Abstract: Provided is a silicon-containing curable composition which includes a prepolymer (A) containing two or more Si—H groups in one molecule, which is obtained by subjecting one or more kinds of a cyclic siloxane compound (?) represented the following formula (1) and one or more kinds of a compound (?) represented by the following formula (2), to a hydrosilylation reaction; a cyclic siloxane compound (B) containing, in one molecule, two or more carbon-carbon double bonds that are reactive with Si—H groups; a polysiloxane compound (C) which is different from the prepolymer (A) and the cyclic siloxane compound (B); and a hydrosilylation catalyst (D). In formula (1), R1 to R3 each represent an alkyl group having 1 to 6 carbon atoms, or a phenyl group; a represents a number from 2 to 10; and b represents a number from 0 to 8. In formula (2), n represents the number 1 or 2.

Abstract: A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed.

Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.

Abstract: Disclosed is a millable type silicone rubber composition including as an essential components: (A) 100 parts by weight of an organopolysiloxane represented by the following average compositional formula (I) and having a polymerization degree of at least 100; R1aSiO(4-a)/2??(I) wherein R1 are, identical or different, unsubstituted or substituted monovalent hydrocarbon groups, and a is a positive number of 1.95 to 2.05; (B) 70 to 150 parts by weight of fumed silica having a specific surface area of more than 200 m2/g; (C) 0.1 to 30 parts by weight of an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule; and (D) 0.1 to 10 parts by weight of a hydrosilylation reaction catalyst.

Abstract: The present invention provides a curable polysiloxane composition which is excellent in light resistance (particularly ultraviolet resistance) and adhesion and has a sufficient heat resistance/hydrothermal resistance and film-forming property and which generates little foaming at curing and does not generate cracks, peeling, coloring, and foaming even when used for a long period of time. A curable polysiloxane composition which comprises a specific hydrosilyl group-containing polysiloxane compound, a specific polysiloxane compound comprising two or more silanol groups in one molecule, and a dehydrogenative condensation reaction catalyst.

Abstract: Silicone-based pressure-sensitive adhesive composition comprising 100 parts (A) a branched organopolysiloxane having on molecular terminals at least two alkenyl groups and represented by (R3SiO1/2)4-p(R1R2SiO1/2)p(R2SiO)m(RR1SiO)n(SiO4/2), to 400 parts (B) an organopolysiloxane composed of R3R22SiO1/2 units and SiO4/2 units, (C) an organohydrogenpolysiloxane, and a catalytic quantity of (D) a platinum-type catalyst. Pressure-sensitive adhesive tape or sheet having an adhesive layer in the form of a cured layer of the aforementioned composition.

Abstract: A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.

Abstract: The present invention provides rubber sealing members having an exterior surface adapted to sealingly engage an inner surface of a chamber of the medical device, the exterior surface of the sealing member having a coating thereon prepared from a curable composition including: (a) a first organopolysiloxane having at least two alkenyl groups; and (b) a second organopolysiloxane having at least two pendant hydrogen groups, the second organopolysiloxane being different from the first organopolysiloxane, wherein at least one of the first organopolysiloxane, the second organopolysiloxane or an optional third organopolysiloxane of the curable composition comprises a fluoro group.

Abstract: The object of the present invention is to provide a silicone resin composition for encapsulating an optical semiconductor element which has strong adhesiveness to a substrate and provide an optical semiconductor element which has high reliability. The present invention provides a silicone resin composition comprising an organopolysiloxane (A) having at least two alkenyl groups per molecule, a liner organohydrogenpolysiloxane (B-1) which has hydrogen atoms each bonded to a silicon atom at the both terminals and a liner organohydrogenpolysiloxane (B-2) which has a hydrogen atom bonded to a silicon atom at one terminal and a hydroxyl or alkoxy group bonded to a silicon atom at the other terminal, a branched organohydrogenpolysiloxane (C) having at least three hydrosilyl groups per molecule, a catalytic (D), and a condensation catalyst (E). The present invention also provides an optical semiconductor device provided with a cured product thereof.

Abstract: Provided are poly(ferrocenyl)silane based network polymers, methods of preparing the same, and films including the poly(ferrocenyl)silane based network polymers. The network polymers have a steric network structure and are prepared by using a simplified process.

Abstract: The field of the invention is that of articles adhesive to the skin for medical or paramedical use. The invention relates to an article adhesive to the skin.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: In general, the present invention relates to optical elements, which can be modified post-manufacture such that different versions of the element will have different optical properties. In particular, the present invention relates to lenses, such as intraocular lenses, which can be converted into aspheric lenses post-fabrication. Also, the present invention relates to a method for forming aspheric lenses post-fabrication.

Abstract: An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: (R1SiO3/2)a(R22SiO)b(R3R42SiO1/2)c??(1) wherein R1 represents an alkyl group, R2 represents an aryl group, R3 represents an alkenyl group, and R4 represents an alkyl group or an aryl group, (B) an organohydrogenpolysiloxane represented by an average composition formula (2) and containing at least two silicon atom-bonded hydrogen atoms per molecule: R1dR2eHfSiO(4-d-e-f)/2??(2) wherein R1 and R2 are as defined above, and (C) an addition reaction catalyst.

Abstract: This organic electroluminescent element sealing composition contains an addition reaction curing type silicone composition which is liquid at normal temperature and has a curing temperature of 100 degrees C. or below and a moisture content of 400 ppm or less. The addition reaction curing type silicone composition contains (A) polyorganosiloxane having an average of 0.2 to 5 alkenyl groups bonded to silicon atoms in one molecule, (B) polyorganohydrogensiloxane having at least two or more hydrogen atoms bonded to silicon atoms in one molecule, and (C) a platinum-based catalyst. The organic electroluminescent element sealing composition can prevent deterioration of the organic electroluminescent element and can provide the organic light-emitting device having a good light-emitting property for a long period.

Abstract: Polyarylene sulfide compositions are described as are methods of forming the polyarylene sulfide compositions. The polyarylene sulfide compositions are formed by melt processing polyarylene sulfide, a silane coupling agent and a silicone elastomer. The silane coupling agent is, e.g., an amino silane coupling agent and the silicone elastomer can be a poly(dimethyl siloxane). The compositions exhibit good strength and heat resistance characteristics and can be utilized in forming a variety of products such as pipes and houses, automotive components and electrical components.

Abstract: The present invention provides silicone polymer particles having excellent tensile properties and excellent transparency and also provides a silicone composition. The present invention relates to silicone polymer particles having a silicone core-alkoxysilane condensate shell structure in which silicone particles with a volume-average particle diameter of 0.001 ?m to 1.0 ?m are coated with an alkoxysilane condensate, and also relates to a silicone composition containing (A) the silicone polymer particles, (B) a polyorganosiloxane having at least one alkenyl group in its molecule, and (C) a curing agent. The present invention further relates to respective manufacturing methods of the silicone polymer particles and the silicone composition.

Abstract: Gels having viscoelastic qualities, physical stability and adhesive properties, well suited for a wide variety of end applications, are prepared by crosslinking, by hydrosilylation, silicone compositions which contain: a polyorganosiloxanes POS (I) of SiH type; a polyorganosiloxanes POS (II) of SiVi type (Vi=vinyl); a polyorganosiloxanes POS (III) of monofunctional SiVi type; a platinum-based catalyst (D); and optionally, a polyorganosiloxanes POS (IV) of polydimethylsiloxane type.

Abstract: Provided are a silicone adhesive composition for a window film, and a window film using same, wherein the composition has excellent release properties for easy release from a window, and also has excellent compatibility with a UV absorbent. The silicone adhesive composition for a window film, according to the present invention, is characterized by comprising: a) 100 parts by weight of a combination of a silicone adhesive and a silicone release agent; b) 1 to 10 parts by weight of a crosslinking agent; c) 0.1 to 2 parts by weight of a platinum based catalyst; and d) 0.1 to 5 parts by weight of an anchoring agent, wherein the weight ratio of the silicone adhesive to the silicone release agent is in the range of 1:1 to 1:0.2.

Abstract: An encapsulated material composition is presented, which contains a compound of Chemical Formula I and a compound of Chemical Formula II, and has high refractive index due to the cycloalkane structure in the compound of Chemical Formula I and the compound of Chemical Formula II. Therefore, when the encapsulated material composition is applied in the light emitting diode (LCD) encapsulated structure, the light extraction efficiency of the LED encapsulated structure is effectively enhanced.

Abstract: A silicon composition with a silicon compound represented by Formula 1 and a silicon compound represented by Formula 2: wherein, R1, R2, R3, R4, R11, R12, R13, R14, R15, R16, R17, R18, and R19 are each independently a C1-C4 alkyl group, R5, R6, R7, R8, R9, and R10 are each independently hydrogen or deuterium, k, m, and n are positive integers, and the ratio of k to the sum of m and n is from about 1:0.001 to about 1:0.2; and an organic light emitting device including the same.

Abstract: The invention relates to curable compositions comprising a) at least one organic polymer selected from polyethers and polyacrylic acid esters, wherein the organic polymer has at least one defined, cross-linkable end group having at least one C1-C8-alkoxy- or C1-C8-acyloxy radical, b) at least one poly(dialkylsiloxane) having at least one defined, cross-linkable end group having at least one vinyl radical and likewise at least one C1-C8-alkoxy- or C1-C8-acyloxy radical and c) at least one flame-retarding additive selected from red phosphorus, organic phosphor compounds, ammonia polyphosphate, metal hydroxides, expandable graphite, zinc borate and melamine salts, to the use of such compositions as adhesive, sealing or coating material, in particular for providing a substrate having a flame-retardant, elastic coating, to a coating thus obtained and to the use of at least one poly(dialkylsiloxane) b) to improve the fire properties of a curable composition comprising at least one organic polymer a).

Abstract: Silicone fibers suitable for use as optical fibers are prepared by crosslinking an extruded mixture of a silicone resin and an organopolysiloxane, both containing aliphatically unsaturated groups, an organopolysiloxane bearing Si—H groups, and a light activatable trimethyl(methylcyclopentadienyl) platinum catalyst.

Abstract: Sulfur contaminants, such as elemental sulfur (S8), hydrogen sulfide and other sulfur components in fluids (e.g., air, natural gas, and other gases, as well as water and other liquids) are removed using a silicone-based chemical filter/bath. In one embodiment, a silicone-based chemical filter includes a membrane having a cross-linked silicone that is a reaction product of an olefin and a polyhydrosiloxane. For example, sulfur contaminants in air may be removed by passing the air through the membrane before the air enters a data center or other facility housing computer systems. In another embodiment, a silicone-based chemical bath includes a housing having an inlet port, an outlet port, and a chamber containing a silicone oil. For example, sulfur contaminants in air may be removed by passing the air through the silicone oil in the chamber before the air enters a data center or other facility housing computer systems.

Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.

Abstract: Aqueous suspensions of silicate shell microcapsules are disclosed wherein a first portion of the silicate shell micro-capsules contain an organopolysiloxane having at least two alkenyl groups and a hydrosilylation catalyst as Part A of a curable siloxane composition, and a second portion of the silicate shell microcapsules contain an organohydrogensiloxane as Part B of the curable siloxane composition.

Abstract: The invention relates to a water-insoluble hydrophilic polymer network comprising polyorganosiloxane polyoxyalkylene block copolymer moieties characterized that they are linked to each other through an organosilicon cross-linking moiety, provided that the cross-linking moiety forming the links between polyorganosiloxane polyoxyalkylene block copolymer moieties result from an addition reaction between cross-linking sites present on the polyorganosiloxane polyoxyalkylene block copolymer moieties prior to formation of the hydrophilic polymer network, selected from silicon-bonded hydrogen atoms and aliphatically unsaturated groups, and reactive groups present on the cross-linking moiety prior to formation of the hydrophilic polymer network. Also disclosed is a process for making the polymer network, and a curable composition able to be reacted into such polymer network.

Abstract: A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst.

Abstract: Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.

Abstract: A borosiloxane composition comprising a borosiloxane having an average of at least two alkenyl groups per molecule, an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, and a hydrosilylation catalyst; a borosiloxane adhesive comprising a cured product of at least one borosiloxane; and a coated substrate and a laminated substrate, each comprising the borosiloxane adhesive.

Abstract: The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.

Abstract: A curable composition contains (A) a polyorganosiloxane base polymer having an average per molecule of at least two aliphatically unsaturated organic groups, optionally (B) a crosslinker having an average per molecule of at least two silicon bonded hydrogen atoms, (C) a catalyst, (D) a thermally conductive filler, and (E) an organic plasticizer. The composition can cure to form a thermally conductive silicone gel or rubber. The thermally conductive silicone rubber is useful as a thermal interface material, in both TIM1 and TIM2 applications. The curable composition may be wet dispensed and then cured in situ in an (opto)electronic device, or the curable composition may be cured to form a pad with or without a support before installation in an (opto)electronic device.

Abstract: The general field of the invention is that of airbags. The invention relates to a process for improving the tear strength and the combing strength of coated fabrics intended for uses in the field of inflatable bags using a silicone composition comprising an additive containing a polyorganosiloxane resin (V) and a calcium carbonate. After coating the composition onto the fabric supports and curing, the coated supports not only have optimum adhesion and crease resistance properties, but also have good properties in terms of combing strength and tear strength.

Abstract: The present invention relates to mold release agents. More particularly, it relates to a two-component, high gloss, semi permanent water-based mold release agent.

Abstract: [Object] To provide a silicone resin composition for optical semiconductor devices, which has a low gas permeability and high dependability. [Means for solution] The silicone resin composition of the present invention contains the following components (A) through (D): (A) an organopolysiloxane as shown in the following general formula (1) in which the number of alkenyl groups contained per one molecule is two or more (R1SiO3/2)x(R23SiO1/2)y(R22SiO2/2)z??(1) (wherein R1 is a cycloalkyl group, R2 is either one kind of or more than one kind of substituted or non-substituted monovalent hydrocarbon group having 1-10 carbon atoms, x is 0.5-0.9, y is 0.1-0.5, z is 0-0.2, and x+y+z=1.0), (B) a hydrogen organopolysiloxane containing at least two SiH groups per one molecule, (C) a catalyst for addition reaction, (D) an adhesion promoter agent.

Abstract: A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. (where, in formula, R1 represents a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. R2 represents hydrogen or a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. The molar ratio of the monovalent hydrocarbon group:hydrogen in R2 in the cage octasilsesquioxane as a whole is, as an average value, in the range of 6.5:1.5 to 5.5:2.5.

Abstract: To provide a glass substrate with protective glass which suppresses formation of microscopic scratches on the back surface of the glass substrate in the production process for a display device, and which prevents a strength decrease in the process or formation of etch pits after a chemical etching treatment; a process for producing a display device by using the glass substrate with protective glass; and a double-sided removable resin sheet for the glass substrate with protective glass. A glass substrate with protective glass, which comprises a glass substrate and a protective glass plate laminated on each other, and which is characterized in that the glass substrate and the protective glass plate are laminated by a double-sided removal resin sheet.

Abstract: To provide a silicone impression material having high viscosity of a kneaded material before curing and low hardness after curing. A dental silicone impression material composition includes: A) an organopolysiloxane mixture comprising a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbons in one molecule and having viscosity of 1,000,000 mPa·s or more at 25° C., and b) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon in one molecule and having viscosity of 100 to 5,000 mPa·s at 25° C., wherein a ratio of a):b) is 1:0.5 to 10; B) an organohydrogenpolysiloxane having at least three hydrogen atoms directly bonded to a silicon atom in one molecule; C) a silicone-soluble platinum compound; D) an organopolysiloxane not having a functional group; and E) an inorganic filler.

Abstract: An organo-modified silicone obtained by an addition reaction of (I) a chain silicone represented by formula (1): wherein the formula (1), R1s represent hydrocarbon groups having 1 to 3 carbon atoms, and a and b are numbers satisfying conditions represented by the following formulae (i) to (iii): 0?a?195??(i) 5?b??(ii) 10?a+b?200??(iii), with (II) a hydrocarbon such as monoolefins and aromatic hydrocarbons, and (III) a di(meth)acrylic acid ester, at a molar ratio satisfying conditions represented by the following formula (iv): {the chain silicone}:{the hydrocarbon}:{the di(meth)acrylic acid ester}=A:B:C??(iv) wherein the formula (iv), A represents a number of moles of the chain silicone, and B and C are numbers satisfying conditions represented by the following formulae (v) and (vi): 0.05A?C?A??(v) A×b?2C=B??(vi) in the presence of a hydrosilylation catalyst.

Abstract: A heat-curable polyorganosiloxane composition which includes (A) an alkenyl group-containing linear polyorganosiloxane represented by the following formula (I): wherein Ra represents a C2-C6 alkenyl and Rb represents a C1-C6 alkyl or a phenyl; (B1) a linear polyorganohydrogensiloxane represented by the following formula (II): wherein Rc is hydrogen and Rd represents a C1-C6 alkyl or a phenyl; (B2) a cyclic polyorganohydrogensiloxane including an Re2HSiO1/2 unit, wherein Re represents a hydrogen atom or C1-C6 alkyl group, and an SiO4/2 unit, and having three or more hydrogen atoms bonded to a silicon atom in one molecule; (C) a platinum series catalyst; and (D) an adhesion promoter, a ratio of a sum (HB1+HB2) of a number HB1 of the hydrogen atom(s) bonded to a silicon atom of (B1) and a number HB2 of the hydrogen atom(s) bonded to a silicon atom of (B2) based on a number ViA of the alkenyl group(s) of (A) is 0.2 to 1.0, and HB1 is 0.5 to 0.8 based on HB1+HB2.

Abstract: A curable polyorganosiloxane composition for use in an LED or optical lens, including: (A) an alkenyl group-containing polyorganosiloxane which contains a (A1) branched polyorganosiloxane including an SiO4/2 unit and an R3SiO1/2 unit, and optionally an R2SiO unit and/or an RSiO3/2 unit, wherein at least three R per molecule are vinyl groups, and optionally (A2) a linear polyorganosiloxane having R bonded to a silicon atom, wherein at least two R per molecule are vinyl groups, wherein 100 mol % or more of the R present in components (A1) and (A2), excluding alkenyl groups, are methyl groups; (B) a polyalkylhydrogensiloxane including an SiO4/2 unit and an R3(CH3)2SiO1/2 unit, the polyalkylhydrogensiloxane having the formula [R3(CH3)2SiO1/2]8[SiO4/2]4 or [R3(CH3)2SiO1/2]10[SiO4/2]5, wherein each R3 represents a hydrogen atom, and (C) a platinum-vinylsiloxane complex. The composition having desirable light transmission properties, and is unlikely to suffer yellowing due to exposure to heat.

Abstract: A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO2 unit, (B) a mixture of a linear organohydrogenpolysiloxane containing two or more SiH groups and a branched organohydrogenpolysiloxane that is liquid at 25° C., (C) a platinum group metal catalyst, and (D) a linear or cyclic organopolysiloxane having at least two functional groups selected from the group consisting of alkenyl groups, alkoxysilyl groups and epoxy groups bonded to silicon atoms. A cured product of the composition exhibits dramatically reduced surface tack, and therefore using the composition for encapsulating optical semiconductor elements improves the optical semiconductor device yield.

Abstract: An addition curable self-adhesive silicone rubber composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) an organohydrogenpolysiloxane containing at least three SiH groups, (C) an aromatic ring-free organohydrogenpolysiloxane containing at least two SiH groups, and (F) an addition reaction catalyst, with a SiH/alkenyl molar ratio ranging from 0.8 to 5.0, is briefly moldable and cures to various metals and organic resins.

Abstract: An organopolysiloxane is prepared by hydrolysis and polycondensation of an organosilicon compound in the presence of a liquid hydrolytic condensation catalyst which is separable. The organopolysiloxane contains a high proportion of cyclic polysiloxanes and has a sharp molecular weight distribution due to minimized monomer and polymer contents.

Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:

Abstract: The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.

Abstract: The invention relates to curable compositions comprising a) at least one organic polymer selected from polyethers and polyacrylic acid esters, wherein the organic polymer has at least one defined, cross-linkable end group having at least one C1-C8-alkoxy- or C1-C8-acyloxy radical, b) at least one poly(dialkylsiloxane) having at least one defined, cross-linkable end group having at least one vinyl radical and likewise at least one C1-C8-alkoxy- or C1-C8-acyloxy radical and c) at least one flame-retarding additive selected from red phosphorus, organic phosphor compounds, ammonia polyphosphate, metal hydroxides, expandable graphite, zinc borate and melamine salts, to the use of such compositions as adhesive, sealing or coating material, in particular for providing a substrate having a flame-retardant, elastic coating, to a coating thus obtained and to the use of at least one poly(dialkylsiloxane) b) to improve the fire properties of a curable composition comprising at least one organic polymer a).

Abstract: A coating composition and process for generating transparent, near-transparent, and semi-transparent super-hydrophobic coatings on surfaces having a contact angle of greater than 165 degrees. The composition comprises hydrophobic nanoparticles of silsesquioxanes containing adhesion promoter groups and low surface energy groups.

Abstract: A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain.

Abstract: A multi part hydrosilylation curable silicone elastomer composition comprising (i) an organopolysiloxane comprising at least two unsaturated groups and having a viscosity of at least 1,000 mPas at 25° C.; (ii) inorganic filler having a hydrophilic surface; (iii) a filler treating agent comprising an organopolysiloxane comprising at least 2 hydroxy or otherwise hydrolysable groups, or a mixture thereof and having an average degree of polymerization of from 2 to 50; (iv) an organohydrogensiloxane having an average of greater than two silicon bonded hydrogen atoms per molecule having a viscosity of up to about 10 PaS at 25° C.; (v) a hydrosilylation catalyst; and/or a treated filler obtained by the reaction of (ii) and (iii) above characterized in that the filler treating agent (iii) and/or treated filler is packaged separately from organohydrogensiloxane (iv) prior to curing.