Abstract: A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.

Abstract: An organopolysiloxane containing both an amino functional organic group and a mercapto functional organic group is disclosed. A method of making such amino-mercapto functional organopolysiloxanes is by reacting (A) a silanol-functional polysiloxane, (B) an amino functional alkoxy silane, and (C) a mercapto functional alkoxy silane, via a condensation reaction. The amino-mercapto functional organopolysiloxanes products are useful in textile and fabric treatments.

Abstract: A method for the preparation of hydrophilic elastomers involves the synthesis of polydimethylsiloxane with tunable hydrophilic surface properties. An elastomeric monolith with desired hydrophilic properties is produced by combining a polyethylene oxide polymeric surfactant additive with a PDMS base and curing agent during polymerization. The surfactant chain segment lengths are varied to control the hydrophobic/hydrophilic balance.

Abstract: A process for making a foam control composition comprising a cross-linked polyorganosiloxane in which is dispersed a filler, with hydrophobic surface, comprising step (A) mixing (i) a finely divided filler, (ii) a polyorganosiloxane having on at least two reactive substituents, for example on average two reactive substituents, and (iii) a polyorganosiloxane having at least three reactive substituents, capable of addition reaction via hydrosilylation; (B) hydrosilylation reaction of components (ii) and (iii) until the mixture at least partially gels, followed by applying shearing forces to this at least partially gelled mixture. Optionally step (A) comprises a diluent or solvent and after step (B) an emulsification step is carried out to make the foam control composition into an O/W emulsion.

Abstract: The object of the present invention is to provide a silicone resin composition for encapsulating an optical semiconductor element which has strong adhesiveness to a substrate and provide an optical semiconductor element which has high reliability. The present invention provides a silicone resin composition comprising an organopolysiloxane (A) having at least two alkenyl groups per molecule, a liner organohydrogenpolysiloxane (B-1) which has hydrogen atoms each bonded to a silicon atom at the both terminals and a liner organohydrogenpolysiloxane (B-2) which has a hydrogen atom bonded to a silicon atom at one terminal and a hydroxyl or alkoxy group bonded to a silicon atom at the other terminal, a branched organohydrogenpolysiloxane (C) having at least three hydrosilyl groups per molecule, a catalytic (D), and a condensation catalyst (E). The present invention also provides an optical semiconductor device provided with a cured product thereof.

Abstract: A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.

Abstract: A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole 1% is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.

Abstract: A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogen-siloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.

Abstract: An addition curable self-adhesive silicone rubber composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) an organohydrogenpolysiloxane containing at least three SiH groups, (C) an aromatic ring-free organohydrogenpolysiloxane containing at least two SiH groups, and (F) an addition reaction catalyst, with a SiH/alkenyl molar ratio ranging from 0.8 to 5.0, is briefly moldable and cures to various metals and organic resins.

Abstract: Inorganic/organic hybrid polymers containing silsesquioxane cages are robust and exhibit desirable physical properties such as strength, hardness, and optical transparency at infrared and ultraviolet wavelengths. The polymers are prepared by polymerizing functionalized polyhedral silsesquioxane monomers such as polyhedral silsesquioxanes bearing two complementarily reactive functional groups bonded to cage silicon atoms by means of spacer moieties. The spacer moieties allow for steric mobility and more complete cure than polyhedral silsesquioxanes bearing reactive functional groups bound directly to cage silicon atoms.

Abstract: Hydrophobic silica particles are produced by reacting them with a hydrosiloxane agent.

Abstract: Mixtures of silicone resin with an organopolysiloxane copolymer prepared by hydrosilylating a substantially linear polymer containing an isocyanate reactive group with an Si—H containing organopolysiloxane, and reacting this intermediate with a diisocyanate, are useful as long lasting defoamers which are compatible with numerous media.

Abstract: A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra-Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.

Abstract: A thermoconductive silicone elastomer comprising a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition, a reinforcing fine powder silica, a thermoconductive inorganic powder, and a non-reactive organopolysiloxane that is liquid at room temperature which are dispersed in the aforementioned silicone elastomer; a thermoconductive medium comprising the aforementioned thermoconductive silicone elastomer; a hydrosilation-curable thermoconductive silicone elastomer composition comprising a hydrosilation-curable organopolysiloxane composition, a reinforcing fine powder silica, a thermoconductive inorganic powder, and a non-reactive organopolysiloxane that is liquid at room temperature.

Abstract: Methods are disclosed of making linear and cross-linked, HMW (high molecular weight) polysilanes and polygermanes, polyperhydrosilanes and polyperhydrogermanes, functional liquids containing the same, and methods of using the liquids in a range of desirable applications. The silane and germane polymers are generally composed of chains of Si and/or Ge substituted with R? substituents, where each instance of R? is, for example, independently hydrogen, halogen, alkenyl, alkynyl, hydrocarbyl, aromatic hydrocarbyl, heterocyclic aromatic hydrocarbyl, SiR?3, GeR?3, PR?2, OR?, NR?2, or SR?; where each instance of R? is independently hydrogen or hydrocarbyl. The cross-linked polymers can be synthesized by dehalogenative coupling or dehydrocoupling. The linear polymers can be synthesized by ring-opening polymerization. The polymers can be further modified by halogenation and/or reaction with the source of hydride to furnish perhydrosilane and perhydrogermane polymers, which are used in liquid ink formulations.

Abstract: A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.

Abstract: The invention relates to curable silicone compositions which contain silane based crosslinkers and a mixture of different organopolysiloxanes. The compositions are particularly suitable as curable impression materials in dental applications.

Abstract: The present invention relates to coating and printing ink compositions possessing silicone surfactants compositions comprising fluorine-free organomodified trisiloxanes which are resistant to hydrolysis between a pH of about 3 to a pH of about 12. The coatings and printing ink composition of the present invention exhibit enhanced wetting, flow and leveling properties.

Abstract: A free-standing film comprising a cured organopolysiloxane resin obtained by conducting a cross-linking reaction between (A) an organopolysiloxane resin represented by the following average siloxane unit formula: [R1aR23-aSiO1/2]v[R3SiO3/2]w (1) or [R1aR23-aSiO1/2]x[R3SiO3/2]y[SiO4/2]z (2) (where R1 designates univalent hydrocarbon groups of one or more than one type selected from alkyl groups having 1 to 4 carbon atoms and univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; R2 designate alkenyl groups having 2 to 6 carbon atoms; R3 designates alkyl groups with 1 to 4 carbon atoms or univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; at least 50 mole % of R3 groups being phenyl groups; “a” is 0, 1, or 2; 0.8?w<1.0 and v+w=1; 0<x<0.4, 0.5<y<1, 0<z<0.

Abstract: A thermoconductive silicone elastomer comprising a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A hydrosilation-curable thermoconductive silicone elastomer composition comprising: a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A thermoconductive medium comprising the aforementioned thermoconductive silicone elastomer.

Abstract: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

Abstract: The present invention provides rubber sealing members having an exterior surface adapted to sealingly engage an inner surface of a chamber of the medical device, the exterior surface of the sealing member having a coating thereon prepared from a curable composition including: (a) a first organopolysiloxane having at least two alkenyl groups; and (b) a second organopolysiloxane having at least two pendant hydrogen groups, the second organopolysiloxane being different from the first organopolysiloxane, wherein at least one of the first organopolysiloxane, the second organopolysiloxane or an optional third organopolysiloxane of the curable composition comprises a fluoro group.

Abstract: An aqueous polyorganosiloxane (POS) emulsion which can easily be deposited on/applied to a fibrous substrate at high speed and at limited deposition rates, for example less than 40 g/m2. The emulsion contains (A) a POS with ?Si-vinyl units, (B) a POS with ?SiH units, (C) an adhesion promoter, (D) a catalyst, (E) at least one surfactant, (F) optionally a POS resin with ?Si-vinyl units, (G) optionally a crosslinking inhibitor, (H) optionally a pH fixing agent, (I) optionally a formulating additive, (J) optionally a filler, and (K) water. Adhesion promoter (C) is selected from protective hydrocolloids, hydroxylated silanes and/or POS carrying at least one hydroxyl group and at least one salified amino group per molecule, and mixtures thereof, and is present in the range from 0.005 to 10% by weight, based on the silicone phase. Also disclosed is the corresponding coating process and the coated substrate.

Abstract: Silicone-based pressure-sensitive adhesive composition comprising 100 parts (A) a branched organopolysiloxane having on molecular terminals at least two alkenyl groups and represented by (R3SiO1/2)4-p(R1R2SiO1/2)p(R2,SiO)m(RR1SiO)n(SiO4/2), to 400 parts (B) an organopolysiloxane composed of R3R2SiO1/2 units and SiO4/2 units, (C) an organohydrogenpolysiloxane, and a catalytic quantity of (D) a platinum-type catalyst. Pressure-sensitive adhesive tape or sheet having an adhesive layer in the form of a cured layer of the aforementioned composition.

Abstract: Polyorganosiloxane compositions crosslinkable by polyaddition reactions are provided. Methods for reducing yellowing of a silicone elastomer composition crosslinked by hydrosilylation including adding a polyorganosiloxane resin (D), comprising at least one Si-alkenyl unit, preferably Si-vinyl, to the silicone elastomer composition prior to crosslinking are also provided.

Abstract: A curable silicone composition comprising: an alkenyl-containing organopolysiloxane (A) that contains: a dialkylpolysiloxane (A-1) having on average at least 2 alkenyl groups in one molecule having a 25° C. viscosity in the range of 5,000 to 35,000 mPa·s, and a alkenyl-containing organopolysiloxane resin (A-2) consisting of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units (where R1 designates alkyl groups with 1 to 10 carbon atoms, and R2 designates alkenyl groups) with the content of alkenyl groups ranging from 3.5 to 5.0 mass %, and with the ratio of the sum of the mole numbers of the R12R2SiO1/2 units and R13SiO1/2 units to 1 mole of the SiO4/2 units in the range from 0.5 to 1.4; an organopolysiloxane (B), wherein silicon-bonded hydrogen atoms are in an amount of at least 0.7 mass %; and a hydrosilylation catalyst (C). The composition is capable of forming a flex-resistant highly transparent cured silicone product with non-tacky surface.

Abstract: A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent.

Abstract: An emulsion composition for building exterior walls is provided comprising in admixture, [A] a graft copolymerized emulsion obtained by adding to (1) an oil-in-water type emulsion containing at least one organopolysiloxane having an organic group containing a radical reactive group or SH group, (2) a monomer or monomeric mixture containing at least 70 wt % of at least one monomer selected from acrylic and methacrylic monomers and effecting emulsion graft polymerization of component (2) to the organopolysiloxane, and [B] a silicone resin-containing emulsion. The emulsion composition is capable of forming an elastic, flexible coating which is endowed with water resistance, weather resistance, water repellency, adhesion and heat resistance and maintains these properties over a long period of time. It can thus be used as a base in a variety of paints and coating agents.

Abstract: Mixtures of silicon-containing coupling reagents comprising (mercaptoorganyl)alkylpolyethersilanes containing silanol groups and (mercaptoorganyl)alkylpolyethersilanes free of silanol groups in a weight ratio of from 5:95 to 95:5. The mixtures can be prepared by transesterification and hydrolysis. The mixtures can be used in rubber mixtures.

Abstract: Described herein are PEG-coated, core-shell nanoparticles, which display reduced aggregation and/or reduced non-specific or undesired attachment characteristics. These fluorescent nanoparticle include: a silica-based core having an organic functional group that includes a mercapto substituent, an organic fluorescent compound, a silica shell; and a silane-PEG compound. The silica shell of the nanoparticle encapsulates the silica-based core and the silane-PEG compound is conjugated to the silica shell.

Abstract: A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa-s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).

Abstract: A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.

Abstract: An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.

Abstract: Curable fluoropolyether compositions comprising (a) a polyfluorodialkenyl compound, (b) a fluorinated organohydrogenpolysiloxane, (c) a platinum catalyst, (d) hydrophobic silica powder, (e) a tackifier in the form of a specific silicon compound, and (f) an organosiloxane having a SiH group, an epoxy and/or trialkoxysilyl group, and a perfluoroalkyl or perfluoropolyether group cure to thermoplastic resins to form a durable tight bond at a low temperature within a short time and are readily releasable from metal molds.

Abstract: A silicone resin composition is provided, which includes an alkenyl group-containing polysiloxane represented by the following average composition formula (PSA(1)), a hydro group-containing polysiloxane represented by the following average composition formula (PSA(2)), two kinds of polysiloxane, both having opposite ends sealed with a vinyl group, which are represented by the following formulas (PSC(1) and PSC(4)), and a hydrosilylating catalyst:

Abstract: The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.

Abstract: An extremely durable, stable and fast-curing elastomeric composition suitable for coating all types of architectural and decorative glass is disclosed.

Abstract: A silicone-based pressure-sensitive adhesive comprising: (A) a mixture or a product of partial condensation of (a) a raw rubberlike organopolysiloxane having an average of at least one alkenyl group per molecule and (b) an organopolysiloxane resin consisting essentially of R13SiO1/2 units and SiO4/2 units; (B) an organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a phenol-type oxidation inhibitor and/or a phenol-modified organosiloxane; (D) an aromatic amino-type oxidation inhibitor and/or aromatic amino-modified organosiloxane; and (E) a platinum-based catalyst, can form a pressure-sensitive adhesive layer that maintains good removability after being exposed to high temperatures.

Abstract: A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO2 unit, (B) a mixture of a linear organohydrogenpolysiloxane containing two or more SiH groups and a branched organohydrogenpolysiloxane that is liquid at 25° C., (C) a platinum group metal catalyst, and (D) a linear or cyclic organopolysiloxane having at least two functional groups selected from the group consisting of alkenyl groups, alkoxysilyl groups and epoxy groups bonded to silicon atoms. A cured product of the composition exhibits dramatically reduced surface tack, and therefore using the composition for encapsulating optical semiconductor elements improves the optical semiconductor device yield.

Abstract: A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.

Abstract: The present invention relates to substances, crosslinkable by attachment of an Si-bonded hydrogen atom to an aliphatic multiple bond, which comprise at least one compound of the formula R3P(O) (OH)2??(III) and/or the derivatives thereof, R3 being an optionally substituted hydrocarbon radical which can be interrupted by heteroatoms.

Abstract: A silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, having an epoxy equivalent measured by a titration method equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m; and a method of manufacturing a silicone rubber powder comprising the steps of dispersing in water a silicone rubber composition comprising at least components (A) through (C) listed below; adding component (D); and curing the mixture: (A) a diorganopolysiloxane capped at both molecular terminals with silanol groups and having in one molecule 30 or less silicon atoms; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an epoxy-containing alkoxysilane; and (D) a condensation-reaction catalyst. The silicone rubber powder has low epoxy equivalent and possesses excellent dispersibility in organic resins, and the method is efficient in manufacturing of the aforementioned powder.

Abstract: Addition crosslinkable silicone compositions with excellent adhesion to polymer and other substrates contain an Si—H functional cycloorganosiloxane and an adhesion promoter having at least two aryl moieties linked by an intermediary linking group and containing at least one aliphatically unsaturated group.

Abstract: An object is to provide a curable composition having a good curability by use of an organotin-free catalyst, and the object is solved by a curable composition, comprising: (A) a polymer having a silicon group which can be crosslinked through formation of a siloxane bond, (B) fluorosilanes represented by general formula (1): R14-aSiFa (1) (wherein R1's, the number of which is 4-a, are each independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or at least one selected from the group consisting of siloxy groups represented by R23SiO— (wherein R2's are each independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms or a fluorine atom), and a is any of 1, 2 or 3), and (C) an amine based compound.

Abstract: The present invention relates to mold release agents. More particularly, it relates to a two-component, high gloss, semi permanent water-based mold release agent.

Abstract: A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl groups located in side molecular chains in one molecule (a) and organopolysiloxane resin having one or more hydrolyzable groups in one molecule (b) to a condensation reaction in the presence of catalyst (c), (B) an organohydrogenpolysiloxane, (C) a diorganopolysiloxane having silicon-bonded alkenyl groups on both molecular terminals, (D) an organopolysiloxane resin and (E) a platinum catalyst.

Abstract: The invention relates to a water-insoluble hydrophilic polymer network comprising polyorganosiloxane polyoxyalkylene block copolymer moieties characterised that they are linked to each other through an organosilicon cross-linking moiety, provided that the cross-linking moiety forming the links between polyorganosiloxane polyoxyalkylene block copolymer moieties result from an addition reaction between cross-linking sites present on the polyorganosiloxane polyoxyalkylene block copolymer moieties prior to formation of the hydrophilic polymer network, selected from silicon-bonded hydrogen atoms and aliphatically unsaturated groups, and reactive groups present on the cross-linking moiety prior to formation of the hydrophilic polymer network. Also disclosed is a process for making the polymer network, and a curable composition able to be reacted into such polymer network.

Abstract: A curable organopolysiloxane composition is provided, which includes (A) an organopolysiloxane containing at least one silicon atom-bonded alkenyl group within each molecule, (B) an organohydrogenpolysiloxane, which contains, within each molecule, at least one silicon atom-bonded hydrogen atom at a molecular chain terminal, and at least two silicon atom-bonded hydrogen atoms at non-terminal positions within the molecular chain, and which satisfies the formula shown below: 0<?/?0.25 (wherein, ? represents the number of silicon atom-bonded hydrogen atoms at non-terminal positions within the molecular chain, and ? represents the total number of silicon atoms within the component (B)), in sufficient quantity to provide from 0.1 to 5 silicon atom-bonded hydrogen atoms per silicon atom-bonded alkenyl group within the component (A), and (C) a platinum-based catalyst.

Abstract: A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.

Abstract: A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2?CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o??(1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.