Abstract: A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2?CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o??(1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.

Abstract: A solventless silicone pressure-sensitive adhesive composition is provided. The composition includes (A) a polyorganosiloxane with a polymerization degree of 300 to 2,000 and having at least two alkenyl group-containing organic groups, (B) a polyorganohydrosiloxane having at least three silicon-bonded hydrogen atoms, (C) a polydiorganosiloxane having alkenyl groups at both terminals, (D) a polydiorganosiloxane having SiH groups at both terminals, (E) a polyorganosiloxane composed of R23SiO1/2 units and SiO2 units (R2 is a monovalent hydrocarbon group), and (F) a platinum-based catalyst. The composition enables the prevention of problems caused by residual or volatilized organic substances, such as the absorption of ultraviolet radiation or the like, and also enables ready removal of the composition without deforming or damaging the adherend.

Abstract: The present invention is generally directed to methods of making ceramics with nanoscale/microscale structure involving self-assembly of precursor materials such as, but not limited to, inorganic-based block co-polymers, inorganic-/organic-based hybrid block co-polymers, and other similar materials, and to the structures made by such methods. Where such precursor materials are themselves novel, the present invention is also generally directed to those materials and their synthesis.

Abstract: A composition includes a siloxane of the formula: (RMe2Si01/2)a(MeRSi02/2)b(RSi03/2)o(Si04/2)d wherein a is at least 2, b is from 3 to 20, c is from 0 to 10, d is from 0 to 10, and each R is independently of the formula —CR?2-CR?2-Y—Z or —CRVCRVZ, wherein each R1 is independently a hydrogen atom or a Ci to C1O hydrocarbyl free of aliphatic unsaturation so long as at least one R? is a hydrogen atom, Y is a divalent organic group, and Z is a polycyclic group containing at least one aromatic ring. A method of making the siloxane includes charging (HMe2SiO i/2)a(MeHSi?2/2)b(HSi?3/2)c(Si?4/2)d, a platinum catalyst, and an alkene of the formula CR2=CR—Y—Z or CR2=CR—Z into a reactor to form the siloxane. The siloxane is useful as a component in holographic storage media for photopolymer-based holographic data storage applications. The siloxane exhibits excellent compatibility when mixed with a polymerizable component before the polymerizable component is cured.

Abstract: A phosphor-containing addition-curable silicone resin composition is provided. The composition is capable of forming a cured product which exhibits excellent crack resistance and shock resistance, and minimal surface tackiness. The composition includes (A) an organopolysiloxane including R1SiO1.

Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.

Abstract: Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst.

Abstract: A tube-coated belt suited for heat fixation of color images and the like, downsizing and high-speed operation; and an organopolysiloxane adhesive composition of high adhesion durability suited for the manufacture of tube-coated belt, wherein the tube-coated belt has a resin tube on a silicone-rubber elastic layer through an adhesive layer, wherein the adhesive layer is composed of a cured product of an organopolysiloxane adhesive composition containing a specific organopolysiloxane component.

Abstract: A responsive coated particle comprising at least one particle comprising an interfacial surface to which a responsive coating attaches, said responsive coating comprising (a) at least one silicone-based, substantially hydrophobic polymer and (b) at least one substantially hydrophilic polymer wherein said responsive coating particle is in a first state.

Abstract: A silicone composition according to the present invention comprises (A) an organopolysiloxane resin having an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogensilane in an amount sufficient to cure the composition, (C) an effective amount of a reactive diluent comprising (i) an organosiloxane having an average of at least two alkenyl groups per molecule and a viscosity of from 0.001 to 2 Pa·s at 25° C., wherein the viscosity of (C)(i) is not greater than 20% of the viscosity of component (A), and (ii) an organohydrogensiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule and a viscosity of from 0.001 to 2 Pa·s at 25° C., in an amount sufficient to provide from 0.5 to 3 moles of silicon-bonded hydrogen atoms in (C)(ii) to moles of alkenyl groups in (C)(i), and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone resin prepared by curing the silicone composition.

Abstract: A surface of particles of a silicone resin is treated with a low-molecular organosilicon derivative, with or without a water-soluble cationic polymer to improve the hydrophilicity of the silicone resin. The thus-treated powder is quite excellent in dispersibility (readily dispersible) and in dispersion stability in an aqueous dispersion medium. The use of the surface-treated powder provides a dispersion for cosmetic, excellent in dispersibility and dispersion stability and the like. The use of the surface-treated powder, or the use of the dispersion provides further a cosmetic excellent in dispersibility and dispersion stability, and further excellent in ease of re-dispersion and dispersion stability with lapse of time when selecting aqueous cosmetic as an agent form, and also excellent in smooth feeling in comparison with ordinary products.

Abstract: Disclosed herein is a silicon adhesive composition for transporting a flexible substrate. The composition includes (A) 42 to 70 parts by weight of a polydiorganosiloxane containing an alkenyl group, (B) 55 to 28 parts by weight of a polyorganosiloxane copolymer including R13SiO1/2 units and SiO2 units, wherein R1 is a hydroxy group or a monovalent hydrocarbon group of 1 to 12 carbon atoms, (C) a polyorganosiloxane containing an SiH group, wherein the molar ratio of the SiH group of component (C) to the alkenyl group of component (A) is from 0.5 to 20, and (D) a platinum group catalytic compound, wherein the weight ratio of a metal component of the compound to the sum of components (A) and (B) is from 1 to 5000 ppm by weight.

Abstract: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20.

Abstract: The invention relates to an abhesive layer and to a method for producing an abhesive coating from cross-linked inorganic nanosols. It is an object of the invention to develop an abhesive layer, which has a strong abhesive effect especially with respect to adhesive liquids or pastes, such as printing inks and, while adhering well to the coated materials, has an improved, wear resistance. This objective is accomplished by an abhesive layer or abhesive coating of cross-linked inorganic nanosols with additions of polyorganosiloxanes, which form a three-dimensional network in the layer.

Abstract: Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole % is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole % is phenyl; and an addition reaction-curing catalyst.

Abstract: A glue for packaging a light emitting diode (LED) is described and includes a first set of compositions and a second set of compositions mixed based on a predetermined weight ratio. The first set of compositions is poly(dimethyl siloxane), and the second set of compositions includes a copolymer of dimethyl siloxane, methyl hydrogen siloxane, and vinyl siloxane. The copolymer in the second set of compositions has a weight percentage from about 94% to 99%, dimethyl siloxane in the copolymer has a weight percentage from about 84% to 90%, methyl hydrogen siloxane in the copolymer has a weight percentage from about 4% to 9%, and vinyl siloxane in the copolymer has a weight percentage from about 2% to 7%. A use of the glue for packaging a LED is also described.

Abstract: A self-adhesive organopolysiloxane composition is provided comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups, (C) a hydrosilylation catalyst, and (D) an adhesive component obtained by previously mixing (i) a titanium chelate catalyst and/or a tetraorganoxytitanium and (ii) a silane coupling agent and aging the mixture. The composition cures at room temperature or lower temperature while it is fully adhesive to metal and plastic substrates.

Abstract: A pressure sensitive adhesive composition includes (A) a bodied MQ resin containing (i) a resinous core and (ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group; (B) a treated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and (C) a polydiorganosiloxane terminated with a condensation reactable group; where resin/polymer ratio has a value of 2.0 to 3.0; optionally (D) a crosslinker; optionally (E) a catalyst; and optionally (F) a solvent. A pressure sensitive adhesive product prepared by curing the pressure sensitive adhesive composition is useful in structural attachment applications such as structural glazing applications.

Abstract: A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2 H to 9 H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.

Abstract: An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C. and 40 to 100 at 150 degree C. as measured in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane of organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body produced from aforementioned components (A), (B), and (C) and possesses the aforementioned characteristics.

Abstract: Organopolysiloxanes having quaternary ammonium groups are prepared by first, condensing organopolysiloxanes having a terminal unit HO—SiR22O1/2??(I) with aminosilanes AaRbSi(OR1)4-(a+b)??(II), where A is a monovalent SiC-bonded organic radical containing at least one tertiary amino group and free of primary or secondary amino groups, R a monovalent C1-18 hydrocarbon radical, R1 is a C1-8 alkyl radical, a is 1 or 2, b is 0 or 1, and a+b is 1 or 2, optionally with catalysts, to obtain organopolysiloxanes having tertiary amino groups, and, second, partly or fully quaternizing the organopolysiloxanes obtained in the first step with alkylating agents, no bases being added in the second step, and water is substantially absent.

Abstract: Nanosize titanium dioxide having supported thereon metallic platinum are efficient hydrosilylation catalysts whose hydrosilylation activity may be increased by irradiation. The catalysts are prepared by depositing soluble platinum compounds on a titanium dioxide sol or titanium dioxide pigments followed by drying, calcining, and reduction to platinum metal. The catalysts are particularly useful in preparing addition-curable organopolysiloxane elastomers.

Abstract: A multi-component room-temperature-curable silicone rubber composition comprising at least: (A) a diorganopolysiloxane, (B) a methoxy group-containing silicon compound comprising a bis(methoxysilyl)alkane or a organotrimethoxysilane (except amino group containing organotrimethoxysilane) (B-1), a methoxy group-containing carbasilatrane derivative (B-2), and an aminoalkylmethoxysilane (B-3) (wherein the weight ratio of constituent (B-2) to constituent (B-3) is in the range of (20:80) to (80:20)); and (C) a curing catalyst, the composition being packaged as two or more separately stored compositions wherein none of said separately stored compositions contain all said components (A), (B), and (C) simultaneously.

Abstract: Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3 or —SiR1X1 X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1 X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups.

Abstract: A curable silicone rubber composition, comprising: (A) an organopolysiloxane containing two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, (C) a metal-based condensation reaction catalyst, (D) a platinum group metal-based addition reaction catalyst, and (E) an adhesion-imparting agent, wherein among the refractive indices of component (A), a mixture of component (A) and component (B), and component (E), the difference between the maximum refractive index and the minimum refractive index is not more than 0.03.

Abstract: A silicone rubber coating composition comprising (A) a diorganopolysiloxane containing an average of at least two alkenyl groups, (B) silica powder having a specific surface area of at least 50 m2/g, (C) an organosilicon compound containing a ureido group, an isocyanuric acid ester modified with an organosilicon compound or a (partial) hydrolytic condensate thereof, and (D) a curing agent is applied and vulcanized to base fabric to form a coated fabric, from which airbags are prepared. The composition has a sufficient adhesion to withstand high temperature and abrupt elongation upon inflation of the airbag even after long-term storage under hot humid conditions.

Abstract: Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

Abstract: Addition curable elastomer compositions whose cured products exhibit high elongation at break and high tear propagation resistance are prepared from specific molecular weight ranges of alkenyl-terminal, alkenyl-pendant, and substantially non-functional organopolysiloxanes.

Abstract: The present invention provides a polysiloxane composition maintaining high transparency over a wide wavelength region and a wide temperature region and being excellent in heat resistance, low-dielectric characteristics, workability, and the like. A polysiloxane composition includes (A) a polysiloxane which is composed of a polysiloxane compound having a polyhedral skeleton having 6 to 24 Si atoms in its molecule and which has at least one alkenyl group bonded directly or indirectly to a Si atom constituting the polyhedral skeleton, (B) a polysiloxane having a hydrosilyl group, and (C) a hydrosilylation catalyst.

Abstract: A silicone resin composition is provided, which includes polysiloxane including (PSA1), (PSA2), (PSB) and (PSC), and a hydrosilylating catalyst, wherein a weight ratio between (PSA2) and (PSA1) (w2/w1) is 0.03-0.

Abstract: An addition curable silicone resin composition is provided. The composition includes two types of alkenyl group-containing organopolysiloxanes, and two types of organohydrogenpolysiloxanes, and a platinum group catalyst. The composition is cured to form a hard cured product with excellent flexibility and minimal surface tack, suited to a silicone lens.

Abstract: The present invention relates to silicone compositions that can be used to control the interface at which release occurs when a bi-layer or multi-layer structure comprising compositions as separate layers, and a pattern of a different material sandwiched in between, is separated. The present invention further relates to a process that utilizes these compositions to control the transfer or release of patterns deposited on a substrate.

Abstract: The invention aims at a curing agent, curable compositions or compositions for optical materials, capable of providing for cured artifacts having laudable heat resistance, optical transparency, and light resistance; optical materials and methods for their production; and liquid crystal displays and LED's made by using the materials. A curing agent, which comprises at least two SiH groups, is obtainable by subjecting an aliphatic organic compound (?1) and an acyclic and/or cyclic polyorganosiloxane (?1) to hydrosilylation reaction. The curing agent is also obtainable by subjecting an organic compound (?2) and a cyclic polyorganosiloxane (?2) to hydrosilylation reaction.

Abstract: The invention relates to coating formulations comprising (i) a silicone-based coating component susceptible to misting under mist-producing conditions; and (ii) an anti-misting amount of a branched polysiloxane component resulting from copolymerizing under hydrosilylation conditions a component mixture comprising (a) one or more organosilicon compounds containing at least two unsaturated hydrocarbon functional groups per molecule, and (b) one or more silylhydride-containing compounds containing at least two silylhydride functional groups per molecule, with the provision that (i) at least one component (a) or (b) contains at least three functional groups per molecule; (ii) a component (a) or (b) having a higher number of functional groups per molecule is present in a molar amount equal to or lower than a molar amount of the other component (a) or (b) having a lower number of functional groups per molecule; and (iii) unsaturated hydrocarbon compounds are excluded from the component mixture.

Abstract: A method is disclosed for preparing an elastomeric composition comprising: (I) mixing (A) a silicone base comprising a curable organopolysiloxane, (B) an optional crosslinking agent, (C) a cure agent in an amount sufficient to cure said organopolysiloxane; (II) mixing the product of step (I) with (D) a fluorocarbon elastomer, (E) an optional compatibilizer, (F) an optional catalyst, and (III) statically vulcanizing the organopolysiloxane, wherein the weight ratio of fluorocarbon elastomer (D) to silicone base (A) in the elastomeric base composition ranges from 95:5 to 30:70. The cured rubber compositions obtained from the fluorocarbon elastomeric compositions herein have good fuel resistance properties.

Abstract: A silicone composition is provided comprising (A) an organopolysiloxane of resin structure consisting of R1SiO1.5, R22SiO, and R3aR4bSiO(4?a?b)/2 units, wherein R1, R2, and R3 are methyl, ethyl, propyl, cyclohexyl or phenyl, R4 is vinyl or allyl, a is 0, 1 or 2, b is 1 or 2, a+b is 2 or 3, the number of recurring R22SiO units being 10 to 300, (B) an organohydrogenpolysiloxane of resin structure consisting of R1SiO1.5, R22SiO, and R3cHdSiO(4?c?d)/2 units, wherein R1, R2, and R3 are as defined above, c is 0, 1 or 2, d is 1 or 2, c+d is 2 or 3, the number of recurring R22SiO units being 10 to 300, and (C) a platinum catalyst. The silicone composition cures into a product exhibiting flexibility and minimized surface tack, and can be effectively molded on the existing molding machines.

Abstract: Provided is a room temperature curable organopolysiloxane composition, including (A) 100 parts by mass of a diorganopolysiloxane with both terminals blocked with silanol groups, or a diorganopolysiloxane with each terminal blocked, independently, with a trialkoxysilyl group or a dialkoxyorganosilyl group, or a mixture thereof, (B) 0.1 to 30 parts by mass of a silane compound and/or a partial hydrolysis-condensation product thereof containing an average of at least two hydrolysable groups bonded to silicon atoms within each molecule, and in which the remaining groups bonded to silicon atoms are methyl groups, ethyl groups, propyl groups, vinyl groups, or phenyl groups, and (C) 0.1 to 10 parts by mass of either one, or two or more organosilicon compounds containing amino groups, and also containing four or more hydrolysable groups. Also provided are a sealing material and an adhesive including the above composition.

Abstract: Crosslinkable silicone coating compositions are prepared from (1) organopolysiloxanes containing alkenyl groups and containing per molecule at least one unit O3-n/2RnSi—Y(SiRnO3-n/2)a ??(I), at least 2 units R1RbSiO(3-b)/2 ??(II), and units RcSiO(4-c)/2 ??(III), where R is a monovalent, SiC-bonded organic radical having 1 to 30 C atoms free from aliphatic carbon-carbon multiple bonds, R1 is an alkenyl radical having 2 to 4 C atoms, and Y is a divalent or trivalent organic radical having 1 to 30 C atoms, with the proviso that the organopolysiloxanes (1) contain units (II) in amounts wherein the concentration of alkenyl radicals R1 is less than 2 meq/g, (2) organopolysiloxanes containing Si-bonded hydrogen atoms, (3) a hydrosilylation catalyst, and (4) optionally, inhibitors. The compositions cure rapidly with few extractables and are very useful in preparing release coatings.

Abstract: The invention relates to crosslinkable or crosslinked silicone compositions capable of being used to form a water-repellent and release coating for a flexible support made of paper or of polymer, in particular a heat-sensitive flexible support. These compositions are of the type of those comprising crosslinking polyorganosiloxanes carrying SiH units and unsaturated, preferably vinylated, polyorganosiloxanes capable of reacting with the crosslinking agent by polyaddition in the presence of platinum to form the release crosslinked coating on the flexible support. The targeted aim is to make possible the instantaneous crosslinking at low temperature (85-90° C.) of such silicone compositions coated on flexible supports at a very high speed. To achieve this aim, the invention provides for the use of specific crosslinking agents composed of POSs hydrogenated at the chain end and in the chain.

Abstract: A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed.

Abstract: Borane catalyst complexes with amide functional polymers have a borane portion of the complex that may contain at least one silicon atom. The catalyst complexes can be used as components in curable compositions containing (i) the catalyst complex, (ii) a free radical polymerizable monomer, oligomer or polymer, and optionally (iii) a decomplexer. The curable compositions may contain a component capable of generating a gas, as well as various other optional ingredients. These curable compositions can be used as rubbers, tapes, adhesives, protective coatings, thin films, thermoplastic monolithic molded parts, thermosetting monolithic molded parts, sealants, foams, gaskets, seals, o-rings, pressure sensitive adhesives, die attachment adhesives, lid sealants, encapsulants, potting compounds, conformal coatings, and electronic components.

Abstract: Crosslinkable compositions especially useful as one component sealants include a basic nitrogen compound and an oxathiazine or derivative thereof as an antimicrobial. Despite the presence of the basic nitrogen compound, the compositions are resistant to coloration both before and after cure, while yet exhibiting antimicrobial activity.

Abstract: An extremely durable, stable and fast-curing elastomeric composition suitable for coating all types of architectural glass is disclosed.

Abstract: A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.

Abstract: A method for preparing a modified thermoplastic resin by mixing a thermoplastic resin having a tg of 95° C. or greater and having a melt processing temperature of 250° C. or greater with a silicone base comprised of 100 parts by weight of a diorganopolysiloxane gum and having an average of at least 2 alkenyl groups per molecule in conjunction with 0 to 50 parts by weight of a reinforcing filler along with a radical initiator. The silicone base and this combination are dynamically vulcanized to cure the silicone base at an elevated temperature.

Abstract: A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.

Abstract: A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

Abstract: Use of release fluids or agents constituting hyperbranched polymers. The three-dimensional structure imparts characteristics that make the hyperbranched polymers useful in xerographic processes. The hyperbranched polymer release fluids or agents may be used with a fuser member having a substrate, an outer layer covering the substrate, and a release coating on the outer layer, wherein the release coating includes a hyperbranched polymer.

Abstract: A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO2 units, R3nR4pSiO0.5 units and R3qR4rSiO0.5 units wherein R3 is vinyl or allyl, R4 is a monovalent hydrocarbon group free of aliphatic unsaturation, n is 2 or 3, p is 0 or 1, n+p=3, q is 0 or 1, r is 2 or 3, q+r=3, (C) an organohydrogenpolysiloxane having at least two SiH groups, and (D) a platinum catalyst cures into a silicone rubber having excellent rubbery and strength properties and little surface tack.

Abstract: This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst, (IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both, (V) an unsaturated ester-functional compound, and (VI) an adhesion promoter. The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.