Mixed With Additional Polycarboxylic Acid And A Polyamine; Amino Carboxylic Acid Or Derivative; Polyamine Salt Of A Polycarboxylic Acid; Lactam; Or Polymer Derived Therefrom Patents (Class 525/432)
  • Patent number: 5212258
    Abstract: Aramid block copolymers which contains blocks whose polymer chains are flexible, and blocks whose polymer chains are flexible in solution and in undrawn polymer, but relatively rigid in drawn polymer, are disclosed. The aramids are tough materials with high modulus and tensile strength. Also disclosed is a process for making such block copolymers. The copolymers are useful as fibers and films, for example in ropes and composites.
    Type: Grant
    Filed: October 29, 1991
    Date of Patent: May 18, 1993
    Assignee: E. I Du Pont de Nemours and Company
    Inventor: Robert S. Irwin
  • Patent number: 5206310
    Abstract: The invention relates to a polyamide resin composition comprising(A) nylon 4.6,(B) an aliphatic polyamide having a CH.sub.2 /NHCO ratio of from 6 to 11 and(C) a non-crystalline polyamide having a glass transition temperature of at least 100.degree. C. The composition has a decreased water absorption while retaining high mechanical strength, heat stability and chemical resistance. Dimensional stability and mechanical properties after water absorption are unexpectedly good.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: April 27, 1993
    Inventors: Kenji Yasue, Tsuneo Tamura, Akio Motoyama, Hiromasa Itakura
  • Patent number: 5206309
    Abstract: The present invention provides a heat stable film composition comprising polyepsiloncaprolactam and poly(epsiloncaprolactam-hexamethylene adipamide) copolymer which finds particular use in applications wherein the film is subjected heat for a prolonged period of time, such as in an oven or an autoclave.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: April 27, 1993
    Assignee: Allied Signal Inc.
    Inventor: Carl E. Altman
  • Patent number: 5202412
    Abstract: Soluble polymeric precursors having oligomeric imide and amic acid segments, which are suitable to form segmented, preferably insoluble, polyimide copolymers.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: April 13, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Brian C. Auman, John D. Summers
  • Patent number: 5198507
    Abstract: Novel amino acid-derived polycarbonates and amino acid-derived diphenol compound starting materials from which the polycarbonates are polymerized. Polymer blends of the amino acid-derived polycarbonates with polyiminocarbonates prepared from identical amino acid-derived diphenol starting materials.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: March 30, 1993
    Assignee: Rutgers, The State University of New Jersey
    Inventors: Joachim B. Kohn, Satish K. K. Pulapura
  • Patent number: 5198551
    Abstract: The present invention provides (1) curable polyamide monomers represented by the formula: R.sup.1 -A.sup.1 -B.sup.1 -A.sup.2 -B.sup.2 -A.sup.3 -R.sup.2 where R.sup.1 and R.sup.2 are radicals selected from the group consisting of maleimide, substituted maleimide, nadimide, substituted nadimide, ethynyl, and (C(R.sup.3).sub.2).sub.2 where R.sup.3 is hydrogen with the proviso that the two carbon atoms of (C(R.sup.3).sub.2).sub.2 are bound on the aromatic ring of A.sup.1 or A.sup.3 to adjacent carbon atoms, A.sup.1 and A.sup.3 are 1,4-phenylene and the same where said group contains one or more substituents selected from the group consisting of halo, e.g., fluoro, chloro, bromo, or iodo, nitro, lower alkyl, e.g., methyl, ethyl, and propyl, lower alkoxy, e.g., methoxy, ethoxy, or propoxy, and fluoroalkyl or fluoroalkoxy, e.g., trifluoromethyl, pentafluoroethyl and the like, A.sup.
    Type: Grant
    Filed: June 7, 1991
    Date of Patent: March 30, 1993
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Brian C. Benicewicz, Andrea E. Hoyt
  • Patent number: 5183864
    Abstract: Disclosed is a process for the preparation of a thermoplastic polymer blend comprising a first preformed thermoplastic polymer such as a polyester, polycarbonate, ABS graft polymer and the like and a second thermoplastic polyamide or polyamideimide. The second polymer is prepared from a diisocyanate and polycarboxylic compund selected from a dicarboxylic acid, tricarboxylic acid or anhydride thereof, or mixtures of these components by reactively processing the monomer components in the presence of the first polymer.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: February 2, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert G. Nelb, II, Kemal Onder
  • Patent number: 5179175
    Abstract: Disclosed is a method for reducing compatibility problems when introducing a polyetheramine having a molecular weight of about 100 to 1000 into a nylon-6,6 polymer by prereacting the polyetheramine with two moles of adipic acid and reacting the adipic acid salt with nylon-6,6 and adipic acid.
    Type: Grant
    Filed: December 14, 1990
    Date of Patent: January 12, 1993
    Assignee: Texaco Chemical Company
    Inventors: George P. Speranza, Donald H. Champion
  • Patent number: 5171828
    Abstract: Polyimide copolymers are disclosed having the recurring structure ##STR1## wherein AR is AR.sub.1 or AR.sub.2, wherein AR.sub.1 is ##STR2## and wherein AR.sub.2 is ##STR3## provided that the molar ratio of AR.sub.1 to AR.sub.2 is 3:1 to 1:3, and wherein AR.sub.3 is ##STR4## These polyimides have unexpected properties which are useful in various electronic applications.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: December 15, 1992
    Assignee: Occidental Chemical Corporation
    Inventors: Timothy A. Meterko, Rudolph F. Mundhenke, Willis T. Schwartz
  • Patent number: 5168011
    Abstract: This invention relates in general to the formation of fibers having a controlled molecular orientation prepared from rod-like extended chain aromatic-heterocyclic ordered polymers, and containing a binder in the micro-infrastructure. Such fibers have high tensile strength, modulus, and environmental resistance characteristics.
    Type: Grant
    Filed: June 14, 1989
    Date of Patent: December 1, 1992
    Assignee: Foster Miller Inc.
    Inventors: Robert Kovar, Roland R. Wallis, Jr.
  • Patent number: 5168108
    Abstract: Nylon compositions useful for molding and film applications with film properties and impact strength are made of a polyamide resin and a block copolymer of poly(amide-ether) of the formula ##STR1## where R is an alkyl or substituted alkyl group with from one to 12 carbons, n is an integer from 2 to 20, m is an integer from 2 to 6, and x and y are numbers from about 50 to about 30,000. In one embodiment, a nonpolymeric amide is added to the composition. Articles made from the claimed compositions have improved impact strength; films made from the compositions have improved drapeability over the unmodified resin, both at room temperature and after heat-aging. Reinforced compositions are obtained by including mineral and other reinforcing fillers, including glass fibers, in the extrusion process. The reinforced compositions exhibit improved impact characteristics.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: December 1, 1992
    Assignee: Allied Signal Inc.
    Inventors: Varkki P. Chacko, George M. Johns, Mocherla K. Rao, Michael F. Tubridy, Donald F. Stewart
  • Patent number: 5166309
    Abstract: Novel block polyetheramides, well adapted for the usual thermoplastic elastomer applications, e.g., as molded or extruded shaped articles, films, sheaths, composites and the like, have the following general formula: ##STR1## in which D is the residue of an oligoamidediacid having an Mn ranging from 300 to 8,000 and/or the residue of the diacidic polymer chain limiter, PE is the residue of a polyetherdiol having an Mn ranging from 200 to 5,000, X is a linear or branched, (cyclo)aliphatic or aromatic hydrocarbon having form 3 to 20 carbon atoms, R.sub.1 and R.sub.2, which may be identical or different, are either OH or H, n is a number ranging from 0.1 to 10, and m is an average number ranging from 2 to 50, and are prepared by reacting, in the molten state, an oligoamidediacid A with an oligotherdiol B and a low molecular weight diacidic coupler C, the respective molar percentages a, b and c of which being such that:-5.ltoreq.a+c-b.ltoreq.5 and c.gtoreq.3.
    Type: Grant
    Filed: March 16, 1992
    Date of Patent: November 24, 1992
    Assignee: Elf Atochem S.A.
    Inventors: Philippe Maj, Noelle Forichon
  • Patent number: 5166278
    Abstract: A process for modifying the dyeability of polyamide polymers is disclosed, the process involving the addition of co-fed polyamide flake of the same type of polyamide as the base polyamide with the co-fed flake having a significant effect on the final dyeability. The additive flake comprises high- or low-amine-end polyamide flake which is mixed and melted with the base polyamide to adjust the total number of amine ends in the polymer, thereby controlling the polymer dyeability.
    Type: Grant
    Filed: April 17, 1990
    Date of Patent: November 24, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Sundar M. Rao
  • Patent number: 5166246
    Abstract: Polyphenylene ether- polyamide compositions having improved resistance to water absorption and swell are provided by incorporating therein a phenolic compound.
    Type: Grant
    Filed: April 5, 1989
    Date of Patent: November 24, 1992
    Assignee: General Electric Company
    Inventors: Robert R. Gallucci, John A. Rock
  • Patent number: 5164475
    Abstract: The invention relates to a polyamide substrate with a high concentration of amine groups, and a method of transferring biological materials by adsorption onto said substrate.
    Type: Grant
    Filed: January 31, 1990
    Date of Patent: November 17, 1992
    Assignee: Du Pont Merck Pharmaceutical Company
    Inventor: Robert C. Wheland
  • Patent number: 5162454
    Abstract: Polyamide-polyimide block copolymers having an average molecular weight M.sub.n of 1,000-50,000 and containing recurring units of the formula I--(PA)-(PI)--. (I)in which (PA) is a polyamide block having an average molecular weight M.sub.n of 300-20,000 and containing at least one (recurring) unit of the formula II ##STR1## in which R.sup.1 is ##STR2## and R.sup.2 is ##STR3## in which Q is a direct bond, --CH.sub.2 --, --CH.sub.2 CH.sub.2 --, ##STR4## --O--, --S--, --SO.sub.2 -- or --C(O)--, and n is 2-12, and Y.sub.a, Y.sub.b, Y.sub.c and Y.sub.d independently of one another are hydrogen, halogen or C.sub.1 -C.sub.4 alkyl, and (PI) is a polyimide block having an average molecular weight M.sub.n of 300-20,000 and containing at least one (recurring) unit of the formula III ##STR5## in which R.sup.3 is ##STR6## and Q and R.sup.2 are as defined above, with the proviso that 25-100 mol % of all the bridge members R.sup.2 are ##STR7## and the (cyclo)aliphatic proportion of bridge members R.sup.
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: November 10, 1992
    Assignee: Ciba-Geigy Corporation
    Inventor: Rudolf Pfaendner
  • Patent number: 5159029
    Abstract: This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide having the following repeating unit. ##STR1## wherein Z=C or SO.sub.2. Provided is an improved high temperature matrix resin which is capable of performing in the 200.degree. to 300.degree. C. range. This resin has significantly improved toughness and microcracking resistance, excellent processability, mechanical performance and moisture and solvent resistances.
    Type: Grant
    Filed: October 31, 1989
    Date of Patent: October 27, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Ruth H. Pater, Norman J. Johnston
  • Patent number: 5157085
    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer.
    Type: Grant
    Filed: March 9, 1989
    Date of Patent: October 20, 1992
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5155179
    Abstract: Novel polyimide blends are formed of polyimide polymers each having moieties derived from dianhydride and diamine comonomers. The miscible blends of the present invention may be formed by selecting polyimide polymers having structurally different dianhydride-derived moieties, as well as structurally different diamine-derived moieties. More specifically, the blends of this invention include at least one polyimide polymer which is a reaction product of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, and 2,2-bis(3-aminophenyl) hexafluoropropane; and at least another polyimide polymer which is a reaction product of 2,2-bis(4-aminophenyl) hexafluoropropane and a dianhydride which is at least one selected from the group consisting of pyromellitic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, and 3,3',4,4'-benzophenone tetracarboxylic dianhydride.
    Type: Grant
    Filed: April 25, 1990
    Date of Patent: October 13, 1992
    Assignee: Hoechst Celanese Corp.
    Inventors: Tai-Shung Chung, Edward R. Kafchinski
  • Patent number: 5155178
    Abstract: Blends of nylon 6,6, nylon 6 or nylon 6,6/6 copolymer which contain a randomly copolymerized cationic dye modifier are formed by melt blending such copolymer with a polyamide having 8 to 22 carbon atoms per amide link to form a block copolymer composition which is resistant to staining with acid dyes under ambient temperature and pH conditions.
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: October 13, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: William T. Windley
  • Patent number: 5153275
    Abstract: Nylon compositions useful for molding and film applications with film properties and impact strength are made of a polyamide resin and a block copolymer of poly(amide-ether) of the formula ##STR1## where R is an alkyl or substituted alkyl group with from one to 12 carbons, n is an integer from 2 to 20, m is an integer from 1 to 6, and x and y are numbers from about 50 to about 30,000. In one embodiment, a non-polymeric amide is added to the composition. Articles made from the claimed compositions have improved impact strength; films made from the compositions have improved drapeability over the unmodified resin, both at room temperature and after heat-aging. Reinforced compositions are obtained by including mineral and other reinforcing fillers, including glass fibers, in the extrusion process. The reinforced compositions exhibit improved impact characteristics.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: October 6, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Varkki P. Chacko, George M. Johns, Mocherla K. Rao, Michael F. Tubridy, Donald F. Stewart
  • Patent number: 5151472
    Abstract: A high strength synthetic resin based structural material in which a polymer having coil-like molecules is uniformly mixed with a second polymer having rigid rod-like molecules. This material is made, basically, by dissolving a thermoplastic matrix polymer having coil-like molecules in a suitable solvent, adding thereto thermosetting polymer reactants which then form a prepolymer. The rigid rod prepolymer may then be partially cyclized through heat or by the use of a chemical agent in order to reduce chain conformations. Excess cyclizing agent can then be removed and the mixture can be heated to complete polymerization to produce a high strength structure with rigid rod-like molecules intimately blended with the matrix coil-like molecules.
    Type: Grant
    Filed: August 10, 1990
    Date of Patent: September 29, 1992
    Assignee: General Dynamics Corporation, Convair Division
    Inventor: David A. Valia
  • Patent number: 5149746
    Abstract: This invention is a process for making a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide having the following repeating unit: ##STR1## Provided is an improved high temperature matrix resin which is capable of performing at 316.degree. C. in air for several hundreds of hours. This resin has significantly improved toughness and microcracking resistance, excellent processability and mechanical performance, and cost effectiveness.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: September 22, 1992
    Assignee: The United States of America as represented by The National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5147944
    Abstract: A polyamide resin which comprises a molten reaction mixture composed of 10-90% by weight of a polyamide (A1) from xylylenediamine and a C.sub.6 -C.sub.20 .alpha.,.beta.-linear aliphatic dibasic acid and 90-10% by weight of polyamide-6 (A2). The polyamide resin has either a single glass transition temperature differing from that of both (A1) and (A2), or two glass transition temperatures both differing from those of (A1) and (A2), the difference between the two temperatures being less than 10.degree. C. There are also provided a toughened polyamide resin composition comprising (A) 100 parts by weight of the polyamide resin, and (B) 5 to 80 parts by weight of an elastomer such as one composed mainly of a block-copolymerized elastomer which has been modified with an unsaturated dicarboxylic acid or a derivative thereof and hydrogenated.
    Type: Grant
    Filed: October 16, 1990
    Date of Patent: September 15, 1992
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventor: Yuji Takeda
  • Patent number: 5145916
    Abstract: A composition of terminal-modified imide oligomers is disclosed. The composition comprises a flexible terminal-modified imide oligomer (A) and a rigid terminal-modified imide oligomer (B). The flexible terminal-modified imide oligomer (A) is selected from specific oligomers (I) and (II). The rigid terminal-modified imide oligomer (B) is selected from specific oligomers (III) and (IV). The oligomer (I) is formed from biphenyltetracarboxylic acid or its derivative, an aromatic diamine compound (a) and an unsaturated monoamine compound or an unsaturated carboxylic acid or its derivative. The oligomer (II) is formed from biphenyltetracarboxylic acid or its derivative and an unsaturated monoamine compound. The oligomer (III) is formed from biphenyltetracarboxylic acid or its derivative, an aromatic diamine compound (b) and an unsaturated monoamine compound or an unsaturated carboxylic acid or its derivative.
    Type: Grant
    Filed: April 24, 1990
    Date of Patent: September 8, 1992
    Assignee: Ube Industries, Ltd.
    Inventors: Shinji Yamamoto, Hideho Tanaka, Kazuyoshi Fujii
  • Patent number: 5143983
    Abstract: A heat resistant polyamide film which is obtained by melt-extruding into a sheet a polyamide composition of a mixture of a preformed polyamide (A) composed of diaminobutane and adipic acid and a semi-aromatic polyamide (B) composed of a polyamide containing an aromatic dicarboxylic acid and an aliphatic diamine in an amount of at least 80% by weight of the polyamide-constituting components, in a weight ratio of (A):(B)=99.9:0.1 to 30:70, quenching the sheet, then biaxially stretching it at least 2.0.times.2.0 times, followed by heat setting at a temperature of at least 205.degree. C., and which has a heat distortion initiation temperature of at least 130.degree. C.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: September 1, 1992
    Assignee: Mitsubishi Kasei Polytec Company
    Inventors: Naomichi Yamagishi, Masashi Hasegawa
  • Patent number: 5139821
    Abstract: A polyamide resin composition is used in powder coating and comprises a first polyamide having a carboxylic acid at 70 percent or above of the terminal groups thereof and a second polyamide having an amine at 70 percent or above of the terminal groups thereof.
    Type: Grant
    Filed: August 6, 1990
    Date of Patent: August 18, 1992
    Assignee: Daicel-Huls Ltd.
    Inventor: Hajime Suzuki
  • Patent number: 5137986
    Abstract: As-spun fibers from certain spinnable dopes of poly-p-phenylenebenzobisthiazole, poly-p-phenylenebenzobisoxazole, or poly-2,5-benzoxazole and thermoplastic polymers in certain mixed solvents are provided.
    Type: Grant
    Filed: March 6, 1989
    Date of Patent: August 11, 1992
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: William C. Uy
  • Patent number: 5137985
    Abstract: A miscible blend comprising from about 5 to about 95 weight percent of a polybenzimidazole and from about 95 to about 5 weight percent of a polyamide-imide having fluorine-containing linking groups, total weight percent of the two polymers being 100. A process for preparing the blends comprises dissolving in a mutual solvent from about 5 to about 95 weight percent of the aromatic polybenzimidazole to about 95 to about 5 weight percent of the polyamide-imide having fluorine-containing linking groups, based on the total weight of those polymers and subsequently evaporating the solvent, thereby producing a dried blend of a polybenzimidazole and a polyamide-imide having fluorine-containing linking groups. The blends, particularly in the form of films, fibers or fibrets, may be post-treated with heat or sulfuric acid in order to minimize their shrinkage when subsequently subjected to heat and in order to increase their resistance to solvents and acid.
    Type: Grant
    Filed: September 22, 1989
    Date of Patent: August 11, 1992
    Assignee: Hoechst Celanese Corp.
    Inventors: Paul N. Chen, Sr., Morton Glick, Rohitkumar H. Vora, Michael Jaffe
  • Patent number: 5137688
    Abstract: Thermoplastic articles molded from amorphous polyamide and polycarbonate resin blends exhibit improved color when irradiated with ionizing radiation.
    Type: Grant
    Filed: November 29, 1990
    Date of Patent: August 11, 1992
    Assignee: General Electric Company
    Inventor: James L. DeRudder
  • Patent number: 5135991
    Abstract: A polymer powder is produced by separately melting two or more of polymers and monomers which are reactive with each other, spraying a mixture of the polymers and the monomers, while continuously mixing them with each other, the mixture being solid at a normal temperature, having a melt viscosity of 1,000 cps or below at 300 degree C., then cooling the sprayed mixture to obtain a powder thereof, and solid phase-polymerizing it to obtain the polymer powder. It is useful for powder coating.
    Type: Grant
    Filed: October 11, 1989
    Date of Patent: August 4, 1992
    Assignee: Daicel Huls Ltd.
    Inventor: Hajime Suzuki
  • Patent number: 5118765
    Abstract: Soluble and/or fusible polyamidoimide-polyimide block copolymers with high heat stability, useful e.g. as molding powders for thermoplastic shaping films, fibers and laminates and process for their preparation are provided.
    Type: Grant
    Filed: March 26, 1991
    Date of Patent: June 2, 1992
    Assignee: Chemie Holding Aktiengesellschaft
    Inventors: Gerd Greber, Heinrich Gruber, Wolfgang Wimmer
  • Patent number: 5116920
    Abstract: Novel soluble polyamide-polyimide block copolymers having an average molecular weight M.sub.n of 1,000-50,000 and containing radicals of the formula ##STR1## in the polyimide blocks are described. The compounds can be crosslinked by heating to give insoluble products.
    Type: Grant
    Filed: January 25, 1990
    Date of Patent: May 26, 1992
    Assignee: Ciba-Geigy Corporation
    Inventor: Rudolf Pfaendner
  • Patent number: 5116945
    Abstract: A resinous substance obtained by reacting a rosin compound containing 1 to 10 equivalents of carboxylic groups per kilogram with triglycidyl isocyanurate. A process for producing it is also disclosed.
    Type: Grant
    Filed: February 12, 1990
    Date of Patent: May 26, 1992
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Ken'ichi Osawa, Hisao Ikeda, Fumio Mizuochi, Hiroyuki Uehara
  • Patent number: 5116913
    Abstract: A process for the preparation of crosslinked polymers by heating selected polyamide-polyimide block copolymers having an average molecular weight M.sub.n of 1,000-50,000 is described. In the compounds, at least 10 mol % of alkyl-substituted diaminodiphenylmethane groups, relative to the total amount of diamine radicals in the polyamide and polyimide blocks, are co-condensed.The uncrosslinked compounds are soluble in dipolar, aprotic solvents.
    Type: Grant
    Filed: January 25, 1990
    Date of Patent: May 26, 1992
    Assignee: Ciba-Geigy Corporation
    Inventor: Rudolf Pfaendner
  • Patent number: 5116939
    Abstract: A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15% by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.
    Type: Grant
    Filed: August 11, 1987
    Date of Patent: May 26, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: James C. Fletcher, J. Richard Pratt, Terry L. St. Clair, Diane M. Stoakley, Harold D. Burks
  • Patent number: 5110879
    Abstract: Novel polyimide blends are formed of polyimide polymers each having moieties derived from dianhydride and diamine comonomers. The blends of the present invention may be formed by selecting polyimide polymers having structurally identical dianhydride-derived moieties, but structurally different diamine-derived moieties. Preferred miscible blends are formed wherein one of polyimides in the blend is the polymer condensation product of a dianhydride selected from 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 3,3',4,4'-diphenyl tetracarboxylic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl ether dianhydride, pyromellitic dianhydride, and mixtures thereof, and 2,2-bis(3-aminophenyl) hexafluoropropane, and another of the polyimides in the blend is the polymer condensation product of the same dianhydride and mixtures thereof noted above, and 2,2-bis(4-aminophenyl) hexafluoropropane.
    Type: Grant
    Filed: April 24, 1990
    Date of Patent: May 5, 1992
    Assignee: Hoechst Celanese Corp.
    Inventors: Tai-Shung Chung, Rohitkumar H. Vora
  • Patent number: 5106915
    Abstract: Flame resistant polymer blends contain a polyetherimide and an impact strength-enhancing amount of a siloxane-polyetherimide copolymer. These blends exhibit high impact strengths, good blow-moldability and injection moldability, amenability to thermoforming and very low flammability. The blends are particularly suited to the manufacture of aircraft cabin interior components.
    Type: Grant
    Filed: August 8, 1991
    Date of Patent: April 21, 1992
    Assignee: General Electric Company
    Inventors: John A. Rock, L. Joseph Male, Norman E. Durfee, Jr.
  • Patent number: 5106910
    Abstract: Improved polyamide-based compositions are provided which are particularly formulated for plasma-spray application to surfaces subjected to acidic conditions. The compositions include respective amounts of polyvinylidene fluoride, a polyamide (e.g., Nylon 11) and a compatable adhesive such as a nylon terpolymer adhesive.
    Type: Grant
    Filed: November 9, 1989
    Date of Patent: April 21, 1992
    Assignee: Applied Polymer Systems
    Inventors: Larry G. Weidman, Alma L. Coats
  • Patent number: 5104943
    Abstract: The invention relates to a resin composition comprising 100 parts by weight polyamide 4.6 resin and 2 to 200 parts by weight of a polyamide amide resin.The composition has improved HDT in wet state and improved impact resistance in dry state.
    Type: Grant
    Filed: May 23, 1989
    Date of Patent: April 14, 1992
    Assignee: Stamlcarbon B.V.
    Inventors: Katsuhiko Hironaka, Hiroo Inata, Shunichi Matsumura
  • Patent number: 5102959
    Abstract: The present invention relates to copolyimides of 100-70 mol % of recurring structural units of the formula I and 0-30 mol % of recurring structural units of the formula II ##STR1## in which z.sup.a is a tetravalent aromatic tetracarboxylic acid radical other than that of thioxanthonetetracarboxylic acid, the carboxyl groups thereof in each case being located in pairs in the ortho-position or peri-position relative to one another, and x.sup.a is a divalent aromatic diamine radical which, in at least one ortho-position relative to at least one nitrogen atom, carries a hydrocarbon substituent having at least one aliphatic .alpha.-hydrogen atom or x.sup.a is a radical of the formula III ##STR2## in which X.sup.c is a divalent aromatic diamine radical which, in ortho-position relative to both nitrogen atoms, carries in each case at least one mono-valent hydrocarbon substituent having at least one aliphatic .alpha.-hydrogen atom, n assumes an average value of 1.0 to 2.5, Z.sup.b is as defined for Z.sup.a and X.sup.
    Type: Grant
    Filed: March 2, 1990
    Date of Patent: April 7, 1992
    Assignee: Ciba-Geigy Corporation
    Inventors: Ottmar Rohde, Stanley J. Jasne, Josef Pfeifer
  • Patent number: 5098961
    Abstract: This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide having the following repeating unit: ##STR1## Provided is an improved high temperature matrix resin which is capable of performing at 316.degree. C. in air for several hundreds of hours. This resin has significantly improved toughness and microcracking resistance, excellent processability and mechanical performance, and cost effectiveness.
    Type: Grant
    Filed: January 26, 1989
    Date of Patent: March 24, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5095075
    Abstract: Provided is a molecular composite comprising a rigid-rod aromatic heterocyclic polymer, a flexible, coil-like thermoplastic polymer and a thermosetting polymer.Also provided is a method for fabricating a molecular composite film or fiber which comprises the steps of forming a biphasic, stir opalescent solution of a rigid-rod aromatic heterocyclic polymer, a thermoplastic polymer, a thermosetting polymer and a solvent which is common to the three polymers, adding solvent to the solution until the solution becomes isotropic and stir opalescence has ceased to determine the critical concentration of polymers in the solvent, adding additional solvent to the solution so that the polymer concentration is below the critical concentration, extruding the solution into a non-solvent for the polymers to form the desired film or fiber, drying the film or fiber and hot drawing the film or fiber at a temperature above the Tg of the thermoplastic, but below the polymerization temperature (Tpoly) of the thermosetting resin.
    Type: Grant
    Filed: December 11, 1990
    Date of Patent: March 10, 1992
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Fred E. Arnold, Thaddeus E. Helminiak, Donald R. Wiff, Loon S. Tan, Wen F. Hwang, Hoe Chuah
  • Patent number: 5093435
    Abstract: This invention is directed to a molded electrical device comprising an electrically conductive pathway and an insulating material, and capable of interconnecting with external circuitry said insulating material comprising a blend of a particular amorphous polymer and a particular crystalline thermoplastic polymer. Also, this invention is directed to a composition suitable for use as an insulating material in an electrical device comprising from about 35 to about 65 weight percent of an amorphous polymer selected from a polyarylethersulfone resin, a polyarylether resin, a polyetherimide or a polyarylate, and from about 65 to about 35 weight percent of a crystalline polymer selected from a poly(arylene sulfide), a polyester or a polyamide.
    Type: Grant
    Filed: October 17, 1989
    Date of Patent: March 3, 1992
    Assignee: Amoco Corporation
    Inventors: James E. Harris, Lloyd M. Robeson, Stephen B. Rimsa
  • Patent number: 5086120
    Abstract: A molecular composite system consisting essentially of a para-oriented benzobisazole polymer and a matrix polymer, poly(2-acrylamido-2-methylpropanesulfonic acid).
    Type: Grant
    Filed: February 8, 1991
    Date of Patent: February 4, 1992
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, Fred E. Arnold
  • Patent number: 5086125
    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin composition of this invention comprises 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide has recurring units of the following formula: ##STR1## wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: February 4, 1992
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5084517
    Abstract: Higher yields of graft copolymer occur when a catalytic amount of base is present during the grafting reaction of a polyamide and a polyglutarimide. The resulting blends of ungrafted polyamide and polyglutarimide with higher graft-copolymer content, the graft copolymer being a polyamide-grafted poly(glutarimide)ionomer, exhibit improved toughness and clarity.
    Type: Grant
    Filed: July 17, 1989
    Date of Patent: January 28, 1992
    Assignee: Rohm and Haas Company
    Inventor: Michael P. Hallden-Abberton
  • Patent number: 5077382
    Abstract: A co-polyimide based upon a mixture of 4,4'-oxydiphthalic dianhydride (ODPA) and 3,4,3',4'-biphenyltetracarboxylic dianhydride (BPDA) as the dianhydride component and either 4,4'-oxydianiline (ODA) or paraphenylene diamine as the amine component is disclosed. The molar ratio between the ODPA and BPDA ranges from 3:1 to 1:3. The co-polyimide may either be formed as a random copolymer, or as a block copolymer where the blocks are based upon blocks of polymer containing ODPA and blocks of polymer containing BPDA provided that the molar ratios of ODPA and BPDA are in the ratio of 3:1 to 1:3.
    Type: Grant
    Filed: October 26, 1989
    Date of Patent: December 31, 1991
    Assignee: Occidental Chemical Corporation
    Inventors: Timothy A. Meterko, Rudolph F. Mundhenke, Willis T. Schwartz
  • Patent number: 5075168
    Abstract: Disclosed herein are a polyamide filament comprising a polyamide resin composition which comprises an aromatic polyamide resin (A) produced by polymerizing a monomer containing not less than 85 wt % of an aromatic polyamide component composed of terephthalic acid, isophthalic acid and aliphatic diamine, and an aliphatic polyamide resin (B), and having a heat-shrinkage in boiling water of not less than 20%, and a process for producing the same.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: December 24, 1991
    Assignee: Mitsubushi Kasei Corporation
    Inventors: Seiichiro Maruyama, Masami Tsunoda
  • Patent number: 5075392
    Abstract: The present invention encompasses non-phase-separated thermoplastic block copolymers containing rigid rod PBZ blocks and thermoplastic PBZ blocks; dopes and compositions containing those block copolymers; a process for making shaped articles from thermoplastic block copolymers containing rigid rod PBZ blocks and thermoplastic PBZ blocks; and shaped articles made by that process.
    Type: Grant
    Filed: March 23, 1989
    Date of Patent: December 24, 1991
    Assignee: The Dow Chemical Company
    Inventors: William J. Harris, Zenon Lysenko, Wen-Fang Hwang