Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.

Abstract: A cross-linkable silicone composition comprising at least the following components: (A) an organopolysiloxane represented by an average unit formula and containing phenyl and alkenyl groups; (B) an organopolysiloxane represented by a general formula and containing phenyl and alkenyl groups; (C) an organopolysiloxane having in one molecule at least one phenyl group and two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst, can be cross-linked by a hydrosilylation reaction and forms a solid body which has high hardness at room temperature and becomes significantly soft or a liquefied at high temperature.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.

Abstract: A two-part curable liquid silicone rubber composition comprises a first liquid composition and a second liquid composition. The first and second liquid compositions are stored separately and yield, upon mixing, a silicone rubber forming composition. The silicone rubber composition comprises: (A) an alkenyl group-containing organopolysiloxane comprising (A-1) an organopolysiloxane having only a silicon-bonded alkenyl group at each molecular terminal and (A-2) an organopolysiloxane having from 1 to 4 silicon-bonded alkenyl groups in side molecular chains and containing not greater than 2.0 wt. % of alkenyl groups; (B) a calcium carbonate powder; (C) a hydrosilylation reaction catalyst; and (D) an organohydrogenpolysiloxane having silicon-bonded hydrogen atoms.

Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,

Abstract: A curable silicone composition comprises (A) (A-1) a dialkylpolysiloxane that has at least two alkenyl groups in each molecule and a viscosity of at least 1,000 mPa·s to not more than 50,000 mPa·s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit wherein R1 is alkyl and R2 is alkenyl and that contains the alkenyl group in the range from at least 0.5 mass % to less than 3.5 mass %; (B) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable composition provides a highly transparent cured silicone material that has a hardness in the range from at least 30 to not more than 80, a parallel light transmittance at 25° C. of at least 90%, and a parallel light transmittance at 200° C. that is at least 99% of the parallel light transmittance at 25° C.

Abstract: Silicone composites subject to reticulation or reticulated, particularly for creating a coating or water-repellent and anti-adhesive film for flexible substrates such as paper or similar in the form of natural or synthetic polymer films. These compounds contain reticulating polyorganosiloxanes that have SiH units and unsaturated polyorganosiloxanes, preferably vinylated, suitable for reacting with the reticulating agent in an addition reaction and in the presence of platinum to form the reticulated anti-adhesive coating on the flexible substrate, plus at least one additive (D) to promote adhesion to it.

Abstract: A curable silicone composition comprises (A) (A-1) an alkenyl-containing dialkylpolysiloxane and a viscosity of at least 1,000 mPa·s to not more than 20,000 mPa·s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit wherein R1 is alkyl and R2 is alkenyl, that contains from 2.5 to 5.0 mass % alkenyl group, and that has a ratio for the total number of moles of R12R2SiO1/2 and R13SiO1/2 units to 1 mole of the SiO4/2 unit in the range from 0.70 to 1.10; (B) an organopolysiloxane that contains at least 0.9 mass % silicon-bonded hydrogen; and (C) a hydrosilylation reaction catalyst. The curable composition provides a bending-tolerant and highly transparent cured silicone material that has a hardness in the range from 80 to 95, and a parallel light transmittance at 200° C. of a value that is at least 99% of the parallel light transmittance at 25° C.

Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.

Abstract: A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogensiloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —R1R2SiO)m—, wherein R1 is a C1-6 alkyl group or the phenyl group, R2 is a C2-10 alkenyl group, and m is a positive number from 5 to 50; (B) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —(R3HSiO)n—, wherein R3 is a C1-6 alkyl group or the phenyl group and n is a positive number from 10 to 100; and (C) a hydrosilylation reaction catalyst, cures to form a cured product that has a small thermal expansion coefficient.

Abstract: The general field of the invention is that of airbags. The invention relates to a process for improving the tear strength and the combing strength of coated fabrics intended for uses in the field of inflatable bags, using a silicone composition comprising an additive consisting of a polyorganosiloxane resin (V) and a calcium carbonate. After coating the composition onto the fabric supports and curing, the coated supports not only have optimum adhesion and crease resistance properties, but also have good properties in terms of combing strength and tear strength.

Abstract: The present invention provides rubber sealing members having an exterior surface adapted to sealingly engage an inner surface of a chamber of a medical device, the exterior surface of the sealing member having a coating thereon prepared from a curable composition including: (a) a first organopolysiloxane having at least two alkenyl groups; and (b) a second organopolysiloxane having at least two pendant hydrogen groups, the second organopolysiloxane being different from the first organopolysiloxane, wherein at least one of the first organopolysiloxane, the second organopolysiloxane or an optional third organopolysiloxane of the curable composition comprises a fluoro group.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I?): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Abstract: A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. (where, in formula, R1 represents a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. R2 represents hydrogen or a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. The molar ratio of the monovalent hydrocarbon group:hydrogen in R2 in the cage octasilsesquioxane as a whole is, as an average value, in the range of 6.5:1.5 to 5.5:2.5).

Abstract: The present invention is a curable organopolysiloxane composition containing (A) a compound shown by the following average composition formula (1), wherein R1 represents an aliphatic unsaturated group, R2 represents a monovalent hydrocarbon group, R3 represents an aliphatic hydrocarbon group, Ar represents an aryl group, and “n” and “m” represent positive numbers which satisfy n?1, m?1, and n+m?10, (B) a hydrogen atom-containing organic silicon compound having at least two silicon atom-bonded hydrogen atoms per one molecule while not having an aliphatic unsaturated group, and (C) a hydrosilylation catalyst which contains a platinum group metal. Thereby, there can be provided a curable organopolysiloxane composition which can give a cured product having high transparency, high refractive index, and excellent thermal shock resistance; an optical device sealing material; and an optical device.

Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processability and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: There are provided a composition for forming a superfine pattern and a method employing the same for forming a superfine pattern. The composition enables to simply produce a superfine pattern with high mass productivity. The composition comprises perhydropolysilazane (I), silicon-containing polymer (II) having a hydrocarbon group, and a solvent. The mixture of those polymers contains silicon-hydrogen bonds and silicon-hydrocarbon group bonds in such amounts that the number of the silicon-hydrocarbon group bonds is in a ratio of 1 to 44% based on the total number of the silicon-hydrogen bonds and the silicon-hydrocarbon group bonds. The composition is applied on a resist pattern to form a spacer formed of the composition on the side wall of the ridges in the pattern, and then the spacer or a resin layer disposed around the spacer is used as a mask to form a superfine pattern.

Abstract: The invention provides a curable silicone resin composition comprising: (A) an organopolysiloxane containing an aromatic group having two or more alkenyl groups, and having a viscosity at 25° C. of 10 to 1,000,000 mPa·s, (B) an organopolysiloxane having a resin structure, comprising 10 to 80 mol % of a SiO4/2 unit, 1 to 80 mol % of a (R1)2SiO2/2 unit, and 1 to 60 mol % of a (R2)3SiO1/2 unit, and containing a SiOH group in a range of 0.1 to 5.0 mol %, (C) an organohydrogenpolysiloxane having two or more SiH group, and among whole substituents bonded to the silicon atom, 20 to 80 mol % is a phenyl group, and a SiO4/2 unit is less than 5 mol %, and (D) a platinum group metal catalyst, and the component (B) is contained in an amount of 20 to 80% by mass based on a sum of the component (A) and the component (B).

Abstract: Provided is a metallosiloxane compound (A) prepared by reacting a bifunctional silane compound (S1), a monofunctional silane compound (S2), a boron compound (M), and optionally H2O in a molar ratio of [the silane compound (S1)]:[the silane compound (S2)]:[the boron compound (M)]:[H2O] of n:m:k:a, where n, m, k, and a satisfy all conditions (i), (ii), and (iii), in which the metallosiloxane compound has at least one Si—H bond or C2-10 alkenyl group per molecule, and the conditions (i), (ii), and (iii) are expressed as follows: (i) n>0, m>0, k>0, a?0; (ii) m/n?0.5; and (iii) (n+m)/k?1.8.

Abstract: A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two silanol groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without having an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation retarder.

Abstract: A silicone emulsion composition is provided comprising organopolysiloxane, organohydrogenpolysiloxane, surfactant, and water. Two organopolysiloxanes of different type are blended, whereby a cured silicone coating is improved to be fully adherent to plastic film and lightly peelable from pressure-sensitive adhesive. By limiting the SiH content of organohydrogenpolysiloxane, the composition is improved in shelf stability. A specific surfactant is used to control the size of emulsion particles so as to improve wettability to plastic film.

Abstract: A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain.

Abstract: An addition curable self-adhesive silicone rubber composition is provided. This silicone rubber composition comprises (A) 100 parts by weight of an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms per molecule, (B) 0.05 to 10 parts by weight of an organosilicon compound containing 1 to 100 silicon atoms which has at least 1 phenylene skeleton per molecule, and which has at least 1 hydrogen atom bonded to a silicon atom, (C) 0 to 30 parts by weight of an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms per molecule, and containing no phenylene skeleton in the molecule, (D) 0.001 to 0.1 part by weight of a triazole compound, and (E) a catalytic amount of a platinum catalyst. This silicone rubber composition is capable of forming a cured article having good adhesion to various organic resins.

Abstract: The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more.

Abstract: Disclosed is an addition reaction-curable organopolysilmethylenesiloxane copolymer composition including: (A) an organopolysilmethylenesiloxane copolymer represented by formula (a) shown below: which has in one molecule at least two alkenyl groups bonding to silicon atoms; (B) an organopolysiloxane represented by formula (b) shown below: R2aSiO(4-a)/2??(b) which has in one molecule at least two alkenyl groups bonding to silicon atoms; (C) an organohydrogenpolysilmethylenesiloxane and/or organohydrogenpolysiloxane; and (D) a platinum group metal-based catalyst. The copolymer composition excels in heat resistance, electrical insulation, mechanical strength, and optical properties, and exhibits good water resistance, hydrolysis resistance and gas barrier properties under severe use conditions without suffering gas permeability and poor chemical resistance inherent in silicone rubber.

Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.

Abstract: A solventless addition-curable pressure sensitive silicone adhesive composition is provided. The composition comprises (A) an alkenyl group-containing polydiorganosiloxane; (B) a condensation product of (a) a polydiorganosiloxane having hydroxyl group or an alkoxy group on opposite ends of the molecular chain and (b) a polyorganosiloxane containing R13SiO1/2 unit and SiO2 unit as critical components and also a HOSiO3/2 unit in the molecule; (C1) a polyorganohydrosiloxane having at least three SiH groups per molecule; (C2) a polydiorganohydrosiloxane having SiH group on opposite ends; and (D) a platinum group metal catalyst. Use of the present composition enables production of a pressure sensitive adhesive agent having flexibility, pressure sensitive adhesiveness, and heat resistance, and the present composition is particularly effective for use as a buffer member having pressure sensitive adhesiveness.

Abstract: Composite materials contain a silicone addition crosslinkable silicone elastomer composition comprising an organopolysiloxane having aliphatic unsaturation, an Si—H functional cyclic organopolysiloxane, a hydrosilylation catalyst, together with specific adhesion promoters, applied to a substrate material.

Abstract: A curable organopolysiloxane composition comprises the following: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups and having an average unit formula (I): (R12SiO2/2)a(R23SiO1/2)b(R3SiO3/2)c(SiO4/2)d(CH2CH2)e; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1 to R7 and a to j are as defined in the specification.

Abstract: A process for forming a new group of siloxane-based compositions by a one-step co-hydrolysis and the compositions formed thereof. The siloxane-based compositions being functionalized with a carbon-carbon double (C?C) bond and a silicon-hydrogen (Si—H) bond. The C?C bond and hydrogen (H) each being attached directly to a silicon (Si) atom of the silicon-oxygen (Si—O) backbone of the siloxane-based composition. The C?C bond may be from a vinyl or an aromatic radical like a phenyl substituent. The C?C bond substituent provides the functionality needed for forming crosslinkages through standard dehydrocoupling catalysts without the need for siloxane fluids or organic compounds containing alkyl or aryl functional groups. The process provides for varying proportions of silanes as starting monomers to tailor the desired silicon, carbon, hydrogen and oxygen ratios in the siloxane-based compositions or resins.

Abstract: The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.

Abstract: A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.

Abstract: An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.

Abstract: A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain.

Abstract: A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.

Abstract: A curable silicone composition comprising: an alkenyl-containing organopolysiloxane (A) that contains: a dialkylpolysiloxane (A-1) having on average at least 2 alkenyl groups in one molecule having a 25° C. viscosity in the range of 5,000 to 35,000 mPa·s, and a alkenyl-containing organopolysiloxane resin (A-2) consisting of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units (where R1 designates alkyl groups with 1 to 10 carbon atoms, and R2 designates alkenyl groups) with the content of alkenyl groups ranging from 3.5 to 5.0 mass %, and with the ratio of the sum of the mole numbers of the R12R2SiO1/2 units and R13SiO1/2 units to 1 mole of the SiO4/2 units in the range from 0.5 to 1.4; an organopolysiloxane (B), wherein silicon-bonded hydrogen atoms are in an amount of at least 0.7 mass %; and a hydrosilylation catalyst (C). The composition is capable of forming a flex-resistant highly transparent cured silicone product with non-tacky surface.

Abstract: A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0<x<0.1; 0<y<1; 0=z<0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.