1993
    Assignee: Rhone-Poulenc Viscosuisse SA
    Inventors: Josiane Enggasser, Roland Stahlin
  • Patent number: 5258470
    Abstract: An aromatic polyamide molding compound, comprising:I. an aromatic polyamide having the basic structure ##STR1## where Ar is an aromatic radical without amine-reactive functional groups n is a number between 5 and 500; X represents --SO.sub.2 -- or --CO--, andY represents --O-- or --S--; andII. an aromatic liquid crystalline thermoplastic.
    Type: Grant
    Filed: May 28, 1992
    Date of Patent: November 2, 1993
    Assignee: Huls Aktiengesellschaft
    Inventors: Gunter Poll, Jurgen Finke, Horst Beyer, Harald Modler
  • Patent number: 5254625
    Abstract: Provided are polymers containing methine linkages. Also provided are shaped or formed articles comprised of the light absorbing polymers either alone or admixed with other thermoplastic polymers to form a light absorbing thermoplastic polymer composition.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: October 19, 1993
    Assignee: Eastman Kodak Company
    Inventors: Max A. Weaver, James J. Krutak, Clarence A. Coates, Wayne P. Pruett, Samuel D. Hilbert
  • Patent number: 5252647
    Abstract: A thermoplastic moulding material is prepared by the admixture ofa) 3 to 80 parts by weight of polyphenylene ethers,b) 20 to 97 parts by weight of polyamides,c) 0.1 to 10 parts by weight of carbonates of the general formula ##STR1## in which X and Y independently of one another denote an alkyl, cycloalkyl, aryl or substituted aryl radical, each having up to 12 C atoms,d) 0 to 30 parts by weight of impact modifiers ande) 0 to 75 parts by weight of further polymers, if necessary.
    Type: Grant
    Filed: November 18, 1991
    Date of Patent: October 12, 1993
    Assignee: Huels Aktiengesellschaft
    Inventors: Joachim Mugge, Udo Kowalczik, Friedrich G. Schmidt
  • Patent number: 5252661
    Abstract: Thermoplastic molding compositions contain as essential componentsA) 40-95% by weight of a partly aromatic copolyamide composed essentially ofA.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine,A.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam andA.sub.3) 0-80% by weight of units derived from adipic acid and hexamethylenediamine,B) 5-60% by weight of an impact modifying rubber, and in additionC) 0-50% by weight of fibrous or particulate fillers or mixtures thereof.
    Type: Grant
    Filed: April 6, 1992
    Date of Patent: October 12, 1993
    Assignee: BASF Aktiengesellschaft
    Inventors: Horst Reimann, Gunter Pipper, Hans-Peter Weiss, Christoph Plachetta, Eckhard M. Koch, Gerd Blinne, Walter Goetz, Peter Steiert
  • Patent number: 5250633
    Abstract: Fibers and fibrets of a novel miscible blend of component polymers comprising from about 5 weight percent to about 95 weight percent of a polybenzimidazole and from about 95 weight percent to about 5 weight percent of an aromatic polyamide, aromatic polyamide-hydrazide or aromatic polyamide containing heterocyclic linkages. Miscibility of the component polymers of the blend is indicated by infrared, X-Ray and Differential Scanning Calorimetry analyses and electron photomicrographs. In fibers or fibrets of a blend mostly comprised of a polybenzimidazole, it is preferred that the aromatic polyamide, aromatic polyamide-hydrazide or aromatic polyamide containing heterocyclic linkages be present in the blend in an amount sufficient to yield a blend with improved tensile properties compared to the polybenzimidazole and more thermally processable than the polybenzimidazole. The fibers or fibrets of the blend have a lower moisture regain than polybenzimidazole fibers or fibrets.
    Type: Grant
    Filed: January 29, 1991
    Date of Patent: October 5, 1993
    Assignee: Hoechst Celanese Corp.
    Inventors: Gordon W. Calundann, Edward C. Chenevey, Tai-Shung Chung
  • Patent number: 5250604
    Abstract: Polyamide composition having a high strength, high-rigidity and high impact characteristics with a smooth surface and improved in the decrease of physical properties by water absorption are made by compounding 100-250 parts by weight of glass fiber and 100 parts of weight of a mixture of 95-60 parts by weight of crystalline aliphatic polyamide, 0.2-10 parts by weight of crystalline copolyamide and 5-40 parts by weight of amorphous polyamide.
    Type: Grant
    Filed: April 9, 1992
    Date of Patent: October 5, 1993
    Assignee: Kishimoto Sangyo Company Ltd.
    Inventors: Takeshi Moriwaki, Kenji Tsutsui
  • Patent number: 5250619
    Abstract: This invention relates to a process for the preparation of particulate, high molecular weight polyamides, to the particulate, high molecular weight polyamides prepared by this process, to the use of these polyamides for the production of moulded bodies, especially by extrusion or blow moulding, and to the articles produced from the polyamides according to the invention. The process is characterized in that polyamides are mixed with concentrates of certain compounds containing phosphorus and worked up into granulates and these granulates are converted into high molecular weight products by solid phase after-condensation.
    Type: Grant
    Filed: July 16, 1990
    Date of Patent: October 5, 1993
    Assignee: Bayer Aktiengesellschaft
    Inventors: Hans-Detlef Heinz, Helmut Schulte, Hans-Josef Buysch
  • Patent number: 5248711
    Abstract: Thermosetting resins for use in high performance fiber-reinforced composites are toughened without compromising their processability by the inclusion of micron-sized particles of thermoplastic material which are solid at ambient temperatures but solubilize in the resins at a temperature below the gel temperature of the thermosetting resin. By appropriate selection of the solubilization temperature (or temperature range) of the thermoplastic material, one achieves a composite product having intralaminar or interlaminar toughness emphasized or a combination of both. The invention is of particular utility when applied to bismaleimide resin systems.
    Type: Grant
    Filed: February 16, 1989
    Date of Patent: September 28, 1993
    Assignee: Hexcel Corporation
    Inventors: Robert A. Buyny, Karen A. Olesen
  • Patent number: 5248738
    Abstract: A vibration-damping resin molded product which can be used as an engine part or attachment in a motor vehicle, the resin molded product being made of a blend of nylons comprising:(A) 5 to 90% by weight, based on the total amount of the blend, of a nylon 6 resin,(B) 5 to 90% by weight, based on the total amount of the blend, of a xylylenediamine-based nylon resin, and(C) 5 to 90% by weight, based on the total amount of the blend, of a nylon 66 resin. Optionally, the resin molded product can contain an inorganic filler (D) in an amount of 10 to 150 parts by weight, per 100 parts by weight of the above-described blend of nylons.
    Type: Grant
    Filed: October 18, 1990
    Date of Patent: September 28, 1993
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Koichi Sato, Tadaoki Okumoto, Koji Sasaki, Hidetoshi Ishihara
  • Patent number: 5248759
    Abstract: The aromatic heterocyclic copolymer is produced by (a) reacting (i) an aromatic diaminodithiol compound, hydrogen atoms of thiol groups of which compound are substituted with substituted or unsubstituted alkyl groups, with (ii) an aromatic diamino compound and (iii) a dicarboxylic acid derivative in an organic solvent, to produce a precopolymer; and (b) heating the precopolymer to cause a thiazole ring closure reaction. This aromatic heterocyclic copolymer is contained as a reinforcing polymer in a molecular composite material.
    Type: Grant
    Filed: May 13, 1992
    Date of Patent: September 28, 1993
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Akita, Tatsuya Hattori, Kazuhiro Kagawa, Hiroto Kobayashi
  • Patent number: 5247068
    Abstract: Substantially water-insoluble, crosslinked polypeptides containing 15 to 85 mole % of amino acid residues such as glutamic acid, aspartic acid, phosphoserine, phosphohomoserine, phosphotyrosine, phosphothreonine, phosphoasparagine, or phosphoglutamine, and 15 to 85 mole % of amino acid residues such as lysine, arginine, asparagine, glutamine, serine or tyrosine, in which the degree of crosslinking is sufficient to result in a substantially water-insoluble polypeptide with the ability to absorb a 1% aqueous NaCl solution in an amount of at least 20 times the weight of the polypeptide, are useful as superabsorbents in devices such as diapers, etc.
    Type: Grant
    Filed: March 29, 1991
    Date of Patent: September 21, 1993
    Assignee: University of South Alabama
    Inventors: Julie Donachy, Steven Sikes
  • Patent number: 5244984
    Abstract: A polymer powder is produced by separately melting two or more of oligomers and monomers which are reactive with each other, spraying a mixture of the oligomers and the monomers, while continuously mixing them with each other, the mixture being solid at a normal temperature, having a melt viscosity of 1,000 cps or below at 300 degree C., then cooling the sprayed mixture to obtain a powder thereof, and solid phase-polymerizing it to obtain the polymer powder. It is useful for powder coating.
    Type: Grant
    Filed: March 22, 1991
    Date of Patent: September 14, 1993
    Assignee: Daicel Huls Ltd.
    Inventor: Hajime Suzuki
  • Patent number: 5242992
    Abstract: 1. A polyamide molding compound, comprised of:(I) an aromatic polyamide having the structure ##STR1## where n is a number between 5 and 500; X represents --SO.sub.2 -- or --CO--, andY represents --O-- or --S--; and (II) an amorphous polyamide.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: September 7, 1993
    Assignee: Huls Aktiengesellschaft
    Inventors: Gunter Poll, Jurgen Finke, Harald Modler, Horst Beyer
  • Patent number: 5243024
    Abstract: Improved imide-containing copolymers comprising, in the aromatic diamine component, p-phenylene diamine and at least one additional aromatic diamine have increased rigidity and useful processability. The copolymers of this invention also may exhibit improved resistance to the detrimental effects of humid environments and retain mechanical properties at elevated temperatures after exposure to humid environments.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: September 7, 1993
    Assignee: Amoco Corporation
    Inventors: Ronald E. Bockrath, Edward J. Gordon
  • Patent number: 5241018
    Abstract: The terminal-modified imide oligomer composition capable of being cured within a short time and of being converted to a shaped, cured resin article having a high mechanical strength, heat resistance and elastic modulus, comprises a rigid, high molecular weight aromatic polyimide (I) produced by polymerizing and imidizing a tetracarboxylic acid component comprising at least one biphenyltetracarboxylic acid compound with an amine component comprising at least one aromatic diamine compound (a) having at least one cyclic structure and two amino groups directly attached to the cyclic structure; a flexible imide oligomer (II) produced by polymerizing and imidizing the tetracarboxylic acid component, with a diamine component comprising at least one aromatic diamine compound (b) having at least two cyclic structures and two amino groups attached directly or through a divalent bonding member to the cyclic structures and a monoamine component comprising at least one monoamine compound (c) having an unsaturated hydrocar
    Type: Grant
    Filed: June 5, 1992
    Date of Patent: August 31, 1993
    Assignee: Ube Industries, Ltd.
    Inventors: Shinji Yamamoto, Yasuo Hirano, Kazuyoshi Fujii
  • Patent number: 5225489
    Abstract: This invention relates to mixtures of short fibers of varying lengths, diameters and aspect ratios composed of an anisotropic polymer, to compositions containing said fibers and one or more thermoplastic or thermoset resins, and to a process for forming said mixtures.
    Type: Grant
    Filed: December 11, 1990
    Date of Patent: July 6, 1993
    Assignee: Allied-Signal Inc.
    Inventors: Dusan C. Prevorsek, Kwok W. Lem, Hong B. Chin
  • Patent number: 5223196
    Abstract: An improved process for melt-spinning a pigmented hexamethylene adipamide fiber from a melt blend of a polymer and a colored pigment wherein the polymer is a random interpolyamide or a block polymer having two different difunctional recurring amide-forming moieties other than those which form hexamethylene adipamide is disclosed along with pigmented hexamethylene adipamide polymer fibers having tenacities greater than 7.5 or even 8 grams per denier.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: June 29, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Ketan G. Shridharani, Peter R. Witt, Perry H. Lin, Sundar M. Rao
  • Patent number: 5223588
    Abstract: A composite material is comprised of an in situ polymerized rigid rod polymer and an in situ polymerized matrix polymer. The composite material is isotropic and has enhanced mechanical properties as well as improved temperature resistance, improved solvent resistance and improved moisture resistance.
    Type: Grant
    Filed: October 28, 1991
    Date of Patent: June 29, 1993
    Assignee: GenCorp Inc.
    Inventors: Gerd M. Lenke, Donald R. Wiff
  • Patent number: 5219953
    Abstract: Semi-aromatic copolyamides and copolyester-amides are obtained by placing an aliphatic polyamide into contact with an aromatic hydroxyacid or aminoacid, by operating at high temperature, under melting conditions, possibly in the presence of a catalyst, with a ratio of the monomer units of aliphatic polyamide to the mols of aromatic hydroxyacid or aminoacid comprised within the range of from 20:1 to 1:1.The semiaromatic copolyamides and copolyester-amides so obtained can display a thermotropic liquid-crystal behavior as a function of their content of aromatic units linked inside the molecular chain. Their elastic modulus results to be improved relatively to the alifatic polyamides used as the starting product, and the elongation at break results to be decreased.Such semiaromatic polyamides and copolyester-amides can find application in the production of high-stiffness articles, by means of moulding or extrusion processes.
    Type: Grant
    Filed: October 30, 1990
    Date of Patent: June 15, 1993
    Assignee: Eniricerche S.p.A.
    Inventors: Ming-de Liu, Bruno Bresci, Pier L. Magagnini, Nicoletta Maurizi, Ugo Pedretti, Arnaldo Roggero
  • Patent number: 5217809
    Abstract: Granular compositions which comprise a block copolymer containing blocks of rigid rod polybenzazole polymer and blocks of thermoplastic polybenzazole polymer can be compression molded to provide a molded article having physical properties superior to molded articles made from the thermoplastic polymer alone.
    Type: Grant
    Filed: August 6, 1990
    Date of Patent: June 8, 1993
    Assignee: The Dow Chemical Company
    Inventors: Wen-Fang Hwang, Otto C. Raspor, William J. Harris, Thuan P. Dixit
  • Patent number: 5212257
    Abstract: Aramid block copolymers which contains blocks which are crystalline and blocks that are noncrystalline after drawing and where polymer chains are flexible in solution and in undrawn polymer, but relatively rigid in drawn polymer, are disclosed. The aramids are tough materials with high modulus and tensile strength. Also disclosed is a process for making such block copolymers. The copolymers are useful as fibers and films, for example in ropes and composites.
    Type: Grant
    Filed: December 6, 1991
    Date of Patent: May 18, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Robert S. Irwin
  • Patent number: RE34447
    Abstract: Novel crystalline polyamides having high heat deflection temperatures when filled are prepared from aliphatic diamines and either mixtures of terephthalic acid and adipic acid or mixtures of terephthalic acid, isophthalic acid and adipic acid. The mole ratio of aliphatic diamine to terephthalic acid, isophthalic acid, and adipic acid is in the range of about 100:65-95:25-0:35-5. The polyamides can be filled with about 10 to about 60 parts by weight of a filler. The mechanical properties of these polyamides are largely unaffected by absorbed water.
    Type: Grant
    Filed: July 21, 1988
    Date of Patent: November 16, 1993
    Assignee: Amoco Corporation
    Inventors: Wassily Poppe, Larry W. Autry, Yu-Tsai Chen, Joel A. Richardson, David P. Sinclair