Contains Nitrogen Reactant Or Polymer Therefrom Patents (Class 525/484)
  • Patent number: 11795354
    Abstract: An epoxy resin adhesive including at least one epoxy resin in the resin component, at least one adduct AD including primary amino groups which is free-flowing at room temperature and is formed from (i) at least one polyepoxide and (ii) at least one amine of the formula (I) and optionally further amines, and additionally at least one accelerator B having at least one dimethylamino group in the hardener component, and a total of at least 50% by weight of at least one inorganic filler. The epoxy resin adhesive has low odor and good processibility, rapidly builds up strength at room temperature and under cold conditions and, after curing, has high strengths, especially particularly high compressive strengths, and high bonding forces to substrates such as steel, carbon fiber composites (CRP) and concrete.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: October 24, 2023
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Ulrich Gerber, Steffen Kelch, Christoph Mayer
  • Patent number: 11574849
    Abstract: A method of manufacturing an electronic package is disclosed. The described method includes (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant in a pressureless way; and (c) forming at least one further layer structure at the layer structure to thereby form a stack beneath the encapsulated electronic component. A further described electronic package includes (a) a stack comprising at least one layer structure and at least one further layer structure; (b) an electronic component being placed on the stack; and (c) an encapsulant encapsulating the electronic component, wherein the encapsulant has been formed in a pressureless way. Further described is an electronic device comprising such an electronic package.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: February 7, 2023
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Gernot Gmundner, Gernot Schulz
  • Patent number: 11572422
    Abstract: The present invention concerns new precursors of recyclable cross-linked diene elastomers comprising at least one furanyl group along the chain and comprising chain-end units with furanyl groups, their use in the preparation of said recyclable elastomers and their process of preparation. The invention also concerns new recyclable cross-linked diene elastomers, their preparation process and their uses.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: February 7, 2023
    Assignees: UNIVERSITÉ DE BORDEAUX, INSTITUT POLYTECHNIQUE DE BORDEAUX, Centre national de la recherche scientifique
    Inventors: Frédéric Peruch, Pierre Berto, Stéphane Grelier
  • Patent number: 11560476
    Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: January 24, 2023
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Naoki Maruyama, Yuka Yoshida, Tomoko Higashiuchi, Kazumasa Fukuda, Keiichiro Nishimura, Yoshitaka Takezawa
  • Patent number: 11551985
    Abstract: A semiconductor device of an embodiment includes: a wiring board; a semiconductor chip mounted on the wiring board; and a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board. The resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: January 10, 2023
    Assignee: Kioxia Corporation
    Inventors: Yuki Sugo, Ayana Amano, Keiichiro Hattori, Takeshi Watanabe
  • Patent number: 9382459
    Abstract: The present invention is a solventless one liquid type cyanate ester-epoxy composition comprising: (A) a multifunctional cyanate ester, or mixture thereof, of formula (1), wherein an average cyanate group number is 2.5 or more; (B) a multifunctional liquid epoxy resin, or mixture thereof, of formula (2), wherein an average epoxy group number is 2.5 or more, and (C) an amine latent curing agent. [ Average ? ? cyanate ? ? group ? ? number ] = ? i = 1 n ? ? ( Ai × Xi ) 100 Formula ? ? ( 1 ) Ai is a cyanate group number of component i, and Xi is a content ratio of component i (percent by mass) in the formula (1). [ Average ? ? epoxy ? ? group ? ? number ] = ? k = 1 n ? ? ( Bk × Yk ) 100 Formula ? ? ( 2 ) Bk is an epoxy group number of component k, and Yk is a content ratio of component k (percent by mass) in the formula (2).
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: July 5, 2016
    Assignee: ADEKA CORPORATION
    Inventors: Ryo Ogawa, Yoko Masamune
  • Patent number: 9228112
    Abstract: Curable compositions comprising a benzoxazine component, a polyamine component and an ortho-dihydroxyaryl component are described. The compositions may be cured to produce compositions useful in coating, sealants, adhesive and many other applications.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: January 5, 2016
    Assignee: 3M Innovative Properties Company
    Inventors: Ilya Gorodisher, Mario A. Perez, Werner M. Grootaert
  • Patent number: 9169393
    Abstract: Curable compositions comprising a benzoxazine component, a polyamine component and a fluoropolymer component are described. The compositions may be cured to produce compositions useful in coating, sealants, adhesive and many other applications.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: October 27, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Atri A. Rungta, Ilya Gorodisher, Mario A. Perez
  • Patent number: 8362116
    Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: January 29, 2013
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming Jen Tzou, June Che Lu, Yi Cheng Lin
  • Publication number: 20120029116
    Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.
    Type: Application
    Filed: October 6, 2011
    Publication date: February 2, 2012
    Applicant: TRILLION SCIENCE, INC.
    Inventors: Rong-Chang Liang, John J. McNamara, Yurong Ying, Chung-Jen Hou
  • Patent number: 7989575
    Abstract: A composition is disclosed, which comprises a hydroxyaromatic-aldehyde resole resin comprising an aldehyde and a hydroxyaromatic compound, modified with a urea-aldehyde condensate. The hydroxyaromatic-aldehyde resole resin is prepared without ammonia or a primary amine and the composition does not contain a triazone or a substituted triazone compound. The composition has improved premix stability, improved cure efficiency, comparable tensile strength, and lower volatiles than the hydroxyaromatic-aldehyde resole resin unmodified with a urea-aldehyde condensate. Also disclosed are articles prepared therefrom.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: August 2, 2011
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Stephen W. Arbuckle
  • Patent number: 7553904
    Abstract: A method of using olefin containing nanostructured chemicals and silanol containing nanostructured chemicals as high temperature resins is described. Vinyl containing nanostructured chemicals are particularity effective in thermosets as they control the motions of polymer chains, and segments, at the molecular level. Silanol containing nanostructured chemicals are particularity effective in thermosets containing polar groups as the silanol can enhance the reactivity of these groups. Because of their tailorable compatibility with fluorinated polymers, nanostructured chemicals can be readily and selectively incorporated into polymers by direct blending and polymerization processes. The incorporation of a nanostructured chemical into a polymer favorably impacts a multitude of polymer physical properties. Properties most favorably improved are heat distortion and flammability characteristics, permeability, optical properties, texture, feel and durability.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: June 30, 2009
    Assignee: Hybrid Plastics, Inc.
    Inventors: Joseph D. Lichtenhan, Qibo Liu, Yan-Jyh Lee, Xuan Fu, Sukhendu Hait, Joseph J. Schwab, Rusty L. Blanski, Patrick N. Ruth
  • Publication number: 20090036582
    Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of b1a) at least one diglycidyl- and/or at least one monoglycidylether with b1b) a composition comprising a volatile monoamine and a polyamine, said composition b1b) is used in an amount to provide an excess amino groups relative to epoxy groups from b1a), and whereby the excess of monoamine is removed off from the reaction product, b2) 0-60 wt % of a polyamine, and b3) 0-25 wt % of a polyphenol novolac, and whereby the sum of components b1), b2) and b3) is 100 wt %, providing long pot life combined with fast cure times at low temperatures, thus making said compositions especially useful for marine and offshore coatings, industrial maintenance, construction, tank and pipe linings, adhesive, automobile and electrical potting applications.
    Type: Application
    Filed: January 23, 2008
    Publication date: February 5, 2009
    Applicant: Huntsman International L.L.C
    Inventor: Isabelle Marie Marguerite Muller-Frischinger
  • Patent number: 7323534
    Abstract: A composition is disclosed, which comprises a hydroxyaromatic-aldehyde resole resin comprising an aldehyde and a hydroxyaromatic compound, modified with a urea-aldehyde condensate. The composition has improved premix stability, improved cure efficiency, comparable tensile strength, and lower volatiles than the hydroxyaromatic-aldehyde resole resin unmodified with a urea-aldehyde condensate. Also disclosed are articles prepared therefrom.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: January 29, 2008
    Assignee: Hexion Specialty Chemicals, Inc.
    Inventor: Stephen W. Arbuckle
  • Patent number: 7276563
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: October 2, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Patent number: 7122605
    Abstract: The invention relates to a method of making an acrylic graft polymer, especially a urethanized acrylic graft polymer. The method of the invention requires an ethylenically unsaturated monomer mixture (a) comprising a monomer (ai) of a particular structure having at least one cyclic carbonate group and the polymerization of the monomer mixture (a) under free radical polymerization conditions to make an acrylic backbone polymer (b) comprising one or more cyclic carbonate functional groups (bi). At least one grafting moiety (c) is then provided, said grafting moiety (c) comprising at least one amine group (ci) selected from primary amines, secondary amines, and mixtures of both primary and secondary amines. The grafting moiety (c) is then grafted onto acrylic backbone polymer (b) via reaction between the at least one amine group (ci) and cyclic carbonate functional groups (bi) so as to make an urethanized acrylic graft polymer.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: October 17, 2006
    Assignee: BASF Corporation
    Inventors: Walter H. Ohrbom, Patricia A. Herrel, John W. Rehfuss
  • Patent number: 7049387
    Abstract: The cure rate of phenol-aldehyde resins is accelerated by conjoint use of a cyclic carbonate cure accelerant and an amine cure accelerant. The cure rate is accelerated still further by addition of a resorcinol source to resin comprising a cyclic carbonate and an amine cure accelerator. Also, cured resins made in accordance with the method.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: May 23, 2006
    Assignee: Georgia-Pacific Resins, Inc.
    Inventor: Frederick C. Dupre, Jr.
  • Patent number: 6933345
    Abstract: The nanoscopic dimensions of polyhedral oligomeric silsesquioxanes (POSS) and polyhedral oligomeric silicates (POS) materials ranges from 0.7 nm to 5.0 nm and enables the thermomechanical and physical properties of polymeric materials to be improved by providing nanoscopic reinforcement of polymer chains at a length scale that is not possible by physically smaller aromatic chemical systems or larger fillers and fibers. A simple and cost effective method for incorporating POSS/POS nanoreinforcements onto polymers via the reactive grafting of suitably functionalized POSS/POS entities with polymeric systems amenable to such processes is described. The method teaches that the resulting POSS-grafted-polymers are particularly well suited for alloying agents by nongrafted POSS entitles such as molecular silicas. The successful alloying of POSS-polymers is aided because their interfacial tensions are reduced relative to non-POSS containing systems.
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: August 23, 2005
    Assignee: Hybrid Plastics, LLP
    Inventors: Joseph D. Lichtenhan, Frank J. Feher, Joseph J. Schwab, Sixun Zheng
  • Patent number: 6723763
    Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at higher cure speeds and comparable physical properties for the reaction products formed therefrom.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: April 20, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Qinyan Zhu, Shabbir Attarwala
  • Patent number: 6716919
    Abstract: A method of using nanostructured chemicals as alloying agents for the reinforcement of polymer microstructures, including polymer coils, domains, chains, and segments, at the molecular level. Because of their tailorable compatibility with polymers, nanostructured chemicals can be readily and selectively incorporated into polymers by direct blending processes. The incorporation of a nanostructured chemical into a polymer favorably impacts a multitude of polymer physical properties. Properties most favorably improved are time dependent mechanical and thermal properties such as heat distortion, creep, compression set, shrinkage, modulus, hardness and abrasion resistance. In addition to mechanical properties, other physical properties are favorably improved, including lower thermal conductivity, fire resistance, and improved oxygen permeability.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: April 6, 2004
    Assignee: Hybrid Plastics
    Inventors: Joseph D. Lichtenhan, Joseph J. Schwab, Andre Lee, Shawn Phillips
  • Publication number: 20030207126
    Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at least comparable cure speeds and physical properties for the reaction products formed therefrom.
    Type: Application
    Filed: March 15, 2002
    Publication date: November 6, 2003
    Applicant: LOCTITE CORPORATION
    Inventors: Qinyan Zhu, Shabbir Attarwala
  • Patent number: 6613436
    Abstract: The present invention provides a crosslinking agent which may have reactive benzoxazine groups prepared from (a) at least one aromatic compound, (b) at least one aminotriazine compound, and (c) at least one other compound having active hydrogen groups reactive with aminoplast compound (b). The crosslinking agent is essentially free of hydroxyl functionality and has a glass transition temperature of at least 25° C. The present invention is further directed to a method for preparing the above-described crosslinking agent, and a curable powder coating composition comprising a mixture of (A) a polymer having functional groups reactive with aminotriazine and/or benzoxazine groups having a glass transition temperature of at least 30° C.; and (B) the above crosslinking agent. Multilayer composite coating compositions are also provided including a basecoat deposited from a film-forming composition and a topcoat over the basecoat, deposited from the curable powder coating composition described above.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: September 2, 2003
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Ronald R. Ambrose, Anthony M. Chasser, Shengkui Hu, Jackie L. Smith
  • Publication number: 20030100687
    Abstract: The invention relates to a method of making an acrylic graft polymer, especially a urethanized acrylic graft polymer. The method of the invention requires an ethylenically unsaturated monomer mixture (a) comprising a monomer (ai) of a particular structure having at least one cyclic carbonate group and the polymerization of the monomer mixture (a) under free radical polymerization conditions to make an acrylic backbone polymer (b) comprising one or more cyclic carbonate functional groups (bi). At least one grafting moiety (c) is then provided, said grafting moiety (c) comprising at least one amine group (ci) selected from primary amines, secondary amines, and mixtures of both primary and secondary amines. The grafting moiety (c) is then grafted onto acrylic backbone polymer (b) via reaction between the at least one amine group (ci) and cyclic carbonate functional groups (bi) so as to make an urethanized acrylic graft polymer.
    Type: Application
    Filed: November 29, 2001
    Publication date: May 29, 2003
    Inventors: Walter H. Ohrbom, Patricia A. Herrel, John W. Rehfuss
  • Patent number: 6548576
    Abstract: A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether) 0.5-8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10% by weight; cycloaliphatic polyamine (catalyst) 4-15% by weight; kaolin clay (filler) 2-20% by weight; magnesium alumino silicate (filler) 2-15% by weight; Sb2O3 (filler) 4-5% by weight, and hydrated Al2O3 (filler) 0-15% by weight.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: April 15, 2003
    Assignee: Bourns, Inc.
    Inventor: Raymond L. Winter
  • Patent number: 6500545
    Abstract: The present invention provides a crosslinking agent having reactive benzoxazine groups which is the ungelled reaction product of (a) at least one mono-hydroxy aromatic compound and (b) at least one aminotriazine compound having one or less non-alkylated NH group present in a molar ratio of reactant (a) to reactant (b) ranging from 1.0 to 3.0: 1.0, provided that where reactant (a) is a single ring monohydroxy aromatic compound, the molar ratio of reactant (a) to reactant (b) ranges from 1.0 to 1.8:1.0 and from 2.2 to 3.0:1.0. The crosslinking agent is essentially free of hydroxyl functionality and has a glass transition temperature of at least 25° C. The present invention is further directed to a method for preparing the above-described crosslinking agent.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: December 31, 2002
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Ronald R. Ambrose, Anthony M. Chasser, Shengkui Hu, John R. Schneider, Jackie L. Smith
  • Patent number: 6465601
    Abstract: Compounds active as accelerators for curable epoxy and polyurethane systems, those compounds having been prepared by means of a transamination reaction by reacting (a) a substituted phenolic compound (Mannich base) having at least one substituent of formula R1(R2)N—CH(R3)—  (A), wherein R1 and R2 are each independently of the other linear or branched C1-4alkyl and R3 is hydrogen, methyl, ethyl or phenyl, with (b) a compound of formula R4(R5)N—CnH2n—(NH—CnH2n)q—NH2  (B), wherein R4 and R5 are each independently of the other C1-C6alkyl or together form a radical of formula —(CH2)5— or —(CH2)2—O—(CH2)2—, n is an integer from 2 to 5 and q is zero, 1, 2 or 3, and the compound obtained or the compounds present in the mixture obtained has/have on average, per molecule, at least one substituent of formula (R4)(R5)N—CnH2n—(NH—CnH2n)q—NH—CH(R3)—, and the use of those compounds as acceler
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: October 15, 2002
    Assignee: Vantico Inc.
    Inventors: Rolf Wiesendanger, Walter Fischer, Bryan Dobinson
  • Patent number: 6399719
    Abstract: A melamine-containing resin modified with a cyclic urea prepolymer comprising urea, formaldehyde and ammonia or a primary amine. The prepolymer-modified melamine-containing resin provides useful binders alone, or when combined or coreacted with other resins. Products prepared with the binder include wood composites such as particleboard and medium density fiberboard.
    Type: Grant
    Filed: June 23, 1999
    Date of Patent: June 4, 2002
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Pablo G. Dopico, Brian M. Peek, Benjamin D. Gapud, Kelly A. Shoemake, James C. Phillips
  • Patent number: 6380323
    Abstract: The invention provides a resin composition comprising (A) a polymer comprising at least 1 primary carbamate functional group and 1 or more quaternary ammonium groups, and (B) a carbamate functional reactive additive that is generated in situ during the production of polymer (A).
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: April 30, 2002
    Assignee: BASF Corporation
    Inventor: Timothy S. December
  • Patent number: 6379814
    Abstract: The preparation of phenol-formaldehyde and melamine-formaldehyde resin-based binders extended with a cyclic urea-formaldehyde prepolymer and to products prepared using the binders. More particularly, the invention relates to a cyclic urea prepolymer comprising urea, formaldehyde, and ammonia or a primary amine which, when added to a phenol-formaldehyde or melamine-formaldehyde based resin, results in a useful binder for the manufacturer numerous articles.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: April 30, 2002
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: F. C. Dupre, Millard E. Foucht, William P. Freese, Kurt D. Gabrielson, Benjamin D. Gapud, W. Hayes Ingram, Ted M McVay, Richard A. Rediger, Kelly A. Shoemake, Kim K. Tutin, James T. Wright
  • Patent number: 6369171
    Abstract: The preparation of phenol-formaldehyde and melamine formaldehyde resin-based binders extended with a cyclic urea-formaldehyde prepolymer and to products prepared using the binders. More particularly, the invention relates to a cyclic urea prepolymer comprising urea, formaldehyde, and ammonia or a primary amine which, when added to a phenol-formaldehyde or melamine-formaldehyde based resin, results in a useful binder for the manufacturer numerous articles.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: April 9, 2002
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Frederick C. Dupre, Millard E. Foucht, William P. Freese, Kurt D. Gabrielson, Benjamin D. Gapud, W. Hayes Ingram, Ted M McVay, Richard A. Rediger, Kelly A. Shoemake, Kim K. Tutin, James T. Wright
  • Patent number: 6353081
    Abstract: Metal compounds of pseudohalogenides and their use as curing agents for epoxy compounds which curing agents can be produced by mixing the reactants in aqueous solution and are distinguished by a long processibility time at temperatures up to 100° C. as well as by very short curing times at temperatures in the range of 120 to 160° C.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: March 5, 2002
    Assignee: Bakelite AG
    Inventors: Andreas Palinsky, Manfred Doring, Holger Dey, Jorg Wuckelt
  • Patent number: 6322848
    Abstract: A flexible encapsulating material resulting from a mixture that includes at least one epoxy novolak resin and at least two other epoxy compounds wherein the material has a percent hardness change of less than 20% after thermal aging of 504 hours at 140° C. The epoxy novolak resin preferably has less than 3 epoxy groups per molecule. A further embodiment is an electronic component encapsulated with a flexible material resulting from combining a two part system wherein a first part includes an epoxy novolak resin and at least two other epoxy resins and the second part includes at least one amine. An additional embodiment is a method for flexibly encapsulating an electronic component comprising applying to the component a mixture comprising an epoxy novolak resin having less than 3 epoxy groups per molecule and at least one other epoxy compound.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: November 27, 2001
    Assignee: Lord Corporation
    Inventors: Michael T. Phenis, Manny Tavares
  • Patent number: 6303690
    Abstract: The invention provides a cathodic electrocoat coating composition having (A) a polymer comprising at least one primary carbamate group and at least one cationic salting site, (B) a curing agent having groups that are reactive with said functional groups on (A), and (C) a reactive additive comprising at least one compound having a molecular weight of from 131 to 2000 and comprising at least one primary carbamate group and at least one alkyl group selected from the group consisting of branched alkyl groups of from 5 to 30 carbons, straight chain alkyl groups of more than 10 carbons, and mixtures thereof, wherein one or both of (A) and (B) comprise groups that are reactive with the primary carbamate group of (C).
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: October 16, 2001
    Assignee: BASF Corporation
    Inventors: Timothy S. December, Walter H Ohrbom
  • Patent number: 6245438
    Abstract: The preparation of phenol-formaldehyde and melamine-formaldehyde resin-based binders extended with a cyclic urea-formaldehyde prepolymer and to products prepared using the binders. More particularly, the invention relates to a cyclic urea prepolymer comprising urea, formaldehyde, and ammonia or a primary amine which, when added to a phenol-formaldehyde or melamine-formaldehyde based resin, results in a useful binder for the manufacturer numerous articles.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: June 12, 2001
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: F. C. Dupre, Millard E. Foucht, William P. Freese, Kurt D. Gabrielson, Benjamin D. Gapud, W. Hayes Ingram, Ted M. McVay, Richard A. Rediger, Kelly A. Shoemake, Kim K. Tutin, James T. Wright
  • Patent number: 6114491
    Abstract: The preparation of phenol-formaldehyde and melamine-formaldehyde resin-based binders extended with a cyclic urea-formaldehyde prepolymer and to products prepared using the binders. More particularly, the invention relates to a cyclic urea prepolymer comprising urea, formaldehyde, and ammonia or a primary amine which, when added to a phenol-formaldehyde or melamine-formaldehyde based resin, results in a useful binder for the manufacturer numerous articles.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: September 5, 2000
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: F. C. Dupre, Millard E. Foucht, William P. Freese, Kurt D. Gabrielson, Benjamin D. Gapud, W. Hayes Ingram, Ted M. McVay, Richard A. Rediger, Kelly A. Shoemake, Kim K. Tutin, James T. Wright
  • Patent number: 6090870
    Abstract: The present invention provides an epoxy resin composition, comprising:(A) a phenol epoxy resin represented by the following formula (I) ##STR1## wherein each R.sup.1 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,each R.sup.2 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, ##STR2## wherein R.sup.3 is selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, each R.sup.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: July 18, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Hsiu-Rong Chang, Yeong-Tsyr Hwang, Meng-Song Yin, Kung-Lung Cheng
  • Patent number: 5939473
    Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.
    Type: Grant
    Filed: April 29, 1996
    Date of Patent: August 17, 1999
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhiro Hirano, Masatsugu Akiba, Akira Yokota, Hiroshi Nakamura, Shigeki Naitoh
  • Patent number: 5863970
    Abstract: A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.
    Type: Grant
    Filed: February 4, 1997
    Date of Patent: January 26, 1999
    Assignees: Polyset Company, Inc., Motorola, Inc.
    Inventors: Ramkrishna Ghoshal, Prosanto Mukerji
  • Patent number: 5859153
    Abstract: A composition useful as a powder coating comprises an epoxy resin and a novolak compound or resin having a structure obtained from the reaction of a substituted phenol such as cresol and an aldehyde to form a substituted bis(hydroxymethyl) phenol intermediate which is then reacted with a polyhydroxyphenol containing adjacent hydroxyl groups such as catechol to yield a polyhydroxyphenol-endcapped novolak compound or resin.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: January 12, 1999
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Alan R. Kirk, Allen L. Griggs
  • Patent number: 5840824
    Abstract: An object is to provide hardened products having excellent water resistance and mechanical strength, and an epoxy resin and an epoxy resin composition for use in the production thereof. An epoxy resin obtained by the glycidylation of a novolak type resin which is prepared by the condensation of biphenyls with phenols and naphthols, and a resin composition containing said epoxy resin and hardened products thereof.
    Type: Grant
    Filed: December 26, 1996
    Date of Patent: November 24, 1998
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Kenichi Kuboki, Yoshio Shimamura, Ryoichi Hasegawa
  • Patent number: 5821289
    Abstract: The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100.degree. F. when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: October 13, 1998
    Assignee: The B.F. Goodrich Company
    Inventors: Carmen D. Congelio, Andrew M. Olah
  • Patent number: 5789498
    Abstract: A curing catalyst for use in epoxy resin, said curing catalyst being a metal salt complex of an adduct between polyepoxide and imidazoles; and a heat curing coating composition prepared by mixing the above curing catalyst with a coating composition containing an epoxy group-containing compound.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: August 4, 1998
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Kazuhiko Ohnishi, Shigeo Nishiguchi
  • Patent number: 5750631
    Abstract: The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: May 12, 1998
    Assignee: Shell Oil Company
    Inventors: Yasuyuki Murata, Yoshinori Nakanishi
  • Patent number: 5668226
    Abstract: A polyhydroxystyrene having a 2,4-diamino-s-triazinyl group substituted for 1-50 mol % of its hydroxyl group and a weight average molecular weight of 3,000-50,000 is provided. A negative radiation-sensitive resist composition comprising the polymer, preferably along with a photo-acid generator and a crosslinking agent has high resolution and developability, affords a resist pattern of rectangular profile, and is shelf stable. The composition is thus very useful as resist material for LSI manufacture.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: September 16, 1997
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoyoshi Furihata, Motoyuki Yamada
  • Patent number: 5659004
    Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: August 19, 1997
    Assignee: Fujitsu Limited
    Inventors: Yukio Takigawa, Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari, Nobuo Kamehara
  • Patent number: 5648409
    Abstract: There is disclosed a self-disbursing curable epoxy resin composition comprising the addition product of reactants comprising (a) 1.0 reactive equivalent of an epoxy resin, (b) from about 0.40 to 0.95 reactive equivalents of a polyhydric phenol, and (c) from about 0.005 to 0.5 reactive equivalents of an amine-epoxy adduct comprising the addition product of reactants comprising 1.0 reactive equivalent of an aromatic polyepoxide and from about 0.3 to 0.9 reactive equivalents of a polyoxyalkyleneamine.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: July 15, 1997
    Assignee: Henkel Corporation
    Inventors: Kartar S. Arora, David I. Devore, Reuben H. Grinstein, Grannis S. Johnson, John G. Papalos, Shailesh Shah
  • Patent number: 5646204
    Abstract: An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) ##STR1## wherein each R.sub.1, independent of the other, represents hydrogen, a hologen atom, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups, and X represents ##STR2## and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product exhibiting low hygroscopicity and high adhesiveness.
    Type: Grant
    Filed: September 8, 1995
    Date of Patent: July 8, 1997
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Masatsugu Akiba, Yutaka Shiomi, Kazuo Takebe, Noriaki Saito, Takashi Morimoto
  • Patent number: 5643976
    Abstract: There is disclosed a self-dispersing curable epoxy resin composition comprising the addition product of reactants comprising (a) 1.0 reactive equivalent of an epoxy resin, (b) from about 0.40 to 0.95 reactive equivalents of a polyhydric phenol, and (c) from about 0.005 to 0.5 reactive equivalents of an amine-epoxy adduct comprising the addition product of reactants comprising 1.0 reactive equivalent of a polyepoxide and from about 0.3 to 0.9 reactive equivalents of a polyoxyalkyleneamine having the structural formula:R.sub.1 --O--R.sub.2 --CH.sub.2 CH(R.sub.3)--X--R.sub.4 --NH2wherein:R.sub.1 designates a monovalent organic radical selected from the group consisting of C.sub.1 to C.sub.12 aliphatic, alicyclic or aromatic hydrocarbons, andR.sub.2 represents a polyoxyalkylene chain having the structural formula:(CH.sub.2 --CH.sub.2 --O).sub.a --(CH.sub.2 --CH(R.sub.5)--O).sub.bwherein:R.sub.5 is a monovalent organic radical selected from the group consisting of C.sub.1 to C.sub.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: July 1, 1997
    Assignee: Henkel Corporation
    Inventors: Kartar S. Arora, Michael S. Wiggins
  • Patent number: 5641852
    Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: June 24, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Tsuji, Shoji Hara, Hirosaku Nagano
  • Patent number: 5641840
    Abstract: An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: June 24, 1997
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Satoru Tsuchida, Masahiko Osaka, Kouzou Hirokawa, Yasuaki Nakamura