Abstract: The present invention discloses novel flame retardant aqueous formulations comprising micronized particles of brominated epoxy polymers having a predetermined molecular weight, their use as flame retardant coating of wood-based substrates, their preparation and flame-retarded wood-based substrates prepared by using them.

Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.

Abstract: A method of stabilizing a resorcinol-aldehyde resin comprises heating a resorcinol-aldehyde resin in the substantial absence of an acid or base catalyst at a temperature from about 130° C. to about 180° C. for a sufficient amount of time to render the resin stable in an aqueous solution, wherein the resorcinol-aldehyde resin prior to heating is a novolak resin. The stabilized resins have many useful applications. For example, they can be used to make aerogels and xerogels. They also can be used to make dipping solutions to improve the adhesion between rubber and tire cords in a tire, belt, or hose.

Abstract: A method of making a fluoropolymer dispersion by first providing a fluoropolymer dispersion comprising fluoropolymer particles and one or more fluorinated surfactants selected from fluorinated carboxylic acids or salts thereof having the general formula: [Rf—O-L-COO?]iXi+??(I) wherein L represents a linear fully fluorinated alkylene group, Rf represents a linear fully fluorinated aliphatic group or a linear fully fluorinated aliphatic group interrupted with one oxygen atom, Xi+ represents a cation having the valence i and i is 1, 2 or 3; then adding one or more non-fluorinated surfactants selected from anionic and non-ionic surfactants followed by reducing the total amount of the one or more fluorinated surfactants to an amount of not more than 500 ppm, for example not more than 250 ppm based on the total weight of the dispersion while maintaining or increasing the amount of solids in the dispersion.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: A method of making a fluoropolymer dispersion by first providing a fluoropolymer dispersion comprising fluoropolymer particles and one or more fluorinated surfactants selected from fluorinated carboxylic acids or salts thereof having the general formula: [Rf—O-L-COO?]iXi+??(I) wherein L represents a linear fully fluorinated alkylene group, Rf represents a linear partially or fully fluorinated aliphatic group or a linear partially or fully fluorinated aliphatic group interrupted with one oxygen atom, Xi+ represents a cation having the valence i and i is 1, 2 or 3; then adding one or more non-fluorinated surfactants selected from anionic and non-ionic surfactants followed by reducing the total amount of the one or more fluorinated surfactants to an amount of not more than 500 ppm, for example not more than 250 ppm based on the total weight of the dispersion while maintaining or increasing the amount of solids in the dispersion.

Abstract: A polyol emulsion of castor oil and monoepoxides is combined with methylenediphenyl diisocyanate (MDI) and cement to produce a polymer cement.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: The present invention provides modified metal surfaces, methods of preparing the same, and intermediates thereto. These materials are useful in a variety of applications including biomaterials.

Abstract: Disclosed herein are a phenol novolac resin which is used as a raw material for thermosetting resin, a phenol novolac epoxy resin which is obtained therefrom, an epoxy resin composition which utilizes the phenol novolac resin as a curing agent or contains the phenol novolac epoxy resin as a base resin.

Abstract: Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided.

Abstract: A method of making a fluoropolymer dispersion by first providing a fluoropolymer dispersion comprising fluoropolymer particles and one or more fluorinated surfactants selected from fluorinated carboxylic acids or salts thereof having the general formula: [Rf—O-L-COO?]iXi+??(I) wherein L represents a linear partially or fully fluorinated alkylene group or an aliphatic hydrocarbon group, Rf represents a linear partially or fully fluorinated aliphatic group or a linear partially or fully fluorinated aliphatic group interrupted with one or more oxygen atoms, Xi+ represents a cation having the valence i and i is 1, 2 or 3; then adding one or more non-fluorinated surfactants selected from anionic and non-ionic surfactants followed by reducing the total amount of the one or more fluorinated surfactants to an amount of not more than 500 ppm, for example not more than 250 ppm based on the total weight of the dispersion while maintaining or increasing the amount of solids in the dispersion.

Abstract: The present invention provides bifunctional polymers, methods of preparing the same, and intermediates thereto. These compounds are useful in a variety of applications including the PEGylation of biologically active molecules. The invention also provides methods of using said compounds and compositions thereof.

Abstract: A stabilized aqueous fluoropolymer dispersion comprising: about 30 to about 70 weight % non-melt-processible fluoropolymer particles having an SSG of less than about 2.225, said fluoropolymer particles comprising a core of high molecular weight polytetrafluoroethylene and a shell of lower molecular weight polytetrafluoroethylene or modified polytetrafluoroethylene; and about 2 to about 11 weight % of aliphatic alcohol ethoxylate nonionic surfactant based on the weight of said fluoropolymer, wherein said dispersion is essentially free of surfactants containing aromatic groups and contains less than 300 ppm of fluorosurfactant based on the weight of said dispersion.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: Epoxy systems having improved shelf life are disclosed. The epoxy systems are suitable for use in a number of applications, including as an adhesive or as a sealant (e.g., as a component in a melt-sealing tape). Methods of making and using the epoxy systems are also disclosed.

Abstract: Fluorine-containing emulsifiers can be removed from fluoropolymer dispersions by adding to the dispersion a nonionic emulsifier, removing the fluorine-containing emulsifier by contact with an anion exchanger and separating the dispersion from the anion exchanger. The resulting dispersions can be concentrated and used for coating applications.

Abstract: The present invention provides a process of reducing the amount of fluorinated emulsifier in an aqueous fluoropolymer dispersion by contacting the aqueous fluoropolymer dispersion with an anion exchange resin in a non-fixed resin bed, the process comprising: (a) mixing the aqueous fluoropolymer dispersion with an effective amount of a surfactant so as to stabilize the fluoropolymer dispersion while being contacted with the anion exchange resin; (b) contacting the aqueous fluoropolyrner dispersion with an anion exchange resin by agitating the aqueous fluoropolymer dispersion with an effective amount of anion exchange resin for a time of less than 4 hours to reduce the amount of fluorinated emulsifier in the aqueous fluoropolymer dispersion to a desired level; and (c) separating the anion exchange resin from the aqueous fluoropolymer dispersion.

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: wherein R's are the same or different and each represents a hydrogen atom or —R13—C6-10 aryl-(OR14)p, and the aryl group is optionally substituted with C1-6 alkyl group, in which R13 represents a C1-6 alkylene group or a phenylene —CH2— group optionally substituted with a hydroxy group, R14 represents a glycidyl group, and p is an integer of 1 or 2, provided that at least one R group is not a hydrogen atom; R1 represents a phenyl group or —N(R)2 group in which R is defined as above. The resin is produced from sequentially reacting melamine derivatives with aldehydes, phenolic compounds, and epihalohydrin.

Abstract: An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.

Abstract: A pultrusion resin composition comprising about 75 wt % to about 85 wt % of a phenolic resin, about 9 wt % to about 20 wt % of the reaction product of a polyhydroxy compound and an epoxy-functional polysiloxane, about 6 wt % to about 15 wt %, of a phenolic epoxy, and about 0.2 wt % to about 1 wt % of a catalyst, based on total weight of the composition. Pultruded products are formed by drawing fibrous reinforcement through a bath of the pultrusion resin composition.

Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.

Abstract: According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C.

Abstract: A flexible encapsulating material resulting from a mixture that includes at least one epoxy novolak resin and at least two other epoxy compounds wherein the material has a percent hardness change of less than 20% after thermal aging of 504 hours at 140° C. The epoxy novolak resin preferably has less than 3 epoxy groups per molecule. A further embodiment is an electronic component encapsulated with a flexible material resulting from combining a two part system wherein a first part includes an epoxy novolak resin and at least two other epoxy resins and the second part includes at least one amine. An additional embodiment is a method for flexibly encapsulating an electronic component comprising applying to the component a mixture comprising an epoxy novolak resin having less than 3 epoxy groups per molecule and at least one other epoxy compound.

Abstract: The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.

Abstract: The present invention provides an epoxy resin composition, comprising:(A) a phenol epoxy resin represented by the following formula (I) ##STR1## wherein each R.sup.1 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,each R.sup.2 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, ##STR2## wherein R.sup.3 is selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, each R.sup.

Abstract: There are described a self-adhesive prepreg on the basis of a resin-impregnated fibrous supporting material carrying on at least one surface a layer with an increased ratio of resin to supporting material, and the use thereof for the production of sandwich structures.

Abstract: A copolymer is formed from reacting, within a melt, a phthalonitrile resin with an epoxy resin having at least three epoxy groups. In an alternative embodiment, a copolymer is formed by reacting a phthalonitrile resin with an epoxy resin, at least one of the epoxy and phthalonitrile resins having a perfluorinated carbon. The copolymers of the present invention have exceptional thermal stability and a low affinity for water.

Abstract: This invention provides resins and resin compositions which afford cured products with high heat resistance, low water absorption and high adhesion which are useful as electric and electronic materials. Resins obtained by condensation reaction between 4,4'-di(.omega.-substituted methyl)biphenyl or the like and naphthols; epoxy resins obtained by glycidyleterifying said resins; epoxy resin compositions containing these resins; and cured products thereof are disclosed.

Abstract: The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant.

Abstract: The present invention relates to an aqueous powder coating dispersion based on epoxy resins and phenolic curing agents or carboxyl-containing polyesters for the coating of packaging containers, which dispersion consists of a solid, pulverulent component I and an aqueous component II, component I being a powder coating which containsA) at least one epoxy resin having an epoxide equivalent weight of from 300 to 5500 andB) at least one curing agent having more than one phenolic hydroxyl group per molecule and a hydroxyl equivalent weight, based on phenolic OH groups, of from 100 to 500, preferably from 200 to 300, orC) at least one polyester having an acid number of from 25 to 120 mg of KOH/g and an OH number >10 mg of KOH/g, andD) at least one epoxy resin having an epoxide equivalent weight of from 400 to 3000, and component II being the aqueous component of the dispersion which contains at least one nonionic or anionic thickener.

Abstract: An aromatic hydrocarbon formaldehyde resin novolak, useful as a raw phenolic compound for producing a curing agent and an epoxy resin, an epoxy resin composition which contains a novolak type epoxy resin derived from the above novolak resin and an epoxy resin and is therefore excellent in heat resistance, adhesion and humidity resistance, and a process for the production of a phenolic resin, which comprises reacting an aromatic hydrocarbon formaldehyde resin, phenol and formaldehyde in a novolak-forming reaction in the presence of a catalyst to prepare an aromatic hydrocarbon formaldehyde resin novolak, and treating the reaction product with steam while maintaining the temperature of a reaction mixture at 120.degree. to 195.degree. C. to remove unreacted substances and to decompose high-molecular-weight polymers.

Abstract: A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.

Abstract: A halogen-free resin mixture comprising an epoxy resin, a hardener, a flame retardant as well as additives, a self-extinguishing prepreg composed of this resin mixture as well as its advantageous application, particularly as an insulation material. The halogen-free resin mixture being composed of:a) 20-60 weight % epoxy resin;b) 20-60 weight % phenolic novolak hardener;c) 5-65 weight % zinc borate as flame retardant; andd) 0-30 weight % additives.

Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.

Abstract: A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin composition includes a solid or semi-solid epoxy resin having an epoxide functionality of at least 2.5, a metal acetylacetonate for catalyzing the epoxy resin, and an accelerator of bisphenol A-formaldehyde novolac catalyzed by an acidic catalyst and having a hydroxyl equivalent weight of 120. The resin composition is essentially unreactive at room temperature and at elevated temperatures sufficient to enable permeation of the sheet material by the resin in its manufacture, is essentially unreactive at temperatures required to remove moisture and volatiles during processing of articles wrapped or taped with the sheet material, and cures at a higher temperature without adversely affecting the cure characteristics of the resin composition.

Abstract: The present invention relates to a powder coating, in particular for internal coating of packaging containers, which is characterized in that it1.) comprises at least one epoxy resin having an epoxide equivalent weight of from 300 to 5500 and at least one hardener having more than one phenolic hydroxyl group per molecule and a hydroxyl equivalent weight, based on the phenolic OH groups, of from 100 to 500, and2.) has a particle size distribution such that at least 90 percent by weight of the powder coating particles have a particle size of between 1 and 60 .mu.m, the maximum particle size of the powder coating particles is .ltoreq.100 .mu.m, the mean particle size of the powder coating particles is between 5 and 20 .mu.m and the gradient of the particle distribution curve at the point of inflexion is .gtoreq.100.

Abstract: Curing components containing amino groups for curing epoxy resins are obtained by the reaction of alkylated polyhydroxy aromatics (A) with polyamines (B) and aldehydes (C) by the mechanism of the Mannich reaction. The preparation of curable mixtures and varnish formulations is also disclosed. The curing components and curable mixtures can also be employed at a low temperature.

Abstract: Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.

Abstract: Curing components containing amino groups for curing epoxy resins are obtained by the reaction of alkylated polyhydroxy aromatics (A) with polyamines (B) and aldehydes (C) by the mechanism of the Mannich reaction. The preparation of curable mixtures and varnish formulations is also disclosed. The curing components and curable mixtures can also be employed at a low temperature.

Abstract: Curable compositions containing (A) one or more epoxy resins, one (B) or more curing agents and (C) one or more cure controlling catalysts wherein at least one of components (A) or (B) or both components (A) and (B) contain a mesogenic moiety are prepared. These curable compositions permit processing at higher temperatures and improved properties. They are useful in the preparation of coatings, castings, electrical or laminates or composites and the like.

Abstract: A curable composition which comprises:(1) a compound which contains on average more than 1 epoxy group per molecule;(2) a compound which contains on average more than 1 phenolic hydroxyl group per molecule; and(3) a catalytic amount of a catalyst compound which contains:(a) a cation containing at least one heterocyclic nitrogen-containing ring, and(b) an anion which is a conjugate base of fluoroarsenic acid, fluoroantimonic acid, fluorophosphoric acid, chloroarsenic acid, chloroantimonic acid, chlorophosphoric acid, nitric acid, hydrofluoric acid, trifluoroacetic acid, trifluoromethane sulfonic acid, picric acid, fluoboric acid, or an acid represented by the Formula:HBR.sub.3 R'wherein each R is independently a hydrocarbyl or substituted hydrocarbyl group and R' is a halogen, a hydrocarbonoxy group, a hydrocarbonamino group, or a hydrocarbonphosphino group.

Abstract: An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).

Abstract: The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.

Abstract: Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

Abstract: Mesogen containing biaxially oriented films are prepared from curable mixtures containing an epoxy resin and a curing agent therefor. Certain of the mesogen containing biaxially oriented films possess unique properties, such as a metallic like, highly reflective appearance. These films are useful in adhesives, coatings, laminates or composites and the like.

Abstract: Laminates containing one or more plies of substrate material impregnated with a composition containing (A) one or more epoxy resins, (B) one or more curing agent and (C) about 0.00005 to about 0.1 mole per epoxide equivalent of cure controlling catalyst, wherein at least one of components (A) or (B) contain at least one mesogenic moiety, which, optionally, has been subjected to either (a) the application of an electric field, (b) the application of a magnetic field, (c) drawing or shear forces, or (d) any combination thereof, are prepared.

Abstract: An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride, and (4) a dispersible latent curing accelerator, wherein the ratio of (1) to (2) is from 0.8 to 1.2, defined as the number of acid anhydride equivalents/the number of epoxy equivalents, and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.

Abstract: A photohardenable composition especially suitable for use in solid imaging. The compositions are characterized by their improved photospeed in combined with excellent initial green strength. The compositions allows for the production of articles by solid imaging processing techniques that show little or no distortion, high accuracy, excellent clarity. The compositions are low in toxicity and have low sensitivity to water.